JP3218328B2 - Bending type three-dimensional structure circuit device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bent three-dimensional structure circuit device for forming a circuit in a three-dimensional structure by bending a flat plate material on which a circuit is formed in advance.

[0002]

2. Description of the Related Art Conventionally, in order to form a circuit having a three-dimensional structure, it has been proposed to form a three-dimensional structure by etching using a silicon material and form a circuit on the surface thereof. This method has an advantage that it is suitable for mass production and that an electronic circuit can be easily formed on the material.

[0003] Further, in order to form a three-dimensional structure, an optical molding method in which a resin is solidified using a laser beam is also used. This method has an advantage that it is easy to form an overhang structure and a cavity, and it is possible to form a complicated three-dimensional structure.

[0004]

On the other hand, in the conventional technology for forming a three-dimensional structure, in which a silicon material is used, the processing of the silicon material has conventionally been carried out by forming technology of a two-dimensional structure. However, the processing technology of the three-dimensional structure has not yet been sufficiently established, and it is extremely difficult to form a three-dimensional structure with a deep carving.

Further, when performing three-dimensional processing using a silicon material, the material is substantially limited to silicon oxide, and selection of the material of the material is limited. Furthermore, since the silicon material is highly brittle, it cannot be physically deformed significantly.

[0006] On the other hand, in the optical shaping method using the laser beam, it is necessary to use a resin which is cured by irradiating the laser beam. Since it is necessary to repeat the process of forming the next resin layer on the resin after curing the resin and irradiating the layer with a laser beam, it takes more time to wait for the curing time of the resin, which is not suitable for mass production. There is a problem that is.

Further, since the material is resin, in order to form a circuit in the three-dimensional structure, the three-dimensional structure is formed as described above.
After molding a three-dimensional structure, it is necessary to mount and wire a circuit on each surface of this structure to form a three-dimensional circuit, and the process becomes complicated. It has the drawback that it is difficult to mount and wire the circuit.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a three-dimensional structure circuit device capable of easily manufacturing a circuit having a complicated three-dimensional structure using various materials.

[0009]

In order to solve the above-mentioned problems, the present invention is directed to a metal plate with a circuit having a predetermined shape having a circuit formed on the surface thereof via an insulating layer. In a bent three-dimensional circuit device having a three-dimensional structure formed by bending, a detected portion is formed on one of the opposing surfaces of a prism formed by bending a metal plate with a circuit into a prism shape.
On the other hand, a bent type three-dimensional structure circuit device is provided in which a detection unit is provided and each surface is fixed to two relatively movable members.

According to a second aspect of the present invention, there is provided the bent three-dimensional structure circuit device according to the first aspect, wherein the detected portion is a magnet and the detecting portion is a Hall element.

According to a third aspect of the present invention, a single metal plate with a circuit is bent and formed so as to form a three-dimensional structure in which a plurality of prisms each having a right angle to each axis are arranged. Is a bent three-dimensional structure circuit device.

According to a fourth aspect of the present invention, there is provided the bent three-dimensional structure circuit device according to the third aspect, wherein the two prisms are arranged so that the axial directions thereof are the X and Y axis directions. is there.

According to a fifth aspect of the present invention, there is provided the bent three-dimensional structural circuit device according to the third aspect, wherein the three prisms are arranged so that the axial directions of the three prisms are the X, Y, and Z axis directions. Things.

According to a sixth aspect of the present invention, there is provided the bent three-dimensional structure circuit device according to the first aspect, wherein the attachment portion to the member is also integrally formed.

[0015]

Embodiments of the present invention will be described with reference to the drawings. FIG. 1 shows an initial step of manufacturing a basic structure of a bent type three-dimensional structure circuit device according to the present invention. In the present invention, as shown in the first perspective view of FIG. Metal plate 1 with thickness suitable for size, application, etc.
Is cut into the shape of a three-dimensional structure to be manufactured by means such as etching, and the metal flat plate 2 is formed. In the embodiment shown in the figure, it is cut out into one developed shape so as to finally have a rectangular parallelepiped box shape.

At the same time as this cutting, a shallow groove 3 is formed in the bent portion by etching so that the bent portion can be easily bent at a predetermined position later. The groove 3 can be formed on either the mountain fold side or the valley fold side of the bent portion, but is formed on the mountain fold side in the illustrated embodiment. FIG.
(B) is a cross-sectional view of the metal plate 2 formed in this manner.

The metal plate 2 formed as described above
On the other hand, an insulating layer 4 is formed on the surface side by coating as shown in FIG. Next, a conductor foil 5 such as copper is attached to the surface of the insulating layer 4 as shown in FIG. The flat body 6 having such a three-layer structure is shown in FIG.
It is shown in FIG.

Next, the portion of the conductor foil 5 is etched into a predetermined shape to form a circuit pattern such as a conductor portion and a land portion. Thereafter, as shown in FIG. 2B, predetermined electronic components 8 such as a resistor, a capacitor, an IC, and an LSI are mounted at predetermined positions on the circuit pattern 7, and reflow soldering is performed. The generation of the circuit pattern and the mounting of the electronic components and the like as described above can be performed not only on the front surface side of the metal plate body 2 but also on the rear surface side as necessary by the same forming method.

The thus formed two-dimensional electronic component mounting plate 10 is bent along the bent portion.
As described above, the shallow groove 3 is formed in the bent portion with respect to the metal plate 2.
Is formed, it can be easily bent into a predetermined shape. In this embodiment, as shown in FIG. 2C, a rectangular parallelepiped box-shaped structure 11 in which electronic components are mounted on the outer wall is formed. . In addition, by the same method, a rectangular parallelepiped box-shaped structure in which electronic components are mounted on the inner wall can be formed. The above-mentioned bending can be automatically performed by a machine in addition to a manual operation. When this three-dimensional structure circuit device is applied to a micromachine, the three-dimensional structure circuit device is contactless by a Lorentz force utilizing a force generated by an electric current. It can also be folded. Therefore, using a thin metal plate, it is possible to form structures having various shapes such as a crane shape which is a typical shape of origami.

Based on the basic structure of the bent three-dimensional circuit device as described above, a displacement is formed so that a displacement of the structure can be detected while forming a box-shaped three-dimensional structure. An example of a structure with a sensor will be described with reference to FIGS. In this embodiment, a metal plate cut into a shape as shown in FIG. This metal plate has a square pillar shape as shown in FIG.
This is a developed shape of the three-dimensional structure, which has a joint margin 29 and has a protruding piece 22 formed on the side.

On the metal plate having such a shape, in the same manner as shown in FIG. 1, coating of an insulating layer, pasting of a conductor foil, generation of a circuit pattern 18 by etching of the conductor foil, The electronic components 31 are sequentially mounted on the electronic component 31 to obtain the electronic component mounting plate 20. The electronic component mounting flat body 20 is bent along a preformed fold groove 21 to form a quadrangular prism-shaped bent three-dimensional structure circuit device as shown in FIG. The structure 24 with the displacement sensor can be formed. In the folding curve, a solid line indicates a mountain-folded portion, a broken line indicates a valley-folded portion, and so on.

In the structure 24 with a displacement sensor,
A bent piece 23 provided at the tip of the protruding piece 22 extending from the upper surface 27 toward the lower surface 28 is arranged close to the lower surface 28,
A Hall element 30 is arranged in the vicinity of the lower surface 28, and a signal processing IC 31 for processing a signal from the Hall element 30 adjacent to the Hall element 30 is provided on the lower surface 28.
Is provided. Further, connection terminals for outputting the signal of the signal processing IC 31 to the control device are arranged on the side of the lower surface 28. A small permanent magnet 33 is fixed to the back surface of the bent portion 23 formed at the tip of the protruding piece 22. The signal processing IC 31 and the connection terminal 32 can be provided at arbitrary positions such as the upper surface 27.

The structure 24 with the displacement sensor formed as described above is disposed between the first member 25 and the second member 26, for example, as shown in FIG. The upper surface 27 is adhesively fixed to the first member 25 and the lower surface 28 is adhesively fixed to the second member 26, respectively. At this time, the bent piece 23 at the tip of the protruding piece 22 extending from the upper face 27 is close to the lower face 28, whereby the permanent magnet 33 provided on the back face of the bent piece 23 is provided.
Are arranged close to a Hall element 30 as an electronic component provided at a position facing the bent piece 23 on the lower surface 28.

Structure 2 with displacement sensor thus constructed
In FIG. 4, for example, as shown in FIG. 4B, when the second member 26 moves rightward in the figure, the displacement sensor-equipped structure 24 is formed of a thin metal plate and has elasticity.
It displaces with the second member 26 while generating a reaction force that increases with the displacement amount like a spring. At this time, since the detected magnetic force of the permanent magnet 33 changes, the Hall element 30
Generates an output signal in accordance with the displacement of. This output signal is processed by the signal processing IC 31 and output from the connection terminal 32 to the outside.

The structure 24 with the displacement sensor having such a structure.
Can be used in various fields. For example, as shown in FIG. 5, the present invention can also be applied to an elastic member for absorbing a position error in a component gripping portion provided at the tip of a transfer arm of an assembling robot or the like. That is, in an assembling robot or the like, an article is gripped by the tip of a transfer arm, and is moved horizontally, for example, to a predetermined position above an assembly point, and then vertically lowered to move the conveyed article to a predetermined position. I'm doing it down. Such operations are not limited to the horizontal and vertical conveyance of the article as described above, and conveyance in various forms is performed for assembling in various postures. Not limited to this, similar operations are performed in various types of article transport devices.

In a transfer apparatus using such a transfer arm, as shown in the schematic diagram of FIG.
The component is gripped by the component gripper provided at the tip, and the component insertion port 3
When inserting a component into the component 6, if the component cannot be moved accurately due to a positional error and the component is lowered vertically at a position shifted in the horizontal direction, the lower end of the component is inserted into the component insertion port 3.
6 cannot be lowered any more because it abuts against the opening edge of 6 and cannot be assembled. At this time, it is conceivable that the component insertion opening is sufficiently large. However, in many cases, the component insertion opening cannot be made too large due to deterioration in accuracy of the component assembly product.

Therefore, a chamfered portion 37 is formed on the periphery of the component insertion opening, and when the component comes into contact with the periphery of the component insertion opening at a position close to the component insertion opening 36 as described above, the tip of the component comes into contact with the chamfered portion 37, The component 49 is guided to the center of the component insertion port 36 by the lowering of the transfer arm 41. At this time, when the component is firmly fixed to the transfer arm 41, even if the component 49 falls, the chamfer 37
Therefore, the elastic movable member 40 is provided between the transfer arm and the component gripping portion.

As a result, the lower end of the component 49 is
When the part 49 descends in a state where the part 49 is in contact with the part 7, the part holding part is moved substantially horizontally by the elastic movable member 40, and
9 is guided to the center of the component insertion port 36. Then, finally, the outer periphery of the component 49 is
Inserted while being guided to the inner circumference. The elastic movable member 40 for performing such an operation is an RCC (Remote Center Co., Ltd.).
mpliance), which is widely used in robots for assembly work and the like.

As the elastic movable member 40 for absorbing the position error of the transfer arm as described above, for example, the one shown in the schematic diagram of FIG. 5 has been proposed. That is, the elastic movable member 40 includes an upper plate 43 having a projection 42 fixed to the transfer arm 41, and a lower plate 44 having a grip portion 45 capable of gripping and detaching the component 49. , A plurality of fixing pins 46 such as three
The lower plate 44 is similarly provided with the fixing pins 46 of the upper plate 43.
A fixing pin 47 is provided in opposition to
Elastic cylinder 48 made of rubber or the like is arranged between 6, 47,
Both fixing pins 46 and 47 are inserted and fixed in the elastic cylinder 48 in the axial direction.

The lower end of the component 49 is pressed by the elastic movable member 40 during the assembly of the component 49 as described above.
When being guided by the chamfered portion 37 of the insertion port and moving horizontally toward the center of the insertion port, the lower plate 44 of the elastic movable member 40 moves horizontally. At this time, at both ends of the elastic cylindrical body 48, the elastic cylindrical body 48 is held in a state in which it cannot move in the horizontal direction by the internal fixing pins 46 and 47. It moves horizontally by the deformation and absorbs the movement in the pressing direction.

If the force of the transfer arm 41 pressing the component 49 at this time, that is, the force F of pressing the component by the elastic movable member 40 without the component being smoothly inserted into the insertion opening, is large, the component is damaged, and The member into which the part is inserted is also damaged. Therefore, it is necessary to detect this pressing force, move the transfer arm 41 when the force is large, and operate so that the center line of the component and the center line of the insertion port are more matched.

Conventionally, when detecting such a force that the transfer arm presses the component, a strain gauge is pasted and fixed to the side of the elastic cylinder 48 of the elastic movable member, and the pressing force of the component by the transfer arm 41 is conventionally used. Attempts have been made to measure the amount of deformation of the elastic cylinder 48 deformed according to F with a strain gauge. However, such a strain gauge is expensive and causes an increase in the cost of the apparatus. Further, although strain gauges are suitable for measuring small deformations,
It is not always suitable for use with a material having a large deformation amount such as CC. On the other hand, it is also conceivable that the force of pressing the component by the transfer arm is directly detected by the force sensor without providing the strain gauge as described above. However,
Rigidity is required for the entire apparatus, and it is difficult to apply the apparatus to a flexible deformable one such as the RCC.

As a countermeasure, the present applicant has previously described a transfer position error absorbing device in which an upper plate 43 fixed to a transfer arm and a lower plate 44 provided with a component holding portion 45 are connected by an elastic movable member. , A permanent magnet is fixed to the upper plate 43 or the lower plate 44, and the lower plate 44 on the side opposite to the side on which the permanent magnet is fixed.
Alternatively, a Hall element is fixed to the upper plate 43 in the vicinity of the permanent magnet, and a pressing force F against a component of the transfer arm 41 due to a position error of the transfer arm is detected by an output of the Hall element. . Thus, the force applied to the component by the transfer arm 41 is converted into the movement amount of the transfer position error absorbing device, and the movement amount can be detected by the Hall element, and can be measured accurately and at low cost. Like that.

The three-dimensional structure circuit device according to the present invention is used as a structure with a displacement sensor in which the transfer arm position error absorbing device as described above and a sensor for detecting a displacement generated when absorbing the position error are integrated. be able to.
FIG. 6 shows the structure 24 with the displacement sensor according to the present invention fixed to the transfer arm 41 by the fixing portion 39. Structure 24 with displacement sensor in device shown in FIG.
Operates similarly to the device shown in FIG. That is, when the component 49 is inserted into the component insertion slot and abuts against the chamfered portion 37 on the periphery of the insertion slot, the transport arm 41 resists the elastic force of the structure with the displacement sensor according to the force F pushing down the component. The component 49 and the lower plate 44 move to the right in the figure as shown. As a result, the lower surface 28 of the displacement sensor-equipped structure 24 fixed to the lower plate 44 moves, and the Hall element 30 also moves. FIG. 6 shows this state. As a result, the position of the Hall element 30 is shifted with respect to the magnet 33 provided at the tip of the protruding piece 22 that does not move in the horizontal plane direction. Since the magnetic force of the magnet 33 detected by the Hall element 30 changes due to the displacement, the amount of movement of the component 49 in the left-right direction in FIG. Can be detected.

When the structure 24 with the displacement sensor is attached to the transfer arm position error absorbing device, the force applied to the component by the transfer arm can be detected based on the above principle. Parts 4 in the device
9 is indeterminate at which position of the conical chamfered portion 37 at the peripheral edge of the component insertion opening 36 abuts. If the moving direction of the component 49 shown in FIG. It may move in the shifted Y direction, and thus movement in all directions on the XY plane is considered. Thus, the structure 24 with the displacement sensor that detects the movement only in the X direction as described above is not sufficient. .

As a countermeasure, for example, as shown in FIG. 7B, a structure 51 with a Y-axis direction displacement sensor having the same configuration as the structure with a displacement sensor shown in FIG. It is preferable to use in combination with the structure 24 with a sensor. When the structure 51 with the Y-axis direction displacement sensor is used as a single sensor, when the upper surface 52 is fixed to the first member and the lower surface 53 is fixed to the second member, the second member is fixed to the Y-axis. When the second member moves relatively in the direction, the amount of movement of the second member in the Y-axis direction can be detected by the same operation as described above. The structure 51 with the Y-axis direction displacement sensor can be manufactured by bending a plate having the shape shown in FIG. 3A, but is cut out and creased as shown in FIG. 7A. It can also be manufactured by a plate.

When the above-described structure 51 with the displacement sensor in the Y-axis direction is combined with the structure 24 with the displacement sensor for detecting the displacement in the X-axis direction, a plate having the shape shown in FIG. The lower surface portion 28 and the upper surface portion 52 of the plate having the shape shown in FIG. 7A are used as a common first common surface portion 54 to form a plate having a shape as shown in FIG. By attaching and folding this into an origami shape, a structure 55 with an XY axis direction displacement sensor as shown in FIG. 8B can be manufactured. In the structure 55 with an XY-axis direction displacement sensor, a structure 56 with an X-axis direction displacement sensor located at an upper part in the upper part of the figure, a structure part 57 with a Y-axis direction displacement sensor located at a lower part, and Are formed continuously in the first common surface portion 54.

The structure 55 with the XY axis direction displacement sensor
6 is fixed to the transfer arm 41 as shown in FIG. 6, the uppermost end 58 is fixed to the transfer arm 41, and the lowermost end 59 is fixed to the lower plate 44. Thus, when the lower plate 44 moves together with the component 49, the amount of movement in the X-axis direction is detected by the structure unit 56 with the X-axis direction displacement sensor at the top in the figure, and the amount of movement in the Y-axis direction is Since the detection is performed by the sensor-equipped structure unit 57, by processing both detection signals, the movement of the component 49 in the horizontal plane can be detected, and the transfer arm accurately detects the force acting on the component. be able to.

On the other hand, in the transfer arm position error absorbing device, the component 49
It is displaced not only in the axial direction but also in the Z direction. This displacement in the Z direction is directly related to the force of the transfer arm 41 pressing the component 49, and the transfer arm 4 is measured by measuring this displacement.
1 can detect the force pressing the component. In particular,
When the component descends far away from the component insertion port 36 and its end does not reach the chamfered portion 37, the movement of the lower plate in the Z-axis direction is the same as the force by which the transfer arm 41 presses the component 49. Become.

To measure such a displacement in the Z direction,
For example, a structure 60 with a Z-direction displacement sensor as shown in FIG. 9B can be used. The structure 60 with a Z-direction displacement sensor includes a projecting piece 63 projecting from the first side surface 61 in the direction of the second side surface 62.
Is provided with an upper fixing surface portion 64 extending above the first side surface portion 61 and extending horizontally from the tip thereof. FIG.
As is apparent from the view of the unfolded state of (a), the rod fixing piece 65 protrudes from the side of the first side surface portion 61 opposite to the side where the protruding piece 63 extends. Are formed with four folds, which are bent at the folds and the bent front end portion 69 is fixed to the first side surface portion 61, whereby the rod gripping portion 66 as shown in FIG.
To form A rod 67 protruding from a moving member in the Z-axis direction provided below the rod holding portion 66 is held and fixed to the rod holding portion 66. The structure with the Z-axis direction displacement sensor having such a structure can be formed by a plate having a fold and having a shape as shown in FIG. 9A.

When using the structure 60 with the Z-axis direction displacement sensor alone, the upper fixing surface portion 64 is fixed to the transfer arm 41 and the rod holding portion 66 holds the rod 67 fixed to the lower plate. And fix it. With this configuration, when the transfer arm 41 presses a component as described above, the first side surface portion 61 together with the lower plate 44 is fixed to the fixed upper fixed surface portion 64 and the second side surface portion 62. Since it moves upward, the amount of movement can be detected in the same manner as in each of the structures with displacement sensors.

The structure 60 with the Z-direction displacement sensor can be used together with the structure 55 with the XY-axis direction displacement sensor. In this case, as shown in FIG. This is provided below the structure 55 with the Y-axis direction displacement sensor. As a result, the structure with the displacement sensor becomes XY
The omnidirectional sensor 70 in the −Z direction can be used. When manufacturing such an omnidirectional sensor 70, FIG.
The portion that becomes the upper fixed surface portion 64 in the plate having the shape shown in FIG. 8A is shared with the lowermost portion 59 in the plate of the structure with the XY axis direction displacement sensor shown in FIG. 1
As shown in FIG. 10 (a), a plate is integrally formed, and a fold is formed on the plate to easily manufacture a structure 70 with an omnidirectional displacement sensor as shown in FIG. be able to. In addition, a circuit and a wiring for sending a detection signal of each part to the outside are provided in each part constituting the sensor with respect to the plate shown in FIG.
Since the circuit is formed in the same manner as that shown in (b), a circuit having a three-dimensional structure is formed in a state where the plate is bent as described above.

In addition to the omnidirectional sensor 70 having the above structure, if necessary, the sensor is fixed to a transfer arm or the like. The circuit may have a three-dimensional structure.
In addition, the present invention is not limited to the above-described embodiment, but can be formed into various shapes as long as it can be folded in an origami manner, and can be used for various devices.

[0044]

Since the present invention is constructed as described above, according to the first aspect of the present invention, since a three-dimensional structure is formed by bending, a circuit having a complicated three-dimensional structure suitable for various uses can be easily manufactured. The use of a metal plate makes the structure stable, and the use of metal plates of various materials allows the selection of an appropriate material according to the application, and the use of metal with a circuit. Since the detection target portion is provided on one of the opposing surfaces of the prism body formed by bending the plate body into a prism shape, the detection portion is formed on the other, and each surface is fixed to two relatively movable members, A structure with a displacement sensor for detecting the relative movement of the two members can be easily formed.

According to the second aspect of the present invention, since the portion to be detected is a magnet and the detecting portion is a Hall element, the displacement sensor is provided for detecting the displacement by the relative movement of the magnet and the Hall element by the relative movement of the two members. The structure can be easily formed.

According to a third aspect of the present invention, there is provided a three-dimensional structure in which a plurality of prisms each having a right angle to each axis are arranged.
Since one metal plate with a circuit is bent and formed, a structure with a displacement sensor for detecting movement in different axial directions can be easily formed.

According to the fourth aspect of the present invention, since the two prisms are arranged so that the axis directions thereof are the X and Y axis directions, the displacement of the member moving in the plane direction can be detected accurately and easily. be able to.

According to the fifth aspect of the present invention, the three prisms are arranged so that the axial direction is the X, Y and Z axis directions.
Displacement of a member moving in a space can be accurately and easily detected.

According to the sixth aspect of the present invention, since the attachment portion to the member is also integrally formed, the structure with the displacement sensor can be attached to the member with a simple structure.

[Brief description of the drawings]

FIG. 1 shows a metal plate before bending, which forms a basic structure of a bent three-dimensional structure circuit device according to the present invention;
(A) is its perspective view, (b) thru | or (d) are sectional views which show a manufacturing process.

FIG. 2 is a perspective view showing a process of forming a basic structure of a box-shaped bent three-dimensional structure circuit device according to the present invention.

3A and 3B show examples of forming a structure with a displacement sensor for detecting displacement in the X-axis direction according to the present invention, wherein FIG. 3A is a plan view of a plate material cut out into a predetermined shape, and FIG. It is a perspective view showing the state where it did.

FIG. 4 shows a use state of the structure with a displacement sensor,
(A) is a side view of a state before the relative displacement of the upper and lower two members occurs, and (b) is a side view of a state where the relative displacement occurs.

FIG. 5 is a sectional view of a conventional RCC.

FIG. 6 shows a structure with a displacement sensor shown in FIG.
FIG.

7A and 7B show examples of forming a structure with a displacement sensor for detecting displacement in the Y-axis direction according to the present invention, wherein FIG. 7A is a plan view of a plate material cut into a predetermined shape, and FIG. It is a perspective view showing the state where it did.

8A and 8B show an example of forming a structure with a displacement sensor for detecting displacement in the X-Y axis direction according to the present invention, wherein FIG. 8A is a plan view of a plate material cut out into a predetermined shape, and FIG. It is a perspective view showing the state where it was bent and formed.

9A and 9B show examples of forming a structure with a displacement sensor for detecting displacement in the Z-axis direction according to the present invention, wherein FIG. 9A is a plan view of a plate material cut into a predetermined shape, and FIG. It is a perspective view showing the state where it did.

10A and 10B show an example of forming a structure with a displacement sensor for detecting displacement in the XYZ axis directions according to the present invention, wherein FIG. 10A is a plan view of a plate material cut into a predetermined shape, and FIG. FIG. 3 is a perspective view showing a state in which bending is performed.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Metal plate 2 Metal plate 3 Groove 4 Insulating layer 5 Conductor foil 6 Plate 7 Circuit pattern 8 Electronic component 10 Electronic component mounting plate 11 Box-shaped structure

Claims (6)

(57) [Claims] 1. A bent three-dimensional circuit device in which one metal plate with a circuit having a predetermined shape and a circuit formed on the surface with an insulating layer interposed therebetween is formed into a three-dimensional structure by bending. A bent three-dimensional structure circuit device, wherein a detected part is provided on one of opposing surfaces of a prism formed by bending a metal plate into a prism shape, and a detection part is provided on the other. 2. The bent three-dimensional structure circuit device according to claim 1, wherein the detected portion is a magnet, and the detecting portion is a Hall element. 3. The bent three-dimensional structure circuit according to claim 1, wherein one metal plate with a circuit is bent and formed so as to form a three-dimensional structure in which a plurality of prisms each having a right angle in each axis direction are arranged. apparatus. 4. The folded three-dimensional structure circuit device according to claim 3, wherein the two prisms are arranged such that the axis directions of the two prisms are the X and Y axis directions. 5. The bent three-dimensional structure circuit device according to claim 3, wherein the three prisms are arranged so that the axial directions of the three prisms are the X, Y, and Z axis directions. 6. The apparatus according to claim 1, wherein the attachment portion to the member is also integrally formed.
The bent three-dimensional structure circuit device according to claim 1.