JP3206571B2 - Plasma display panel and method of manufacturing the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of a color plasma display panel used for an information display terminal, a flat panel television, and the like, particularly to a high-definition panel structure, and a manufacturing method for realizing the structure.

[0002]

2. Description of the Related Art A plasma display panel is a display in which a phosphor is excited and emitted by ultraviolet rays generated by gas discharge to perform a display operation. First, the basic structure of the plasma display panel will be described. Plasma display panels can be classified into an AC type and a DC type depending on the form of discharge. A in this
The C type is superior to the DC type in terms of luminance, luminous efficiency, and life, and among the AC types, the reflective AC surface discharge type is superior in terms of luminance and luminous efficiency. Here, a reflection type AC surface discharge type will be described as an example. FIG. 7 shows a cross section of an example of a reflection type AC surface discharge color plasma display panel. A surface discharge electrode 102 is formed on a front substrate 100 which is a transparent glass plate on the display surface side. A plurality of the surface discharge electrodes 102 are formed in a band shape in a direction parallel to the paper surface, and one pair is formed for one discharge cell. A pulsed AC voltage of several tens of kHz to several hundreds of kHz is applied between the adjacent surface discharge electrodes 102 to obtain a display discharge.

[0003] Although not shown, the surface discharge electrode 102 is formed by laminating a transparent electrode and a bus electrode. The transparent electrode is made of tin oxide (SnO2) or indium tin oxide (I
TO) is used. The bus electrode formed for lowering the resistance of the surface discharge electrode 102 is formed of a metal thin film such as a multilayer thin film of chromium / copper / chrome or an aluminum thin film, or a thick metal film such as silver. In the case of forming a thick silver film, a small amount of black pigment is often mixed to improve the contrast. The surface discharge electrode 102 is covered with an insulating layer 103. Due to dielectric strength and ease of manufacturing,
The insulating layer 103 is usually formed by applying a paste mainly containing low-melting-point lead glass by a screen printing method, firing at a softening temperature or higher, and reflowing. By repeating this process a plurality of times, a smooth transparent insulating layer 103 having a thickness of about 25 μm to 40 μm and containing no air bubbles or the like can be obtained. Next, a protective layer 104 is formed so as to cover the insulating layer 103. The protective layer 104 is a thin film of MgO formed by an evaporation method or a sputtering method, or a thick film of MgO formed by a printing method, a spray method, or the like. The film thickness is about 0.5 to 2 microns. The role of this protective layer 104 is to reduce the firing voltage and prevent surface spatter.

On the other hand, a data electrode 108 for writing display data is formed on the back substrate 101. In FIG. 7, the data electrode 108 extends in a direction perpendicular to the paper surface, and one data electrode is formed for each discharge cell. That is, the data electrode 108 is the surface discharge electrode 1 formed on the front substrate 100.
It is orthogonal to 02. The data electrode 108 is covered with an insulating layer 107 formed by screen-printing and firing a thick film paste in which a low-melting-point lead glass and a white pigment are mixed. As the white pigment, titanium oxide powder or alumina powder is usually used. The insulating layer 107 may be formed of a thin film such as silicon dioxide. Note that this insulating layer 107
May not be required. The partition 105 is usually formed on the insulating layer 107 by a sand blast method or a liquid honing method. The material of the partition is a mixture of low melting point lead glass and alumina. The partition 105 forms a discharge space 109. To give an example of the dimensions of the completed partition, when the trio pitch is 1 mm, the partition width is 70 μm.
m, a height of about 130 μm, and a structure having a high aspect ratio. For a higher definition panel, the partition width is 50 μm.
Or a width smaller than this is required. Further, for each discharge cell, a phosphor 106 corresponding to the emission color of each cell is applied by a screen printing method. Each phosphor is also formed on the side surface of the partition wall 105 in order to increase the phosphor application area and obtain high luminance.

The above-mentioned front substrate 100 and rear substrate 101
And a gas capable of discharging, for example, a mixed gas of He, Ne, and Xe is sealed in the discharge space 109 at a pressure of about 500 torr. In FIG.
Two surface discharge electrodes 102 are arranged in each discharge cell,
Surface discharge occurs between the transparent electrodes. The phosphor 106 is excited by the ultraviolet light generated at this time to generate visible light, and display light emission is obtained through the front substrate 100. A pair of adjacent surface discharge electrodes 102 that generate a surface discharge serve as scan electrodes and sustain electrodes, respectively. In actual panel driving, a sustain pulse is applied between the scan electrode and the sustain electrode. When a write discharge is generated, a voltage is applied between the scan electrode and the data electrode 108 to generate a counter discharge, and a sustain pulse is applied between the scan electrode and the data electrode 108 to generate a sustain discharge between the surface discharge electrodes. This sustain discharge becomes an actual display discharge, and display is performed by controlling the number of times.

Next, a conventional method of manufacturing the partition 105 will be described. As shown in FIG. 8, a partition material layer 80 is formed on a substrate 81. Here, the substrate 81 is usually a glass plate on which data electrodes and insulating layers are formed, but these are omitted. The area of the partition wall material layer 80 is larger than the partition formation region, and may be formed on the entire surface of the substrate 81 in some cases. The forming method is performed by a screen printing method or a paste coater such as a comma coater or a blade coater.
After the partition wall material layer 80 is formed and dried, a resist partition wall pattern 82 is formed with a resist. A dry film or the like is used as the resist. At this time, the resist partition pattern 82
Is formed only in the partition formation region, that is, only on the partition material layer 80. Thereafter, processing is performed by a sand blast method or a liquid honing method. In the sandblasting method, abrasive grains of glass beads or calcium carbonate are put on high-pressure air and sprayed onto a substrate. In the liquid honing method, a liquid or abrasive particles similar to the sandblast method is dispersed in a liquid such as water and sprayed on a substrate. As a result, the unnecessary partition wall material not covered with the resist is removed. Thereafter, the resist is peeled off and baked to form a partition.
In addition, in order to prevent peeling of the resist partition wall pattern during sandblasting or liquid honing,
As shown in FIG. 9, the ends of the resist partition wall pattern 92 may be connected by a resist connection pattern 93.

[0007]

The conventional method of forming a partition wall has a disadvantage that the resist partition wall pattern is easily peeled off from the edge during sandblasting or liquid honing. For this reason, the yield of the partition wall forming step is poor, and the cost is deteriorated. In particular, the partition wall pitch is 0.1 to
This problem was remarkable when forming a partition having a high definition of 0.5 mm. This phenomenon will be described with reference to FIG. FIG. 10A is a cross-sectional view when a partition wall material layer 41 and a resist partition wall pattern 40 are formed on a substrate 42. When a sand blast method in which abrasive grains are sprayed or a liquid honing method in which a liquid or a liquid in which abrasive grains are dispersed is sprayed, large side etching 45 occurs at the end of the partition wall pattern (b). This is because, for example, in the case of a stripe-shaped partition, the end of the resist partition pattern is subjected to side etching from three directions, and the amount of side etching is larger than other portions. Therefore, the resist peeling 48 tends to occur from the end as shown in FIG.

In order to solve this problem, there is a method of connecting the ends of the resist partition pattern 92 with a resist connection pattern 93 as shown in FIG. This connection is also called a tie bar. However, in this method, since the partition wall material layer 90 in the portion of the resist connection portion pattern 93 remains on the substrate 91, the conductance of exhaust of the discharge cells deteriorates,
It has a serious adverse effect on discharge characteristics and reliability. Therefore, FIG.
Is rarely used. As described above, an object of the present invention is to provide a partition having a pitch of 0.1 to 0.1.
It is to form a partition pattern having a high definition of 5 mm and a shape having good exhaust conductance at a high yield by a sandblast method or a liquid honing method.

[0009]

According to a method of manufacturing a color plasma display panel according to the present invention, a partition material layer is formed on an insulating substrate, and a plurality of resist patterns are coated on the partition material layer. A method of manufacturing a plasma display panel, comprising removing an unnecessary portion of the partition wall material layer by using an edge portion of each resist pattern before the removal of the partition wall material layer outside a peripheral edge of the partition wall material layer. And a peripheral portion of the partition wall material layer is protected by the extended portion.

As described above, since the conventional resist pattern does not reach the periphery of the partition wall material layer, the partition wall material layer is not protected against an external force. Therefore, normal image display becomes impossible. On the other hand, in the present invention, an end portion of a normal resist (partition) pattern is extended beyond the periphery of the partition material layer to form a resist extension pattern, and at least a part of the resist extension pattern is formed on the periphery of the partition material layer. And protects the partition wall material layer from external force such as the side etching described above. It is desirable that the resist extension pattern is in contact with the partition wall material layer and the substrate as much as possible, and it is preferable that at least the outer peripheral portion of the partition wall material layer is not exposed due to close contact, so that the partition wall material layer is almost completely formed. Protected. Therefore, according to the method of the present invention, a high-definition plasma display panel can be realized in which a partition obtained by removing unnecessary portions of a partition material layer by a sandblast method or the like accurately corresponds to a resist pattern.

Further, at least a part of the plurality of resist patterns of the plurality of resist patterns having extended ends may be formed in a shape in which at least some of the plurality of ends are connected to each other by a connecting portion, or a plurality of resist patterns having extended ends may be formed. Of the plurality of ends may be divided into a plurality of blocks, and the ends in each block may be formed in a shape in which the ends are connected to each other by a connection portion. In addition, if the peripheral edge of the partition wall material layer is at a right angle and a step is formed, blurring may occur, and a flattening layer may be added to prevent this. The partition wall material layer can be formed by a screen printing method, may be formed by sticking a partition wall material processed into a sheet shape, or may be formed by coating a paste. As the resist of the resist pattern, a dry film can be used. The removal of the partition wall material of the portion of the partition wall material layer where the resist pattern is not covered,
It can be performed by a sandblasting method or a liquid honing method. The partition group formed by the sand blast method or the like can be formed in a stripe shape, a honeycomb shape, a lattice shape, or the like.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A method for manufacturing a plasma display panel according to a first embodiment of the present invention will be described with reference to FIG. Here, a process of forming a partition on a rear substrate, which is a feature of the present invention, will be described. Other processes are the same as the conventional method. Further, the shape of the partition wall will be described with a stripe shape which is the most general and the effect of the present invention is most remarkable. Also,
Although the partition is described as being formed on the back substrate, the present invention is similarly effective when formed on the front substrate.

Referring to FIG. 1, a partition material layer 1 is formed on a substrate 2. Here also, data electrodes and the like are formed on the substrate 2 but are omitted. In the following description, the description is similarly omitted. The method for forming the partition wall material layer 1 includes a screen printing method, a paste coater such as a comma coater and a blade coater, or a method of attaching a partition wall material processed into a sheet shape such as a green sheet. Unlike the conventional example, the partition wall material layer 1 is applied only to a region substantially the same as the region where the partition wall is formed. Next, a resist partition pattern 3 is formed.
A dry film is often used as the resist. The resist partition pattern 3 extends to a region without the partition material layer 1,
This extension is the resist extension pattern 4. The portion of the resist extension pattern 4 does not have the partition material layer 1 to be shielded from exposure light or the like under the portion, and therefore has only a function of protecting the peripheral portion of the partition material layer 1 from external force. FIG. 5 shows details of a cross section of the extended portion. FIG.
(A) is a state in which a resist extension pattern is formed,
The resist extends outside the partition wall material layer 61. The resist extension pattern 62 is in close contact with the substrate 63. Therefore, the ends of the partition walls are covered with the resist, and no side etching occurs, and no resist peeling occurs. Also, as shown in FIG. 5B, even if side etching 65 is caused by abrasive grains or the like entering from a gap, the resist extension pattern 66 is fixed to the substrate 67, so that the resist is stripped during sandblasting or liquid honing. Will not occur.

FIG. 2 shows a second embodiment of the present invention.
The plurality of resist extension patterns 10 formed up to the outside of the partition wall material layer 5 are connected to each other by resist connection patterns 8 and 9. As a result, the end of the resist extension pattern 10 is strengthened, and the adhesion of the resist to the substrate 6 is further strengthened, so that the resist is less likely to peel off. Of course, since there is no partition wall material layer 20 in the portions of the resist connection patterns 8 and 9, nothing lowers the exhaust conductance in this portion. The resist connection patterns 8 and 9 do not need to be connected to all the resist extension patterns 10 as shown in FIG. 2, but are divided into a plurality of blocks to connect the ends of the resist extension patterns 10 in each block. May be. Also, resist connection pattern 8
The patterns 9 and 9 are more effective when the pattern width is set to, for example, about 1 to 10 mm and is larger than the resist partition wall pattern 7 in order to more firmly adhere to the substrate 6.

FIG. 3 shows a third embodiment of the present invention.
By further developing the second embodiment, all the resist connection patterns connected to the resist extension pattern 24 are connected to each other, and the periphery of the partition wall formation region is framed. This makes resist peeling less likely to occur.
Of course, since no partition is formed in the portion of the resist connection portion pattern 23, the problem of deterioration of the exhaust conductance does not occur. In some cases, a frame-shaped partition pattern is formed outside the partition pattern. This is to prevent the sealing material (frit glass) applied to the periphery of the panel from flowing into the display section of the panel when the panel is hermetically sealed. When forming such a pattern,
As shown in FIG. 4, a partition material layer 31 is additionally formed at a necessary portion,
Further, a resist frame pattern 30 may be formed on the surface. This frame pattern has a larger line width (for example, 0.1 to 1 mm) than the partition wall of the display portion, and therefore, there is no risk of resist peeling without any particular care. There is also a method in which an extension is formed in this resist frame pattern and the resist frame pattern is connected to the substrate in a region where there is no partition material layer. The screen printing method is the easiest to apply the partition material to the pattern such as the partition material layers 25 and 31. Alternatively, a green sheet previously processed into such a pattern may be used. In the case of a paste coater, this pattern can also be formed by a lift-off method or the like.

FIG. 6 shows a fourth embodiment of the present invention.
This is a cross-sectional view around the resist extension pattern 71. Since the partition wall material layer 74 is usually very thick, about 150 to 200 μm, the resist needs to overcome this step. As shown in FIG. 5 (a), if there is a step, the resist extension pattern 71 must be greatly deformed, and this pattern may be slightly blurred in pattern formation by exposure and development or may cause peeling. There is. To prevent this, a flattening layer 72 is formed outside the partition wall material layer 74.
The flattening layer 72 is filled in a space between the outer peripheral surface of the partition wall material layer 74, the lower surface of the resist extension pattern 71, and the upper surface of the substrate 73, and is formed by, for example, attaching a resist or a sheet. This eliminates the step,
Resist peeling can be made more difficult to occur.

As described above, according to the method for manufacturing a plasma display panel of the present invention, it is possible to easily form a high-definition partition wall having a good exhaust conductance by a sandblasting method or a liquid honing method, which has been conventionally difficult. become able to. The above description has been given of the AC type surface discharge type, but the present invention can also be applied to an AC facing discharge type or DC type plasma display panel. In addition, although the partition wall shape has been described in the form of a stripe, it is needless to say that the present invention is not limited to this, and the present invention can be applied to a partition wall manufacturing process of various shapes such as a lattice shape, a honeycomb shape, a ladder shape, and a grid shape. No.

[0018]

As described above, according to the plasma display panel of the present invention and the method of manufacturing the same, since the periphery of the partition wall material layer is protected by the resist extension pattern (claim 1), the partition wall material layer is protected. Are not scraped off by an external force, and a group of partition walls to be formed conforms to a desired shape, and a high-definition plasma display panel having a partition wall pitch of 0.1 to 0.5 m can be realized. Further, since the partition wall process is stabilized, the yield is improved and the cost can be reduced. Further, since the partition wall having good exhaust conductance can be formed, the discharge characteristics can be improved and the reliability can be greatly improved.

At least a part of the plurality of resist patterns of the plurality of resist patterns having extended ends is formed in a shape in which at least a part of the plurality of resist patterns are connected to each other by a connecting portion. It is also possible to divide at least a part of the plurality of ends into a plurality of blocks and form the ends in each block into a shape in which the ends are connected to each other by a connection portion (claims 2 and 3). As a result, the end of the resist extension pattern is strengthened, the adhesion of the resist to the substrate is further strengthened, and the resist is less likely to peel off. A flattening layer can be formed in the space between the outer peripheral surface of the partition wall material layer, the lower surface of the resist extension pattern, and the upper surface of the substrate (claim 4), whereby large deformation of the resist extension pattern can be prevented. Slight blurring and peeling during pattern formation by exposure and development of a portion can be suppressed.

The partition material layer may be formed by any of a screen printing method (claim 5), sticking of the partition material processed into a sheet shape (claim 6), and paste coating (claim 7). Can be manufactured. The resist of the resist partition wall pattern or the resist extension pattern can be formed by attaching a dry film or the like (claim 8). The removal of the partition wall material in the portion of the partition wall material layer that is not covered with the resist pattern may be performed by a sandblast method or a liquid honing method (claim 9). The partition group formed by the sand blast method or the like has a stripe shape (Claim 10) and a honeycomb shape (Claim 11).
Alternatively, it can be configured as a lattice-like shape (claim 12) or the like,
Regardless of the shape, the partition wall material layer is appropriately protected by the present invention, and a high-definition plasma display panel can be manufactured.

[Brief description of the drawings]

FIG. 1 is a plan view showing a first embodiment of a method for manufacturing a plasma display panel according to the present invention.

FIG. 2 is a plan view showing a second embodiment of the method for manufacturing a plasma display panel according to the present invention.

FIG. 3 is a plan view showing a third embodiment of the method for manufacturing a plasma display panel according to the present invention.

FIG. 4 is a plan view showing a method for manufacturing a plasma display panel according to the present invention in which a partition material layer is additionally formed.

FIG. 5 is a schematic view showing a state of a resist extension pattern in the method of manufacturing a plasma display panel according to the present invention.

FIG. 6 is a sectional view showing a fourth embodiment of the method for manufacturing a plasma display panel according to the present invention.

FIG. 7 is a cross-sectional view showing an example of a conventional reflective AC surface discharge color plasma display panel.

FIG. 8 is a cross-sectional view illustrating a method for manufacturing a conventional plasma display panel.

FIG. 9 is a cross-sectional view showing another method for manufacturing a conventional plasma display panel.

FIG. 10 is a schematic view illustrating a peeling state of an end portion of a resist partition wall pattern in a conventional technique.

[Explanation of symbols]

1.5.0.25.35.31.41.44.51.61.
68.74.80.90. Partition material layer 2.6.21.26.42.46.46.50.63.67.
73.81.91. Substrate 3.7.22.27.40.43.47.47.60.64.
70.82.92. Resist barrier rib pattern 4.10.24.33.26.66.66.71. Resist extension pattern 8.9.23.28.29.29.33. Resist connection pattern 30. Resist frame pattern 45.49.65. Side etching 48. Resist stripping 72. Flattening layer 100. Front substrate 101. Rear substrate 102. Surface discharge electrode 103. Insulating layer 104. Protective layer 105. Partition wall 106. Phosphor 107. Insulating layer 108. Data electrode 109. Discharge space

Claims (8)

(57) [Claims] 1. A forming a barrier rib material layer on an insulating substrate, covering the plurality of resist patterns in the partition wall material layer, include that using the resist pattern to remove an unnecessary portion of the partition wall material layer In the method for manufacturing a plasma display panel, a flattening layer having a thickness substantially equal to that of the partition wall material layer is formed around the partition wall material layer, and an end of each resist pattern before the removal of the partition wall material layer is formed. A method of manufacturing a plasma display panel, comprising: extending on the flattening layer outside a peripheral edge of the partition wall material layer, and protecting a peripheral edge of the partition wall material layer at the extended portion. 2. The method according to claim 1, wherein at least a part of the plurality of end portions of the plurality of resist patterns having extended end portions is formed in a shape in which the end portions are connected to each other by a connection portion. Item 2. A method for manufacturing a plasma display panel according to Item 1. 3. A shape in which at least a part of the plurality of end portions of the plurality of resist patterns having extended end portions is divided into a plurality of blocks, and the end portions in each block are connected to each other by a connection portion. 2. The method according to claim 1, further comprising forming. 4. The method according to claim 1, wherein the partition material layer is formed by a screen printing method. 5. The method for manufacturing a plasma display panel according to claim 1, wherein the partition wall material layer is formed by sticking a partition wall material processed into a sheet shape. 6. The method of manufacturing a plasma display panel according to claim 1, wherein the partition material layer is formed by a paste coater. 7. A dry film is used as a resist for forming the resist pattern.
7. The method for manufacturing a plasma display panel according to any one of items 1 to 6. 8. The method according to claim 1, further comprising removing a partition material layer not covered with the resist pattern by a sand blast method or a liquid honing method to form a partition group. A manufacturing method of the plasma display panel according to the above.