JP3216221B2 - Lead frame processing equipment - Google Patents
Lead frame processing equipmentInfo
- Publication number
- JP3216221B2 JP3216221B2 JP11148492A JP11148492A JP3216221B2 JP 3216221 B2 JP3216221 B2 JP 3216221B2 JP 11148492 A JP11148492 A JP 11148492A JP 11148492 A JP11148492 A JP 11148492A JP 3216221 B2 JP3216221 B2 JP 3216221B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- island
- frame
- suspension
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Punching Or Piercing (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、枠部と、この枠部の略
中心に位置し、半導体チップを搭載する大きさを有して
上記枠部に吊りリードによって連結されたアイランド
と、このアイランド周囲に放射状に位置し、内側先端に
上記半導体チップの電極との間で配線を行なうボンディ
ング部を備えると共に外側先端が上記枠部に連結した多
数のリードと、リードのボンディング部の更に内側に複
数のリード同士を接続する先端接続部を具備して成るリ
ードフレームを加工する装置に関し、更に詳しくは上記
先端接続部を切断除去すると共に、上記吊りリードに段
差を形成してアイランドをリードより下方に位置せしめ
る加工装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a frame, an island located substantially at the center of the frame, and having a size for mounting a semiconductor chip and connected to the frame by a suspension lead. A plurality of leads radially located around the island and having a bonding portion for wiring between the electrodes of the semiconductor chip at the inner end and an outer end connected to the frame portion, and further inside the bonding portion of the lead. More specifically, the present invention relates to an apparatus for processing a lead frame having a tip connecting portion for connecting a plurality of leads, and more particularly to cutting and removing the tip connecting portion and forming a step in the suspension lead to lower an island below the lead. To a processing device to be located at
【０００２】[0002]
【従来の技術】リードのボンディング部の更に内側に複
数のリード同士を接続する先端接続部を具備するリード
フレームは例えば特開昭６２−２４６５６号、特開昭６
２−１１５８５３号等に記載されているように、一般に
図５に示すような形状を有している。すなわち、リード
フレームａはこのリードフレームａ全体を支持する枠部
ａ１を外周に有し、この枠部ａ１の略中心にアイランド
ａ２が位置している。このアイランドａ２は後述するよ
うに半導体チップｂを搭載するもので、この半導体チッ
プｂを搭載できる程度の大きさに構成されており、線状
に形成された２〜４本程度の吊りリードａ３を介して上
記枠部ａ１に連結している。そしてこのアイランドａ２
周囲には放射状に多数の線状のリードａ４が位置してい
る。このリードａ４は、上記半導体チップｂの電極と配
線するためのもので、その内側（アイランドａ２近辺）
先端には上記半導体チップｂの電極ｂ１と金属ワイヤー
ｃを介して配線するためのボンディング部ａ４１が設け
られている。このボンディング部ａ４１は、金属ワイヤ
ーを強固に接合する必要から、金属ワイヤーの材質に応
じて金又は銀めっきが施されていることが普通である。
先端接続部ａ４２はこのめっき工程等の工程でリードａ
４のボンディング部ａ４１の変形を防止して平坦な形状
を確保するために設けられたもので、リードａ４のボン
ディング部ａ４１の更に内側に設けられ、リードａ４の
複数を互いに接続し、ボンディング前に切除されて除去
されるものである。一方、このリードａ４の外側は、例
えばリードａ４全体と吊りリードａ３を連結するタイバ
ーａ５を介して上記枠部ａ１に連結して、この枠部ａ１
によりリードａ４が支えられている。なお、図中、ａ６
はリードフレームａ加工の際のリードａ４の変形を防止
するポリイミドテープである。2. Description of the Related Art A lead frame having a tip connecting portion for connecting a plurality of leads further inside a lead bonding portion is disclosed in, for example, JP-A-62-24656 and JP-A-6-24656.
As described in, for example, 2-115853, it generally has a shape as shown in FIG. That is, the lead frame a has a frame portion a1 on its outer periphery that supports the entire lead frame a, and the island a2 is located substantially at the center of the frame portion a1. The island a2 has a semiconductor chip b mounted thereon as described later. The island a2 is configured to have such a size that the semiconductor chip b can be mounted, and has about two to four suspension leads a3 formed in a linear shape. It is connected to the above-mentioned frame part a1. And this island a2
A number of linear leads a4 are radially located around the periphery. The lead a4 is for wiring with the electrode of the semiconductor chip b, and is inside (in the vicinity of the island a2).
At the tip, a bonding portion a41 for wiring with the electrode b1 of the semiconductor chip b and the metal wire c is provided. The bonding portion a41 is usually plated with gold or silver according to the material of the metal wire because it is necessary to strongly bond the metal wire.
The tip connecting portion a42 is a lead a in the plating step or the like.
4 is provided to prevent deformation of the bonding portion a41 and to secure a flat shape. The bonding portion a41 is provided further inside the bonding portion a41 of the lead a4, and a plurality of leads a4 are connected to each other. It is excised and removed. On the other hand, the outside of the lead a4 is connected to the frame a1 via a tie bar a5 connecting the entire lead a4 and the suspension lead a3, for example.
Supports the lead a4. In the figure, a6
Is a polyimide tape for preventing deformation of the lead a4 during processing of the lead frame a.
【０００３】先端接続部ａ４２を切除した後のリードフ
レームは、更に吊りリードａ３を折り曲げて段差を形成
することによりアイランドａ２をリードａ４より下方に
位置せしめた後、図６に示すように、アイランドａ２に
半導体チップｂを搭載して接着し、金線等の金属ワイヤ
ーｃにより半導体チップｂの電極ｂ１とリードａ４のボ
ンデング部ａ４１を配線し、リードａ４が外側に突出す
るように樹脂等の封止材料ｄで全体を固めると共に、枠
部ａ１を切断除去し、また連結部ａ５を切断してリード
ａ４のそれぞれを独立させて、半導体パッケージとす
る。こうして得られた半導体パッケージは、例えばパッ
ケージの外側に突出したリードを印刷配線板等に接続し
て使用される。この際、アイランドａ２をリードａ４よ
り下方に位置せしめることにより、搭載される半導体チ
ップｂの電極ｂ１をリードａ４に近づけて金属ワイヤー
ｃの長さを短くし、金線等の高価な金属ワイヤーｃを節
約すると共に金属ワイヤーｃの抵抗を減少させて半導体
パッケージの安定性を確保することができる。[0003] The lead frame after the distal end connecting portion a42 is cut off, the suspension lead a3 is further bent to form a step, so that the island a2 is positioned below the lead a4, and as shown in FIG. The semiconductor chip b is mounted on and adhered to a2, and the electrode b1 of the semiconductor chip b and the bonding portion a41 of the lead a4 are wired by a metal wire c such as a gold wire, and a resin or the like is sealed so that the lead a4 protrudes outward. The whole is hardened with the stopper material d, the frame part a1 is cut and removed, and the connecting part a5 is cut to make each of the leads a4 independent, thereby forming a semiconductor package. The semiconductor package thus obtained is used, for example, by connecting leads protruding outside the package to a printed wiring board or the like. At this time, by positioning the island a2 below the lead a4, the electrode b1 of the semiconductor chip b to be mounted is brought closer to the lead a4 to shorten the length of the metal wire c, and the expensive metal wire c such as a gold wire is used. And the resistance of the metal wire c can be reduced to ensure the stability of the semiconductor package.
【０００４】ところで、このようなリードフレームａは
銅や鉄／ニッケル合金等の金属板を表裏からエッチング
して製造されるが、確実に金属ワイヤーをボンディング
するためボンディング部ａ４１のボンディング面（表
面）を幅広く形成すると共に、その反対面（裏面）を比
較的幅狭く形成してリードａの全体の幅を狭くすること
によりリードを高い密度で形成可能としている。Incidentally, such a lead frame a is manufactured by etching a metal plate such as copper or an iron / nickel alloy from the front and back, and a bonding surface (front surface) of a bonding portion a41 for securely bonding a metal wire. Are formed wider, and the opposite surface (rear surface) is formed relatively narrower to reduce the overall width of the lead a, thereby making it possible to form leads at a higher density.
【０００５】そして、その先端接続部ａ４２を切除する
際には、その切断部の変形を防止すると共に除去された
先端接続部ａ４２がリードフレームａに付着することな
く確実に工程のラインから除去されるように、リードフ
レームａの裏面を上側に向けてこの上側から押切り刃を
当てて切除している。この際、幅広く形成された表面か
ら幅狭く形成された裏面に向かって押切り刃を当てると
この切断部のリードａ４が変形して正しい寸法できれい
に切断することができず、また下側から上方向に向かっ
て押切り刃を当てると切断された先端接続部ａ４２がが
リードフレームの上に残存滞留し、後工程に悪影響を及
ぼすことがある。[0005] When the distal end connecting portion a42 is cut off, deformation of the cut end portion is prevented, and the removed distal end connecting portion a42 is surely removed from the process line without adhering to the lead frame a. As described above, the back surface of the lead frame a is turned upward, and a cutting blade is applied from above to cut off. At this time, if a pressing blade is applied from the wide surface to the narrow surface, the lead a4 of the cut portion is deformed and cannot be cut cleanly with the correct dimensions. If the push cutting blade is applied in the direction, the cut distal end connecting portion a42 remains and remains on the lead frame, which may adversely affect a subsequent process.
【０００６】このため、インナーリードの先端接続部ａ
４２の切断を施す前にリードフレームａを表面が上側を
向いている状態から反転して裏面が上側を向く状態と
し、この状態で先端接続部ａ４２を切断した後、更に反
転して表面が上面を向く状態に戻し、次に型を使用して
吊りリードａ３を折り曲げてアイランドａ２をリードａ
４より下方に位置せしめていた。For this reason, the connecting portion a of the tip of the inner lead
Before cutting 42, the lead frame a is inverted from a state in which the front surface is facing upward to a state in which the rear surface is facing upward. Then, the suspension lead a3 is bent using a mold to convert the island a2 into the lead a.
4 was located below.
【０００７】[0007]
【発明が解決しようとする課題】しかしながら、このよ
うな方法によれば、先端接続部ａ４２の切断の前後で二
度に渡ってリードフレームａを反転させる必要があり、
その工程や装置が複雑であるという問題点があった。However, according to such a method, it is necessary to invert the lead frame a twice before and after the cutting of the distal end connecting portion a42.
There is a problem that the process and the apparatus are complicated.
【０００８】そこで、本発明は、反転工程を省略して先
端接続部ａ４２切断工程と吊りリードａ３折り曲げ工程
を簡略化することができる簡易な装置を提供することを
目的とする。Accordingly, an object of the present invention is to provide a simple apparatus which can omit the reversing step and simplify the cutting step of the distal end connecting portion a42 and the bending step of the suspension lead a3.
【０００９】[0009]
【課題を解決するための手段】すなわち、請求項１記載
の発明は、上記先端接続部を具備するリードフレームを
加工して、上記先端接続部を切断除去すると共に、上記
吊りリードに段差を形成してアイランドをリードより下
方に位置せしめるリードフレームの加工装置において、
上記アイランドの裏面に対面するアイランド裏面対面部
と、このアイランド裏面対面部より突出して上記吊りリ
ードに段差を設ける吊りリード裏面対面部と、この吊り
リード裏面対面部より更に突出して上記先端接続部を切
断除去する先端押切り刃とを有する上型と、上記アイラ
ンド裏面対面部、吊りリード裏面対面部及び先端押切り
刃のそれぞれに対応するアイランド表面対面部、吊りリ
ード表面対面部及び押切り刃受け用穴部を有する下型、
とから構成されることを特徴とする。That is, according to the first aspect of the present invention, a lead frame provided with the distal end connecting portion is processed to cut and remove the distal end connecting portion, and a step is formed on the suspension lead. In the lead frame processing device to position the island below the lead
The back surface of the island facing the back surface of the island, the back surface of the suspension lead that protrudes from the back surface of the island to provide a step in the suspension lead, and the front connection portion further protrudes from the back surface of the suspension lead. An upper die having a tip pressing blade to be cut and removed, and an island surface facing portion, a suspending lead surface facing portion, and a pushing blade receiver respectively corresponding to the island back facing portion, the suspension lead back facing portion, and the tip pushing blade. Lower mold with holes for
And characterized by the following.
【００１０】[0010]
【作用】請求項１記載の発明によれば、リードフレーム
の裏面を上側に向けて上型と下型の間に位置合わせして
載置し、上型を下方に下降させることにより、まず、先
端押切り刃が押切り刃受け用穴部に進入しながら上記先
端接続部を切断し、更に上型を下降させることにより、
吊りリード裏面対面部と吊りリード表面対面部の間で吊
りリードを挟んで噛み合うと共に、アイランド裏面対面
部とアイランド表面対面部が間にリードフレームのアイ
ランドを挟んで噛み合い、この吊りリード裏面対面部と
アイランド裏面対面部の間に設けられた段差によって吊
りリードが曲げられ、表面から見た場合にアイランドが
リードより下方に位置する形状に加工される。According to the first aspect of the present invention, the upper surface of the lead frame is positioned and placed between the upper and lower dies with the back surface facing upward, and the upper die is lowered. By cutting the above-mentioned tip connection part while the tip pushing blade enters the pushing blade receiving hole, and further lowering the upper die,
The suspending lead is interposed between the suspension lead back-facing portion and the suspension lead surface-facing portion, and the island back-facing portion and the island surface-facing portion are engaged with each other across the lead frame island. The suspension lead is bent by a step provided between the island back surface and the surface, and the island is processed into a shape positioned below the lead when viewed from the surface.
【００１１】[0011]
【実施例】図３Ａの平面図及び図３Ｂの断面図に示すよ
うに、枠部と、この枠部の略中心に位置し、半導体チッ
プを搭載する大きさを有して上記枠部に吊りリード３２
によって連結されたアイランド３１と、このアイランド
３１周囲の四辺に放射状に位置し、内側先端に上記半導
体チップの電極との間で配線を行なうボンディング部３
３ｂを備えると共に外側先端が上記枠部に連結した多数
のリード３３と、リード３３のボンディング部３３ｂの
更に内側に複数のリード同士を接続する先端接続部３３
ａを具備して成るリードフレーム３をサンプルとし、こ
のリードフレーム３の先端接続部３３ａを切断除去する
と共に、その吊りリード３２に段差を形成してアイラン
ド３１をリード３３より下方に位置せしめる加工装置を
作成した。なお、図３ａ及び図３ｂ中、４は加工に当た
ってリード３３の変形を防止するためリード３３に貼着
されたポリイミドテープであり、このリードフレーム３
は、アイランド３１及びリード３３のボンディング部３
３ｂに銀めっきが施されている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS As shown in the plan view of FIG. 3A and the sectional view of FIG. Lead 32
Bonding part 3 which is connected radially to the island 31 connected by the above and the four sides around the island 31 and has an inner tip for wiring between the electrodes of the semiconductor chip.
3b and a plurality of leads 33 whose outer ends are connected to the frame portion, and a tip connecting portion 33 for connecting a plurality of leads further inside the bonding portion 33b of the leads 33.
a processing device that cuts and removes the leading end connection portion 33a of the lead frame 3 and forms a step in the suspension lead 32 to position the island 31 below the lead 33. It was created. In FIGS. 3A and 3B, reference numeral 4 denotes a polyimide tape adhered to the lead 33 to prevent deformation of the lead 33 during processing.
Is the bonding portion 3 of the island 31 and the lead 33
3b is silver-plated.
【００１２】このリードフレーム３を加工する装置は上
型１と下型２とから構成されており、図１Ａは下方から
見た上型１の斜視図、図１Ｂは上型１の底面図である。
図から分かるように、この上型１は、上記リードフレー
ム３のアイランド３１に対応する位置に平面状のアイラ
ンド裏面対面部１１を有し、また吊りリード３２に対応
する位置に吊りリード裏面対面部１２を有している。そ
して、この吊りリード裏面対面部１２は上記アイランド
裏面対面部１１より下方向に突出して、両者の間でその
段差に応じて吊りリード３２を折り曲げることのできる
形状を有している。An apparatus for processing the lead frame 3 is composed of an upper die 1 and a lower die 2. FIG. 1A is a perspective view of the upper die 1 as viewed from below, and FIG. is there.
As can be seen from the figure, the upper die 1 has a planar island back surface facing portion 11 at a position corresponding to the island 31 of the lead frame 3, and a hanging lead back surface facing portion at a position corresponding to the hanging lead 32. 12. The suspension lead back-facing portion 12 projects downward from the island back-facing portion 11, and has a shape that allows the suspension lead 32 to be bent in accordance with the step between the two.
【００１３】また、この上型１は、上記リードフレーム
３の先端接続部３３ａに対応する位置に、この先端接続
部３３ａを切断除去する先端押切り刃１３を有してお
り、この先端押切り刃１３は上記吊りリード裏面対面部
１２より更に下方に突出している。The upper die 1 has a tip pressing blade 13 at a position corresponding to the tip connecting portion 33a of the lead frame 3 for cutting and removing the tip connecting portion 33a. The blade 13 protrudes further below the suspension lead back surface facing portion 12.
【００１４】一方、図２Ａは下型２の斜視図、図２Ｂは
その平面図であり、図から分かるように、この下型２
は、上記アイランド裏面対面部１１に対応するアイラン
ド表面対面部２１、上記吊りリード裏面対面部１２に対
応する吊りリード表面対面部２２、及び上記先端押切り
刃１３に対応する押切り刃受け用穴部２３を有してい
る。On the other hand, FIG. 2A is a perspective view of the lower die 2 and FIG. 2B is a plan view thereof.
Are the surface 21 facing the island corresponding to the surface 11 facing the island, the surface 22 facing the suspension lead corresponding to the surface 12 facing the suspension lead, and the hole for receiving the cutting blade corresponding to the tip cutting blade 13. It has a part 23.
【００１５】この上型１及び下型２から構成される加工
装置を使用して、上記リードフレーム３を以下のように
加工した。すなわち、ボンディング部３３ｂが幅狭く形
成された裏面を上側に向けて上型１と下型２の間に上記
リードフレーム３を位置合わせして載置し、次に上型１
を下降させた。この結果、まずリードフレーム３の先端
接続部３３ａが切断されて下型２の押切り刃受け用穴部
２３に落下し、続いて吊りリード３２が折れ曲がって上
型１と下型２が完全に噛み合った。The lead frame 3 was processed as follows using a processing device including the upper die 1 and the lower die 2. That is, the lead frame 3 is positioned and placed between the upper mold 1 and the lower mold 2 with the back surface on which the bonding portion 33b is formed narrow facing upward.
Was lowered. As a result, first, the distal end connecting portion 33a of the lead frame 3 is cut and falls into the press-cutting blade receiving hole 23 of the lower die 2, and then the suspension lead 32 is bent so that the upper die 1 and the lower die 2 are completely separated. I engaged.
【００１６】次に上型１を上昇させたところ、図４Ａ及
びＢに示す形状のリードフレーム３が得られた。このリ
ードフレーム３のボンディング部３３ｂは何ら変形もな
く、きれいに先端接続部３３ａが切断除去されており、
また、吊りリード３２は上型１のアイランド裏面対面部
１１と吊りリード裏面対面部１２の間に設けられた段差
形状に沿って折り曲げられ、表面側から見るとアイラン
ド３１がリード３３より下方に位置したリードフレーム
が得られた。Next, when the upper mold 1 was raised, a lead frame 3 having the shape shown in FIGS. 4A and 4B was obtained. The bonding portion 33b of the lead frame 3 is not deformed at all, and the distal end connection portion 33a is cut and removed cleanly.
The suspension lead 32 is bent along a step formed between the island back-facing portion 11 and the suspension lead back-facing portion 12 of the upper die 1 so that the island 31 is located below the lead 33 when viewed from the front side. The obtained lead frame was obtained.
【００１７】[0017]
【発明の効果】請求項１記載の発明によれば、リードフ
レームの裏面を上側に向けて上型と下型の間に位置合わ
せして載置し、上型を下方に下降させることにより先端
接続部の切断と吊りリードの折り曲げが可能となるた
め、先端接続部の切断と吊りリードの折曲げの間にリー
ドフレームを反転することが不要で工程が簡単であり、
しかもこの工程に要する装置も簡単にすることができ
る、という効果を有するものである。According to the first aspect of the present invention, the lead frame is placed with the back surface of the lead frame facing upward between the upper die and the lower die, and the upper die is lowered to lower the leading end. Since the connection part can be cut and the suspension lead can be bent, there is no need to invert the lead frame between cutting the tip connection part and bending the suspension lead, and the process is simple.
In addition, the apparatus required for this step can be simplified.
【図１】Ａは実施例に係る装置の上型を下方から見た斜
視図。Ｂは実施例に係る装置の上型の底面図。FIG. 1A is a perspective view of an upper mold according to an embodiment as viewed from below. B is a bottom view of the upper die of the device according to the embodiment.
【図２】Ａ実施例に係る装置の下型の斜視図。Ｂは実施
例に係る装置の下型の平面図。FIG. 2 is a perspective view of a lower mold of the apparatus according to the embodiment A. B is a plan view of the lower die of the device according to the embodiment.
【図３】Ａは先端切除型リードフレームの平面図。Ｂは
先端切除型リードフレームの断面図。FIG. 3A is a plan view of a lead frame of a tip resection type. B is a cross-sectional view of a lead frame of a tip cutting type.
【図４】Ａは実施例に係る加工後のリードフレームの平
面図。Ｂは実施例に係る加工後のリードフレームの断面
図。FIG. 4A is a plan view of a lead frame after processing according to the embodiment. B is a cross-sectional view of the lead frame after processing according to the example.
【図５】従来のリードフレームの平面図。FIG. 5 is a plan view of a conventional lead frame.
【図６】半導体パッケージの断面図。FIG. 6 is a sectional view of a semiconductor package.
３ リードフレーム。 ３１ アイランド。 ３２ 吊りリード。 ３３ リード。 ３３ａ 先端接続部。 ３３ｂ ボンディング部。 １ 上型。 １１ アイランド裏面対面部。 １２ 吊りリード裏面対面部。 １３ 先端押切り刃。 ２ 下型。 ２１ アイランド表面対面部。 ２２ 吊りリード表面対面部。 ２３ 押切り刃受け用穴部。 3 Lead frame. 31 island. 32 Suspended lead. 33 leads. 33a Tip connection. 33b Bonding part. 1 Upper type. 11 Island back side facing part. 12 Hanging lead back face-to-face. 13 Tip cutting blade. 2 Lower type. 21 Island surface facing part. 22 Hanging lead surface facing part. 23 Hole for receiving the press cutting blade.
フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) B21D 28/00 B21D 35/00 H01L 23/50 Continuation of the front page (58) Field surveyed (Int. Cl. 7 , DB name) B21D 28/00 B21D 35/00 H01L 23/50
Claims (1)
体チップを搭載する大きさを有して上記枠部に吊りリー
ドによって連結されたアイランドと、このアイランド周
囲に放射状に位置し、内側先端に上記半導体チップの電
極との間で配線を行なうボンディング部を備えると共に
外側先端が上記枠部に連結した多数のリードと、リード
のボンディング部の更に内側に複数のリード同士を接続
する先端接続部を具備して成るリードフレームを加工し
て、上記先端接続部を切断除去すると共に、上記吊りリ
ードに段差を形成してアイランドをリードより下方に位
置せしめるリードフレームの加工装置において、上記ア
イランドの裏面に対面するアイランド裏面対面部と、こ
のアイランド裏面対面部より突出して上記吊りリードに
段差を設ける吊りリード裏面対面部と、この吊りリード
裏面対面部より更に突出して上記先端接続部を切断除去
する先端押切り刃とを有する上型と、上記アイランド裏
面対面部、吊りリード裏面対面部及び先端押切り刃のそ
れぞれに対応するアイランド表面対面部、吊りリード表
面対面部及び押切り刃受け用穴部を有する下型、とから
構成されることを特徴とするリードフレームの加工装
置。1. A frame portion, an island located substantially at the center of the frame portion, having a size for mounting a semiconductor chip, and connected to the frame portion by a suspension lead, and being located radially around the island. A bonding portion for wiring between the electrodes of the semiconductor chip is provided at the inner end, and a plurality of leads connected to the frame at the outer end are connected to a plurality of leads further inside the bonding portion of the lead. A lead frame processing apparatus for processing a lead frame comprising a leading end connecting portion to cut and remove the leading end connecting portion and forming a step in the suspension lead to position an island below the lead. An island back-facing portion facing the back surface of the island, and a suspension projecting from the island back-facing portion to provide a step on the suspension lead. An upper die having a tip back surface facing portion, a tip pushing blade protruding further from the suspension lead back facing portion to cut and remove the tip connecting portion, the island back facing portion, the suspension lead back facing portion, and the tip pushing portion. A lead frame processing apparatus, comprising: an island surface facing portion corresponding to each of the cutting blades; a lower die having a suspension lead surface facing portion; and a punching blade receiving hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11148492A JP3216221B2 (en) | 1992-04-30 | 1992-04-30 | Lead frame processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11148492A JP3216221B2 (en) | 1992-04-30 | 1992-04-30 | Lead frame processing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05305362A JPH05305362A (en) | 1993-11-19 |
| JP3216221B2 true JP3216221B2 (en) | 2001-10-09 |
Family
ID=14562435
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11148492A Expired - Fee Related JP3216221B2 (en) | 1992-04-30 | 1992-04-30 | Lead frame processing equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3216221B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002334963A (en) * | 2001-05-10 | 2002-11-22 | Ueno Seiki Kk | Manufacturing method and manufacturing apparatus of electronic component |
| JP2002368173A (en) * | 2001-06-07 | 2002-12-20 | Ueno Seiki Kk | Device and method for manufacturing electronic component |
| KR102071078B1 (en) * | 2012-12-06 | 2020-01-30 | 매그나칩 반도체 유한회사 | Multi chip package |
-
1992
- 1992-04-30 JP JP11148492A patent/JP3216221B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05305362A (en) | 1993-11-19 |
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