JP3205915U - Treatment liquid supply piping circuit - Google Patents

Abstract

A processing liquid supply piping circuit that supplies a processing liquid used in a manufacturing process of a semiconductor wafer, an FPD substrate, or the like toward a substrate is provided. A processing liquid is provided in a liquid processing apparatus for supplying a processing liquid to a surface of a substrate from a liquid supply nozzle to perform processing, and is configured between the liquid supply nozzle and a liquid supply source of the processing liquid. In the supply piping circuit, a discharge pump for supplying the processing liquid toward the liquid supply nozzle, a supply valve for the processing liquid provided on the downstream side of the discharge pump, a discharge operation by driving the discharge pump, and an operation for opening the supply valve And a control unit that controls execution of the supply operation of the processing liquid on the substrate, and the internal flow path 35 is driven in the surface direction by the radial cross section of the internal flow path 35 of the supply valve so that the internal flow path 35 can be sealed. The valve body 31 is provided, and a gap h is secured to prevent the radial cross section from being completely shielded even when the shielding valve body 31 is closed. [Selection] Figure 4

Description

  The present invention relates to a processing liquid supply piping circuit that supplies a processing liquid used in a manufacturing process such as a semiconductor wafer or an FPD (flat panel display) substrate toward a substrate.

  In general, in the manufacture of a semiconductor device, for example, a photolithography technique is used to form a circuit pattern by applying a resist solution to a semiconductor wafer, an FPD substrate or the like (hereinafter referred to as a substrate) and exposing a mask pattern. ing. In this photolithography technology, a resist solution is applied to a substrate by a spin coating method, a resist film formed thereby is exposed according to a predetermined circuit pattern, and this exposure pattern is developed to process a circuit on the resist film. A pattern is formed.

  In such a photolithography process, generally, a coating / development processing system in which an exposure apparatus is connected to a coating / developing apparatus that performs resist coating / development is used. In this coating / development processing system, it is necessary to supply a processing solution such as a developing solution or thinner to each processing unit provided in the system, for example, a resist coating processing unit, a development processing unit, or the like.

  As a conventional processing liquid supply piping circuit of this type, a processing liquid supplied from a processing liquid supply source is pumped to supply a processing liquid to a liquid processing unit that performs processing using the processing liquid. The liquid is discharged from the liquid nozzle of the liquid processing unit and supplied to the substrate. In such a configuration, an on-off valve that opens and closes when the processing liquid is supplied is provided on the upstream side of the liquid nozzle.

JP 2000-088702 A (FIG. 25)

CKD Co., Ltd. catalog for air operated valves and suckback valves for chemicals (eg AMDSZ0 / AMDS00Series) [May 6, 2016] Internet <URL: http://hosefia.co.kr/goods/dokimec /fine/wetfine/ams022/amds00/f_amds00.html>

  In the processing liquid supply piping circuit, it is necessary to minimize foreign matter (particles) in the processing liquid before being supplied to the substrate, and it is desirable that there is no foreign matter in the processing liquid. Therefore, since the processing liquid is generally filtered using a filter, the number of foreign matters in the processing liquid after passing through the filter is reduced. However, the air operated valve / suckback valve for processing liquid, which is an on-off valve, is arranged upstream of the liquid nozzle, and it is not a little generated by driving a shielding valve that opens and closes the flow path inside the on-off valve. Foreign matter may flow out due to dust. For this reason, there is a concern that foreign matter may be discharged from the liquid nozzle and cause defective coating. Due to the recent miniaturization of patterns, it is required to suppress the occurrence of a small number of foreign substances or minute foreign substances.

  The present invention has been made in view of the above circumstances, and an object thereof is to eliminate dust generation from an on-off valve used for supplying a processing liquid, which is located near a liquid nozzle.

  In order to solve the above problem, a processing liquid supply piping circuit of the present invention is provided in a liquid processing apparatus for supplying a processing liquid to a surface of a substrate from a liquid supply nozzle to perform processing, and the liquid supply nozzle and the In a treatment liquid supply piping circuit configured between a treatment liquid supply source and a discharge pump for supplying the treatment liquid toward the liquid supply nozzle, and a supply valve for the treatment liquid provided on the downstream side of the discharge pump And a control section for controlling execution of the supply operation of the processing liquid to the substrate by the discharge operation by driving the discharge pump and the operation of opening the supply valve, and a radial cross section of the internal flow path of the supply valve A shielding valve body that can seal the internal flow path by driving in a plane direction, and when the shielding valve body is closed, there is a gap for the shielding valve body not to completely shield the radial cross section. , The shielding valve body and the It is provided between the parts channel (claim 1). In this case, the gap is preferably 0.07 mm to 0.7 mm.

  In this way, the shield valve body is completely shielded to provide a gap so that friction does not occur, that is, non-contact, thereby causing the shield valve body by driving the supply valve upstream of the liquid supply nozzle. Generation of foreign matter (particles) is eliminated, and continuous use is possible without generating dust.

  Further, in the invention of claim 1 or claim 2, the pipe branched from the pipe between the discharge pump and the supply valve is provided with a pressure release valve for releasing the pressure in the pipe. (Claim 3). In addition, the control unit may perform an operation of opening the pressure relief valve after the operation of supplying the processing liquid is completed. Further, the control unit may perform an operation of opening the pressure relief valve in synchronization with the completion of the supply operation of the processing liquid (Claim 5).

  By configuring in this way, in order to stop the leakage of the processing liquid due to the residual pressure from the supply valve after stopping the supply of the processing liquid from the liquid supply nozzle, accurate supply by removing the residual pressure in the piping Can keep the quantity. Since the timing for releasing the residual pressure varies depending on the type and viscosity of the processing liquid, it may be operated at a predetermined timing after the supply operation is completed, or may be synchronized with the supply stop control.

  Further, in the invention of claim 3, a flow meter is provided on the upstream side of the supply valve, and the control unit is based on an operation signal detected by the flow meter when the supply valve is closed. Control may be performed to open the pressure relief valve.

  By configuring in this way, the residual pressure in the pipe can be released (released) if the processing liquid flows in the pipe.

  In addition, a filtration filter for the treatment liquid may be provided on the downstream side of the supply pump, and the pressure relief valve may be provided on a pipe branched from the primary side and the secondary side of the filtration filter, respectively.

  By configuring in this way, residual pressure that tends to remain in the filter can be removed from the flow passages on both sides of the filter, that is, the primary side and the secondary side, so that leakage of the processing liquid from the supply valve can be stopped quickly. I can do it.

  In the present invention, the control unit closes the processing liquid supply valve of the supply pump and opens the discharge valve of the discharge pump after the operation of supplying the processing liquid to the substrate is completed. You may make it perform the control which pulls the process liquid of the piping of the side, and makes it flow backward (Claim 8).

  By comprising in this way, the residual pressure in piping can be extracted using a supply pump.

  According to the present invention, dust generation from the supply valve provided at the final stage in the processing liquid supply piping circuit can be eliminated, so that the processing liquid that has been subjected to the foreign substance removal processing on the upstream side of the supply valve can be left as it is on the substrate. Can be supplied.

1 is a plan view of a resist coating and developing apparatus in which an embodiment of the present invention is adopted. 1 is a perspective view of a resist coating and developing apparatus in which an embodiment of the present invention is adopted. It is explanatory drawing which showed typically the process liquid supply piping circuit which concerns on embodiment of this invention. It is explanatory drawing which showed typically the structure part of the internal cross section of the supply valve in embodiment of this invention. It is explanatory drawing which showed typically the operation state of the supply valve in embodiment of this invention. It is a control timing chart figure of the process liquid supply piping circuit which concerns on embodiment of this invention.

  A resist coating and developing apparatus employing a processing liquid supply piping circuit according to an embodiment of the present invention will be described below. The processing liquid supply apparatus, for example, sends a resist liquid used in a resist coating and developing processing apparatus, which is a liquid processing apparatus, from a resist liquid gallon bin, which is a chemical bottle serving as a supply source, and a semiconductor substrate in the resist liquid coating apparatus. In this configuration, the resist solution is supplied to the surface of the substrate, and is incorporated in the resist coating and developing treatment apparatus and operates in conjunction with the solution treatment apparatus. A case where the present invention is applied to a resist coating and developing apparatus for a wafer W as a substrate as shown in FIGS. 1 and 2 will be described as a form of a resist coating and developing apparatus in which a processing liquid supply apparatus is incorporated. In this resist coating and developing apparatus, a carrier block S1 is provided, and a transfer arm C is connected to a wafer from a carrier 20, which is a hermetically sealed substrate storage container mounted on the mounting table 21, via an opening / closing part 22. W is taken out and transferred to the processing block S2 surrounded by the casing 24 on the back side (right side in FIG. 1) of the carrier block S1, and the transfer arm C receives the processed wafer W from the processing block S2 and receives the carrier 20 It is configured to return to

  As shown in FIG. 2, the processing block S2 is formed on the lower side of the first block (DEV layer) B1 and B2 of the development processing apparatus and the resist film which is the subject of the present invention in order to perform development processing in this example. A second block (BCT layer) B3 provided with a lower-layer antireflection film coating apparatus for performing an antireflection film forming process, and a resist coating apparatus for coating a resist film that is a subject of the present invention. Third block (COT layer) B4 provided, and fourth block (TCT layer) of the upper antireflection film coating apparatus for forming the antireflection film formed on the upper layer side of the resist film to be the subject of the present invention ) B5 is laminated in order from the bottom.

  The processing block S2 of the resist coating and developing apparatus includes the first blocks (DEV layers) B1 and B2 for performing the pre-development heating process and the development process, and the antireflection film formed on the lower layer side of the resist film. The second block (BCT layer) B3 for performing the heat treatment after forming the resist film and the antireflection film, and the third block (COT layer) for performing the heat treatment after applying the resist film and forming the resist film B4 has an antireflection film formed on the upper layer side of the resist film and a fourth block (TCT layer) B5 for performing heat treatment after the formation of the antireflection film.

  For example, taking the third block (COT layer) B4 as an example, for each layer, as shown in FIG. 1, for example, three processing cups 28 for applying a resist are provided in the COT unit 26. . Then, heating and cooling processing unit groups U1, U2, U3, and U4 are arranged facing the straight conveyance path so as to sandwich the straight conveyance path of the conveyance arm A4. Each of the processing unit groups U1, U2, U3, and U4 is configured in two stages, and there are a total of eight processing units in the example of FIG. The COT unit 26 (not shown in detail) in FIG. 1 includes a spin chuck 29 that can rotatably hold the wafer W by suction, and a processing cup 28 that is provided so as to surround the spin chuck 29. A liquid process is performed on the upper surface of the wafer W adsorbed on the wafer W by discharging an appropriate amount of, for example, a resist solution from a discharge nozzle (for example, a liquid supply nozzle N1 described later) to form a coating film having a nearly uniform thickness.

  Further, the processing block S2 is provided with a shelf unit U5 (detailed configuration is not shown) as shown in FIG. 1, and the wafer W from the carrier block S1 becomes a delivery unit of the shelf unit U5 by the delivery arm C 3 A shelf stage U5 is transferred to a transition stage (not shown) in which the pins are erected and is transferred to a corresponding cooling processing unit (cooling plate) (not shown) of the second block (BCT layer) B3. Are sequentially conveyed by a transfer arm D that can be moved up and down. Further, a shelf unit U6 (detailed configuration is not shown) is provided at a position adjacent to the interface block S3 on the opposite side of the processing block S2 from the carrier block S1. The shelf unit U6 is configured in the same manner as the shelf unit U5, and is configured so that the wafer W can be moved up and down by each transfer arm E. The shelf unit U5 includes a plurality of cooling plates and transition stages (not shown), and is configured by stacking them. The shelf unit U6 is configured in the same manner as the shelf unit U5.

  The transfer arm A3 (detailed configuration is not shown) in the second block (BCT layer) B3 receives the wafer W from the cooling processing unit (not shown) of the shelf unit U5, and each unit (antireflection film). Unit and heating / cooling system processing unit group), and an antireflection film is formed on the wafer W in these units. Similarly, the wafer W that has been processed in the second block (BCT layer) B3 is transferred to the cooling processing unit of the shelf unit U6 and the cooling process corresponding to the third block (COT layer) B4 by the transfer arm E. It is transported to a unit (not shown) and transported to each processing unit by a transport arm A4 of a third block (COT layer) B4, and a resist coating process is performed.

  Thereafter, it is transferred to a cooling processing unit (not shown), and the transfer arm D is transferred to the receiving cooling processing unit (not shown) in the same manner as described above to transfer the transfer arm (fourth block (TCT layer) B5) The detailed anti-reflection film treatment is performed by a detailed configuration (not shown). Thereafter, the wafer W is transferred to a cooling unit (not shown) of the shelf unit U6, and the wafer W is transferred to a transition stage (not shown) by the transfer arm E. This wafer W is transferred to the exposure machine S4 by the transfer arm F in the interface block S3. The wafer W unloaded from the exposure machine S4 is received by the transfer arm F, and transferred to a cooling processing unit (not shown) configured so that three pins for supporting the wafer W can be protruded and retracted, and then developed. Are performed in the first blocks (DEV layers) B1 and B2 (detailed configuration is not shown). After that, it is delivered to a cooling processing unit (not shown). After passing through the cooling processing unit, the delivery arm C of the carrier block S1 is received and stored in the carrier 20.

  Next, a processing liquid supply piping circuit according to this embodiment applied to the above-described COT unit 26 shown in FIG. 3 will be described. The processing liquid supply piping circuit absorbs liquid from the chemical solution bottle B containing the resist liquid as the processing liquid through the piping 41 to the discharge pump P that is a diaphragm pump, for example. At this time, the discharge pump P opens the liquid introduction valve V1, closes the discharge valve V2 and the pump bubble removal valve V3, expands the diaphragm while controlling the electropneumatic valve EV at a predetermined speed by the control unit 100, and sucks the resist liquid. Let The pump bubble vent valve V3 is provided to periodically open and allow bubbles to flow out when bubbles are present inside the diaphragm.

  When discharging the resist solution from the discharge pump P, the liquid introduction valve V1 is closed, the discharge valve V2 is opened, the diaphragm is pressed by the electropneumatic valve EV, and the resist solution is sent downstream through the pipe. For example, a filtration filter F that captures foreign substances (particles) of the resist solution is provided in the pipe 42 located on the downstream side from the discharge pump P, and the flow rate of the resist solution in the pipe is further provided in the pipe 43 on the downstream side. And a supply valve AS in which an air operated valve and a suck back valve are integrally formed are provided on the downstream side thereof. With such a configuration, the resist solution is supplied to the substrate from the liquid supply nozzle N1 of the COT unit 26.

  4 and 5 show a part of the structure on the air operated valve 30 side in the internal cross section of the supply valve AS in the embodiment. FIG. 4 shows a cross-sectional structure on the air operated valve 30 side, and the radial cross section of the internal flow path is sealed between the IN side flow path 33 on the primary side and the OUT side flow path 34 on the secondary side in the surface direction. A shielding valve body 31 that is driven to stop is provided, and the shielding valve body 31 is configured to be driven by the operation of the flexible film body 32.

  FIG. 4 shows a state where the resist solution is not supplied (supply stop), and the shielding valve element 31 is positioned so as to block the internal flow path 35. The internal flow path 35 is configured in a cylindrical shape whose upper surface is opened by wall bodies 35a and 35b constituting the flow path. When the supply valve AS is closed, a minute gap h is set so that the shielding valve element 31 does not completely shield the radial cross section of the internal flow path 35. That is, the upper end portions of the wall bodies 35a and 35b and the shielding valve body 31 are not in contact with each other, and a minute gap h is set between them. The minute gap h is set to 0.07 mm to 0.7 mm depending on the type and viscosity of the processing liquid. FIGS. 5A and 5B show the state of the shielding valve element 31 during the opening / closing operation of the supply valve AS on the air operated valve 30 side, and FIG. 5A shows the state in which the valve is open at the time of supply. , (B) respectively show a state in which the valve is closed when supply is stopped. Thus, even when the supply valve AS is closed, the shielding valve body 31 does not contact the wall bodies 35a and 35b constituting the internal flow path 35, so that the contact is made by the opening / closing operation on the air operated valve 30 side. No friction and no dust generation.

  Since the supply operation of the resist solution is controlled by the control unit 100, it is possible to supply the resist solution by opening the supply valve AS while performing the discharge operation of the discharge pump P. If the supply valve AS is closed after supplying the resist solution, the residual pressure on the upstream side is affected, and there is a concern that the resist solution may leak from the minute gap h. If it leaks out, the resist solution to be supplied may be supplied in excess of a set amount, or the resist solution sucked back from the liquid supply nozzle N1 may sag. In order to prevent this, a pressure relief valve V4 shown in FIG. 3 is provided in the pipe 44 that branches from the downstream side of the filtration filter F in the pipe 42 and returns to the chemical solution bottle B. A pipe 45 from the pump bubble vent valve V3 of the supply pump P is connected to the pipe 44.

  The control unit 100 controls the operation of opening the pressure release valve V4 so that the operation of opening the pressure release valve V4 is executed after completion of the resist solution supply operation (supply stop). Alternatively, the operation of opening the pressure relief valve V4 may be executed in synchronization with the completion of the resist solution supply operation (supply stop). This difference in operation is selected depending on the type and viscosity of the processing liquid. For example, if the resist solution or the antireflection film solution with a low viscosity is used, the pressure relief valve V4 is opened in synchronization. If the polyimide liquid is a processing liquid having a high viscosity, the closing operation time of the supply valve AS also takes a long time. Therefore, it is difficult for the remaining pressure to remain, so the pressure release valve V4 is opened after the supply operation is completed (supply stop).

  Since the filtration filter F is structurally susceptible to residual pressure, piping 45 connected to the pressure relief valve V4 may be provided on each of the primary side and the secondary side of the filtration filter F. In such a case, the pressure relief valve V4 is provided. May also be provided for each. By using such a connection circuit, the residual pressure can be quickly released.

  In addition, after completion of the resist solution supply operation (supply stop), the pressure relief valve V4 may be opened based on the signal of the flow meter FM that monitors the flow rate value configured in the piping circuit of FIG. Good. As a result, even if the opening operation of the pressure relief valve V4 is not set according to the type and viscosity of the processing liquid, it may be opened at a predetermined timing when the flow of the liquid is confirmed.

  Next, a process for releasing the residual pressure after the supply operation using the discharge pump P will be described. After the completion of the supply operation of the resist solution (supply stop), the discharge valve V2 is opened while the liquid introduction valve V1 is closed, so that the residual pressure of the resist solution in the downstream pipes 42 and 43 is reduced in the discharge pump P. Absorbed by volume. Before opening the discharge valve V2, the residual pressure of the discharge pump P may be released by opening the pump bubble vent valve V3 connected to the pipes 44 and 45 serving as return pipes to the chemical bottle B for several seconds. Good.

  The operation state of the above-described embodiment is shown in the operation timing chart of FIG. In this operation timing chart, the upper side indicates ON, and the lower side indicates OFF, and the upper side indicates open and the lower side indicates closed.

  As described above, the case where the processing liquid supply system according to the present invention is applied to the resist solution piping circuit of the semiconductor wafer coating / development processing system has been described. However, the cleaning liquid is used for a thinner or pure water supply line or development processing. The present invention can also be applied to a developer supply line. The present invention can also be applied to a case where a processing liquid is supplied to a substrate to be processed other than a semiconductor wafer, for example, an FPD.

B Chemical liquid bottle P Discharge pump V1 Liquid introduction valve V2 Discharge valve V3 Pump bubble release valve V4 Pressure release valve EV Electropneumatic valve F Filtration filter FM Flow meter AS Supply valve N1 Liquid supply nozzle h Clearance 30 Air operated valve 31 Shielding valve body 32 Flexible membrane body 33 IN side flow path 34 OUT side flow path 100 Control unit

Claims (8)

A processing liquid supply piping circuit that is provided in a liquid processing apparatus for supplying a processing liquid to a surface of a substrate from a liquid supply nozzle to perform processing, and is configured between the liquid supply nozzle and a liquid supply source of the processing liquid In
A discharge pump for supplying the processing liquid toward the liquid supply nozzle;
A supply valve for the processing liquid provided on the downstream side of the discharge pump;
A controller for controlling execution of the supply operation of the processing liquid to the substrate by a discharge operation by driving the discharge pump and an operation of opening the supply valve;
With
A shield valve body capable of sealing the internal flow path by driving a radial cross section of the internal flow path of the supply valve in a plane direction, and when the shield valve body is closed, A processing liquid supply piping circuit, wherein a gap for not completely shielding the radial cross section is provided between the shielding valve element and the internal flow path.   The processing liquid supply piping circuit according to claim 1, wherein the gap is 0.07 mm to 0.7 mm.   The pressure relief valve for releasing the pressure in piping is provided in the piping branched from the piping between the said discharge pump and the said supply valve, Either of Claim 1 or 2 characterized by the above-mentioned. The processing liquid supply piping circuit described in 1.   The processing liquid supply piping circuit according to claim 3, wherein the control unit performs an operation of opening the pressure release valve after the supply operation of the processing liquid is completed.   The processing liquid supply piping circuit according to claim 3, wherein the controller performs an operation of opening the pressure relief valve in synchronization with the completion of the supply operation of the processing liquid.   A flow meter is provided on the upstream side of the supply valve, and the controller performs an operation of opening the pressure relief valve based on an operation signal when the flow meter detects the flow of the processing liquid when the supply valve is closed. The processing liquid supply piping circuit according to claim 3, wherein the processing liquid supply piping circuit is executed.   The filtration filter of the processing liquid is provided on the downstream side of the discharge pump, and the pressure relief valve is provided in a pipe branched from the primary side and the secondary side of the filtration filter, respectively. 4. The processing liquid supply piping circuit according to 3.   The control unit closes the processing liquid supply valve in the discharge pump and opens the discharge valve of the discharge pump after the supply operation of the processing liquid to the substrate is completed, and the processing liquid in the downstream pipe is opened by the discharge pump. The processing liquid supply piping circuit according to any one of claims 1 and 2, wherein the control is performed so that the reverse flow is performed by pulling the pressure.

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