CN117720061A - MEMS sensor and miniaturized packaging method thereof - Google Patents
MEMS sensor and miniaturized packaging method thereof Download PDFInfo
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- CN117720061A CN117720061A CN202311736916.9A CN202311736916A CN117720061A CN 117720061 A CN117720061 A CN 117720061A CN 202311736916 A CN202311736916 A CN 202311736916A CN 117720061 A CN117720061 A CN 117720061A
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- 238000000034 method Methods 0.000 title claims abstract description 34
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 11
- 239000000919 ceramic Substances 0.000 claims abstract description 302
- 239000002356 single layer Substances 0.000 claims description 67
- 238000004080 punching Methods 0.000 claims description 16
- 238000005245 sintering Methods 0.000 claims description 13
- 238000003466 welding Methods 0.000 claims description 13
- 238000003475 lamination Methods 0.000 claims description 8
- 238000005516 engineering process Methods 0.000 claims description 5
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 description 10
- 238000010586 diagram Methods 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 230000001133 acceleration Effects 0.000 description 4
- 238000009434 installation Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000003796 beauty Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
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Abstract
The application provides a MEMS sensor and a miniaturized packaging method. Comprising the following steps: three MEMS sensor chips and a ceramic shell with a cuboid shape; the outer surface of the ceramic shell comprises a first ceramic surface, a second ceramic surface and a third ceramic surface; the first ceramic surface, the second ceramic surface and the third ceramic surface are perpendicular to each other; the three MEMS sensor chips are respectively attached to the first ceramic surface, the second ceramic surface and the third ceramic surface. The method and the device can shorten the distance between the three MEMS sensor chips, improve the accuracy of the three directions of the mutually perpendicular MEMS sensor chips, and improve the accuracy of the data acquisition of the MEMS sensor chips.
Description
Technical Field
The application relates to the technical field of ceramics, in particular to a MEMS sensor and a miniaturized packaging method thereof.
Background
With the advent of MEMS technology, many MEMS technology sensors have been widely used, and MEMS acceleration sensors have the unique advantages of small size, light weight, high reliability, easy integration with control circuits, and being beneficial to mass production, where piezoresistive micro-accelerometers, piezoelectric micro-accelerometers, and the like all have excellent performance, and can meet the requirements of flight attitude parameter testing.
Currently, because three-axis six-direction degrees of freedom exist in coordinates in space, acceleration is required to be measured in three directions X, Y, Z, and three independent acceleration sensing devices are required to be orthogonally placed on a PCB (printed circuit board) along the three directions X, Y, Z respectively by the traditional accelerometer. The scheme is necessarily poor in measurement precision due to the fact that three accelerometers are far distributed and the installation precision and the deformation of the PCB are poor, the range of the device is limited, and errors are large.
Disclosure of Invention
The application provides a MEMS sensor and a miniaturized packaging method thereof, which are used for solving the problem that in the prior art, the accuracy of measured data is low due to the fact that the mounting position of a MEMS sensor chip is far away.
In a first aspect, the present application provides a MEMS sensor comprising: three MEMS sensor chips and a ceramic shell with a cuboid shape;
the outer surface of the ceramic shell comprises a first ceramic surface, a second ceramic surface and a third ceramic surface; the first ceramic surface, the second ceramic surface and the third ceramic surface are perpendicular to each other;
and three MEMS sensor chips are respectively attached to the first ceramic surface, the second ceramic surface and the third ceramic surface.
In a second aspect, the present application provides a method for miniaturized packaging of a MEMS sensor, comprising:
obtaining a preset number of single-layer ceramic plates, wherein the single-layer ceramic plates are rectangular in surface shape;
according to the lamination sequence of each single-layer ceramic sheet, sequentially punching and printing hole filling treatment are carried out on each single-layer ceramic sheet in a first direction, and all single-layer ceramic sheets with holes are positioned and laminated according to the positions of the holes, so that a laminated ceramic body is obtained; the first direction is the direction in which the rectangular surface of the single-layer ceramic plate is positioned;
ceramic sintering treatment is carried out on the laminated ceramic body at a preset ceramic sintering temperature, so that a ceramic shell with a cuboid shape is obtained;
respectively attaching three MEMS sensor chips to a first ceramic surface, a second ceramic surface and a third ceramic surface of the ceramic shell; the first ceramic surface, the second ceramic surface and the third ceramic surface are perpendicular to each other.
The application provides an MEMS sensor and a miniaturized packaging method thereof, comprising three MEMS sensor chips and a ceramic shell with a cubic shape; the outer surface of the ceramic shell comprises a first ceramic surface, a second ceramic surface and a third ceramic surface; the first ceramic surface, the second ceramic surface and the third ceramic surface are perpendicular to each other; the three MEMS sensor chips are respectively attached to the first ceramic surface, the second ceramic surface and the third ceramic surface. According to the method, three MEMS sensor chips are respectively attached to ceramic surfaces perpendicular to each other by the aid of the cube ceramic shell, so that the distance between the three MEMS sensor chips is shortened, and accuracy of the three MEMS sensor chips in three directions perpendicular to each other is improved according to the cube structure, so that accuracy of data acquisition of the MEMS sensor chips is improved; and the ceramic shell has smaller volume, so that the application requirement of the MEMS sensor chip on the PCB can be met.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required for the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a MEMS sensor provided in an embodiment of the present application;
FIG. 2 is a schematic structural diagram of a fourth ceramic surface and a bonding pad according to an embodiment of the present application;
fig. 3 is a schematic structural diagram of a connection between a ceramic housing and a PCB according to an embodiment of the present application;
fig. 4 is a schematic structural diagram of mounting two MEMS sensor chips according to an embodiment of the present disclosure;
fig. 5 is a flow chart of a miniaturized packaging method for a MEMS sensor according to an embodiment of the present application.
Detailed Description
In the following description, for purposes of explanation and not limitation, specific details are set forth, such as particular system configurations, techniques, etc. in order to provide a thorough understanding of the embodiments of the present application. It will be apparent, however, to one skilled in the art that the present application may be practiced in other embodiments that depart from these specific details. In other instances, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of the present application with unnecessary detail.
For the purpose of making the objects, technical solutions and advantages of the present application more apparent, the following description will be made with reference to the accompanying drawings by way of specific embodiments.
Fig. 1 is a schematic structural diagram of a MEMS sensor according to an embodiment of the present application. As shown in fig. 1, the MEMS sensor includes three MEMS sensor chips (MEMS sensor chip A, MEMS sensor chip B, MEMS sensor chip C) and a ceramic housing 1 in the shape of a rectangular parallelepiped.
The outer surface of the ceramic shell 1 comprises a first ceramic face 11, a second ceramic face 12 and a third ceramic face 13; and the first ceramic face 11, the second ceramic face 12 and the third ceramic face 13 are perpendicular to each other.
Three MEMS sensor chips A, B, C are mounted to the first ceramic face 11, the second ceramic face 12, and the third ceramic face 13, respectively.
The MEMS sensor chip is usually directly installed on the PCB, but the spatial direction of the MEMS sensor chip is inaccurate due to the fact that the material of the PCB is easy to deform. And ceramic itself heat stability is strong, compares very little in the deflection of PCB board, consequently this application adopts ceramic shell to laminate three MEMS sensor chip on a device, can improve the accuracy of space direction. And the ceramic shell is cuboid, three mutually perpendicular ceramic surfaces are selected, three independent MEMS sensors are closely distributed and concentrated on a space range 'point', the defect of larger variability of the spatial distribution of the three independent MEMS sensor chips is overcome, the problems that the three MEMS sensor chips are far in distance and the errors are larger after installation and are difficult to debug and eliminate are overcome, and the improvement of test range and precision is realized.
In one possible implementation, the ceramic shell may be cubic in shape.
Specifically, referring to fig. 1, in order to make the distances of the three MEMS sensor chips mounted on the ceramic housing uniform, the shape of the ceramic housing may be made into a cube, the three MEMS sensor chips are attached to the ceramic housing of one cube in a concentrated manner, and the orthogonal placement of three directions can be achieved by using the orthogonal planes formed by six faces of the ceramic housing of the cube, so that the acceleration of X, Y, Z in the three directions is sensed, so that not only the spatial direction is accurate, but also the distances between the three MEMS sensor chips are the same, thereby improving the measuring range and the accuracy of the MEMS sensor chip test.
The size of the ceramic shell can be designed according to the size of the MEMS sensor chip and the space size of the package on the PCB. For example, the cube ceramic shell has a rib length of 10mm; the edge length can also be designed to be smaller than 10mm and larger than the size of the MEMS sensor chip, for example, the edge length of the MEMS sensor chip is 4mm, and the value range of the edge length of the ceramic shell is larger than 4mm and smaller than or equal to 10mm.
In one possible implementation, the ceramic shell includes at least one set of three ceramic faces that are perpendicular to each other.
In one possible implementation, the outer surface of the ceramic shell may further comprise a fourth ceramic face;
the fourth ceramic surface is provided with a bonding pad corresponding to the PCB;
pins of each MEMS sensor chip are connected with corresponding welding spots on the welding pads through wires, and the welding pads are welded with the PCB.
Specifically, referring to fig. 2, the outer surface of the ceramic shell 1 further comprises a fourth ceramic face 14. Wherein the fourth ceramic face 14 is perpendicular to the third ceramic face 13. Referring to fig. 1, the fourth ceramic face 14 is perpendicular to the second ceramic face 12 and the third ceramic face 13 and parallel to the first ceramic face 11.
The fourth ceramic face 14 is provided with pads 141 corresponding to the PCB board. Pins of each MEMS sensor chip are connected to corresponding pads on pad 141 by traces. The bonding pad 141 is soldered to the PCB board, i.e., the ceramic case is fixed to the PCB board.
The routing can be external routing, that is, the MEMS sensor chip and the bonding pad 141 are directly welded by the external routing, and the routing method is convenient and can more clearly track the circuit. The wiring can also be an internal wiring, and the wiring is welded with the bonding pad 141 through the passage by arranging a wire groove or opening the passage on the ceramic shell, so that the outer surface of the ceramic shell is attractive.
In one possible implementation, the first ceramic face, the second ceramic face, and the third ceramic face may include a patch region and a bonding region, respectively; the bonding area comprises a plurality of bonding fingers, bonding wires and internal wires which penetrate through the bonding area;
the bonding pad comprises a plurality of welding spots penetrating through the bonding pad;
the three MEMS sensor chips are respectively attached to the surface mounting areas of the first ceramic surface, the second ceramic surface and the third ceramic surface;
the pins of each MEMS sensor chip are welded with the outer surfaces of bonding fingers corresponding to the corresponding bonding areas through bonding wires, the inner surfaces of the bonding fingers are connected with welding spots corresponding to the inner surfaces of the bonding pads through corresponding internal wires, and the welding spots of the outer surfaces of the bonding pads are welded with the PCB.
Wherein, referring to fig. 1, the first ceramic face 11, the second ceramic face 12 and the third ceramic face 13 respectively comprise a patch area 31 and a bonding area 32. The bonding region 32 includes a plurality of bonding fingers 321, bonding wires, and internal traces that extend through the bonding region 32. The pad 141 includes a plurality of pads penetrating the pad 141.
Specific bond wires and internal traces referring to fig. 3, bond fingers 321 have outer surfaces that connect to bond wires 41 and inner surfaces that connect to internal traces 42.
Specifically, three MEMS sensor chips are mounted on the chip mounting regions 31 of the first ceramic surface 11, the second ceramic surface 12, and the third ceramic surface 13, respectively.
The leads of each MEMS sensor chip are soldered to the outer surfaces of the bonding fingers 321 corresponding to the corresponding bonding areas 32 through bonding wires 41, the inner surfaces of the bonding fingers 321 are connected to the corresponding solder joints of the inner surfaces of the pads 141 through corresponding inner wires 42, and the solder joints of the outer surfaces of the pads 141 are soldered to the PCB.
Illustratively, referring to fig. 3, the mems sensor die D is mounted on the mounting area 31 of the first ceramic surface 13, each lead x of the mems sensor die D is soldered to an outer surface of a bonding finger 321 of the bonding area 32 by a bonding wire 41, an inner surface of each bonding finger 321 is soldered to a solder joint m of an inner surface of the solder joint 141 by an internal trace 42, and a solder joint n of an outer surface of the solder joint 141 is soldered to the PCB board, wherein the solder joint m and the solder joint n are solder joints of the same path through the solder joint 141.
In one possible implementation, the height of the horizontal plane of each bonding area is higher than the height of the horizontal plane of the corresponding patch area by a preset height.
Specifically, since the MEMS sensor chip is mounted on the outer surface of the ceramic housing 1, for the flatness of the surface of the ceramic housing 1, the MEMS sensor chip is not protruded when being mounted, and referring to fig. 1, the height of the plane X1 of each bonding area 32 is higher than the height of the plane X2 of the patch area 31 of the same ceramic surface by a predetermined height. The preset height may be set to be 0.8mm or more, or may be designed according to practical situations.
In one possible implementation, the plurality of bonding fingers of each bonding region are uniformly distributed.
Specifically, due to the number of leads of the MEMS sensor chip, the number of bonding fingers required to be designed is more than 15, and the bonding fingers of each bonding region need to be uniformly distributed for the beauty of the outer surface of the ceramic housing.
In one possible implementation, a maximum of 5 MEMS sensor chips are included in an embodiment of the present application.
Specifically, embodiments of the present application may include at most five MEMS sensor chips. For example, fig. 1 shows three MEMS sensor chips mounted, and fig. 4 shows a schematic structure of two MEMS sensor chips mounted.
Illustratively, when there are more than three MEMS sensor chips, the ceramic face is selected as: if four MEMS sensor chips exist, two MEMS sensor chips are in the same direction and are in orthogonal relation with the other two MEMS sensor chips, and the ceramic surface is selected according to the arrangement direction of the corresponding MEMS sensor chips. Therefore, the wiring order on the PCB is improved, the distance relation between MEME sensor chips can be reduced as much as possible, and the testing range and the testing precision are improved.
The application provides a MEMS sensor, which comprises three MEMS sensor chips and a ceramic shell with a cubic shape; the outer surface of the ceramic shell comprises a first ceramic surface, a second ceramic surface and a third ceramic surface; the first ceramic surface, the second ceramic surface and the third ceramic surface are perpendicular to each other; the three MEMS sensor chips are respectively attached to the first ceramic surface, the second ceramic surface and the third ceramic surface. According to the method, three MEMS sensor chips are respectively attached to ceramic surfaces perpendicular to each other by the aid of the cube ceramic shell, so that the distance between the three MEMS sensor chips is shortened, and accuracy of the three MEMS sensor chips in three directions perpendicular to each other is improved according to the cube structure, so that accuracy of data acquisition of the MEMS sensor chips is improved; and the ceramic shell has smaller volume, so that the application requirement of the MEMS sensor chip on the PCB can be met.
It should be understood that the sequence number of each step in the foregoing embodiment does not mean that the execution sequence of each process should be determined by the function and the internal logic of each process, and should not limit the implementation process of the embodiment of the present application in any way.
The following are method embodiments of the present application, for details not described in detail therein, reference may be made to the corresponding low temperature ceramic power supply housing embodiments described above.
Fig. 5 is a schematic flow chart of a miniaturized packaging method for a MEMS sensor according to an embodiment of the present application, which is described in detail below:
in step 501, alumina porcelain and metal parts in a predetermined process environment are obtained.
The method comprises the steps of obtaining a preset number of single-layer ceramic plates, wherein the single-layer ceramic plates are rectangular in surface shape.
In the embodiment of the present application, since the shape of the ceramic shell is a cuboid, when each single-layer ceramic sheet constituting the ceramic shell is selected, the surface shape of the single-layer ceramic sheet is required to be rectangular. If the ceramic shell is made as a cube, the surface shape of the single-layer ceramic sheet is required to be square.
In step 502, according to the stacking sequence of each single-layer ceramic sheet, punching and printing hole filling are sequentially carried out on each single-layer ceramic sheet in a first direction, and all single-layer ceramic sheets with holes are positioned and stacked according to the positions of the holes, so that a ceramic body after lamination is obtained; the first direction is the direction in which the rectangular surface of the single-layer ceramic plate is located.
When the single-layer ceramic sheet is perforated, the single-layer ceramic sheet in the first direction is perforated, that is, the single-layer ceramic sheet is perforated in the direction of the rectangular surface of the single-layer ceramic sheet.
In the embodiment of the application, the punching and printing hole filling treatment are sequentially performed on each single-layer ceramic sheet in the first direction according to the lamination sequence of the single-layer ceramic sheets. And then positioning and laminating all single-layer ceramic plates according to the positions of the punched holes to obtain a stacked ceramic body with punched holes in the first direction.
In one possible implementation, the first ceramic face, the second ceramic face, and the third ceramic face each include a patch region and a bonding region, the bonding region including a plurality of bonding fingers extending through the bonding region.
Referring to fig. 1, the ceramic face includes a patch area 31 and bonding areas 32 thereon, each bonding area 32 including a plurality of bonding fingers 321.
In one possible implementation, step 502 may include:
determining a first single-layer ceramic piece and a second single-layer ceramic piece according to the lamination sequence of each single-layer ceramic piece, wherein the first single-layer ceramic piece is a single-layer ceramic piece for punching the position of a patch area and the position of each bonding finger of a bonding area, and the second single-layer ceramic piece is all single-layer ceramic pieces for punching the position of each bonding finger of the bonding area;
and respectively punching and printing and hole filling the first single-layer ceramic sheet and the second single-layer ceramic sheet to obtain each single-layer ceramic sheet punched in the first direction.
Specifically, according to the stacking sequence of the single-layer ceramic sheets, a first single-layer ceramic sheet and a second single-layer ceramic sheet are determined, wherein the first single-layer ceramic sheet is a single-layer ceramic sheet perforated at the position of the patch region 31 and the position of each bonding finger 321 of the bonding region 32, and the second single-layer ceramic sheet is a single-layer ceramic sheet perforated at the position of each bonding finger 321 of the bonding region 32. And (3) punching the first single-layer ceramic sheet and the second single-layer ceramic sheet respectively by adopting punching and printing hole filling technologies to obtain the single-layer ceramic sheet with the punched holes in the first direction.
In one possible implementation, after step 502, the method may further include:
printing and punching the laminated ceramic body at the patch area position and each bonding finger position of the bonding area in the second direction by utilizing a printing process to obtain a printed ceramic body; the second direction is any direction perpendicular to the first direction.
Specifically, a printing process is utilized to print and punch side patterns on the positions of the bonding fingers of the bonding area and the positions of the bonding area of the laminated ceramic body in a second direction, so that the printed ceramic body is obtained, wherein the second direction is any direction perpendicular to the first direction.
In step 503, ceramic sintering treatment is performed on the laminated ceramic body at a preset ceramic sintering temperature, so as to obtain a ceramic shell with a cuboid shape.
In this embodiment of the present application, since the ceramic shell is obtained by sintering a plurality of layers of high-temperature co-fired ceramics, rather than being formed by splicing two ceramic packages by welding or bonding after sintering, the ceramic body obtained by laminating in step 502 is subjected to ceramic sintering treatment at a preset ceramic sintering temperature, so as to obtain a ceramic shell with a cuboid shape. Wherein the preset ceramic sintering temperature is above 1500 ℃.
In step 504, three MEMS sensor chips are respectively attached to the first ceramic face, the second ceramic face, and the third ceramic face of the ceramic housing; the first ceramic surface, the second ceramic surface and the third ceramic surface are perpendicular to each other.
In the embodiment of the present application, three MEMS sensor chips are respectively mounted on the first ceramic surface, the second ceramic surface, and the third ceramic surface of the ceramic housing obtained in step 703.
In one possible implementation, step 504 may include:
based on thick film technology, three MEMS sensor chips are respectively attached to the surface mounting areas of the first ceramic surface, the second ceramic surface and the third ceramic surface of the ceramic shell.
Specifically, three MEMS sensor chips are respectively attached to the surface mounting areas of the first ceramic surface, the second ceramic surface and the third ceramic surface of the ceramic shell by adopting a thick film process.
The application provides a MEMS sensor miniaturized packaging method, which comprises the steps of obtaining a preset number of single-layer ceramic plates, wherein the single-layer ceramic plates are rectangular in surface shape; according to the lamination sequence of each single-layer ceramic sheet, sequentially punching and printing hole filling treatment are carried out on each single-layer ceramic sheet in a first direction, and all single-layer ceramic sheets with holes are positioned and laminated according to the positions of the holes, so that a laminated ceramic body is obtained; the first direction is the direction in which the rectangular surface of the single-layer ceramic plate is positioned; ceramic sintering treatment is carried out on the laminated ceramic body at a preset ceramic sintering temperature, so that a ceramic shell with a cuboid shape is obtained; the three MEMS sensor chips are respectively attached to a first ceramic surface, a second ceramic surface and a third ceramic surface of the ceramic shell; the first ceramic surface, the second ceramic surface and the third ceramic surface are perpendicular to each other. According to the method, three MEMS sensor chips are respectively attached to ceramic surfaces perpendicular to each other by the aid of the cube ceramic shell, so that the distance between the three MEMS sensor chips is shortened, and accuracy of the three MEMS sensor chips in three directions perpendicular to each other is improved according to the cube structure, so that accuracy of data acquisition of the MEMS sensor chips is improved; and the ceramic shell has smaller volume, so that the application requirement of the MEMS sensor chip on the PCB can be met.
The above embodiments are only for illustrating the technical solution of the present application, and are not limiting; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present application, and are intended to be included in the scope of the present application.
Claims (10)
1. A MEMS sensor, comprising: three MEMS sensor chips and a ceramic shell with a cuboid shape;
the outer surface of the ceramic shell comprises a first ceramic surface, a second ceramic surface and a third ceramic surface; the first ceramic surface, the second ceramic surface and the third ceramic surface are perpendicular to each other;
and three MEMS sensor chips are respectively attached to the first ceramic surface, the second ceramic surface and the third ceramic surface.
2. The MEMS sensor of claim 1, wherein the outer surface of the ceramic housing further comprises a fourth ceramic face;
the fourth ceramic surface is provided with a bonding pad corresponding to the PCB;
pins of each MEMS sensor chip are connected with corresponding welding spots on the welding pads through wires, and the welding pads are welded with the PCB.
3. The MEMS sensor of claim 2, wherein the first ceramic face, the second ceramic face, and the third ceramic face comprise a patch region and a bond region, respectively; the bonding area comprises a plurality of bonding fingers, bonding wires and internal wires which penetrate through the bonding area;
the bonding pad comprises a plurality of welding spots penetrating through the bonding pad;
three MEMS sensor chips are respectively attached to the patch areas of the first ceramic surface, the second ceramic surface and the third ceramic surface;
the pins of each MEMS sensor chip are welded with the outer surfaces of bonding fingers corresponding to the corresponding bonding areas through bonding wires, the inner surfaces of the bonding fingers are connected with welding spots corresponding to the inner surfaces of the bonding pads through corresponding internal wires, and the welding spots of the outer surfaces of the bonding pads are welded with the PCB.
4. A MEMS sensor according to claim 3, wherein the height of each bonding region is greater than the height of the corresponding patch region by a predetermined height.
5. The MEMS sensor of claim 1, wherein the MEMS sensor comprises at most five MEMS sensor chips.
6. The MEMS sensor of claim 1, wherein the ceramic housing is cubic in shape.
7. A method of miniaturized packaging of a MEMS sensor, comprising:
obtaining a preset number of single-layer ceramic plates, wherein the single-layer ceramic plates are rectangular in surface shape;
according to the lamination sequence of each single-layer ceramic sheet, sequentially punching and printing hole filling treatment are carried out on each single-layer ceramic sheet in a first direction, and all single-layer ceramic sheets with holes are positioned and laminated according to the positions of the holes, so that a laminated ceramic body is obtained; the first direction is the direction in which the rectangular surface of the single-layer ceramic plate is positioned;
ceramic sintering treatment is carried out on the laminated ceramic body at a preset ceramic sintering temperature, so that a ceramic shell with a cuboid shape is obtained;
respectively attaching three MEMS sensor chips to a first ceramic surface, a second ceramic surface and a third ceramic surface of the ceramic shell; the first ceramic surface, the second ceramic surface and the third ceramic surface are perpendicular to each other.
8. The MEMS sensor miniaturized package method of claim 7 wherein the first ceramic face, the second ceramic face, and the third ceramic face each include a patch region and a bonding region, the bonding region including a plurality of bonding fingers extending through the bonding region; according to the lamination sequence of each single-layer ceramic sheet, punching and printing hole filling processing are respectively carried out on each single-layer ceramic sheet in a first direction, and the method comprises the following steps:
determining a first single-layer ceramic plate and a second single-layer ceramic plate according to the lamination sequence of each single-layer ceramic plate, wherein the first single-layer ceramic plate is a single-layer ceramic plate for punching the positions of the patch area and the bonding finger positions of the bonding area, and the second single-layer ceramic plate is all single-layer ceramic plates for punching the bonding finger positions of the bonding area;
and respectively punching and printing and hole filling the first single-layer ceramic sheet and the second single-layer ceramic sheet to obtain each single-layer ceramic sheet punched in the first direction.
9. The MEMS sensor miniaturized package method of claim 7 wherein the first ceramic face, the second ceramic face, and the third ceramic face each include a patch region and a bonding region, the bonding region including a plurality of bonding fingers extending through the bonding region; after all the single-layer ceramic sheets with holes are positioned and laminated according to the positions of the holes to obtain a laminated ceramic body, the method further comprises the following steps:
printing and punching the laminated ceramic body at the patch area position and each bonding finger position of the bonding area in the second direction by utilizing a printing process to obtain a printed ceramic body; the second direction is any direction perpendicular to the first direction.
10. The MEMS sensor miniaturized package method of claim 7 wherein the first, second, and third ceramic faces each include a patch area; the three MEMS sensor chips are respectively attached to the first ceramic surface, the second ceramic surface and the third ceramic surface of the ceramic shell, and the three MEMS sensor chips comprise:
based on thick film technology, three MEMS sensor chips are respectively attached to the surface mounting areas of the first ceramic surface, the second ceramic surface and the third ceramic surface of the ceramic shell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311736916.9A CN117720061A (en) | 2023-12-15 | 2023-12-15 | MEMS sensor and miniaturized packaging method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311736916.9A CN117720061A (en) | 2023-12-15 | 2023-12-15 | MEMS sensor and miniaturized packaging method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117720061A true CN117720061A (en) | 2024-03-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311736916.9A Pending CN117720061A (en) | 2023-12-15 | 2023-12-15 | MEMS sensor and miniaturized packaging method thereof |
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| Country | Link |
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| CN (1) | CN117720061A (en) |
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2023
- 2023-12-15 CN CN202311736916.9A patent/CN117720061A/en active Pending
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