JP2019149449A - Electronic device - Google Patents

Abstract

To provide an electronic device which allows a plurality of electronic components to be disposed with high degree of freedom.SOLUTION: A metal resin joined plate 22 has a plate 510, a plate 520, a plate 530, a plate 540 and a plate 550. The plate 510, the plate 520, the plate 530, the plate 540 and the plate 550 have a face 512, a face 522, a face 532, a face 542 and a face 552, respectively. A first electronic component 30a is mounted on the face 512 of the plate 510. A second electronic component 30b is mounted on the face 522 of the plate 520. In a first state of an electronic device 10, the plate 510 (first plate) and the plate 520 (second plate) are disposed so that the face 512 (first face) and the face 522 (second face) orient toward a common space from directions different from each other.SELECTED DRAWING: Figure 6

Description

  The present invention relates to an electronic device.

  In-vehicle devices such as audio devices, mobile phone devices mounted on vehicles, car navigation devices, and the like employ electronic devices using high-performance ICs that generate a large amount of heat as vehicles become more electronic and have higher performance. It has become like this. On the other hand, problems due to electromagnetic waves generated by these electronic devices, that is, EMI (electromagnetic interference) must be suppressed as much as possible. For this reason, the shield material of the housing containing the electronic equipment is mainly composed of a highly conductive material (for example, galvanized steel plate, copper foil, aluminum foil, etc.) and shielded by reflecting the surface of the radio wave. I came. By using such a shield material, it is also possible to enjoy the merit that it is easy to dissipate the amount of heat generated in the device (see, for example, Patent Documents 1, 2, and 3).

JP 2002-176282 A JP 2005-108328 A Japanese Utility Model Publication No. 5-72180

  The present inventor has considered arranging a plurality of electronic components with a high degree of freedom.

  The present invention has been made in view of the above circumstances, and provides an electronic apparatus capable of arranging a plurality of electronic components with a high degree of freedom.

  According to the present invention, the following electronic device is provided.

[1]
A first metal plate having a first surface and joined with a thermoplastic resin member;
A second metal plate having a second surface and joined with a thermoplastic resin member;
A first electronic component mounted on the first surface of the first plate;
A second electronic component mounted on the second surface of the second plate;
Including
In the first state, the first plate and the second plate are arranged such that the first surface and the second surface face a common space from different directions.
[2]
In the electronic device according to the above [1],
In the first state, the first plate and the second plate are arranged so that the first surface and the second surface face the common space from opposite directions.
[3]
In the electronic device according to the above [2],
In the second state, the first plate and the second plate are arranged side by side so that the first surface and the second surface face the same direction.
[4]
In the electronic device according to the above [3],
Including a metal third plate to which a thermoplastic resin member is bonded;
In the first state, the third plate has a first side shared with the first plate and a second side shared with the second plate on the opposite side of the first side,
The first plate and the third plate can be bent along the first side,
The electronic device, wherein the second plate and the third plate are bendable along the second side.
[5]
In the electronic device according to the above [4],
The third plate has a third surface;
In the second state, the third plate is disposed between the first plate and the second plate so that the third surface faces the same direction as the first surface and the second surface,
An electronic device comprising a third electronic component mounted on the third surface of the third plate.
[6]
In the electronic device according to the above [4] or [5],
A metal fourth plate to which the thermoplastic resin member is bonded;
A metal fifth plate to which a thermoplastic resin member is bonded;
Including
In the first state, the fourth plate has a third side shared with the first plate, a fourth side shared with the second plate, and a fifth side shared with the third plate. And
In the first state, the fifth plate has a sixth side shared with the first plate, a seventh side shared with the second plate, and an eighth side shared with the third plate. Electronic equipment.
[7]
In the electronic device according to the above [6],
In the first state, the first plate has a ninth side opposite to the first side, the second plate has a tenth side opposite to the second side, The four plates have an eleventh side opposite to the fifth side, the fifth plate has a twelfth side opposite to the eighth side,
An electronic device having an opening defined by the ninth side, the tenth side, the eleventh side, and the twelfth side in the first state.
[8]
In the electronic device according to the above [6],
Including a sixth metal plate to which a thermoplastic resin is bonded;
In the first state, the sixth plate includes a ninth side shared with the first plate, a tenth side shared with the second plate, an eleventh side shared with the fourth plate, An electronic device having a twelfth side shared with five plates.
[9]
In the electronic device according to the above [1],
In the first state, the first plate and the second plate are arranged such that the first surface and the second surface face the common space from a direction crossing each other.
[10]
In the electronic device according to [9] above,
In the second state, the first plate and the second plate are arranged side by side so that the first surface and the second surface face the same direction.
[11]
In the electronic device according to the above [10],
In the first state, the first plate shares a first side shared with the second plate,
The electronic device, wherein the first plate and the second plate are bendable along the first side.
[12]
In the electronic device according to the above [11],
Including a metal third plate to which a thermoplastic resin member is bonded;
In the first state, the first plate has a second side that is opposite to the first side and is shared with the third plate.
[13]
In the electronic device according to the above [12],
The third plate has a third surface facing the second surface of the second plate in the first state,
An electronic device comprising a third electronic component mounted on the third surface of the third plate.
[14]
In the electronic device according to any one of [1] to [13],
The first electronic component includes a first main surface, a second main surface opposite to the first main surface, and a first side surface between the first main surface and the second main surface. ,
The first electronic component is an electronic device that is mounted on the first surface of the first plate such that the first side surface faces the first surface.

  ADVANTAGE OF THE INVENTION According to this invention, the electronic device which can arrange | position a some electronic component with a high freedom degree can be provided.

It is the perspective view which showed typically an example of the structure of the housing | casing for electronic devices of embodiment which concerns on this invention. It is the perspective view which showed typically an example of the structure of the cover plate of embodiment which concerns on this invention. It is the perspective view which showed typically an example of the structure of the expansion | deployment figure-like metal plate (development figure-like metal resin joining board) to which the thermoplastic resin member of embodiment which concerns on this invention was joined. It is the perspective view which showed typically an example of the structure of the expansion | deployment figure-like metal plate (development figure-like metal resin joining board) to which the thermoplastic resin member of embodiment which concerns on this invention was joined. It is the perspective view which showed typically an example of the structure of the expansion | deployment figure-like metal plate (development figure-like metal resin joining board) to which the thermoplastic resin member of embodiment which concerns on this invention was joined. 6 is a perspective view showing a first state of an electronic device according to Embodiment 2. FIG. FIG. 7 is a perspective view showing a second state of the electronic device shown in FIG. 6. It is a figure which shows the 1st modification of FIG. It is a figure which shows the 2nd modification of FIG. It is a figure which shows the 3rd modification of FIG. It is a figure which shows the 4th modification of FIG. It is a figure which shows the 5th modification of FIG. It is a perspective view which shows the 1st state of the electronic device which concerns on Embodiment 3. FIG. FIG. 14 is a perspective view illustrating a second state of the electronic device illustrated in FIG. 13. It is a perspective view which shows the 1st state of the electronic device which concerns on Embodiment 4. FIG. 16 is a perspective view showing a second state of the electronic device shown in FIG. 15. FIG. 10 is a diagram for explaining a mounting method of electronic components of an electronic device according to a fifth embodiment. It is a figure which shows the modification of FIG. 1 is a perspective view of a metal resin bonding plate for evaluating mechanical properties used in Example 1. FIG. It is a perspective view of the expansion | deployment figure-like metal plate which concerns on Example 2. FIG. It is a perspective view of the expansion | deployment figure-shaped metal resin joining board which concerns on Example 2. FIG. On the surface of the joint portion of the metal member (M) according to the present embodiment, measurement points of a total of six straight portions including arbitrary three straight portions in parallel relation and arbitrary three straight portions orthogonal to the three straight portions are included. It is a schematic diagram for demonstrating.

  Embodiments of the present invention will be described below with reference to the drawings. In all the drawings, similar constituent elements are denoted by common reference numerals, and description thereof is omitted as appropriate. Moreover, the figure is a schematic diagram and does not match the actual dimensional ratio. Unless otherwise specified, “˜” between numbers in the sentence represents the following.

(Embodiment 1)
[Case for electronic equipment]
First, the electronic device casing 100 according to the present embodiment will be described with reference to FIGS. 1 and 2 as an example.
FIG. 1 is a perspective view schematically showing an example of the structure of an electronic device casing 100 according to an embodiment of the present invention. FIG. 2 is a perspective view schematically showing an example of the structure of the lid plate 203 of the embodiment according to the present invention.

An electronic device casing 100 according to the present embodiment includes a metal bottom plate 201 and metal side plates 202 (202-1, 202-2, 202-3, and 202) that are integrally bent and connected to the bottom plate. 202-4), and a housing for housing an electronic component that is at least a part of an electronic device, and in a metal member (M) including at least a bottom plate 201 and a side plate 202, A thermoplastic resin member 301 is joined to a part of the surface of the metal member (M), preferably directly joined, and the metal member (M) is reinforced by the thermoplastic resin member 301, so that a plate-like metal member (M ) Are joined to the thermoplastic resin member 301. In the present embodiment, direct bonding means bonding in which no intervening layer such as an adhesive-containing layer exists between the metal member (M) and the thermoplastic resin member 301.
Here, the side plates 202 are preferably engaged by, for example, mechanical means. The mechanical engagement means (also referred to as physical engagement means) is not particularly limited, and examples thereof include screwing. The side plate 202 and the lid plate 203 provided as necessary may be engaged by the mechanical means described above, or may be integrally bent and connected to one arbitrary side plate. In FIG. 1, four side plates 202-1, 202-2, 202-3, and 202-4 are included, but the present invention includes an embodiment in which the side plates are three pieces selected from these. However, in this case, it is preferable that the lid plate is integrally bent and connected to one of the three side plates.

  Electronic components housed in the electronic device casing 100 include, for example, circuit boards, semiconductor devices such as microcomputers and CPUs, discrete type elements (for example, capacitive elements, coils, resistance elements, etc.), and ventilation or cooling devices. At least one of the fans.

Since the electronic device casing 100 according to the present embodiment is partially replaced by a light metal member from a heavy metal member, it is lighter than a conventional casing in which the entire casing is made of a metal member. can do.
In addition, the electronic device casing 100 according to the present embodiment includes a metal bottom plate 201 and a metal side plate 202 in a part thereof, so that the entire casing is configured by a metal member. An electromagnetic wave shielding function equivalent to the above can be obtained.
Further, in the electronic device casing 100 according to the present embodiment, the metal member (M) including at least the bottom plate 201 and the side plate 202 is reinforced by the thermoplastic resin member 301, thereby reducing the thickness of the metal member (M). Accordingly, it is possible to suppress a decrease in the mechanical strength of the electronic device casing 100. That is, it is possible to maintain the mechanical strength while realizing the weight reduction of the electronic device casing 100.
Furthermore, in the electronic device casing 100 according to the present embodiment, since the metal bottom plate 201 and the metal side plate 202 are integrally connected, a component for connecting the bottom plate and the side plate becomes unnecessary. The number of points can be reduced, and as a result, process management can be simplified. It is also possible to reduce the number of ground installation locations. And since the electronic device casing 100 according to the present embodiment can reduce the number of parts and the number of grounding locations, the lighter electronic device casing 100 can be realized.
Furthermore, since the thermoplastic resin member 301 is formed only on a part of the surface of the plate-like metal member (M), the entire surface of the metal member (M) is covered by the thermoplastic resin member 301. The heat dissipation characteristics of the electronic device casing 100 can be maintained well.

  In the electronic device casing 100 according to the present embodiment, thermoplastic resin members 301 are bonded to both surfaces of the plate-like metal member (M). By carrying out like this, since the metal member (M) can be reinforced from both surfaces of a metal member (M), the mechanical strength of the housing | casing 100 for electronic devices can be made favorable. Thereby, the thickness of a metal member (M) can be made thin and the housing | casing 100 for lightweight electronic devices can be obtained.

  As described above, the electronic device casing 100 according to the present embodiment is excellent in the balance of lightness, electromagnetic shielding properties, heat dissipation characteristics, and mechanical strength.

  The metal member (M) according to the present embodiment preferably has a fine concavo-convex structure on the surface of the joint portion with the thermoplastic resin member 301. In this case, since the metal member (M) and the thermoplastic resin member 301 are joined by part of the thermoplastic resin member 301 entering the fine concavo-convex structure, the metal member (M) and the thermoplastic resin member 301 The bonding strength can be improved. Thereby, since the mechanical strength of the housing | casing 100 for electronic devices can be made more favorable, the thickness of the metal member (M) which comprises the housing | casing 100 for electronic devices can be made thinner. As a result, a lighter electronic device casing 100 can be obtained.

  In addition, the thermoplastic resin member 301 bonded to one surface of the plate-shaped metal member (M) and at least a part of the thermoplastic resin member 301 bonded to the other surface of the metal member (M) It is preferable that they are arranged so as to face each other in the direction perpendicular to the plate surface. By carrying out like this, it can suppress that a metal member (M) deform | transforms by shrinkage | contraction at the time of shaping | molding of the thermoplastic resin member 301. FIG.

  In the electronic device casing 100 according to the present embodiment, the surface area of the joined portion of the thermoplastic resin member 301 occupying the total surface area of the metal member (M) (hereinafter, may be abbreviated as a joined portion area ratio) is, for example, 1 area% or more and 50 area% or less, preferably 2 area% or more and 40 area% or less, more preferably 5 area% or more and 30 area% or less. When the joint area ratio is equal to or higher than the lower limit, the mechanical strength of the electronic device casing 100 can be further improved. When the joint area ratio is equal to or less than the above upper limit value, it is possible to obtain a lightweight electronic device casing 100 that is more excellent in heat dissipation characteristics.

In the electronic device casing 100 according to the present embodiment, the thermoplastic resin member 301 is preferably joined to at least the peripheral portion of the surface of the metal member (M) as shown in FIGS. By doing so, the metal member (M) can be reinforced more effectively with a smaller amount of the thermoplastic resin member 301. Furthermore, since the usage-amount of the thermoplastic resin member 301 can be reduced, it can suppress that a metal member (M) deform | transforms by the shrinkage | contraction at the time of shaping | molding of the thermoplastic resin member 301. FIG.
Further, in the electronic device casing 100 according to the present embodiment, at least a part of the thermoplastic resin member 301 is formed in a skeleton shape on the surface of the metal member (M), for example, as shown in FIGS. It is preferable. Examples of the frame shape include at least one shape selected from a brace shape, a lattice shape, a truss shape, and a ramen shape. It is preferable to form the thermoplastic resin member 301 in a framework on the surface of the metal member (M) because the metal member (M) can be more effectively reinforced with a smaller amount of the thermoplastic resin member 301.
Furthermore, since the amount of the thermoplastic resin member 301 can be reduced by forming the thermoplastic resin member 301 in a framework shape on the surface of the metal member (M), the thermoplastic resin member 301 is contracted during molding. It can suppress that a metal member (M) deform | transforms and the thermal radiation characteristic of the housing | casing 100 for electronic devices falls by the thermoplastic resin member 301. FIG.

The thickness of the thermoplastic resin member 301 according to the present embodiment may be the same at all locations, or may vary depending on the location.
In the electronic device casing 100 according to the present embodiment, the average thickness of the thermoplastic resin member 301 bonded to the surface of the metal member (M) is equal to the average thickness of the metal member (M) or the size of the entire casing. However, it is, for example, 1.0 mm to 10 mm, preferably 1.5 mm to 8 mm, and more preferably 1.5 mm to 5.0 mm.
When the average thickness of the thermoplastic resin member 301 is not less than the above lower limit value, the mechanical strength of the obtained electronic device casing 100 can be further improved.
When the average thickness of the thermoplastic resin member 301 is equal to or less than the above upper limit value, the obtained electronic device casing 100 can be made lighter. Moreover, since the usage-amount of the thermoplastic resin member 301 can be reduced, it can suppress that a metal member (M) deform | transforms by the shrinkage | contraction at the time of shaping | molding of the thermoplastic resin member 301. FIG.

  In the electronic device casing 100 according to the present embodiment, it is preferable that the thermoplastic resin member 301 is bonded to both surfaces of the metal member (M). By carrying out like this, since the metal member (M) can be reinforced from both surfaces of a metal member (M), the mechanical strength of the housing | casing 100 for electronic devices can be made more favorable. Thereby, the thickness of a metal member (M) can be made thinner and the housing 100 for electronic devices more lightweight can be obtained.

  Further, when the thermoplastic resin member 301 is bonded to both surfaces of the metal member (M), at least a part of the thermoplastic resin member 301 bonded to one surface of the metal member (M) is on the other surface. The bonded thermoplastic resin member 301 and the metal member (M) are preferably disposed at the same position so as to face each other in the direction perpendicular to the plate surface of the metal member (M). By carrying out like this, it can suppress that a metal member (M) deform | transforms by shrinkage | contraction at the time of shaping | molding of the thermoplastic resin member 301. FIG. In this case, in a plan view, at least a part of the thermoplastic resin member 301 bonded to one surface may not overlap with the thermoplastic resin member 301 bonded to the other surface.

  In the electronic device casing 100 according to the present embodiment, as shown in FIG. 1, the thermoplastic resin member 301 is preferably bonded to at least the peripheral portion of the surface of the metal member (M), preferably around the entire periphery. preferable. By doing so, the metal member (M) can be reinforced more effectively with a smaller amount of the thermoplastic resin member 301.

  On one surface of the electronic device casing 100 (for example, the bottom plate 201 and any one of the side plates 202), the thermoplastic resin member 301 is formed in a frame shape. For example, as illustrated in FIG. 3, the thermoplastic resin member 301 includes a first portion 301 a extending in the first direction and a second direction extending in a second direction different from the first direction. Part 301b. In the example shown in FIG. 3, the first portion 301a is orthogonal to one side of the bottom plate 201, and the second portion 301b is orthogonal to the other side of the bottom plate 201 and the first portion 301a. Note that the first portion 301 a and the second portion 301 b may extend obliquely with respect to the side of the bottom plate 201. For example, the first portion 301a and the second portion 301b may extend along a diagonal line of the bottom plate 201, or may have a portion extending radially around a certain point in the bottom plate 201. Good. Further, the thermoplastic resin member 301 may have a portion extending in a lattice shape. Furthermore, the thermoplastic resin member 301 may have a portion extending in a spider web shape.

  In any of the examples, when the thermoplastic resin member 301 is formed by injection molding, any portion of the thermoplastic resin member 301 is connected to the thermoplastic resin member 301 located at the edge of the electronic device casing 100. It is preferable. If it does in this way, all the thermoplastic resin members 301 can be formed by one injection molding.

  In the electronic device casing 100 according to the present embodiment, the thermoplastic resin member 301 is not joined to the boundary portion 205 (that is, the side of the electronic device casing 100 (three-dimensional)) between the bottom plate 201 and the side plate 202. It is preferable. By doing so, it becomes easier to bend the boundary line portion 205 between the bottom plate 201 and the side plate 202, and the electronic device casing 100 can be obtained more easily.

  In the metal member (M) according to the present embodiment, the surface of the metal bottom plate 201 and all the side plates 202 made of metal (in the example shown in FIG. 1, 202-1, 202-2, 202-3, and 202- It is preferable that the thermoplastic resin member 301 is bonded to each surface of 4). By carrying out like this, the mechanical strength of the housing | casing 100 for electronic devices can be made more favorable, and the thickness of a metal member (M) can be made thinner. As a result, a lighter electronic device casing 100 can be obtained.

  Moreover, it is preferable that the electronic device casing 100 according to the present embodiment further includes a metal lid plate 203 that is integrally bent and connected to the side plate 202. In this case, as shown in FIGS. 2 to 4, it is preferable that a thermoplastic resin member 301 is joined to a part of the surface of the lid plate 203, and the lid plate 203 is reinforced by the thermoplastic resin member 301. By doing so, the mechanical strength of the electronic device casing 100 can be further improved, and the thickness of the metal member (M) constituting the electronic device casing 100 can be further reduced. As a result, a lighter electronic device casing 100 can be obtained. In this case, it is preferable that the thermoplastic resin member 301 is not joined to the boundary portion between the side plate 202 and the lid plate 203 in order to facilitate bending. The metal lid plate 203 may be prepared separately from the metal member (M) and engaged with the side plate 202 using mechanical means or an engagement mechanism (for example, a hinge).

  It is preferable that the cover plate 203 according to the present embodiment has a fine uneven structure similar to the surface of the joint portion of the metal member (M) on the surface of the joint portion with the thermoplastic resin member 301. In this case, since the lid plate 203 and the thermoplastic resin member 301 are joined when a part of the thermoplastic resin member 301 enters the fine concavo-convex structure, the joining strength between the lid plate 203 and the thermoplastic resin member 301 is increased. Can be better. Thereby, since the mechanical strength of the electronic device casing 100 can be improved, the thickness of the cover plate 203 constituting the electronic device casing 100 can be further reduced. As a result, a lighter electronic device casing 100 can be obtained.

Here, the metal member (M) including the cover plate 203 and the fine concavo-convex structure on the surface of the cover plate 203 are, for example, a fine concavo-convex structure in which convex portions having an interval period of 5 nm to 500 μm stand.
Since a portion of the thermoplastic resin member 301 enters and is positioned in such a fine concavo-convex structure, the thermoplastic resin member 301 can be bonded to the metal member (M) or the cover plate 203. By doing so, physical resistance (anchor effect) is effectively expressed between the metal member (M) or the cover plate 203 and the thermoplastic resin member 301, and the metal member (M) or the cover plate 203 It becomes possible to join the thermoplastic resin member 301 more firmly.

Moreover, the electronic device casing 100 according to the present embodiment may have an opening 207 and a slit 209 in the side plate 202 as shown in FIG. By providing the opening 207 in the side plate 202, air can be sent from the opening 207 into the electronic device casing 100 using a blower or the like. As a result, the electronic device in the electronic device casing 100 is heated. This electronic device can be cooled by blowing air.
Further, by providing the side plate 202 with the slit 209, the wind taken from the opening 207 can be discharged to the outside of the electronic device casing 100. Note that the opening 207 and the slit 209 may be provided in the bottom plate 201.

  The electronic device according to the present embodiment includes an electronic device casing 100 and an electronic device accommodated in the electronic device casing 100. Examples of the electronic device in which the electronic device is housed in the electronic device casing 100 according to the present embodiment include an audio device, a vehicle-mounted mobile phone device, a car navigation device, an in-vehicle camera, and a drive recorder. Is mentioned.

  Hereafter, each member which comprises the housing | casing 100 for electronic devices which concerns on this embodiment is demonstrated taking FIG. 1 and FIG. 2 as an example.

<Metal member (M)>
The metal member (M) according to this embodiment includes a bottom plate 201 and at least one side plate 202 selected from the side plate 202-1, the side plate 202-2, the side plate 202-3, and the side plate 202-4. One of the preferred embodiments includes a bottom plate 201, a side plate 202-1, a side plate 202-2, a side plate 202-3, and a side plate 202-4. The second preferred embodiment includes a bottom plate 201, a side plate (front plate) 202-1, side plates (both side plates) 202-2 and 202-4, and a lid plate 203. The third preferred embodiment includes a bottom plate 201, a side plate 202-1, a side plate 202-2, a side plate 202-3, a side plate 202-4, and a lid plate 203. Among these embodiments, the embodiments 2 and 3 are particularly preferable.
In this way, the number of parts of the electronic device casing 100 can be further reduced, and as a result, process management can be facilitated and the number of ground installation locations can be further reduced. And since the number of parts and the ground installation location can be further reduced, it is possible to realize the electronic device casing 100 that is much lighter.

Although the metal material which comprises the metal member (M) which concerns on this embodiment is not specifically limited, The metal which has electromagnetic wave shielding property is preferable, for example, iron, steel materials, stainless steel, aluminum, aluminum alloy, magnesium, magnesium alloy, copper , Copper alloy, titanium and titanium alloy. These may be used alone or in combination of two or more.
Among these, aluminum (aluminum alone) and an aluminum alloy are preferable, and an aluminum alloy is more preferable from the viewpoint of light weight, low cost, and high strength.

The aluminum alloy is not particularly limited, but is an alloy containing aluminum as a main component. Specifically, an alloy of aluminum and at least one metal selected from copper, manganese, silicon, magnesium, zinc, nickel and the like can be exemplified.
As an aluminum alloy according to the present embodiment, a 4-digit number of an international aluminum alloy name defined in Japanese Industrial Standard (JIS H4140) is an aluminum / copper alloy in the 2000s, an aluminum / manganese alloy in the 3000s 4000 series aluminum / silicon alloys, 5000 series aluminum / magnesium alloys, 6000 series aluminum / magnesium / silicon alloys, 7000 series aluminum / zinc / magnesium alloys, aluminum / zinc / magnesium / copper alloys Etc. are preferably used. Among these, aluminum / magnesium alloys in the 5000s are particularly preferred from the viewpoint of availability and mechanical / thermal properties.

The thickness of the metal member (M) according to the present embodiment may be the same thickness at all locations or may vary depending on the location. The average thickness of the metal member (M) is preferably from 0.2 mm to 1.0 mm, more preferably from 0.2 mm to 1.0 mm, and particularly preferably from 0.2 mm to 0.8 mm.
When the average thickness of the metal member (M) is equal to or more than the above lower limit value, the mechanical strength, heat dissipation characteristics, and electromagnetic wave shielding characteristics of the obtained electronic device casing 100 can be further improved.
When the average thickness of the metal member (M) is equal to or less than the above upper limit value, the obtained electronic device casing 100 can be made lighter. Furthermore, when the average thickness of the metal member (M) is less than or equal to the above upper limit value, it is easier to bend the metal member (M), and the productivity of the electronic device casing 100 can be further improved.

  The shape of the metal member (M) can be a plate shape, for example. The metal member (M) is formed by processing the metal material into a predetermined shape by a known method such as plastic working by cutting, pressing, etc., punching, cutting, polishing, electric discharge machining, etc. Those that have been subjected to crystallization treatment are preferred. In short, it is preferable to use a material processed into a necessary shape by various processing methods.

On the surface of the joint portion between the metal member (M) and the thermoplastic resin member 301, for example, a fine concavo-convex structure in which convex portions having an interval period of 5 nm or more and 500 μm or less stand is formed.
Here, the interval period of the fine concavo-convex structure is an average value of the distance from the convex portion to the adjacent convex portion, and can be obtained using a photograph taken with an electron microscope or a laser microscope, or a surface roughness measuring device.
The interval period measured by an electron microscope or a laser microscope is usually an interval period of less than 500 nm, and specifically, the surface of the joint portion of the metal member (M) with the thermoplastic resin member 301 is photographed. From the photograph, 50 arbitrary convex portions are selected, and the distances from those convex portions to adjacent convex portions are measured. An interval period is defined by integrating all the distances from the convex portion to the adjacent convex portion and dividing the sum by 50. On the other hand, the interval period exceeding 500 nm is usually determined using a surface roughness measuring device.
Usually, not only the surface of the joint part of the metal member (M) but also the entire surface of the metal member (M) is subjected to the surface roughening treatment, and therefore the same as the surface of the joint part of the metal member (M). It is also possible to measure the interval period from a location other than the joint surface.

The interval period is preferably 10 nm to 300 μm, more preferably 20 nm to 200 μm.
When the interval period is equal to or more than the lower limit value, the thermoplastic resin composition (P) constituting the thermoplastic resin member 301 can sufficiently enter the concave portion of the fine concavo-convex structure, and the metal member (M) and the heat The bonding strength with the plastic resin member 301 can be further improved. Moreover, it can suppress that a clearance gap produces in the junction part of the metal member (M) and the thermoplastic resin member 301 as the said space | interval period is below the said upper limit. As a result, since impurities such as moisture can be prevented from entering through the gap between the metal-resin interface, it is possible to suppress a decrease in strength when the electronic device casing 100 is used at high temperature and high humidity.

As a method of forming the fine concavo-convex structure having the above-mentioned interval cycle, a method of immersing a metal member in an inorganic base aqueous solution containing NaOH or the like and / or an inorganic acid aqueous solution containing HCl, HNO ₃ or the like; Method of processing a member; method of forming irregularities on a metal member surface by pressing a die punch having irregularities produced by mechanical cutting such as diamond abrasive grinding or blasting, sandblasting, knurling, laser processing A method for producing a concavo-convex shape on the surface of a metal member by using a metal member in one or more aqueous solutions selected from hydrated hydrazine, ammonia, and a water-soluble amine compound as disclosed in WO2009 / 31632 And the like. These methods can be selectively used depending on the type of the metal material constituting the metal member (M) and the uneven shape formed within the range of the interval period. In the present embodiment, the method of immersing a metal member in an inorganic base aqueous solution containing NaOH or the like and / or an inorganic acid aqueous solution containing HCl, HNO ₃ or the like can treat the metal member over a wide range, Moreover, it is preferable because the bonding strength between the metal member (M) and the thermoplastic resin member 301 is excellent.

Further, from the viewpoint of further improving the bonding strength between the metal member (M) and the thermoplastic resin member 301, any three linear portions in parallel relation on the bonding portion surface 104 of the metal member (M), and Surface roughness measured according to JIS B0601 (corresponding international standard: ISO 4287) for a total of 6 straight line parts composed of arbitrary 3 straight line parts orthogonal to the 3 straight line parts satisfies the following requirements (1) and (2). It is preferable to satisfy them simultaneously.
(1) Includes one or more straight line portions with a load length ratio (Rmr) of a roughness curve at a cutting level of 20% and an evaluation length of 4 mm of 30% or less. (2) Evaluation length of all straight line portions. Ten point average roughness (Rz) at 4 mm exceeds 2 μm

FIG. 22 is for explaining a total of six straight portions including arbitrary three straight portions in parallel relation on the joint surface 104 of the metal member (M) and arbitrary three straight portions orthogonal to the three straight portions. FIG.
As the six straight line portions, for example, six straight line portions B1 to B6 as shown in FIG. 22 can be selected. First, a center line B1 passing through the center A of the joint surface 104 of the metal member (M) is selected as the reference line. Next, straight lines B2 and B3 that are parallel to the center line B1 are selected. Next, a center line B4 orthogonal to the center line B1 is selected, and straight lines B5 and B6 orthogonal to the center line B1 and parallel to the center line B4 are selected. Here, the vertical distances D1 to D4 between the straight lines are, for example, 2 to 5 mm.
In general, the metal member (M) is subjected to surface roughening treatment not only on the surface 104 of the metal member (M) with the thermoplastic resin member 301 but also on the entire metal member (M). Therefore, for example, the six straight portions may be selected from locations other than the joint surface 104 on the same surface as the joint surface 104 of the metal member (M) with the thermoplastic resin member 301 or on the opposite surface.

  When the above requirements (1) and (2) are satisfied at the same time, it is not always clear why the electronic device casing 100 can be obtained with better bonding strength between the metal member (M) and the thermoplastic resin member 301. The joint surface 104 of the metal member (M) with the thermoplastic resin member 301 has a structure that can effectively develop an anchor effect between the metal member (M) and the thermoplastic resin member 301. It is done.

From the viewpoint of further improving the joint strength between the metal member (M) and the thermoplastic resin member 301, any three straight portions in parallel relation on the joint surface 104 of the metal member (M) and the three straight lines. The surface roughness measured in accordance with JIS B0601 (corresponding international standard: ISO4287) for a total of six straight line parts composed of arbitrary three straight line parts orthogonal to the part is one of the following requirements (1A) to (1C) It is preferable to further satisfy one or more requirements, and it is particularly preferable to satisfy requirement (1C).
(1A) A straight line portion with a load length ratio (Rmr) of a roughness curve at a cutting level of 20% and an evaluation length of 4 mm is preferably 30% or less, preferably 2 straight portions or more, more preferably 3 straight portions or more, most preferably (1B) including 6 straight portions, preferably a straight portion having a load level ratio (Rmr) of 20% or less of a roughness curve at a cutting level of 20% and an evaluation length of 4 mm, preferably 1 straight portion or more, more preferably 2 straight lines. More than 3 parts, more preferably 3 straight parts or more, most preferably 6 straight parts (1C) A straight part where the cutting length is 40% and the load length ratio (Rmr) of the roughness curve at an evaluation length of 4 mm is 60% or less Is preferably 1 straight part or more, more preferably 2 straight parts or more, further preferably 3 straight parts or more, and most preferably 6 straight parts

Further, from the viewpoint of further improving the joint strength between the metal member (M) and the thermoplastic resin member 301, it conforms to JIS B0601 (corresponding international standard: ISO 4287) on the joint surface 104 of the metal member (M). The average value of the load length ratio (Rmr) of the roughness curve at a cutting level of 20% and an evaluation length of 4 mm is preferably 0.1% or more and 40% or less, more preferably 0.5% or more. It is 30% or less, more preferably 1% or more and 20% or less, and most preferably 2% or more and 15% or less.
In addition, what averaged the load length rate (Rmr) of the above-mentioned arbitrary 6 linear parts can be employ | adopted for the average value of the said load length rate (Rmr).

The load length ratio (Rmr) of the joint surface 104 of the metal member (M) according to the present embodiment can be controlled by appropriately adjusting the conditions of the roughening treatment on the surface of the metal member.
In the present embodiment, in particular, the type and concentration of the etching agent, the temperature and time of the roughening treatment, the timing of the etching treatment, and the like are listed as factors for controlling the load length ratio (Rmr).

From the viewpoint of further improving the joint strength between the metal member (M) and the thermoplastic resin member 301, any three straight portions in parallel relation on the joint surface 104 of the metal member (M) and the three straight lines. It is preferable that the surface roughness measured in accordance with JIS B0601 (corresponding international standard: ISO4287) further satisfies the following requirement (2A) for a total of six straight line parts composed of arbitrary three straight line parts orthogonal to the part.
(2A) The 10-point average roughness (Rz) at an evaluation length of 4 mm of all straight portions is preferably more than 5 μm, more preferably 10 μm or more, and further preferably 15 μm or more.

From the viewpoint of further improving the joint strength between the metal member (M) and the thermoplastic resin member 301, the average value of the ten-point average roughness (Rz) on the joint surface 104 of the metal member (M) is preferably It is more than 2 μm and 50 μm or less, more preferably more than 5 μm and 45 μm or less, further preferably 10 μm or more and 40 μm or less, and particularly preferably 15 μm or more and 30 μm or less.
In addition, what averaged the 10-point average roughness (Rz) of the above-mentioned arbitrary 6 linear parts can be employ | adopted for the average value of the said 10-point average roughness (Rz).

From the viewpoint of further improving the joint strength between the metal member (M) and the thermoplastic resin member 301, any three straight portions in parallel relation on the joint surface 104 of the metal member (M) and the three straight lines. It is preferable that the surface roughness measured in accordance with JIS B0601 (corresponding international standard: ISO4287) further satisfies the following requirement (4) for a total of six straight line parts composed of arbitrary three straight line parts orthogonal to the part.
(4) The average length (RSm) of the roughness curve elements of all the linear portions is more than 10 μm and less than 300 μm, more preferably 20 μm or more and 200 μm or less.

From the viewpoint of further improving the joint strength between the metal member (M) and the thermoplastic resin member 301, the average value of the average length (RSm) of the roughness curve elements on the joint surface 104 of the metal member (M). Is preferably more than 10 μm and less than 300 μm, more preferably 20 μm or more and 200 μm or less.
In addition, what averaged the 10-point average roughness (Rz) of the above-mentioned arbitrary 6 linear parts can be employ | adopted for the average value of the average length (RSm) of the said roughness curve element.
Here, in this embodiment, when the average thickness of the metal member (M) is in the range of 500 μm or more, the average value of the average length (RSm) of the roughness curve element is the interval period.

The ten-point average roughness (Rz) of the joint surface 104 of the metal member (M) according to the present embodiment and the average length (RSm) of the roughness curve element are appropriate for the conditions of the roughening treatment on the surface of the metal member. It is possible to control by adjusting to.
In the present embodiment, the temperature and time of the roughening treatment, the etching amount, and the like are particularly cited as factors for controlling the ten-point average roughness (Rz) and the average length (RSm) of the roughness curve elements. .

Next, a method for preparing the metal member (M) that satisfies the above-described interval period, load length ratio (Rmr), ten-point average roughness (Rz), average length of roughness curve elements (RSm), and the like will be described.
Such a metal member (M) can be formed, for example, by roughening the surface of the metal member using an etching agent.
Hereinafter, the roughness of the metal member for obtaining the metal member (M) satisfying the interval period, the load length ratio (Rmr), the ten-point average roughness (Rz), the average length of the roughness curve element (RSm), etc. 2 shows an example of a crystallization processing method. However, the roughening method of the metal member according to the present embodiment is not limited to the following example.

(1) Pretreatment process First, it is desirable that the metal member does not have a thick film made of an oxide film, a hydroxide, or the like on the surface on the joining side with the thermoplastic resin member 301. In order to remove such a thick film, the surface layer may be polished by mechanical polishing such as sand blasting, shot blasting, grinding, barrel processing, or chemical polishing before the next etching step. Good. Further, when there is significant contamination of machine oil or the like on the surface on the joining side with the thermoplastic resin member 301, it is preferable to perform treatment with an alkaline aqueous solution such as a sodium hydroxide aqueous solution or a potassium hydroxide aqueous solution, or degreasing.

(2) Surface roughening treatment process In this embodiment, as a surface roughening treatment method of a metal member, it is preferable to perform the process by the acid type etching agent mentioned later at a specific timing. Specifically, the treatment with the acid-based etching agent is preferably performed at the final stage of the surface roughening treatment step.

  Examples of the roughening treatment using the acid-based etching agent include treatment methods such as immersion and spraying. The treatment temperature is preferably 20 to 40 ° C., the treatment time is preferably about 5 to 350 seconds, 20 to 300 seconds are more preferred, and 50 to 300 seconds are particularly preferred from the viewpoint that the surface of the metal member can be more uniformly roughened.

  By the roughening treatment using the acid-based etching agent, the surface of the metal member is roughened into an uneven shape. The etching amount (dissolution amount) in the depth direction of the metal member when the acid-based etching agent is used is preferably 0.1 to 500 μm when calculated from the mass, specific gravity and surface area of the dissolved metal member. 5 to 500 μm is more preferable, and 5 to 100 μm is even more preferable. When the etching amount is equal to or greater than the lower limit, the bonding strength between the metal member (M) and the thermoplastic resin member 301 can be further improved. Further, if the etching amount is equal to or less than the above upper limit value, the processing cost can be reduced. The etching amount can be adjusted by the processing temperature, processing time, and the like.

  In this embodiment, when the metal member is roughened using the acid-based etching agent, the entire surface of the metal member may be roughened, and only the surface to which the thermoplastic resin member 301 is bonded is used. Partial roughening treatment may be performed.

(3) Post-treatment step In this embodiment, it is usually preferable to perform washing and drying after the surface roughening treatment step. Although there is no restriction | limiting in particular about the method of water washing, It is preferable to wash | clean for predetermined time with immersion or flowing water.

  Furthermore, as a post-treatment step, it is preferable to perform ultrasonic cleaning in order to remove smut and the like generated by the treatment using the acid-based etching agent. The ultrasonic cleaning conditions are not particularly limited as long as the generated smut and the like can be removed, but the solvent used is preferably water, and the treatment time is preferably 1 to 20 minutes.

(Acid etching agent)
In this embodiment, as an etching agent used for the roughening process of the metal member surface, the specific acid type etching agent mentioned later is preferable. By treating with the specific etching agent, a fine concavo-convex structure suitable for improving the adhesiveness with the thermoplastic resin member 301 is formed on the surface of the metal member, and the metal member (M) and the heat are formed by the anchor effect. It is considered that the bonding strength with the plastic resin member 301 is further improved.

  Hereinafter, the components of the acid-based etching agent that can be used in this embodiment will be described.

  The acid-based etching agent contains at least one of ferric ions and cupric ions and an acid, and may contain manganese ions, various additives, and the like as necessary.

-Ferric ion The said ferric ion is a component which oxidizes a metal member, and this ferric ion can be contained in an acid type etching agent by mix | blending a ferric ion source. Examples of the ferric ion source include ferric nitrate, ferric sulfate, and ferric chloride. Among the ferric ion sources, ferric chloride is preferable because it has excellent solubility and is inexpensive.

  In this embodiment, content of the said ferric ion in an acid type etching agent becomes like this. Preferably it is 0.01-20 mass%, More preferably, it is 0.1-12 mass%, More preferably, it is 0.5-7 % By mass, still more preferably 1-6% by mass, particularly preferably 1-5% by mass. If content of the said ferric ion is more than the said lower limit, the fall of the roughening rate (dissolution rate) of a metal member can be prevented. On the other hand, if the content of the ferric ion is not more than the above upper limit value, the roughening rate can be properly maintained, so that the bonding strength between the metal member (M) and the thermoplastic resin member 301 is improved. More suitable uniform roughening becomes possible.

-Cupric ion The said cupric ion is a component which oxidizes a metal member, and can mix | blend this cupric ion in an acid type etching agent by mix | blending a cupric ion source. Examples of the cupric ion source include cupric sulfate, cupric chloride, cupric nitrate, and cupric hydroxide. Of the cupric ion sources, cupric sulfate and cupric chloride are preferred because they are inexpensive.

  In this embodiment, it is preferable that content of the said cupric ion in an acid type etching agent is 0.001-10 mass%, More preferably, it is 0.01-7 mass%, More preferably, it is 0.00. It is 05-1 mass%, More preferably, it is 0.1-0.8 mass%, More preferably, it is 0.15-0.7 mass%, Most preferably, it is 0.15-0.4 mass%. If content of the said cupric ion is more than the said lower limit, the fall of the roughening rate (dissolution rate) of a metal member can be prevented. On the other hand, if the content of the cupric ion is less than or equal to the above upper limit value, the roughening rate can be properly maintained, so that the bonding strength between the metal member (M) and the thermoplastic resin member 301 is improved. More suitable uniform roughening becomes possible.

  The acid-based etching agent may contain only one of ferric ion and cupric ion, or may contain both, but both ferric ion and cupric ion It is preferable to contain. Since the acid-based etching agent contains both ferric ions and cupric ions, a good roughened shape suitable for improving the bonding strength between the metal member (M) and the thermoplastic resin member 301 can be easily obtained. can get.

  When the acid-based etching agent contains both ferric ions and cupric ions, the contents of ferric ions and cupric ions are preferably in the above ranges. The total content of ferric ions and cupric ions in the acid-based etching agent is preferably 0.011 to 20% by mass, more preferably 0.1 to 15% by mass, and even more preferably. Is 0.5 to 10% by mass, particularly preferably 1 to 5% by mass.

Manganese ions The acid-based etching agent may contain manganese ions in order to uniformly roughen the surface of the metal member. Manganese ions can be contained in the acid-based etching agent by blending a manganese ion source. Examples of the manganese ion source include manganese sulfate, manganese chloride, manganese acetate, manganese fluoride, and manganese nitrate. Among the above manganese ion sources, manganese sulfate and manganese chloride are preferable from the viewpoint of being inexpensive.

  In this embodiment, it is preferable that content of the said manganese ion in an acid type etching agent is 0-1 mass%, More preferably, it is 0-0.5 mass%. The present inventors show that the manganese ion content exhibits sufficient bonding strength even when the thermoplastic resin (P1) constituting the thermoplastic resin member 301 is 0% by mass when it is a polyolefin resin. I have confirmed. That is, when a polyolefin resin is used as the thermoplastic resin (P1), the manganese ion content is preferably 0% by mass. On the other hand, when a thermoplastic resin other than the polyolefin resin is used, the content is not more than the upper limit. Manganese ions are used as appropriate.

-Acid The acid is a component that dissolves a metal oxidized by ferric ions and / or cupric ions. Examples of the acid include inorganic acids such as hydrochloric acid, hydrobromic acid, sulfuric acid, nitric acid, phosphoric acid, perchloric acid, and sulfamic acid, and organic acids such as sulfonic acid and carboxylic acid. Examples of the carboxylic acid include formic acid, acetic acid, citric acid, oxalic acid, malic acid and the like. One or more of these acids can be added to the acid-based etching agent. Of the inorganic acids, sulfuric acid is preferred because it has almost no odor and is inexpensive. Among the organic acids, carboxylic acid is preferable from the viewpoint of uniformity of the roughened shape.

  In the present embodiment, the acid content in the acid-based etching agent is preferably 0.1 to 50% by mass, more preferably 0.5 to 50% by mass, and 1 to 50% by mass. It is still more preferable, it is still more preferable that it is 1-30 mass%, it is still more preferable that it is 1-25 mass%, and it is still more preferable that it is 2-18 mass%. If content of the said acid is more than the said lower limit, the fall of the roughening rate (dissolution rate) of a metal member can be prevented. On the other hand, if the content of the acid is not more than the above upper limit, workability can be improved because crystal precipitation of the metal salt of the metal member when the liquid temperature is lowered can be prevented.

Other components To the acid-based etching agent that can be used in the present embodiment, a surfactant may be added to prevent unevenness due to surface contaminants such as fingerprints, and other additives may be added as necessary. May be. Other additives include halide ion sources added to form deep irregularities, such as sodium chloride, potassium chloride, sodium bromide, potassium bromide and the like. Alternatively, thio compounds such as thiosulfate ions and thiourea added to increase the roughening treatment speed, azoles such as imidazole, triazole and tetrazole added to obtain a more uniform roughened shape, Examples thereof include a pH adjuster added to control the oxidization reaction. When these other components are added, the total content is preferably about 0.01 to 10% by mass in the acid-based etching agent.

  The acid-based etching agent of this embodiment can be easily prepared by dissolving each of the above components in ion-exchanged water or the like.

<Thermoplastic resin member>
Hereinafter, the thermoplastic resin member 301 according to the present embodiment will be described.
The thermoplastic resin member 301 according to the present embodiment is composed of a thermoplastic resin composition (P). The thermoplastic resin composition (P) contains the thermoplastic resin (P1) as an essential component, and optionally contains other compounding agents (P2). For convenience, it is described that the thermoplastic resin member 301 is made of the thermoplastic resin composition (P) even when the thermoplastic resin member 301 is made of only the thermoplastic resin (P1).

(Thermoplastic resin (P1))
Although it does not specifically limit as a thermoplastic resin (P1), For example, (meth) acrylic-type resin, such as polyolefin resin and poly (meth) acrylic acid methyl resin, polystyrene resin, polyvinyl alcohol-polyvinyl chloride copolymer resin, Aromatic polyethers such as polyvinyl acetal resin, polyvinyl butyral resin, polyvinyl formal resin, polymethylpentene resin, maleic anhydride-styrene copolymer resin, polycarbonate resin, polyphenylene ether resin, polyether ether ketone resin, polyether ketone resin Ketone, polyester resin, polyamide resin, polyamideimide resin, polyimide resin, polyetherimide resin, styrene elastomer, polyolefin elastomer, polyurethane elastomer, poly Steal elastomer, polyamide elastomer, ionomer, aminopolyacrylamide resin, isobutylene maleic anhydride copolymer, ABS, ACS, AES, AS, ASA, MBS, ethylene-vinyl chloride copolymer, ethylene-vinyl acetate copolymer, ethylene-vinyl acetate Vinyl chloride graft polymer, ethylene-vinyl alcohol copolymer, chlorinated polyvinyl chloride resin, chlorinated polyethylene resin, chlorinated polypropylene resin, carboxyvinyl polymer, ketone resin, amorphous copolyester resin, norbornene resin, fluoroplastic, polytetra Fluoroethylene resin, fluorinated ethylene polypropylene resin, PFA, polychlorofluoroethylene resin, ethylenetetrafluoroethylene copolymer, polyfluoride Vinylidene resin, polyvinyl fluoride resin, polyarylate resin, thermoplastic polyimide resin, polyvinylidene chloride resin, polyvinyl chloride resin, polyvinyl acetate resin, polysulfone resin, polyparamethylstyrene resin, polyallylamine resin, polyvinyl ether resin, polyphenylene Oxide resin, polyphenylene sulfide (PPS) resin, polymethylpentene resin, oligoester acrylate, xylene resin, maleic acid resin, polyhydroxybutyrate resin, polysulfone resin, polylactic acid resin, polyglutamic acid resin, polycaprolactone resin, polyethersulfone Resin, polyacrylonitrile resin, styrene-acrylonitrile copolymer resin, acrylonitrile-butadiene-styrene copolymer resin, polyacetal resin, etc. I can get lost. These thermoplastic resins may be used individually by 1 type, and may be used in combination of 2 or more types.

  Among these, polyolefin resin, polyester resin, polyamide resin, polyphenylene sulfide resin, polycarbonate from the viewpoint that the effect of improving the bonding strength between the metal member (M) and the thermoplastic resin member 301 can be obtained more effectively. Resin, polyether ether ketone resin, polyether ketone resin, polyimide resin, polyether sulfone resin, polystyrene resin, polyacrylonitrile resin, styrene-acrylonitrile copolymer resin, acrylonitrile-butadiene-styrene copolymer resin, (meth) acrylic One or two or more thermoplastic resins selected from a series resin and a polyacetal resin are preferably used.

As the polyolefin-based resin, a polymer obtained by polymerizing olefin can be used without any particular limitation.
Examples of the olefin constituting the polyolefin resin include ethylene, α-olefin, cyclic olefin, and polar olefin.

  Examples of the α-olefin include linear or branched α-olefins having 3 to 30 carbon atoms, preferably 3 to 20 carbon atoms. More specifically, propylene, 1-butene, 1-pentene, 3-methyl-1-butene, 1-hexene, 4-methyl-1-pentene, 3-methyl-1-pentene, 1-octene, 1-octene, Decene, 1-dodecene, 1-tetradecene, 1-hexadecene, 1-octadecene, 1-eicocene and the like can be mentioned.

  As said cyclic olefin, a C3-C30 cyclic olefin is mentioned, Preferably it is C3-C20. More specifically, cyclopentene, cycloheptene, norbornene, 5-methyl-2-norbornene, tetracyclododecene, 2-methyl-1,4,5,8-dimethano-1,2,3,4,4a, 5 , 8,8a-octahydronaphthalene and the like.

  Examples of the polar olefin include vinyl acetate, methyl methacrylate, methyl acrylate, and ethyl acrylate.

  As the olefin constituting the polyolefin resin, ethylene, propylene, 1-butene, 1-pentene, 3-methyl-1-butene, 1-hexene, 4-methyl-1-pentene, 3-methyl-1- Examples include pentene. Of these, ethylene, propylene, 1-butene, 1-hexene and 4-methyl-1-pentene are more preferable, and ethylene or propylene is more preferable.

  The polyolefin resin may be obtained by polymerizing the above-mentioned olefin alone, or may be obtained by random copolymerization, block copolymerization, or graft copolymerization in combination of two or more. .

  The polyolefin resin may be a blend of polyolefins having different properties. Examples thereof include one or more selected from propylene homopolymer, propylene random copolymer, and propylene block copolymer, propylene / ethylene copolymer rubber, ethylene / α-olefin copolymer (here α- Examples of olefins include blends with elastomers such as 1-butene, 1-hexene, 1-octene and the like.

  The polyolefin resin may be a linear resin or a resin having a branched structure.

  Examples of the polyester resin include aliphatic polyesters such as polylactic acid, polyglycolic acid, polycaprolactone, and polyethylene succinate, polyethylene terephthalate, polyethylene naphthalate, polybutylene terephthalate (PBT), and polycyclohexylenedimethylene terephthalate (PCT). ) And the like.

  Examples of the polyamide resins include ring-opening polymerization aliphatic polyamides such as PA6 and PA12; polycondensation polyamides such as PA66, PA46, PA610, PA612, and PA11; MXD6, PA6T, PA9T, PA6T / 66, PA6T / 6. Semi-aromatic polyamides such as amorphous PA; polyaromatic polyamides such as poly (p-phenylene terephthalamide), poly (m-phenylene terephthalamide), poly (m-phenylene isophthalamide), amide elastomers, etc. It is done.

(Other compounding agents (P2))
The thermoplastic resin composition (P) may contain other compounding agents (P2) for the purpose of imparting individual functions. Examples of the compounding agent (P2) include fillers, flame retardants, flame retardant aids, heat stabilizers, antioxidants, pigments, weathering agents, plasticizers, dispersants, lubricants, mold release agents, antistatic agents, Examples include impact modifiers.

In the present embodiment, from the viewpoint of adjusting the difference in linear expansion coefficient between the metal member (M) and the thermoplastic resin member 301 and improving the mechanical strength of the thermoplastic resin member 301, the thermoplastic resin member 301 further includes a filler. It is preferable to include.
As the filler, for example, one or more kinds selected from the group consisting of hydrotalcite, glass fiber, carbon fiber, metal fiber, organic fiber, carbon particle, clay, talc, silica, mineral, and cellulose fiber are selected. Can do. Among these, Preferably, it is 1 type, or 2 or more types selected from hydrotalcite, glass fiber, carbon fiber, talc, and a mineral.
The shape of the filler is not particularly limited, and may be any shape such as a fiber shape, a particle shape, or a plate shape.

  When the thermoplastic resin member 301 includes a filler, the content is, for example, 5% by mass to 95% by mass, preferably 10% by mass to 90% by mass, when the entire thermoplastic resin member 301 is 100% by mass. % Or less, more preferably 20% by mass or more and 90% by mass or less, further preferably 30% by mass or more and 90% by mass or less, and particularly preferably 50% by mass or more and 90% by mass or less.

  The filler has the effect of controlling the linear expansion coefficient of the thermoplastic resin member 301 in addition to the effect of increasing the rigidity of the thermoplastic resin member 301. In particular, in the case of the electronic device casing 100 of the present embodiment, the temperature dependence of the shape stability of the metal member (M) and the thermoplastic resin member 301 is often greatly different. The electronic device casing 100 is likely to be distorted. This distortion can be reduced when the thermoplastic resin member 301 contains a filler. Moreover, reduction of toughness can be suppressed because content of a filler exists in the said range.

In the present embodiment, the filler is preferably a fibrous filler, more preferably glass fiber and carbon fiber, and particularly preferably glass fiber.
Thereby, since shrinkage | contraction of the thermoplastic resin member 301 after shaping | molding can be suppressed, joining to the metal member (M) and the thermoplastic resin member 301 can be made stronger.

Examples of the hydrotalcites include natural products and synthetic products, and examples include hydrous basic carbonates such as magnesium, calcium, zinc, aluminum, and bismuth or those that do not contain crystal water. Examples of natural products include those having the structure of Mg ₆ Al ₂ (OH) ₁₆ CO ₃ .4H ₂ O. As synthetic products, Mg _0.7 Al _0.3 (OH) ₂ (CO ₃ ) _0.15 · 0.54H ₂ O, Mg _4.5 Al ₂ (OH) ₁₃ CO ₃ · 3.5H ₂ O, Mg _4.2 Al ₂ (OH) _12.4 (CO ₃ ) _0.15 , Zn ₆ Al ₂ (OH) ₁₆ CO ₃ .4H ₂ O, Ca ₆ Al ₂ (OH) ₁₆ CO ₃ .4H ₂ O, Mg ₁₄ Bi ₂ (OH) _29.6 · 4.2H ₂ O and the like. The blending amount of the hydrotalcite is preferably 0.01 parts by mass or more and 2 parts by mass or less per 100 parts by mass of the thermoplastic resin composition (P). The heat resistance of the thermoplastic resin member 301 obtained can be made more favorable as the compounding quantity of hydrotalcite is more than the said lower limit. The flame retardance of the thermoplastic resin member 301 obtained can be made more favorable as the compounding quantity of hydrotalcite is below the said upper limit.

  Examples of the flame retardant include bis (2,3-dibromopropyl) ether of tetrabromobisphenol A, bis (2,3-dibromopropyl) ether of tetrabromobisphenol S, and bis (2,3 of tetrabromobisphenol A). -Dibromopropyl) ether, tris (2,3-dibromopropyl) isocyanurate and mixtures of two or more of these. Content of a flame retardant is 5-25 mass parts per 100 mass parts of thermoplastic resin compositions (P), Preferably it is 10-20 mass parts. When the content of the flame retardant is not less than the above lower limit value, the flame retardancy of the obtained thermoplastic resin member 301 can be further improved. When the content of the flame retardant is not more than the above upper limit value, the mechanical properties of the obtained thermoplastic resin member 301 can be further improved.

The thermoplastic resin composition (P) can contain a flame retardant aid. When the thermoplastic resin composition (P) contains a flame retardant aid, the content thereof is 0.5 to 20 parts by mass, preferably 1 to 10 parts by mass, per 100 parts by mass of the thermoplastic resin composition (P). is there. When the content of the flame retardant auxiliary is not less than the above lower limit, a sufficient synergistic effect with the flame retardant can be obtained. When the content of the flame retardant aid is not more than the above upper limit value, the mechanical properties of the obtained thermoplastic resin member 301 can be further improved. Examples of the flame retardant aid include antimony trioxide (Sb ₂ O ₃ ) and antimony pentoxide (Sb ₂ O ₅ ).

  The thermoplastic resin composition (P) preferably has high fluidity in order to facilitate entry into the fine uneven structure provided on the surface of the metal member (M). Therefore, in this embodiment, the thermoplastic resin composition (P) preferably has an MFR of 1 to 200 g / 10 min measured at 230 ° C. under a load of 2.16 kg in accordance with ASTM D1238. More preferably, it is -50g / 10min.

(Method for producing thermoplastic resin composition (P))
The manufacturing method of a thermoplastic resin composition (P) is not specifically limited, Generally, it can manufacture by a well-known method. For example, the following method is mentioned. First, the thermoplastic resin (P1) and, if necessary, other compounding agent (P2) are mixed or mixed using a Banbury mixer, a single screw extruder, a twin screw extruder, a high speed twin screw extruder or the like. A thermoplastic resin composition (P) is obtained by melt-mixing.

[Method of manufacturing casing for electronic device]
Next, a method for manufacturing the electronic device casing 100 according to the present embodiment will be described.
3, 4 and 5 schematically show an example of the structure of the developed figure metal plate (development figure metal resin bonded plate 20, plate material) to which the thermoplastic resin member 301 of the embodiment according to the present invention is joined. FIG.
The method for manufacturing the electronic device casing 100 according to the present embodiment includes, for example, the following steps (A) to (C).
(A) a metal bottom plate 201 and metal side plates 202 (202-1, 202-2, 202-3, and 202-4) integrally connected to the metal bottom plate 201, Step of preparing a developed graphic metal plate having a fine concavo-convex structure on at least the surface of the joining portion to which the thermoplastic resin member 301 is joined (B) The developed graphic metal plate is placed in a mold, and a thermoplastic resin composition ( (P) A step of producing the developed graphic metal resin bonding plate 20 by injecting P into the mold and bonding the thermoplastic resin member 301 to the surface of the developed graphic metal plate. The process of bending the boundary line portion 205 between the bottom plate 201 and the side plate 202 of the 20 and making the development view-like metal resin bonding plate 20 into a box shape is performed by bending the electronic device casing 100 according to the present embodiment. Unfolded metal plate or exhibition that is the previous intermediate product Since the shape of FIG shaped metal resin bonding plate 20 is flat, there is a merit of improving the storage efficiency and transportation efficiency of mass intermediate product.

(Process (A))
First, a metal bottom plate 201 and a metal side plate 202 (202-1, 202-2, 202-3, and 202-4) integrally connected to the metal bottom plate 201 are provided, and at least A development-form metal plate that is a shape of the development view of the electronic device casing 100 having a fine concavo-convex structure on the surface of the joint portion to which the thermoplastic resin member 301 is joined is prepared. Here, the development view metal plate 20 may be a part (for example, two or more) of the development view of the electronic device casing 100. For example, the developed metal plate may further include a metal lid plate 203 integrally connected to one side plate 202 as shown in FIG. 3, or the lid plate 203 as shown in FIG. May not be provided. Moreover, as shown in FIG. 4, it is not necessary to provide one of the side plates (back plate) 202-3. When the lid plate 203 is not provided, the lid plate 203 shown in FIG. 2 is prepared separately, and the lid plate 203 can be engaged with one side plate 202 by, for example, the mechanical engagement means. Similarly, when the back plate 202-3 is not provided, a back plate 202-3 (not shown) is prepared separately, and a surface composed of the bottom plate 201, both side plates 202-2 and 202-4, and the cover plate 203 is provided. For example, it can be engaged by the mechanical engagement means.
Here, the developed figure-like metal plate corresponds to the metal member (M) constituting the casing 100 for the electronic device. For example, the development shown in FIGS. 3, 4, and 5 is performed by punching the plate-like metal member. It can be obtained by processing in the shape of a figure and subjecting at least the surface of the joining portion to which the thermoplastic resin member 301 is joined to the roughening treatment described above.
Details of the metal member and the roughening treatment are omitted here.

(Process (B))
Next, the developed metal plate 20 is placed in the mold, and the thermoplastic resin composition (P) is injected into the mold to join the thermoplastic resin member 301 to the surface of the developed metal plate 20. .
Examples of the method for joining the thermoplastic resin member 301 include an injection molding method, a transfer molding method, a compression molding method, a reaction injection molding method, a blow molding method, a thermoforming method, and a press molding method. Among these, the injection molding method is preferable. That is, the thermoplastic resin member 301 is preferably an injection molded body. Hereinafter, an example using the injection molding method will be described.

The method for joining the thermoplastic resin member 301 to the developed graphic metal plate 20 using the injection molding method includes, for example, the following steps (i) to (ii).
(I) Step of disposing the developed graphic metal plate 20 in the injection mold (ii) Thermoplastic in the mold so that at least a part of the thermoplastic resin member 301 is in contact with the developed graphic metal plate 20. Step of injection molding the resin composition (P) and molding the thermoplastic resin member 301 Hereinafter, a specific description will be given.

  First, (i) an injection mold is prepared, the mold is opened, and a developed metal plate is placed in the cavity (space). (Ii) Thereafter, the mold is closed, and the thermoplastic resin composition (P) is injected into the cavity portion of the mold so that at least a part of the thermoplastic resin member 301 is in contact with the developed metal plate. It solidifies and joins the developed figure metal plate and the thermoplastic resin member 301. Thereafter, by opening the mold and releasing the mold, the developed graphic metal resin bonded plate 20 in which the thermoplastic resin member 301 is bonded to the developed graphic metal plate can be obtained. As the mold, for example, an injection mold generally used in high-speed heat cycle molding (RHCM, heat & cool molding) can be used.

Here, in the step (ii), when adopting high-speed heat cycle molding, the surface temperature of the mold is preferably set between the start of injection of the thermoplastic resin composition (P) and the completion of pressure holding, preferably heat. It is preferable to maintain the glass transition temperature of the plastic resin member 301 (hereinafter also referred to as Tg) or higher, more preferably Tg + (5 or higher and 150 or lower) ° C. or higher.
Thereby, the thermoplastic resin composition (P) can be brought into contact with the surface of the developed metal plate at a high pressure for a longer time while keeping the thermoplastic resin composition (P) in a softened state.
As a result, since the adhesiveness between the developed metal plate and the thermoplastic resin member 301 can be improved, it is possible to more stably obtain the electronic device casing 100 that is more excellent in bonding strength.

  As a method for heating the mold, any one of a steam type, a pressurized hot water type, a hot water type, a hot oil type, an electric heater type, and an electromagnetic induction superheating type or a combination of them may be used.

In the step (ii), the time from the start of injection to the completion of the pressure holding is preferably 1 second to 60 seconds, and more preferably 10 seconds to 50 seconds.
The thermoplastic resin member 301 is brought into contact with the fine concavo-convex structure of the developed metal plate 20 at a high pressure for a longer time while keeping the thermoplastic resin member 301 in a molten state when the time is equal to or greater than the lower limit. Can do. Thereby, the housing | casing 100 for electronic devices which was further excellent by joining strength can be obtained more stably.
Moreover, since the molding cycle of the electronic device casing 100 can be shortened when the time is equal to or less than the upper limit value, the electronic device casing 100 can be obtained more efficiently.

In the method for manufacturing the electronic device casing 100 according to the present embodiment, in the step (B), the thermoplastic resin composition is used so that the thermoplastic resin member 301 is not bonded to the boundary line portion 205 between the bottom plate 201 and the side plate 202. It is preferable to inject (P) into the mold.
By doing so, it is possible to obtain the developed metal resin bonding plate 20 in which the thermoplastic resin member 301 is not bonded to the boundary line portion 205 between the bottom plate 201 and the side plate 202, and as a result, the bottom plate 201 and the side plate 202. It is easier to bend the boundary line portion 205 and the developed view-shaped metal resin bonding plate 20 is more easily box-shaped. Therefore, the productivity of the electronic device casing 100 can be further improved.

(Process (C))
Next, the boundary line portion 205 between the bottom plate 201 and the side plate 202 is bent to form the developed view-like metal resin bonding plate 20 in a box shape, thereby obtaining the electronic device casing 100.
There is no particular limitation on the method for forming the developed metal resin bonding plate 20 in a box shape, and generally known methods can be used. For example, the electronic device casing 100 is obtained by bending the boundary line portion 205 between the bottom plate 201 and the side plate 202 and attaching the cover plate 203 as necessary.
At this time, the adjacent side plates 202 and the lid plate 203 connected to the side plates 202 as necessary may be engaged by mechanical means. Although it does not specifically limit as a mechanical engagement means, Screwing etc. are mentioned.

(Embodiment 2)
FIG. 6 is a perspective view illustrating a first state of the electronic device 10 according to the second embodiment. FIG. 7 is a perspective view showing a second state of the electronic apparatus 10 shown in FIG.

  The electronic device 10 includes a metal resin bonding plate 22 and a plurality of electronic components 30. The metal resin bonding plate 22 corresponds to the developed-pattern metal resin bonding plate 20 shown in FIG.

  The metal resin bonding plate 22 includes a plate 510, a plate 520, a plate 530, a plate 540 and a plate 550. The plate 510, the plate 520, the plate 530, the plate 540, and the plate 550 have a surface 512, a surface 522, a surface 532, a surface 542, and a surface 552, respectively. Each of the plate 510, the plate 520, the plate 530, the plate 540, and the plate 550 is made of metal. A thermoplastic resin member 301 is joined to each of the plate 510, the plate 520, the plate 530, the plate 540, and the plate 550. The plate 510 corresponds to the bottom plate 201 shown in FIG. 4, the plate 520 corresponds to the lid plate 203 shown in FIG. 4, the plate 530 corresponds to the side plate 202-1 shown in FIG. Corresponds to the side plate 202-2 shown in FIG. 4, and the plate 550 corresponds to the side plate 202-4 shown in FIG.

  The plurality of electronic components 30 include a first electronic component 30a and a second electronic component 30b. The first electronic component 30 a is mounted on the surface 512 of the plate 510. The second electronic component 30 b is mounted on the surface 522 of the plate 520.

  As shown in FIG. 6, in the first state of the electronic device 10, the plate 510 (first plate) and the plate 520 (second plate) have a surface 512 (first surface) and a surface 522 (second) from different directions. Are arranged so as to face a common space. In particular, in the example illustrated in FIG. 6, in the first state of the electronic device 10, the plate 510 and the plate 520 are arranged so that the surfaces 512 and 522 face the common space from opposite directions.

  According to the configuration described above, the plurality of electronic components 30 can be arranged with a high degree of freedom. Specifically, in the configuration described above, in the first state of the electronic device 10 (FIG. 6), the plate 510 and the plate 520 are arranged so that the surfaces 512 and 522 face the common space from different directions. be able to. Therefore, the plurality of electronic components 30 can be arranged not only two-dimensionally (for example, horizontally) but also three-dimensionally. In this way, the plurality of electronic components 30 can be arranged with a high degree of freedom.

  Furthermore, according to the configuration described above, heat generated from the plurality of electronic components 30 can be efficiently released. Specifically, in the configuration described above, in the first state of the electronic device 10 (FIG. 6), the plate 510 and the plate 520 are arranged so that the surfaces 512 and 522 face the common space from different directions. be able to. Therefore, the heat generated from the plurality of electronic components 30 can be released to the common space described above. In this way, heat generated from the plurality of electronic components 30 can be efficiently released.

  As shown in FIG. 7, in the second state of the electronic device 10, the plate 510 and the plate 520 are arranged side by side so that the surface 512 and the surface 522 face the same direction.

  According to the configuration described above, the electronic component 30 can be easily mounted on the metal resin bonding plate 22. Specifically, in the configuration described above, in the second state of the electronic device 10 (FIG. 7), the plate 510 and the plate 520 are arranged side by side so that the surface 512 and the surface 522 face the same direction. it can. Therefore, in the second state of the electronic device 10, the plurality of electronic components 30 can be mounted on the metal resin bonding plate 22 from the same direction. In this way, the electronic component 30 can be easily mounted on the metal resin bonding plate 22.

  As shown in FIG. 6, in the first state of the electronic device 10, the plate 530 (third plate) has a side E1 (first side) and a side E2 (second side). The side E1 is shared by the plate 510 and the plate 530, and the side E2 is shared by the plate 520 and the plate 530. The plate 510 and the plate 530 can be bent along the side E1, and the plate 520 and the plate 530 can be bent along the side E2.

  According to the configuration described above, the electronic device 10 can be easily transitioned to the first state (FIG. 6) and the second state (FIG. 7). Specifically, in the above-described configuration, the plate 510 and the plate 530 can be bent along the side E1, and the plate 520 and the plate 530 can be bent along the side E2. Therefore, the electronic device 10 can be changed between the first state and the second state by bending the plate 510 and the plate 530 and bending the plate 520 and the plate 530. In this way, the electronic device 10 can be easily transitioned to the first state and the second state.

  As shown in FIG. 6, in the first state of the electronic device 10, the plate 540 (fourth plate) has a side E3 (third side), a side E4 (fourth side), and a side E5 (fifth side). The plate 550 (fifth plate) has a side E6 (sixth side), a side E7 (seventh side), and a side E8 (eighth side). The side E3 is shared by the plates 510 and 540, the side E4 is shared by the plates 520 and 540, the side E5 is shared by the plates 530 and 540, and the side E6 is 510 and the plate 550, the side E7 is shared by the plate 520 and the plate 550, and the side E8 is shared by the plate 530 and the plate 550. In the example shown in FIGS. 6 and 7, the plate 510 and the plate 540 can be bent along the side E3, and the plate 510 and the plate 550 can be bent along the side E6. Furthermore, in the example shown in FIGS. 6 and 7, as shown in FIG. 7, the plate 520 and the plate 530 can be separated from the plate 540 and the plate 550 in the second state of the electronic device 10.

  According to the configuration described above, the electronic device 10 can be easily transitioned to the first state (FIG. 6) and the second state (FIG. 7). Specifically, in the configuration described above, the plate 510 and the plate 540 can be bent along the side E3, and the plate 510 and the plate 550 can be bent along the side E6. Therefore, the electronic device can be changed between the first state and the second state by bending the plate 510 and the plate 540 and bending the plate 510 and the plate 550. In this way, the electronic device 10 can be easily transitioned to the first state and the second state.

  Furthermore, according to the configuration described above, the electronic device 10 can be deployed in one plane in the second state (FIG. 7). Specifically, in the configuration described above, the plate 520 and the plate 530 can be separated from the plate 540 and the plate 550 in the second state of the electronic device 10. Therefore, even if the electronic device 10 has a three-dimensional shape in the first state (FIG. 6), the electronic device 10 can be developed in one plane in the second state (FIG. 7).

  As shown in FIG. 6, in the first state of the electronic device 10, the electronic device 10 includes the side E <b> 9 (9th side), the side E <b> 10 (10th side), the side E <b> 11 (11th side), and the side E <b> 12 (12th side). Side) and an opening OP. The side E9 is on the side opposite to the side E1, the side E10 is on the side opposite to the side E2, the side E11 is on the side opposite to the side E5, and the side E12 is on the side opposite to the side E8. The opening OP is defined by a side E9, a side E10, a side E11, and a side E12.

  According to the configuration described above, heat generated from the plurality of electronic components 30 can be efficiently released. Specifically, in the configuration described above, the electronic device 10 has the opening OP. Therefore, the heat generated from the plurality of electronic components 30 can be released from the opening OP. In this way, heat generated from the plurality of electronic components 30 can be efficiently released.

  FIG. 8 is a diagram showing a first modification of FIG.

  As shown in FIG. 8, an electronic component 30 (third electronic component 30 c) different from the first electronic component 30 a and the second electronic component 30 b may be mounted on the surface 532 of the plate 530. Also in the example shown in FIG. 8, the plurality of electronic components 30 can be arranged with a high degree of freedom, and the heat generated from the plurality of electronic components 30 can be efficiently released.

  FIG. 9 is a diagram showing a second modification of FIG.

  As illustrated in FIG. 9, the plate 520 and the plate 540 may be bendable along the side E4, and the plate 520 and the plate 550 may be bendable along the side E7. Furthermore, as shown in FIG. 9, in the second state of the electronic device 10, the plate 510 and the plate 530 may be separated from the plate 540 and the plate 550. Also in the example illustrated in FIG. 9, the electronic device 10 can be easily transitioned to the first state and the second state, and the electronic device 10 can be deployed in one plane in the second state.

  FIG. 10 is a diagram illustrating a third modification of FIG.

  As illustrated in FIG. 10, the plate 530 and the plate 540 may be bendable along the side E5, and the plate 530 and the plate 550 may be bendable along the side E8. Furthermore, as shown in FIG. 10, the plate 510 and the plate 520 may be separable from the plate 540 and the plate 550 in the second state of the electronic device 10. Also in the example illustrated in FIG. 10, the electronic device 10 can be easily transitioned to the first state and the second state, and the electronic device 10 can be deployed in one plane in the second state.

  FIG. 11 is a diagram showing a fourth modification of FIG.

  As shown in FIG. 11, the plate 510 and the plate 540 may be bendable along the side E3, and the plate 520 and the plate 550 may be bendable along the side E7. Further, as shown in FIG. 11, in the second state of the electronic device 10, the plate 510 and the plate 530 may be separated from the plate 550, and the plate 520 and the plate 530 may be separated from the plate 540. Also in the example illustrated in FIG. 11, the electronic device 10 can be easily transitioned to the first state and the second state, and the electronic device 10 can be deployed in one plane in the second state.

  FIG. 12 is a diagram showing a fifth modification of FIG.

  As illustrated in FIG. 12, the plate 510 and the plate 540 may be bent along the side E3, and the plate 530 and the plate 550 may be bent along the side E8. Furthermore, as shown in FIG. 12, in the second state of the electronic device 10, the plate 510 and the plate 520 may be separated from the plate 550, and the plate 520 and the plate 530 may be separated from the plate 540. Also in the example illustrated in FIG. 12, the electronic device 10 can be easily transitioned to the first state and the second state, and the electronic device 10 can be deployed in one plane in the second state.

(Embodiment 3)
FIG. 13 is a perspective view illustrating a first state of the electronic device 10 according to the third embodiment. FIG. 14 is a perspective view showing a second state of the electronic apparatus 10 shown in FIG. The electronic device 10 according to the present embodiment is the same as the electronic device 10 according to the second embodiment except for the following points.

  The metal resin bonding plate 22 has a plate 560. The plate 560 has a surface 562. The plate 560 is made of metal. A thermoplastic resin member 301 is joined to the plate 560. The plate 560 corresponds to the side plate 202-3 shown in FIG. As shown in FIG. 13, in the first state of the electronic apparatus 10, the plate 560 has a side E9, a side E10, a side E11, and a side E12. The side E9 is shared by the plates 510 and 560, the side E10 is shared by the plates 520 and 560, the side E11 is shared by the plates 540 and 560, and the side E12 is 550 and plate 560 are shared. Also in the present embodiment, the electronic device 10 can be easily transitioned to the first state and the second state, and the electronic device 10 can be deployed in one plane in the second state.

(Embodiment 4)
FIG. 15 is a perspective view illustrating a first state of the electronic device 10 according to the fourth embodiment. FIG. 16 is a perspective view showing a second state of the electronic device 10 shown in FIG. The electronic device 10 according to the present embodiment is the same as the electronic device 10 according to the second embodiment except for the following points.

  The first electronic component 30a is mounted on the surface 512 (first surface) of the plate 510 (first plate), and the second electronic component 30b is the surface 552 (second surface) of the plate 550 (second plate). ) Is mounted on. As shown in FIG. 15, in the first state of the electronic device 10, the plate 510 and the plate 550 are arranged so that the surface 512 and the surface 552 face a common space from different directions. In particular, in the example illustrated in FIG. 15, in the first state of the electronic device 10, the plate 510 and the plate 550 are arranged so that the surface 512 and the surface 552 face a common space from the direction intersecting each other. Therefore, also in the present embodiment, the electronic device 10 can be easily transitioned to the first state and the second state, and the electronic device 10 can be deployed in one plane in the second state.

  As shown in FIG. 16, in the second state of the electronic device 10, the plate 510 and the plate 550 are arranged side by side so that the surface 512 and the surface 552 face the same direction. Therefore, also in this embodiment, the electronic component 30 can be easily mounted on the metal resin bonding plate 22.

  The plate 510 and the plate 550 can be bent along the side E6 (first side). Therefore, also in this embodiment, the electronic device 10 can be easily changed to the first state and the second state.

(Embodiment 5)
FIG. 17 is a view for explaining a mounting method of the electronic component 30 of the electronic device 10 according to the fifth embodiment.

  The electronic component 30 has a substantially rectangular parallelepiped shape, and has a first main surface 32, a second main surface 34, a first side surface 36a, a second side surface 36b, a third side surface 36c, and a fourth side surface 36d. doing. The second main surface 34 is on the opposite side of the first main surface 32. The first side surface 36 a is between the first main surface 32 and the second main surface 34. The second side surface 36b is on the opposite side of the first side surface 36a. The third side surface 36c is between the first side surface 36a and the second side surface 36b. The fourth side surface 36d is on the opposite side of the third side surface 36c.

  The electronic component 30 has a thickness between the first main surface 32 and the second main surface 34. Specifically, the length between the first main surface 32 and the second main surface 34 of the electronic component 30 is the length between the first side surface 36 a and the second side surface 36 b of the electronic component 30 and the length of the electronic component 30. It is shorter than any of the lengths between the third side surface 36c and the fourth side surface 36d.

  The electronic component 30 is mounted on the plate 510 so that the second main surface 34 faces the surface 512. In the example shown in FIGS. 6 to 16, the electronic component 30 is mounted on each plate (for example, the plate 510 or the plate 520) in the same manner as the example shown in FIG.

  FIG. 18 is a diagram showing a modification of FIG.

  As shown in FIG. 18, the electronic component 30 may be mounted on the plate 510 so that the first side surface 36 a faces the surface 512. Furthermore, as shown in FIG. 18, a plurality of electronic components 30 may be mounted on a plate 510. In the example shown in FIGS. 6 to 16, the electronic component 30 may be mounted on each plate (for example, the plate 510 or the plate 520) in the same manner as the example shown in FIG.

  Hereinafter, the present embodiment will be described in detail with reference to examples and comparative examples. In addition, this embodiment is not limited to description of these Examples at all. 19, FIG. 20 and FIG. 21 are used as diagrams for explaining the embodiment.

[Example 1]
In Example 1, attention was paid to the metal resin bonding plate constituting a part of the electronic device casing according to the present embodiment. The metal member which comprises a metal resin joining board was made into the aluminum alloy, and the thermoplastic resin member was joined to both surfaces of the metal member, and the metal resin joining board E10 was produced. Next, an experimental result in which the metal resin bonding plate E10 exhibits a high weight reduction effect while maintaining a strength comparable to that of the metal plate used in Comparative Example 1 made of only steel plate material (SECC) which is an existing technology. Show.

(Preparation of roughened aluminum alloy plate E101, which is a metal member constituting metal resin bonding plate E10)
An aluminum alloy plate (alloy number 5052 defined in JIS H4000) having a shape of 180 mm (horizontal width) × 129 mm (vertical width) × 0.3 mm (thickness) was prepared. The aluminum alloy plate is provided with a plurality of small holes (not shown) for penetrating resin so that the resin can flow and communicate from the fixed side (cavity side) to the movable side (core side). Yes.
Next, the aluminum alloy plate was degreased using a commercially available degreasing agent, and then a treatment tank 1 filled with an alkaline etching agent (30 ° C.) containing 15% by mass of sodium hydroxide and 3% by mass of zinc oxide. For 3 minutes (may be abbreviated as “alkaline etchant treatment” in the following description), and then immersed in 30% by mass of nitric acid (30 ° C.) for 1 minute to further perform the alkaline etchant treatment. Repeated twice. Next, the obtained aluminum alloy plate was subjected to an acid etching aqueous solution containing 3.9% by mass of ferric chloride, 0.2% by mass of cupric chloride, and 4.1% by mass of sulfuric acid. It was immersed in the filled processing tank 2 at 30 ° C. for 5 minutes and allowed to swing (in the following description, it may be abbreviated as “acid-based etching agent treatment”). Subsequently, ultrasonic cleaning (in water, 1 minute) was performed with running water, and then dried to obtain a roughened aluminum alloy plate E101.

The surface roughness of the obtained roughened aluminum alloy plate E101 is measured according to JIS B0601 (corresponding international standard: ISO4287) using a surface roughness measuring device “Surfcom 1400D (manufactured by Tokyo Seimitsu Co., Ltd.)”. Among the surface roughnesses, the load length ratio (Rmr), ten-point average roughness (Rz) and average length (RSm) of the roughness curve elements were measured. The obtained results are shown below. In addition, as shown in FIG. 22, a measurement place is a total of 6 linear parts which consist of arbitrary 3 linear parts on the fine uneven | corrugated surface of the roughening aluminum alloy plate E101, and arbitrary 3 linear parts orthogonal to the said linear part. is there.
-Load length ratio (Rmr) of roughness curve at cutting level 20%, evaluation length 4 mm: Longitudinal 3 points = 6.4% / 4.0% / 3.7%, Short 3 points = 6.9 % / 2.0% / 6.4%
-Load length ratio (Rmr) of the roughness curve at a cutting level of 40% and an evaluation length of 4 mm: 3 long points: 28.5% / 28.3% / 26.5%, 3 short points = 38.5 % / 18.4% / 19.3%
-Ten-point average roughness (Rz): Longitudinal 3 points = 17.0 μm / 18.4 μm / 16.6 μm, Short 3 points = 17.9 μm / 18.0 μm / 19.8 μm
Average length of roughness curve element (RSm): 3 long points = 120 μm / 165 μm / 127 μm, 3 short points = 119 μm / 145 μm / 156 μm

(Preparation of metal resin bonded plate E10 by insert molding)
A dedicated metal insert mold was attached to an injection molding machine (JSW J180AD110H) manufactured by Nippon Steel Works, and the roughened aluminum alloy plate E101 obtained by the above method was installed in the mold. Next, as a thermoplastic resin composition in the mold, glass fiber reinforced polypropylene (V7100 manufactured by Prime Polymer Co., Ltd., polypropylene (230 ° C., MFR of 2.16 kg load = 80 g / 10 min) 80 parts by mass, glass fiber 20 masses) Part) was subjected to injection molding under the conditions of a cylinder temperature of 230 ° C., a mold temperature of 100 ° C., an injection speed of 100 mm / second, a pressure holding pressure of 80 MPa, a pressure holding time of 5 seconds, and a cooling time of 50 seconds to produce a metal resin bonded plate E10. did. In the metal resin bonding plate E10, all the thermoplastic resin members E102 are bonded so as to face both surfaces of the roughened aluminum alloy plate E101. The widths of the joined thermoplastic resin members (hereinafter sometimes referred to as “resin rib portions”) were 3.6 mm in common and the height of the resin rib portion was 2.1 mm in common. The total weight of the metal resin bonding plate E10 was 39.6 g.
Moreover, the junction area ratio was 14 area%.

(Measurement of displacement in bending test)
The result of measuring the displacement amount (25 ° C.) when a stress of 2 kgf in the vertical direction is applied to the center portion of the metal-resin bonding plate E10 (symbol F in FIG. 19) using an autograph manufactured by Shimadzu Corporation. 1.8 mm.

[Comparative Example 1]
An existing material (zinc) showing the same displacement (1.8 mm) as the metal-resin-bonded plate E10 obtained in Example 1 when a stress of 2 kgf is applied in the same manner as the displacement measurement in Example 1. The thickness of the plated steel sheet (SECC) was determined. That is, as a result of measuring the amount of displacement when 2 kgf buoyancy was applied to a commercially available SECC material having the same vertical and horizontal dimensions as the aluminum alloy plate used in Example 1 but only the thickness, SECC having a thickness of 0.8 mm was found to be an example. It was found that the same displacement (1.8 mm) as that of the metal resin bonding plate E10 obtained in 1 was exhibited. The total weight of the SECC plate was 146.2 g.

  Example 1 and Comparative Example 1 are compared. It was found that the metal-resin bonding plate E10 according to the present embodiment achieved a weight reduction of about 73% despite the same amount of displacement under a constant load as compared with the SECC plate which is an existing material.

[Example 2]
(Preparation of roughened aluminum alloy plate E20, which is a metal member constituting the developed metal resin bonding plate E30)
A commercially available 0.3 mm-thick aluminum alloy plate (alloy number 5052 defined in JIS H4000) is cut into the shape (unit: mm) shown in FIG. 20, and the opening shown in FIG. A portion E207 and a slit portion E209 are provided. The aluminum alloy plate (element plate) is provided with a plurality of small holes (not shown) for penetrating the resin so that the resin can flow from the fixed side (cavity side) to the movable side (core side). It has been. The number of small holes for penetrating resin is not particularly limited, but is usually 2 to 5 per side plate, each side plate, and lid plate.

  Next, the aluminum alloy plate was subjected to surface roughening treatment in exactly the same manner as in Example 1 to obtain a roughened aluminum alloy plate E20 having a bottom plate E201, a side plate E202, and a lid plate E203.

  The surface roughness of the obtained roughened aluminum alloy plate E20 is measured according to JIS B0601 (corresponding international standard: ISO4287) using a surface roughness measuring device “Surfcom 1400D (manufactured by Tokyo Seimitsu Co., Ltd.)”. Among the surface roughnesses, the load length ratio (Rmr), ten-point average roughness (Rz) and average length (RSm) of the roughness curve elements were measured. As a result, it was confirmed that a value reproducing the surface roughness parameter shown in Example 1 was exhibited.

(Production of developed figure metal resin bonding plate E30 by insert molding)
A dedicated metal insert mold was attached to an injection molding machine (JSW J180AD110H) manufactured by Nippon Steel Works, and the roughened aluminum alloy plate E20 obtained by the above method was installed in the mold. Next, as a thermoplastic resin composition in the mold, glass fiber reinforced polypropylene (V7100 manufactured by Prime Polymer Co., Ltd., polypropylene (230 ° C., MFR of 2.16 kg load = 80 g / 10 min) 80 parts by mass, glass fiber 20 masses) Part) was subjected to injection molding under the conditions of a cylinder temperature of 230 ° C., a mold temperature of 100 ° C., an injection speed of 100 mm / second, a pressure holding pressure of 80 MPa, a pressure holding time of 5 seconds, and a cooling time of 50 seconds. A metal-metal-bonded plate E30 was produced. As shown in FIG. 21, it was confirmed that the thermoplastic resin member was bonded to both surfaces of the roughened aluminum alloy plate E20 (in FIG. 21, the resin portion on the back surface side is not shown). Although not shown in FIG. 21, a convex portion (claw portion) and a concave portion are formed at any location of the thermoplastic resin member so that the cover plate and the side plates can be snap-fit engaged with each other.

(Fabrication of electronic equipment casing by bending the boundary)
In the developed developed metal resin bonding plate E30 obtained, each boundary line portion E205 is bent inward at a right angle, and then the convex portion and the concave portion provided in the resin portion are snap-fitted to stop the box-shaped electron. An equipment casing was produced. No warpage or peeling of metal and resin was observed in this electronic device casing. This casing is subjected to a heat cycle test in a heat cycle tester (test conditions: held at −20 ° C. for 2 hours, then held at 80 ° C. for 2 hours, heated and lowered for 1 hour each four times a day. As a result of repeating for 7 days, the metal member and the thermoplastic resin member were maintained in a strongly joined state, and no occurrence of warping or peeling phenomenon was observed.
Moreover, the junction area ratio was 21 area%.

[Comparative Example 2]
In Example 2, the same operation was performed under the same conditions as in Example 2 except that an aluminum alloy plate (element plate) having no small holes for resin penetration was used. A developed graphic metal resin bonded plate in which the thermoplastic resin composition was bonded only to the fixed side (cavity side) of the developed graphic metal plate was obtained by insert molding. Immediately after molding, peeling was already visually observed on a part of the metal member and the thermoplastic resin member. The developed figure-like metal resin bonding plate in which the resin was bonded only on one side was bent in the same manner as in Example 2 to form a box shape. At this time, the joined thermoplastic resin member is bent so as to be inside the box. Next, this electronic device casing was subjected to a heat cycle test in the same manner as in Example 2. As a result, each surface is deformed into a convex shape for all of the bottom plate, all side plates, and the cover plate, and most of the joint portion between the metal member and the thermoplastic resin member (90% or more of the entire joint portion area) is peeled off, It was also confirmed that the boundary line connecting the sides of each surface was deformed to form a gap.

  As mentioned above, although embodiment of this invention was described, these are illustrations of this invention and various structures other than the above are also employable.

DESCRIPTION OF SYMBOLS 10 Electronic device 20 Expanded figure metal plate 30 Electronic component 30a First electronic component 30b Second electronic component 30c Third electronic component 32 First main surface 34 Second main surface 36a First side surface 36b Second side surface 36c Third side surface 36d Fourth side surface 100 Case for electronic device 104 Joint surface 201 Bottom plate 202 Side plate 202-1 Side plate 202-2 Side plate 202-3 Side plate 202-4 Side plate 203 Cover plate 205 Boundary line portion 207 Opening portion 209 Slit 301 Thermoplastic resin member 510 plate 512 surface 520 plate 522 surface 530 plate 532 surface 540 plate 542 surface 550 plate 552 surface 560 plate 562 surface E1 side E2 side E3 side E4 side E5 side E6 side E7 side E7 side E7 side E7 side E7 side E7 side E7 side E7 side E7 side E7 side E7 side E7 side E7 side E7 side

Claims (14)

A first metal plate having a first surface and joined with a thermoplastic resin member;
A second metal plate having a second surface and joined with a thermoplastic resin member;
A first electronic component mounted on the first surface of the first plate;
A second electronic component mounted on the second surface of the second plate;
Including
In the first state, the first plate and the second plate are arranged such that the first surface and the second surface face a common space from different directions. The electronic device according to claim 1,
In the first state, the first plate and the second plate are arranged so that the first surface and the second surface face the common space from opposite directions. The electronic device according to claim 2.
In the second state, the first plate and the second plate are arranged side by side so that the first surface and the second surface face the same direction. The electronic device according to claim 3.
Including a metal third plate to which a thermoplastic resin member is bonded;
In the first state, the third plate has a first side shared with the first plate and a second side shared with the second plate on the opposite side of the first side,
The first plate and the third plate can be bent along the first side,
The electronic device, wherein the second plate and the third plate are bendable along the second side. The electronic device according to claim 4.
The third plate has a third surface;
In the second state, the third plate is disposed between the first plate and the second plate so that the third surface faces the same direction as the first surface and the second surface,
An electronic device comprising a third electronic component mounted on the third surface of the third plate. The electronic device according to claim 4 or 5,
A metal fourth plate to which the thermoplastic resin member is bonded;
A metal fifth plate to which a thermoplastic resin member is bonded;
Including
In the first state, the fourth plate has a third side shared with the first plate, a fourth side shared with the second plate, and a fifth side shared with the third plate. And
In the first state, the fifth plate has a sixth side shared with the first plate, a seventh side shared with the second plate, and an eighth side shared with the third plate. Electronic equipment. The electronic device according to claim 6.
In the first state, the first plate has a ninth side opposite to the first side, the second plate has a tenth side opposite to the second side, The four plates have an eleventh side opposite to the fifth side, the fifth plate has a twelfth side opposite to the eighth side,
An electronic device having an opening defined by the ninth side, the tenth side, the eleventh side, and the twelfth side in the first state. The electronic device according to claim 6.
Including a sixth metal plate to which a thermoplastic resin is bonded;
In the first state, the sixth plate includes a ninth side shared with the first plate, a tenth side shared with the second plate, an eleventh side shared with the fourth plate, An electronic device having a twelfth side shared with five plates. The electronic device according to claim 1,
In the first state, the first plate and the second plate are arranged such that the first surface and the second surface face the common space from a direction crossing each other. The electronic device according to claim 9.
In the second state, the first plate and the second plate are arranged side by side so that the first surface and the second surface face the same direction. The electronic device according to claim 10.
In the first state, the first plate shares a first side shared with the second plate,
The electronic device, wherein the first plate and the second plate are bendable along the first side. The electronic device according to claim 11.
Including a metal third plate to which a thermoplastic resin member is bonded;
In the first state, the first plate has a second side that is opposite to the first side and is shared with the third plate. The electronic device according to claim 12.
The third plate has a third surface facing the second surface of the second plate in the first state,
An electronic device comprising a third electronic component mounted on the third surface of the third plate. The electronic device according to any one of claims 1 to 13,
The first electronic component includes a first main surface, a second main surface opposite to the first main surface, and a first side surface between the first main surface and the second main surface. ,
The first electronic component is an electronic device that is mounted on the first surface of the first plate such that the first side surface faces the first surface.

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