JP3222815B2 - Optical communication package - Google Patents
Optical communication packageInfo
- Publication number
- JP3222815B2 JP3222815B2 JP25817397A JP25817397A JP3222815B2 JP 3222815 B2 JP3222815 B2 JP 3222815B2 JP 25817397 A JP25817397 A JP 25817397A JP 25817397 A JP25817397 A JP 25817397A JP 3222815 B2 JP3222815 B2 JP 3222815B2
- Authority
- JP
- Japan
- Prior art keywords
- lens
- lens holder
- package body
- package
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、光ファイバの先端
と対向させるレンズを内蔵した光通信用パッケージに関
するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical communication package having a built-in lens which faces an end of an optical fiber.
【０００２】[0002]
【従来の技術】この種の光通信用パッケージは、本体が
セラミック製のものと金属製のものがあるが、前者のも
のは、例えば図５に示すように、セラミック製のパッケ
ージ本体１１内に、光通信用のレーザダイオード（Ｌ
Ｄ）、発光ダイオード（ＰＤ）等の半導体素子１２を搭
載するキャビティ１３を形成すると共に、該パッケージ
本体１１の側面に、キャビティ１３に連通する貫通孔１
４を形成すると共に、この貫通孔１４に対応する部位に
シールリング１５をＡｇろう材でろう付けし、金属製の
レンズホルダ１６の内部に、光ファイバ１７の先端と対
向させるためのレンズ１８を接着樹脂１９で接合すると
共に、該レンズホルダ１６をシールリング１５及び貫通
孔１４内に挿入し、該レンズホルダ１６の鍔部をシール
リング１５に抵抗溶接したものがある。2. Description of the Related Art An optical communication package of this type includes a ceramic body and a metal body. The former package is provided in a ceramic package body 11, for example, as shown in FIG. , Laser diode for optical communication (L
D), a cavity 13 for mounting a semiconductor element 12 such as a light emitting diode (PD) is formed, and a through hole 1 communicating with the cavity 13 is formed in a side surface of the package body 11.
4, a seal ring 15 is brazed to a portion corresponding to the through hole 14 with an Ag brazing material, and a lens 18 for facing the tip of an optical fiber 17 is provided inside a metal lens holder 16. In some cases, the lens holder 16 is inserted into the seal ring 15 and the through-hole 14 and the flange of the lens holder 16 is resistance-welded to the seal ring 15 while being bonded with an adhesive resin 19.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、上記従
来構成では、次のような欠点があった。However, the above-described conventional configuration has the following disadvantages.
【０００４】（１）レンズホルダ１６の鍔部をシールリ
ング１５に抵抗溶接する際に、パッケージ本体１１をレ
ンズホルダ１６側に押し付けた状態で抵抗溶接するよう
にしているが、この抵抗溶接時にパッケージ本体１１の
押圧力を大きくし過ぎると、パッケージ本体１１にクラ
ックが発生しやすくなり、反対に、パッケージ本体１１
の押圧力を弱くすると、溶接不良によるリークが発生し
やすい。(1) When the flange of the lens holder 16 is resistance-welded to the seal ring 15, resistance welding is performed while the package body 11 is pressed against the lens holder 16 side. If the pressing force of the main body 11 is too large, cracks are likely to occur in the package main body 11, and conversely,
If the pressing force is weak, leakage due to poor welding is likely to occur.
【０００５】（２）レンズホルダ１６とシールリング１
５との接合を、抵抗溶接からＡｕ−Ｓｎろう付けに変更
することが考えられるが、レンズホルダ１６にレンズ１
８を接着樹脂１９で接合しているため、後工程で、レン
ズホルダ１６をシールリング１５にＡｕ−Ｓｎろう付け
する際に、ろう材を加熱溶融する熱（３００〜４００
℃）で、接着樹脂１９が熱分解して（熱分解温度：２０
０℃）、レンズ１８の接合部がシール不良となり、リー
クが発生しやすい。(2) Lens holder 16 and seal ring 1
It is conceivable to change the joining with the lens 5 from resistance welding to Au-Sn brazing.
8 are bonded by the adhesive resin 19, when the lens holder 16 is Au-Sn brazed to the seal ring 15 in a later step, heat (300 to 400) for heating and melting the brazing material is used.
C), the adhesive resin 19 is thermally decomposed (pyrolysis temperature: 20
0 ° C.), the joint of the lens 18 becomes defective in sealing, and leaks are likely to occur.
【０００６】（３）レンズホルダ１６の表面は、Ｎｉめ
っきを下地としてＡｕめっきが施されているが、レンズ
１８を接合する接合面や光ファイバ１７の保持部材（図
示せず）をレーザ接合する接合面がＡｕめっきされてい
ると、レーザ光がＡｕめっき面に反射されてレンズ１８
の接合やレーザ接合が困難となる。(3) The surface of the lens holder 16 is plated with Au using Ni plating as a base, and the joining surface for joining the lens 18 and the holding member (not shown) for the optical fiber 17 are joined by laser. When the bonding surface is plated with Au, the laser beam is reflected on the Au plated surface and the lens 18
Joining or laser joining becomes difficult.
【０００７】本発明はこのような事情を考慮してなされ
たものであり、従ってその目的は、パッケージ本体のク
ラックや接合部の不良を防止できて、信頼性向上、歩留
り向上を実現できる光通信用パッケージを提供すること
にある。SUMMARY OF THE INVENTION The present invention has been made in view of such circumstances, and an object of the present invention is to provide an optical communication system capable of preventing cracks in a package body and defective joints, and improving reliability and yield. To provide packages for
【０００８】[0008]
【課題を解決するための手段】上記目的を達成するため
に、本発明の光通信用パッケージは、パッケージ本体に
接合するレンズホルダの表面にＮｉめっきを施すと共
に、そのＮｉめっき面のうち、パッケージ本体に接合す
る接合面以外の部分をマスクしてＡｕめっきを施すこと
で、該パッケージ本体に接合する接合面をＡｕめっき面
とすると共に、レンズを接合する接合面及び光ファイバ
の保持部材をレーザ接合する接合面をＮｉめっき面と
し、前記レンズホルダのＮｉめっき面に前記レンズを低
融点ガラスで接合すると共に、前記レンズホルダのＡｕ
めっき面を前記パッケージ本体にＡｕ−Ｓｎろう材で接
合した構成としたものである。In order to achieve the above object, an optical communication package according to the present invention is provided on a package body.
Ni plating is applied to the surface of the lens holder
Then, of the Ni-plated surface,
Au plating by masking the parts other than the joint surface
And the bonding surface to be bonded to the package body is an Au-plated surface.
And a bonding surface for bonding a lens and an optical fiber
The joint surface for laser joining of the holding member is Ni plating surface
Then, the lens is bonded to the Ni-plated surface of the lens holder with a low melting point glass, and the Au of the lens holder is
The plating surface is joined to the package body with an Au-Sn brazing material.
【０００９】この構成では、レンズホルダのＮｉめっき
面にレンズを低融点ガラスで接合するようにしたので、
レンズが確実に接合されると共に、レンズホルダをパッ
ケージ本体にＡｕ−Ｓｎろう付けする際に、ろう材を加
熱溶融する熱（３５０℃）によって、レンズの接合材で
ある低融点ガラス（融点：４５０℃）が熱分解すること
がなく、レンズの接合信頼性が向上する。しかも、レン
ズホルダのＡｕめっき面をパッケージ本体にＡｕ−Ｓｎ
ろう材で接合するようにしたので、抵抗溶接で発生して
いたパッケージ本体のクラックや溶接不良がなくなると
共に、レンズホルダのＡｕ−Ｓｎろう材の接合面をＡｕ
めっき面とすることで、確実なろう付けが可能となる。
更に、レンズホルダのレーザ接合面をＮｉめっき面とす
ることで、確実なレーザ接合が可能となる。In this configuration, the lens is bonded to the Ni-plated surface of the lens holder with low-melting glass.
The lens is securely joined, and when the lens holder is brazed to the package body by Au-Sn, the low melting glass (melting point: 450) as the joining material of the lens is generated by heat (350 ° C.) for heating and melting the brazing material. C) is not thermally decomposed, and the bonding reliability of the lens is improved. In addition, the Au-plated surface of the lens holder is Au-Sn
Since the joining is performed with the brazing material, cracks and poor welding of the package body which have been generated by resistance welding are eliminated, and the joining surface of the Au-Sn brazing material of the lens holder is formed of Au.
By using a plated surface, reliable brazing can be performed.
Further, by setting the laser bonding surface of the lens holder to the Ni plating surface, reliable laser bonding can be performed.
【００１０】[0010]
【発明の実施の形態】以下、本発明の一実施形態を図１
乃至図４に基づいて説明する。まず、図１及び図２に基
づいて光通信用パッケージ全体の構成を説明する。セラ
ミック製のパッケージ本体３１は、アルミナ等のセラミ
ックグリーンシートを積層・焼成して製造したものであ
り、該パッケージ本体３１の内部には、光通信用のレー
ザダイオード（ＬＤ）、発光ダイオード（ＰＤ）等の半
導体素子３２を搭載するキャビティ３３が形成されてい
る。DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to FIG.
4 through FIG. First, the configuration of the entire optical communication package will be described with reference to FIGS. The package body 31 made of ceramic is manufactured by laminating and firing ceramic green sheets such as alumina. Inside the package body 31, a laser diode (LD) for optical communication and a light emitting diode (PD) are provided. A cavity 33 for mounting a semiconductor element 32 such as the above is formed.
【００１１】このパッケージ本体３１のキャビティ３３
の内面には、半導体素子３２をワイヤボンディング等で
接続するための導体パターン３４（図２参照）がＷ，Ｍ
ｏ等で形成され、該パッケージ本体３１の対向する２つ
の側面には、キャビティ３３内の導体パターン３４と導
通する導体パターン３５がＷ，Ｍｏ等で形成され、この
導体パターン３５にリードフレーム３６がＡｇろう材４
１で接合されている。The cavity 33 of the package body 31
A conductor pattern 34 (see FIG. 2) for connecting the semiconductor element 32 by wire bonding or the like
On the two opposing side surfaces of the package body 31, a conductor pattern 35 that is electrically connected to the conductor pattern 34 in the cavity 33 is formed of W, Mo, or the like. Ag brazing material 4
1 are joined.
【００１２】一方、パッケージ本体３１の上面には、シ
ール用メタライズパターン３７がＷ，Ｍｏ等で形成さ
れ、このシール用メタライズパターン３７にコバール等
の金属で形成されたシールリング３８がＡｇろう材４１
で気密に接合されている。そして、キャビティ３３内に
半導体素子３２を搭載した後に、シールリング３８に金
属製のキャップ（図示せず）をシーム溶接等により接合
することで、キャビティ３３を封止する。On the other hand, a sealing metallization pattern 37 is formed on the upper surface of the package main body 31 by W, Mo, or the like, and a seal ring 38 formed of a metal such as Kovar is formed on the sealing metallization pattern 37 by an Ag brazing material 41.
And are hermetically bonded. Then, after mounting the semiconductor element 32 in the cavity 33, the cavity 33 is sealed by joining a metal cap (not shown) to the seal ring 38 by seam welding or the like.
【００１３】パッケージ本体３１のリードフレーム３６
が接合されていない方の側面には、キャビティ３３に連
通する貫通孔３９が形成され、該側面に、シール用メタ
ライズパターン４０がＷ，Ｍｏ等で形成されている。The lead frame 36 of the package body 31
A through hole 39 communicating with the cavity 33 is formed on the side surface where is not joined, and a metallization pattern 40 for sealing is formed on the side surface using W, Mo, or the like.
【００１４】一方、レンズホルダ４３は、例えばコバー
ル、Ｆｅ−Ｎｉ合金等の金属により鍔部４３ａ付きの筒
状に形成され、その内部には、光ファイバ４４の先端と
対向させるためのレンズ４５が低融点ガラス４６で気密
に接合されている。このレンズホルダ４３は、貫通孔３
９内に挿入され、該レンズホルダ４３の鍔部４３ａの全
周がパッケージ本体３１側面のシール用メタライズパタ
ーン４０にＡｕ−Ｓｎろう材４７でろう付けされてい
る。On the other hand, the lens holder 43 is formed of a metal such as Kovar or Fe-Ni alloy into a cylindrical shape with a flange 43a, and a lens 45 for facing the tip of the optical fiber 44 is provided inside the lens holder 43. It is airtightly joined by the low melting point glass 46. The lens holder 43 has a through hole 3
The entire periphery of the flange 43a of the lens holder 43 is brazed to the metallization pattern 40 for sealing on the side surface of the package body 31 with an Au-Sn brazing material 47.
【００１５】レンズホルダ４３には、図３に示すような
めっき処理が施されている。すなわち、レンズ４５を接
合する接合面Ａと、光ファイバ４４の保持部材（図示せ
ず）をレーザ接合するレーザ接合面Ｂは、Ｎｉめっきの
みで被膜し、パッケージ本体３１にＡｕ−Ｓｎろう材４
７で接合する接合面Ｃは、Ｎｉめっきを下地とするＡｕ
めっきで被膜している。また、レンズホルダ４３の鍔部
４３ａの外周面Ｄのうち、レーザ接合面Ｂに近い部分
は、レーザ接合面であるため、Ｎｉめっきのみで被膜
し、その他の部分は、Ｎｉめっきのみ、又はＮｉめっき
を下地とするＡｕめっきで被膜している。また、レンズ
ホルダ４３の内周面Ｅは、Ｎｉめっきのみ、又はＮｉめ
っきを下地とするＡｕめっきで被膜している。The lens holder 43 is subjected to a plating process as shown in FIG. That is, the bonding surface A for bonding the lens 45 and the laser bonding surface B for laser bonding the holding member (not shown) of the optical fiber 44 are coated only with Ni plating, and the Au-Sn brazing material 4 is formed on the package body 31.
The bonding surface C to be bonded at 7 is made of Au with Ni plating as a base.
Coated with plating. Further, of the outer peripheral surface D of the flange portion 43a of the lens holder 43, a portion close to the laser bonding surface B is a laser bonding surface, and thus is coated only with Ni plating, and the other portions are only Ni plating or Ni plating. It is coated with Au plating with plating as a base. The inner peripheral surface E of the lens holder 43 is coated with only Ni plating or Au plating with Ni plating as a base.
【００１６】次に、上記構成の光通信用パッケージの製
造工程を図４に基づいて説明する。まず、レンズホルダ
４３の全面にＮｉめっきを施した後、レンズ接合面Ａ及
びレーザ接合面Ｂ等、Ｎｉめっき面を露出させる部分を
マスクして、Ａｕ−Ｓｎ接合面Ｃ等にＡｕめっきを施
す。この後、レンズホルダ４３のレンズ接合面Ａ（Ｎｉ
めっき面）にレンズ４５を低融点ガラス４６（融点：４
５０℃）で接合する。この際、Ｎｉめっき面と低融点ガ
ラス４６との相性は良く、レンズ４５の接合状態は良好
となる。Next, a manufacturing process of the optical communication package having the above configuration will be described with reference to FIG. First, after Ni plating is applied to the entire surface of the lens holder 43, Au plating is applied to the Au-Sn joint surface C and the like by masking the portions that expose the Ni plated surface such as the lens joint surface A and the laser joint surface B. . Thereafter, the lens joining surface A (Ni
A lens 45 is attached to a low-melting glass 46 (melting point: 4) on the plated surface.
(50 ° C.). At this time, the compatibility between the Ni plating surface and the low-melting glass 46 is good, and the bonding state of the lens 45 is good.
【００１７】一方、パッケージ本体３１に対して、リー
ドフレーム３６、シールリング３８をＡｇろう材４１で
ろう付けする。この後、リードフレーム３６、シールリ
ング３８、パッケージ本体３１側面のシール用メタライ
ズパターン４０等に、Ｎｉめっきを施し、その上からＡ
ｕめっきを施す。On the other hand, the lead frame 36 and the seal ring 38 are brazed to the package body 31 with an Ag brazing material 41. Thereafter, Ni plating is applied to the lead frame 36, the seal ring 38, the metallization pattern 40 for sealing on the side surface of the package body 31, and the like, and A
Apply u plating.
【００１８】この後、このパッケージ本体３１の貫通孔
３９にレンズホルダ４３を挿入し、該パッケージ本体３
１のＡｕ−Ｓｎ接合面Ｃ（Ａｕめっき面）に該レンズホ
ルダ４３をＡｕ−Ｓｎろう材４７により３００〜４００
℃でろう付けする。この際、Ａｕめっき面とＡｕ−Ｓｎ
ろう材４７との相性は良く、レンズホルダ４３の接合状
態は良好となる。また、レンズ４５の接合材である低融
点ガラス４６の融点はＡｕ−Ｓｎろう付け温度よりも高
いため、Ａｕ−Ｓｎろう付け時に低融点ガラス４６が溶
融することがなく、レンズ４５の接合状態が良好に保た
れる。Thereafter, the lens holder 43 is inserted into the through hole 39 of the package main body 31, and the package main body 3 is inserted.
The Au-Sn joint surface C (Au-plated surface) of the first lens holder 43 is 300-400 with the Au-Sn brazing material 47.
Braze at ° C. At this time, the Au plating surface and the Au-Sn
The compatibility with the brazing material 47 is good, and the bonding state of the lens holder 43 is good. Further, since the melting point of the low-melting glass 46, which is the joining material of the lens 45, is higher than the Au-Sn brazing temperature, the low-melting glass 46 does not melt during the Au-Sn brazing, and the joining state of the lens 45 is reduced. It is kept good.
【００１９】以上のようにして製造した光通信用パッケ
ージの品質を評価する試験を行ったので、その試験結果
について説明する。まず、上記製造工程で製造した実施
例のサンプルと、レンズホルダの全面にＡｕめっきを施
した比較例のサンプルをそれぞれ３０個ずつ用意し、レ
ンズ接合不良とレーザ接合不良を評価する試験を行った
ので、その試験結果を下記の表１に示す。A test for evaluating the quality of the optical communication package manufactured as described above was performed. The test result will be described. First, 30 samples each of the sample of the example manufactured in the above manufacturing process and the sample of the comparative example in which Au plating was applied to the entire surface of the lens holder were prepared, and a test was performed to evaluate defective lens bonding and defective laser bonding. Therefore, the test results are shown in Table 1 below.
【００２０】[0020]
【表１】 [Table 1]
【００２１】この試験結果によれば、部分Ａｕめっきし
た実施例では、レンズ接合面Ａ（Ｎｉめっき面）と低融
点ガラスとの接合状態が良好であり、レンズ接合不良は
発生しなかった。また、レーザ接合面Ｂのレーザ接合状
態も良好であり、レーザ接合不良は発生しなかった。According to the test results, in the embodiment where the partial Au plating was performed, the bonding state between the lens bonding surface A (Ni-plated surface) and the low-melting glass was good, and no defective lens bonding occurred. Further, the laser bonding state of the laser bonding surface B was good, and no laser bonding failure occurred.
【００２２】これに対し、レンズホルダの全面をＡｕめ
っきした比較例では、レンズ接合面（Ａｕめっき面）と
低融点ガラスとの相性が悪く、全てのサンプルがレンズ
接合不良となった。また、レーザ接合面（Ａｕめっき
面）とレーザ接合との相性も悪く、３０サンプル中、２
８個もレーザ接合不良が発生した。On the other hand, in the comparative example in which the entire surface of the lens holder was Au-plated, the compatibility between the lens bonding surface (Au-plated surface) and the low-melting glass was poor, and all the samples had poor lens bonding. Further, the compatibility between the laser bonding surface (Au-plated surface) and the laser bonding is poor.
Eight laser defects also occurred.
【００２３】以上の試験結果から、低融点ガラスで接合
するレンズ接合面Ａとレーザ接合面Ｂは、Ｎｉめっき面
とすることで、レンズ接合状態とレーザ接合状態が共に
良好になることが確認された。From the above test results, it has been confirmed that both the lens bonding state and the laser bonding state can be improved by using the Ni-plated surface for the lens bonding surface A and the laser bonding surface B to be bonded with the low melting point glass. Was.
【００２４】また、実施例のサンプル（３０個）につい
て熱衝撃試験と温度サイクル試験を行ったので、その試
験結果を下記の表２に示す。Further, a thermal shock test and a temperature cycle test were performed on the samples (30 samples) of the examples, and the test results are shown in Table 2 below.
【００２５】[0025]
【表２】 [Table 2]
【００２６】ここで、熱衝撃試験の条件は、ＭＩＬ−Ｓ
ＴＤ（米軍規格）のコンディションＣに従い、サンプル
を１５０℃の液中に浸漬して加熱した後、−６５℃の液
中に５分以上浸漬して冷却し、これを再び１５０℃の液
中で加熱するというサイクルを１５サイクル繰り返す。
この際、サンプルを低温の液と高温の液との間で移動さ
せる時間は１０秒以下とする。この熱衝撃試験を行った
３０個のサンプルについてグロスリーク試験を行ったと
ころ、全てのサンプルのリーク率がＭＩＬ−ＳＴＤの規
格値である１×１０-8atm cc/secよりも少なく、不良は
全く発生せず、全てのサンプルが熱衝撃試験で合格とな
った。Here, the conditions of the thermal shock test were MIL-S
In accordance with the condition C of the TD (U.S. military standard), the sample is immersed in a liquid at 150 ° C and heated, then immersed in a liquid at -65 ° C for 5 minutes or more, cooled, and then immersed in the liquid at 150 ° C again. Is repeated for 15 cycles.
At this time, the time for moving the sample between the low-temperature liquid and the high-temperature liquid is 10 seconds or less. When a gross leak test was performed on 30 samples subjected to the thermal shock test, the leak rate of all the samples was less than 1 × 10 −8 atm cc / sec which is the standard value of MIL-STD. None occurred and all samples passed the thermal shock test.
【００２７】また、温度サイクル試験の条件は、ＭＩＬ
−ＳＴＤ（米軍規格）のコンディションＣに従い、サン
プルを−６５℃の気中で冷却した後、１５０℃の気中で
加熱し、これを再び−６５℃の気中で冷却するというサ
イクルを１０００サイクル繰り返す。この際、サンプル
を低温の気中と高温の気中との間で移動させる時間は５
分以下とする。この温度サイクル試験を行った３０個の
サンプルについてグロスリーク試験を行ったところ、全
てのサンプルのリーク率がＭＩＬ−ＳＴＤの規格値であ
る１×１０-8atm cc/secよりも少なく、不良は全く発生
せず、全てのサンプルが温度サイクル試験で合格となっ
た。The condition of the temperature cycle test is MIL
According to Condition C of -STD (U.S. military standard), the sample was cooled in air at -65 ° C, then heated in air at 150 ° C, and cooled again in air at -65 ° C. Repeat cycle. At this time, the time for moving the sample between the low temperature air and the high temperature air is 5 minutes.
Minutes or less. When a gross leak test was performed on 30 samples subjected to the temperature cycle test, the leak rate of all the samples was less than the standard value of MIL-STD of 1 × 10 −8 atm cc / sec. None occurred and all samples passed the temperature cycling test.
【００２８】以上の試験結果から明らかなように、上記
実施形態では、レンズホルダ４３のＮｉめっき面Ａにレ
ンズ４５を低融点ガラス４６で接合するようにしたの
で、レンズホルダ４３にレンズ４５を確実に接合できる
と共に、レンズホルダ４３をパッケージ本体３１にＡｕ
−Ｓｎろう付けする際に、Ａｕ−Ｓｎろう材４７を加熱
溶融する熱（３００〜４００℃）で、レンズ４５の接合
材である低融点ガラス４６（融点：４５０℃）が熱分解
することがなく、レンズ４５の接合信頼性を向上でき
る。しかも、レンズホルダ４３のＡｕめっき面Ｃをパッ
ケージ本体３１にＡｕ−Ｓｎろう材４７で接合するよう
にしたので、抵抗溶接で発生していたパッケージ本体３
１のクラックや溶接不良がなくなると共に、レンズホル
ダ４３のＡｕ−Ｓｎろう材４７の接合面ＣをＡｕめっき
面とすることで、確実なろう付けが可能となり、レンズ
ホルダ４３の接合不良を防止できる。更に、レンズホル
ダ４３のレーザ接合面ＢをＮｉめっき面とすることで、
確実なレーザ接合が可能となり、レーザ接合不良を防止
できる。As is clear from the above test results, in the above embodiment, the lens 45 is bonded to the Ni-plated surface A of the lens holder 43 with the low-melting glass 46, so that the lens 45 is securely attached to the lens holder 43. And the lens holder 43 is attached to the package body 31 by Au.
In the case of -Sn brazing, the low melting glass 46 (melting point: 450 ° C.) which is the joining material of the lens 45 may be thermally decomposed by heat (300 to 400 ° C.) for heating and melting the Au—Sn brazing material 47. Therefore, the joining reliability of the lens 45 can be improved. Moreover, the Au-plated surface C of the lens holder 43 is joined to the package body 31 with the Au-Sn brazing material 47, so that the package body 3 generated by resistance welding is formed.
In addition to eliminating the cracks and poor welding of No. 1 and making the bonding surface C of the Au-Sn brazing material 47 of the lens holder 43 an Au-plated surface, reliable brazing becomes possible and the bonding failure of the lens holder 43 can be prevented. . Furthermore, by making the laser bonding surface B of the lens holder 43 a Ni-plated surface,
Reliable laser bonding can be performed, and laser bonding failure can be prevented.
【００２９】尚、上記実施形態では、レンズホルダ４３
の左端面Ａのみをレンズ接合面（Ｎｉめっき面）とした
が、レンズホルダ４３の内周面Ｅもレンズ接合面（Ｎｉ
めっき面）として、内周面Ｅにも低融点ガラスでレンズ
４５を接合するようにしても良い。In the above embodiment, the lens holder 43
Is used as the lens joining surface (Ni plated surface), but the inner peripheral surface E of the lens holder 43 is also used as the lens joining surface (Ni plating surface).
As the plating surface), the lens 45 may be joined to the inner peripheral surface E with low-melting glass.
【００３０】また、上記実施形態では、パッケージ本体
３１をセラミックで構成したが、金属で構成したパッケ
ージ本体を用いても良く、例えば本体側壁をコバール、
底板をＣｕ−Ｗ等の金属で形成しても良い。In the above embodiment, the package main body 31 is made of ceramic. However, a package main body made of metal may be used.
The bottom plate may be formed of a metal such as Cu-W.
【００３１】[0031]
【発明の効果】以上の説明から明らかなように、本発明
の光通信用パッケージによれば、レンズホルダのレンズ
接合面及びレーザ接合面をＮｉめっきで被膜し、パッケ
ージ本体に接合する接合面をＡｕめっきで被膜し、レン
ズホルダのＮｉめっき面にレンズを低融点ガラスで接合
すると共に、レンズホルダのＡｕめっき面をパッケージ
本体にＡｕ−Ｓｎろう材で接合するようにしたので、レ
ンズ接合不良やレーザ接合不良が発生しなくなると共
に、熱衝撃試験や温度サイクル試験でもリークが発生せ
ず、信頼性向上、歩留り向上を実現することができる。As is clear from the above description, according to the optical communication package of the present invention, the lens bonding surface and the laser bonding surface of the lens holder are coated with Ni plating, and the bonding surface bonded to the package body is formed. The film was coated with Au plating, and the lens was bonded to the Ni-plated surface of the lens holder with low-melting glass, and the Au-plated surface of the lens holder was bonded to the package body with an Au-Sn brazing material. Laser bonding failure does not occur, and no leak occurs even in a thermal shock test or a temperature cycle test, so that reliability and yield can be improved.
【図１】本発明の一実施形態を示す光通信用パッケージ
の縦断面図FIG. 1 is a longitudinal sectional view of an optical communication package showing an embodiment of the present invention.
【図２】光通信用パッケージを部分的に破断して示す斜
視図FIG. 2 is a perspective view showing a partially broken optical communication package.
【図３】レンズを接合したレンズホルダの拡大縦断面図FIG. 3 is an enlarged longitudinal sectional view of a lens holder to which a lens is joined.
【図４】光通信用パッケージの製造工程を示す工程図FIG. 4 is a process diagram showing a manufacturing process of the optical communication package.
【図５】従来例を示す光通信用パッケージの縦断正面図FIG. 5 is a vertical sectional front view of an optical communication package showing a conventional example.
３１…パッケージ本体、３２…半導体素子、３３…キャ
ビティ、３６…リードフレーム、３８…シールリング、
３９…貫通孔、４０…シール用メタライズパターン、４
１…Ａｇろう材、４３…レンズホルダ、４３ａ…鍔部、
４４…光ファイバ、４５…レンズ、４６…低融点ガラ
ス、４７…Ａｕ−Ｓｎろう材。31: package body, 32: semiconductor element, 33: cavity, 36: lead frame, 38: seal ring,
39: through hole, 40: metallized pattern for sealing, 4
1 ... Ag brazing material, 43 ... Lens holder, 43a ... Flange,
44: Optical fiber, 45: Lens, 46: Low melting point glass, 47: Au-Sn brazing material.
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平７−13047（ＪＰ，Ａ) 特開 平６−273640（ＪＰ，Ａ) 特開 平６−102436（ＪＰ，Ａ) 特開 平４−152307（ＪＰ，Ａ) 特開 平１−133009（ＪＰ，Ａ) 特開 平２−61604（ＪＰ，Ａ) 実開 平４−1505（ＪＰ，Ｕ) 実開 平３−112710（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.7，ＤＢ名) G02B 6/26 - 6/27 G02B 6/30 - 6/35 G02B 6/42 - 6/43 ────────────────────────────────────────────────── ─── Continuation of front page (56) References JP-A-7-13047 (JP, A) JP-A-6-273640 (JP, A) JP-A-6-102436 (JP, A) JP-A-4-130 152307 (JP, A) JP-A-1-13309 (JP, A) JP-A-2-61604 (JP, A) JP-A-4-1505 (JP, U) JP-A-3-112710 (JP, U) (58) Field surveyed (Int.Cl. 7 , DB name) G02B 6/26-6/27 G02B 6/30-6/35 G02B 6/42-6/43
Claims (1)
属製で、その内部に光通信用の半導体素子を搭載するキ
ャビティを形成すると共に、該パッケージ本体の側面
に、該キャビティに連通する貫通孔を形成し、筒状に形
成された金属製のレンズホルダの内部に、光ファイバの
先端と対向させるためのレンズを接合すると共に、該レ
ンズホルダを前記貫通孔に挿入して前記パッケージ本体
に接合して成る光通信用パッケージにおいて、前記レンズホルダの表面にＮｉめっきを施すと共に、そ
のＮｉめっき面のうち、前記パッケージ本体に接合する
接合面以外の部分をマスクしてＡｕめっきを施すこと
で、該パッケージ本体に接合する接合面をＡｕめっき面
とすると共に、前記レンズを接合する接合面及び前記光
ファイバの保持部材をレーザ接合する接合面をＮｉめっ
き面とし、 前記レンズホルダのＮｉめっき面に前記レンズを低融点
ガラスで接合し、 前記レンズホルダのＡｕめっき面を前記パッケージ本体
にＡｕ−Ｓｎろう材で接合したことを特徴とする光通信
用パッケージ。1. A package body made of ceramic or metal, a cavity for mounting a semiconductor element for optical communication is formed therein, and a through hole communicating with the cavity is formed on a side surface of the package body. A metal lens holder formed into a cylindrical shape, a lens for facing the tip of the optical fiber is joined to the inside, and the lens holder is inserted into the through hole and joined to the package body. In the optical communication package, the surface of the lens holder is plated with Ni and
Of the Ni-plated surface of the above, joined to the package body
Apply Au plating by masking the parts other than the joint surface
And the bonding surface to be bonded to the package body is an Au-plated surface.
And a bonding surface for bonding the lens and the light
The joint surface for laser joining the fiber holding member
And can surface, the lens is bonded with a low melting point glass Ni plated surface of the lens holder, for optical communication, characterized in that the Au-plated surface of the lens holder is joined with Au-Sn brazing material to said package body package.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25817397A JP3222815B2 (en) | 1997-09-24 | 1997-09-24 | Optical communication package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25817397A JP3222815B2 (en) | 1997-09-24 | 1997-09-24 | Optical communication package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH1195070A JPH1195070A (en) | 1999-04-09 |
| JP3222815B2 true JP3222815B2 (en) | 2001-10-29 |
Family
ID=17316548
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25817397A Expired - Lifetime JP3222815B2 (en) | 1997-09-24 | 1997-09-24 | Optical communication package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3222815B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002014260A (en) * | 2000-04-25 | 2002-01-18 | Oki Electric Ind Co Ltd | Planar mounting optical module and transmission substrate using such module |
| JP2003050341A (en) | 2001-08-06 | 2003-02-21 | Yamaha Corp | Optical parts composite and method for manufacturing the same |
| JP4028270B2 (en) * | 2002-03-19 | 2007-12-26 | 古河電気工業株式会社 | Optical module |
| JP4285753B2 (en) * | 2004-06-21 | 2009-06-24 | 田中貴金属工業株式会社 | Hermetic seal cover and method for manufacturing the same |
| JP4678154B2 (en) * | 2004-07-28 | 2011-04-27 | 日亜化学工業株式会社 | Semiconductor laser package and manufacturing method of semiconductor laser package |
-
1997
- 1997-09-24 JP JP25817397A patent/JP3222815B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH1195070A (en) | 1999-04-09 |
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