JP3202875B2 - Apparatus and method for measuring misalignment between gripper and holder, jig for measuring misalignment, method for diagnosing misalignment between gripper and holder, and cleaning device and cleaning method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for cleaning a workpiece such as a semiconductor wafer, which is preferably used as a transfer means between a wafer chuck and a holding tool such as a boat. The present invention relates to a means for measuring and diagnosing a relative displacement between the gripping tool and the holding tool when transferring the object to be processed, and performing alignment between the two.

[0002]

2. Description of the Related Art For example, a cleaning process in a manufacturing process of a semiconductor device such as an LSI will be described as an example. Conventionally, a cleaning apparatus has been used to remove contamination such as particles, organic contaminants, and metal impurities on the surface of a semiconductor wafer. In particular, wet cleaning apparatuses are widely used because they can remove particles effectively and can perform batch processing.

In such a wet cleaning apparatus, a loading mechanism for loading a cassette containing, for example, 25 semiconductor wafers, a wafer transport apparatus for transporting, for example, 50 semiconductor wafers loaded by the loading mechanism, A plurality of cleaning processing tanks arranged so as to collectively wash the wafers transferred by the transfer device, and an unload mechanism configured to unload the semiconductor wafer cleaned by each cleaning processing tank. .

[0004] The wafer transfer device has a gripper called a wafer chuck for simultaneously gripping a predetermined number of semiconductor wafers at the same time when the semiconductor wafers are transferred to each cleaning tank. In this wafer chuck, a plurality of gripping grooves corresponding to the number of semiconductor wafers to be gripped are formed at predetermined intervals on a pair of gripping members facing each other projecting in a substantially horizontal direction. The peripheral edge portion is inserted into each of the holding grooves, and the respective semiconductor wafers are configured to be vertically held by the wafer chuck when the holding members approach each other.

On the other hand, a holder called a boat for holding semiconductor wafers held and conveyed by a wafer chuck is provided in a cleaning processing tank for cleaning semiconductor wafers. In this boat, a plurality of holding grooves corresponding to the holding grooves in the wafer chuck are formed in order to collectively receive and hold the semiconductor wafers held by the wafer chuck, and each of the semiconductor wafers in each of the holding grooves. Are vertically received to hold the semiconductor wafer at a predetermined holding position.

Therefore, when a semiconductor wafer is transferred between the wafer chuck and the boat, a holding groove serving as a holding position in the wafer chuck and a holding groove serving as a holding position in the boat are transferred when the semiconductor wafer is transferred. If the semiconductor wafers are not located in the same vertical plane, the semiconductor wafer cannot be transferred smoothly. Therefore, it is necessary to perform positioning between the holding position and the holding position in advance between the wafer chuck and the boat.

However, especially in the case of a boat, a cleaning solution tank is often filled with a high-temperature chemical solution or the like, and the length thereof fluctuates due to the heat history and the action of the chemical solution itself. Relative misalignment tends to occur between the holding groove of the boat and the holding groove of the boat. Therefore,
In order to eliminate such a displacement, the wafer chuck is adjusted and moved within a plane as needed to perform the alignment.

Conventionally, such positioning is performed so that a plurality of dummy wafers are actually held in the holding grooves of the wafer chuck and moved to the wafer chuck transfer position, so that the periphery of the dummy wafer can be just fitted into the holding groove on the boat side. In this case, the operator manually adjusts the setting position of the wafer chuck.

[0009]

However, such a method in which the operator performs positioning while visually checking depends on the skill of each operator in many cases, and it cannot be said that there is no artificial error and reliability is high. Lack. In addition, since the actual delivery status in the cleaning tank must be checked by directly looking into it, the working environment is poor, and much time and labor is required for adjustment.

The present invention has been made in view of such a problem, and provides a means for measuring and diagnosing a shift between a gripper and a holder with a simple apparatus configuration and performing relative positioning between the two. It is intended to be.

[0011]

According to the present invention, there is provided a grip for fitting a peripheral portion of an object to be processed.
A holding tool having a holding groove and a holder for fitting the peripheral portion of the object to be processed.
An apparatus for measuring a relative displacement between a holding tool and a holding tool when a workpiece is transferred to and from a holding tool having a holding groove , wherein the holding tool is detachably attached to the holding tool. comprising a tool-side jig, and the holder-side jig to be detachably attached to the holder, a measuring means for measuring the distance between the retainer-side jig with their gripper side tool, and the gripper On the side jig,
A projection to be fitted is formed, and the jig on the holder side is held.
A projection is formed to engage with the holding groove of the holder, and
The step is provided on one of the gripper-side jig and the holder-side jig.
Distance sensor positioned with respect to the projection
And the other of the gripper side jig and the holder side jig.
Measurement of the distance positioned with respect to the protrusion
Provided is a device for measuring a deviation between a gripper and a holder , which is constituted by a fixed reference plane .

In this displacement measuring apparatus, the distance sensor
Is located a predetermined horizontal distance away from the projection
It may be decided. The reference plane is, for example,
It is positioned on the same plane as the projection. In addition,
Two distance sensors and one reference plane may be provided.
No. Further, the distance sensor is, for example, an LED displacement sensor.
It is.

Further, according to the present invention, the relative positioning of the holding tool and the holding tool when the workpiece is transferred between the holding tool and the holding tool is performed using the displacement measuring device. a method, as well as mounting the gripper side jig gripper, the holder is attached to the holder-side jig, the measurement hand
By measuring the distance between the retainer-side jig with their gripper side tool by stages, a method of performing relative positioning of the gripping tool and the holder to match the measured value to the desired value Provided together.

Further, according to the present invention, it is preferable to measure the relative displacement between the holding tool and the holding tool when the workpiece is transferred between the holding tool and the holding tool as described above. As means to be provided, a jig for measuring the misalignment of the gripper and the holder, which is detachable to the gripper or the holder, and which has a distance sensor, and which is detachable to the gripper or the holder, and the distance A jig for measuring a deviation between a gripper and a holder having a reference surface for measurement is provided.

In these displacement measuring jigs ,
Two distance sensors may be provided. The above distance
The sensor is, for example, an LED displacement sensor.

[0016]

Further, according to the present invention, in a device for transferring an object to be processed between a gripper and a holder, a gripper-side jig is mounted on the gripper, and the holder is attached to the holder. The jig is mounted, and the distance between the holding jig and the holding jig is measured to measure the relative displacement generated between the holding jig and the holding jig. In addition, there is provided a method for diagnosing a misalignment between a gripper and a holder, which determines a replacement time and a position adjustment time of the gripper or the holder based on the measured value.

On the other hand, according to the present invention, there is provided a processing apparatus for carrying a processing object into a processing tank configured to be capable of supplying a processing liquid and processing the processing object with the processing liquid. A gripping tool for carrying a body into a processing tank and a holding tool for holding the object to be processed carried into the processing tank by the gripping tool in the processing tank are arranged and detachably attached to the gripping tool. Holder-side jig detachably attached to the gripper-side jig and / or holder, and measuring means for measuring the distance between the gripper-side jig and the holder-side jig Control means is provided for performing relative positioning of the gripper and the holder based on the measurement value measured by the displacement measuring device and transferring the workpiece between the gripper and the holder. A cleaning apparatus is provided.

Further, according to the present invention, the object to be processed gripped by the gripper is loaded into a processing tank configured to be capable of supplying a processing liquid, and the loaded object to be processed is loaded into the processing tank. In a method of holding a holding tool and treating an object to be processed with a processing liquid, a holding tool-side jig is mounted on a holding tool, and a holding tool-side jig is mounted on the holding tool. After measuring the distance between the jig and the jig on the holder side and performing relative positioning of the jig and the holder so that the measured value matches the desired value, the distance between the jig and the jig is determined. There is provided a cleaning method characterized in that an object to be processed is transferred between them.

[0020]

In the displacement measuring apparatus according to the present invention, the holding jig is attached to the holding jig and the holding jig is attached to the holding jig. Then, the distance between the gripper-side jig and the holder-side jig is measured using the distance sensor and the reference plane. Based on the measured values thus obtained, a relative displacement between the gripper and the holder when the workpiece is transferred between the gripper and the holder is measured. In the displacement measuring device of the present invention, since a plurality of distance sensors are provided, the distance displacement generated between the gripper and the holder based on each measurement value measured by each of the distance sensors. In addition, the rotational deviation generated between the gripper and the holder can be measured.

Further, in the positioning method according to the present invention, the relative positions of the gripper and the holder are adjusted so that the respective measured values measured using the distance sensor and the reference plane as described above match the desired values. The relative position shift and the rotational shift occurring between the two are eliminated by adjusting the target position, and the positioning when the workpiece is transferred between the gripper and the holder is performed.

Further, in the deviation diagnosing method of the present invention,
As described above, the operation of measuring the relative displacement generated between the gripper and the holder using the distance sensor and the reference plane is periodically performed. Then, based on the measurement values thus obtained periodically, the progress of the relative displacement between the gripper and the holder is investigated, and the replacement time of the gripper or the holder, the position adjustment time, etc. are predicted and determined. I do.

[0023]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below based on a cleaning apparatus 1 for cleaning a substantially disk-shaped workpiece W such as a semiconductor wafer. As shown in FIG. 1, the cleaning apparatus 1 roughly divides a workpiece W before cleaning processing into a carrier C.
A cleaning unit 3 for cleaning the workpiece W; and an unloading unit 4 for removing the cleaning object W together with the carrier C.

The loading section 5 for loading and loading a carrier C containing a predetermined number of workpieces W to be cleaned, for example, 25 pieces, is arranged in the loading section 2, and the loaded carrier C is aligned. A transfer device 7 for transferring to the part 6 is provided. Three transfer units 11, 12, and 13 are arranged on the front side (front side in FIG. 1) of the cleaning processing unit 3, and each of the transfer units 11, 12, and 13 has a wafer chuck corresponding to a gripper of the present invention. 14, 15, and 16 are provided, respectively. The wafer chuck 14 of the transfer device 11 is
50 workpieces W from the two carriers C carried in
Are collectively taken out, and then the object W is appropriately transported to the cleaning tanks 21 to 29.

The unloading section 4 has a placement section 8 having substantially the same configuration as the placement section 5, an unillustrated alignment section having the same configuration as the alignment section 6, and a configuration similar to the transfer device 7. Transfer devices (not shown) are provided.

The cleaning section 3 includes, in order from the mounting section 5 side,
A chuck cleaning / drying processing tank 21 for cleaning and drying the wafer chuck 14 of the transfer device 11, a chemical liquid for cleaning impurities such as organic contaminants, metal impurities, and particles attached to the surface of the workpiece W with a chemical liquid. Cleaning tank 2
2. Two washing / cleaning tanks 2 for cleaning the object W washed in the chemical liquid washing tank 22 using, for example, pure water.
3, 24, a chemical cleaning tank 25 for cleaning with a chemical different from the chemical in the chemical cleaning tank 22, and two types of cleaning the object W cleaned in the chemical cleaning tank 25 using, for example, pure water. Washing / cleaning processing tanks 26 and 27, chuck cleaning / drying processing tank 28 for cleaning and drying wafer chuck 16 of transfer device 13, and workpiece W from which impurities have been removed.
Is provided with a drying treatment tank 29 for steam-drying the substrate with, for example, IPA (isopropyl alcohol).

The above-mentioned three transfer devices 11, 12, 1
3, and the cleaning tanks 21 to 29 have basically the same configuration. Therefore, the configuration of the transport device 12 and the chemical liquid cleaning tank 25 will be described below as representatives thereof. As shown in FIG. 2, the transfer device 12 includes a wafer chuck 15 and a driving unit 1 for driving the wafer chuck 15.
7. The drive unit 17 includes a traveling unit 17a that travels in the X direction (lateral direction) along a rail 18 laid below the cleaning device 1, and a lifting unit that expands and contracts in the Z direction (vertical direction) above the traveling unit 17a. 17b and the elevating unit 17
b, a supporting portion 17c is provided at the upper end. The support portion 17c is configured to be rotated in a plane by an appropriate adjusting mechanism (not shown) and to be able to adjust the angle in the direction indicated by θ in the drawing.

On the other hand, the wafer chuck 15 is
And a pair of left and right gripping members 15a and 15b rotatably mounted on the supporting portion 17c. These gripping members 1
The protruding length of 5a, 15b is configured to be adjustable in the front-back direction (Y direction). Gripping members 15a, 15b
Has two arms 31a, 31a, 31 respectively.
b, 31b are suspended, and these arms 31a, 31a,
And upper and lower gripping rods 33a between the arms 31b and 31b,
34a and gripping bars 33b, 34b are respectively attached. Then, when the left and right arms 31a and 31b swing in directions M and N in the figure by the rotation of the gripping members 15a and 15b, and swing the arms 31a and 31b closer to each other, for example, 50 sheets The workpiece W is gripped at a time between the grip bars 33a, 34a and the grip bars 33b, 34b.

In the vicinity of the bottom of the chemical liquid cleaning tank 25, a boat 41 corresponding to the holder of the present invention is provided. The boat 41 is composed of three holding rods 42, 43, 44 fixed via brackets 45 (see FIG. 4) near the bottom of the chemical liquid cleaning tank 25. Each of the three holding rods 42, 43, and 44 is disposed in parallel with the gripping rods 33a and 34a and the gripping rods 33b and 34b of the wafer chuck 15 described above. In the tank 25, these holding rods 42,
43 and 44 are configured to collectively hold, for example, 50 workpieces W.

As shown in FIG. 3, a gripping groove P and a gripping groove Q are respectively formed on one of the gripping rods 33a and 34a constituting the wafer chuck 15 (on the side in contact with the workpiece W). Is done. These holding grooves P and holding grooves Q are grooves P _{1 to} P ₅₀ and grooves Q _{1 to} Q ₅₀ arranged at a constant interval L.
Consisting of Although not shown, the other gripping rod 33b and the holding bar 34b of the inner disposed with a certain distance L in (workpiece W side in contact with) a groove P ₁ to P ₅₀ and groove Q which constitute the wafer chuck 15 gripping groove P and the gripping grooves Q made of ₁ to Q ₅₀ are engraved respectively. Then, as described above, the distance between the grip bars 33a, 34a and the grip bars 33b, 34b is 5
When zero workpieces W are collectively gripped, the peripheral edges of the gripped workpieces W are formed by grooves P _{1 to} P _{50 of} grip bars 33a, 34a and grip bars 33b, 34b, groove Q ₁ ~Q ₅₀
Each fits inside.

The three holding rods 4 constituting the boat 41
Holding grooves R, holding grooves S, and holding grooves T are also engraved on the upper surfaces of 2, 43, and 44, respectively. Similarly, the holding groove R, the holding groove S, and the holding groove T also include grooves R _{1 to} R ₅₀ , grooves S _{1 to} S ₅₀ , and grooves T _{1 to} T ₅₀ arranged at a fixed interval L. Then, as described above, these holding rods 42,
When the 50 workpieces W are collectively held by 43 and 44, the peripheral edge of the gripped workpiece W is engraved on the upper surfaces of the holding rods 42, 43 and 44. Groove R
₁ to R _50, are adapted to fit respectively into the groove S ₁ to S _50, and the groove T ₁ through T _50.

When the 50 workpieces W, which are collectively gripped by the wafer chuck 15 of the transport device 12 configured as described above, are to be cleaned in the chemical cleaning tank 25, first, the processing is performed. The wafer chuck 15 holding the body W is moved to just above the boat 41 by the operation of the traveling unit 17a. In this state, the target object W has a peripheral portion that has grip bars 33a and 34a and grip bars 33b and 34.
b into the grooves P _{1 to} P ₅₀ and the grooves Q _{1 to} Q ₅₀ respectively.
It is gripped between the grip bars 33a, 34a and the grip bars 33b, 34b.

Then, the wafer chuck 15 is lowered into the chemical cleaning tank 25, and the object W is transferred to the boat 41. At the time of this transfer, the peripheral edge of each workpiece W held by the wafer chuck 15 is formed with the grooves R _{1 to} R _{50 formed} on the upper surfaces of the holding rods 42, 43, 44 of the boat 41.
It is just fitted into the grooves S _{1 to} S ₅₀ and the grooves T _{1 to} T ₅₀ .

Thereafter, the holding member 1 of the wafer chuck 15
The legs 5a and 15b are opened, and the wafer chuck 15 is lifted and retracted to the outside of the chemical cleaning tank 25.

Next, when a predetermined immersion time has elapsed and the cleaning process has been completed, the wafer chuck 15 is lowered into the chemical cleaning tank 25 with the gripping members 15a and 15b opened, and the workpiece W Stops at the position where it was delivered to the boat 41. Then, a gripping member 15a of the wafer chuck 15,
The leg 15b is closed, and the 50 workpieces W held by the boat 41 are simultaneously and collectively grasped. At the time of this holding, the peripheral edge of each workpiece W held by the wafer chuck 15 is held by the holding bars 33a, 34a and the holding bars 33b, 33b.
4b the groove P ₁ to P ₅₀ of, is just fitted into the groove Q ₁ to Q _50. Thus, the grip bars 33a, 34a and the grip bars 33b, 3
4b, the workpieces W are collectively gripped, the wafer chuck 15 is raised, the gripped workpieces W are retracted to the outside of the chemical cleaning tank 25, and the next cleaning process, ie, water washing, is performed. The workpiece W is transported to the washing / cleaning processing tank 24.

Therefore, as described above, the wafer chuck 15
In order to smoothly transfer the 50 workpieces W between the wafer 41 and the boat 41, each of the holding grooves P ₁ to
P ₅₀ , Q _{1 to} Q ₅₀ and holding grooves R _{1 to} R ₅₀ on the boat 41 side,
S _{1 to} S ₅₀ and T _{1 to} T ₅₀ must be in a correct relative positional relationship. That is, for example, regarding the first groove, the holding grooves P ₁ and Q ₁ and the holding grooves R ₁ , S ₁ and T ₁ must be located on the same vertical plane.

The present invention is provided as a means for measuring, diagnosing, and positioning the relative displacement in such a case. As shown in FIG. 2, the present invention is detachable from the wafer chuck 15 which is a gripping tool. Gripper side jig 50 to be attached to
And a holder-side jig 51 detachably attached to the boat 41 side as a holder.

First, the holder-side jig 51 will be described with reference to FIGS. Protrusions 52 and 53 are formed at lower ends of the holder-side jig 51, respectively. As shown in FIG. 5, both the projection 52 and the projection 53
Has the same curvature as that of the disc-shaped semiconductor wafer, and the interval between the projections 52 and 53 is the same as the interval between the left and right holding rods 42 and 44 of the boat 41 described above. ing. Further, the projections 52 and 53 of this embodiment
, The groove R ₁ to R ₅₀ of the holding rod 42, 44 and grooves T ₁ through T _50,
Three protrusions 5 each having a "V" shape large enough to fit in
4, 55, and 56. These projections 54, 55,
The arrangement interval L of 56 is determined by the grooves R ₁ to
It is formed at the same interval as R ₅₀ and the grooves T _{1 to} T ₅₀ .
Therefore, as shown in FIGS.
By fitting the projections 52, 53 of the above into the holding grooves R, T formed in the holding rods 42, 44 of the boat 41, respectively, the holding jig 51 is detachably attached to the boat 41. It is possible to A reference surface 57 is formed above the holder-side jig 51 as described above. As will be described later, light projected from each distance sensor provided on the gripper-side jig 50 is reflected by the reference surface 57. In the illustrated example, the center protrusion 55 of the above-described protrusions 52 and 53 and the reference surface 57 are formed so as to be on the same plane. Therefore, by attaching the holding jig 51 to the boat 41 using the holding grooves R and T of the holding rods 42 and 44 as described above, the reference surface 57 formed on the holding jig 51 is formed.
Is positioned and arranged at the same position as the groove in which the middle projection 55 of the projections 52 and 53 is fitted.

Next, the gripper-side jig 50 will be described with reference to FIGS. The left and right ends of the gripper-side jig 50 are, as shown in FIG.
The extension part 60a and the extension part 60b for placing the gripper-side jig 50 on the gripper 3a and the gripping bar 33b are formed respectively. Two projections 61a, 61a and a projection 61 each on the left and right sides are provided below the inside of the extension 60a and the extension 60b.
b and 61b are respectively attached. These projections 61
The a, 61a and the protrusions 61b, 61b are formed in shapes that can be fitted into the holding grooves P and Q formed on the holding bars 33a and 33b, respectively. Left and right protrusion 6
The distance between the protrusion 1a and the protrusion 61b is formed by the gripping rods 33a and 33b when the arms 31a and 31b are swung so as to approach each other in the wafer chuck 15 described above to grip the workpiece W. It is the same as the interval. The distance between the two protrusions 61a, 61a attached to the extension 60a and the distance between the two protrusions 61b, 61b attached to the extension 60b are all smaller than the distance of the wafer chuck 15. Gripping bar 33a and gripping bar 3
Each groove P ₁ to P ₅₀ formed 3b, groove spacing Q ₁ to Q ₅₀ L
, And the length of the groove P _{1 in} the example shown in the figure.
To P ₅₀ and 29 times the distance L of the groove Q ₁ to Q _50, i.e., the projection 61a, the distance 61a between the projections 61b, 61b interval of each other, both have become the length of 29L. Therefore,
As shown in FIG. 9, the protrusion 61 of the gripper-side jig 50
a and 61b are gripping rods 33a and 33 of the wafer chuck 15.
b into the gripping grooves P and Q formed on the wafer chuck 15 so that the gripper side jig 50
Can also be detachably attached.

Under the gripper-side jig 50, two distance sensors 66a and 66b are provided via a bracket 65.
Is attached. In the embodiment shown, the distance sensors 66a, 6
Reference numeral 6b denotes an LED displacement sensor using a light emitting diode. As shown in FIG.
a, 66b, on the front surface of the light projecting parts 67a, 6
7b, and light receiving portions 68a and 68b for receiving light reflected from the reference surface 57 of the holder-side jig 51 when the light projected from the light projecting portions 67a and 67b are provided as described later, respectively. I have. In the illustrated example, as shown in FIG. 8, the light projecting units 67a and 67b and the light receiving units 68a and 68a
The horizontal distance L 'between the front surfaces of the distance sensors 66a and 66b having the 7b and the one (lower in FIG. 8) projections 61a and 61b is set to be five times as long as the above-described distance L, that is, 5L. . Therefore, as described above, while the projections 61a and 61b of the gripper-side jig 50 are fitted into the gripping grooves P and Q, respectively, the left and right extending portions 60 of the gripper-side jig 50 are inserted.
a and 60b are gripping rods 33a and 33 of the wafer chuck 15.
b on the wafer chuck 1
5, the light projecting portions 67a, 67b and the light receiving portions 68a, 68b of the distance sensors 66a, 66b are moved from the holding grooves P, Q in which the one (lower in FIG. 8) projections 61a, 61b are fitted. It is possible to arrange at a position 5 L away from the horizontal distance.

When the displacement is measured using the gripper-side jig 50 and the holder-side jig 51 of the embodiment having the above configuration, first, as shown in FIG.
The holder-side jig 50 is mounted on the boat 41, and the holder-side jig 51 is mounted on the boat 41. The wafer chuck 15 is previously swung so that the arms 31a and 31b are close to each other, and is kept in the same state as when the workpiece W is being gripped. Then, the left and right protrusions 61a of the gripper-side jig 50,
61a and the projections 61b, 61b
The extension portions 60a and 60b of the gripper-side jig 50 are gripped by the grip bars 33a of the wafer chuck 15 while being fitted into the grip grooves P and Q formed in the upper grip bars 33a and 33b, respectively. And on the gripping bar 33b. The protrusions 61a, 61 of the gripper-side jig 50
The positions of the gripping grooves P and Q into which b is fitted are determined by the respective grooves P ₁ to
P ₅₀ and grooves Q _{1 to} Q ₅₀ are appropriately selected, and one (lower side in FIG. 8) projections 61 a and 61 b are fitted into the groove at the position where the deviation is to be measured. On the other hand, the gripper-side jig 50 is mounted. Here, the protrusion 61
a gripping groove P which is fitted to a, gripping groove Q for fitting the projection 61b is a groove of the left and right have the same position, i.e., for example, grooves Q ₁₀ for the grooves P _10, and grooves Q _n for groove P _n To correspond. The light projecting unit 67 of the distance sensors 66a, 66b
It is also possible to mount the gripper-side jig 50 with the a, 67b and the light receiving portions 68a, 68b facing the near side in FIG. 2, but conversely, the gripper-side jig 50 is placed in a horizontal plane. It is also possible to mount the distance sensors 66a, 66b with the light projecting parts 67a, 67b and the light receiving parts 68a, 68b turned to the rear side in FIG.

On the other hand, the projections 54, 55, 56 of the projections 52, 53 formed at both lower ends of the holder jig 51 are fitted into the holding grooves R, T on the upper surfaces of the holding rods 42, 44 of the boat 41, respectively. The light emitting units 67a and 67b and the light receiving unit 68 of the distance sensors 66a and 66b of the gripper-side jig 50 mounted on the wafer chuck 15 are mounted on the reference surface 57 of the holder-side jig 51.
The holder jig 51 is attached to the boat 41 so as to face the a and 68b. In this case, the positions of the holding grooves R and T on the upper surfaces of the holding rods 42 and 44 into which the middle protrusions 55 of the protrusions 52 and 53 of the holder-side jig 51 are fitted, respectively.
When the gripper-side jig 50 is attached to the wafer chuck 15 described above, one of the protrusions 61 (the lower side in FIG.
The holding grooves R and T for fitting the protrusions 52 and 53 are set to the same positions on the left and right sides of the holding grooves P and Q where the holding grooves a and 61b are fitted. That is,
For example the wafer chuck 15 whereas when mounting the gripper side jig 50 with the projection 61a, the gripping groove P, the position of Q groove P ₁₀ and the groove Q ₁₀ which is fitted and 61b (FIG. 8, bottom) in, if the projection 55 of the middle of the protrusion 52, 53 is respectively inserted into the groove R ₁₀ and groove T _10, similarly, the gripping groove P, the position of Q is if the groove P _n and the groove Q _n, projection the projection 55 of the middle parts 52, 53 is respectively inserted into the groove R _n and the groove T _n.

As described above, when the gripper-side jig 50 is mounted on the wafer chuck 15 and the holder-side jig 51 is mounted on the boat 41, the raising / lowering part 17b of the drive unit 17 of the transfer device 12 is shortened and operated. Then, the wafer chuck 15 is connected to the chemical cleaning tank 25 through the support portion 17c as shown in FIG.
Lower inside. Thereby, the wafer chuck 15
Gripper-side jig 5 placed on gripping rods 33a, 33b
0 also descends into the chemical cleaning tank 25, and the distance sensor 66 provided on the gripper-side jig 50 as shown in the figure.
a, 66b, the height of the light emitting portions 67a, 67b, and the boat 4
Holder-side jig 51 mounted on one holding rod 42, 44
The height of the reference surface 57 becomes the same.

Then, as shown in FIG. 10, in this state, light is projected from the light projecting portions 67a, 67b of the distance sensors 66a, 66b, respectively, and the reflected light is reflected by the reference surface 57 of the holder jig 51. The light is transmitted to the distance sensors 66a, 6
The light receiving portions 68a and 68b of 6b receive light, respectively. Thus, the distance between the gripper-side jig 50 and the holder-side jig 51 is measured by the distance sensors 66a and 66b.

Here, the distance sensor 66a as described above,
The measurement using 66b can be performed by a measurement system as shown in FIG. 11, for example. The control unit 70 of the measurement system includes a display unit 71a and a display unit 71b. The distance sensors 66a, 66b and the control unit 70 are connected via cables 72a, 72b, respectively, and the distance between the distance sensor 66a and the reference surface 57 of the holder jig 51 is displayed on the display unit 71a. The distance between the holder-side jig 51 and the reference surface 57 measured by the distance sensor 66b is displayed on the display unit 71b. The cables 72a and 72b are connected to the arms 31 of the wafer chuck 15.
It is installed with care so as not to interfere with the movements of a and 31b.

Thus, the distance between the gripper-side jig 50 and the holder-side jig 51 is measured using such a system.
Here, as described above, when the gripper-side jig 50 is mounted on the wafer chuck 15, one (lower in FIG. 8) of the gripping grooves P and Q into which the protrusions 61 a and 61 b are fitted. The position is the same as the position of the holding grooves R and T into which the projection 55 in the middle of the projections 52 and 53 is fitted when the holder jig 51 is attached to the boat 41. The reference surface 57 of the jig 51 and the projection 55 in the middle of the projections 52 and 53 are formed on the same plane.
The horizontal distance L 'between the front surfaces of the distance sensors 66a and 66b having the light projecting portions 67a and 67b and the light receiving portions 68a and 67b and one (lower in FIG. 8) projections 61a and 61b is five times the distance L described above. Is set to 5L. Therefore, if one (lower in FIG. 8) projection 61 of the gripper-side jig 50 is used.
The wafer chuck 15 is positioned at the positions of the holding grooves P and Q into which the a and 61b are fitted, and the positions of the holding grooves R and T at which the middle protrusion 55 of the protrusions 52 and 53 of the holder-side jig 51 are fitted. If there is no relative displacement from the boat 41, the distance between the gripper-side jig 50 and the holder-side jig 51 measured by the distance sensors 66a and 66b as described above is 5L. On the other hand, if the positions of the holding grooves P and Q and the positions of the holding grooves R and T are such, the wafer chuck 1
If there is a relative displacement between 5 and boat 41, the distance between gripper-side jig 50 and holder-side jig 51 measured by distance sensors 66a, 66b is different from 5L. Value. Thus, the distance sensors 66a, 66
the wafer chuck 15 and the boat 41 based on the distance between the gripper-side jig 50 and the holder-side jig 51 measured by b.
, It is possible to measure a relative shift when the target object W is transferred between.

Further, as shown in this embodiment, the gripper-side jig 5
0 is provided with two distance sensors 66a and 66b, and by comparing the measured values measured by the distance sensors 66a and 66b, the rotation generated between the wafer chuck 15 and the boat 41 is compared. The deviation can also be measured. That is, if the wafer chuck 15 and the boat 4
In the case where there is a rotational deviation between the jig 50 and the gripper side jig 50 attached to a predetermined position of the wafer chuck 15 by the gripping grooves P and Q, and the boat 41 by the holding grooves R and T.
Of the holder-side jig 51 attached to the predetermined position of the distance sensor 66a.
7 is not equal to the distance from the light projecting portion 67b of the distance sensor 66b to the reference surface 57 of the holder-side jig 51. Therefore, when a rotational displacement occurs between the wafer chuck 15 and the boat 41, the two distance sensors 66a, 66
Since the measured values measured in 6b are different from each other, it is possible to measure the rotational deviation generated between the wafer chuck 15 and the boat 41 by comparing the measured values.

In the above embodiment, when the relative positioning between the wafer chuck 15 and the boat 41 is performed, first, the wafer chuck 15 is subjected to the same procedure as described above.
The deviation occurring between the boat and the boat 41 is measured. Here, if there is no displacement between the wafer chuck 15 and the boat 41, the gripper-side jig 50 and the holder-side jig 51 measured by the distance sensors 66a and 66b.
Is 5L. However, when there is a deviation between the two, the distance between the gripper-side jig 50 and the holder-side jig 51 measured by the distance sensors 66a and 66b is no longer 5L and is different. The measured value will be shown.

Therefore, first, the gripper-side jig 50 and the holder-side jig 51 measured by the distance sensors 66a and 66b are used.
Are equal to each other, but when both are shortened to, for example, 4L, or when both are increased to, for example, 6L, a pair of left and right gripping members 15a attached to the wafer chuck 15 are provided. The protrusion length of 15b is adjusted in the front-rear direction (Y direction in FIG. 2) by appropriately extending or shortening the protrusion length, and the gripper-side jig 50 and the holder-side jig 51, which are measured by the distance sensors 66a and 66b, Are corrected so that each of the distances becomes 5L.

On the other hand, the distance sensor 66a and the distance sensor 66
If the distance between the gripper-side jig 50 and the holder-side jig 51 measured by b is different from each other, the gripper-side jig 50 and the holder-side jig 51 measured by the distance sensor 66a
Is 4L, and the distance between the gripper-side jig 50 and the holder-side jig 51 measured by the distance sensor 66b is 6L.
In such a case, the wafer chuck 15 and the boat 4
This means that there is a rotational deviation between the first and the second. Therefore,
In such a case, the mounting posture of the boat 41 disposed near the bottom of the chemical liquid cleaning tank 25 is rotationally adjusted, and the angle is adjusted in the direction indicated by θ in FIG. In addition, such a mounting posture of the boat 41 is adjusted by three holding rods 4.
It can be performed by adjusting the mounting position of the bracket 45 supporting the 2, 43, 44.

Thus, the gripping members 15a, 15b are set so that the distance between the gripper-side jig 50 and the holder-side jig 51 measured by the distance sensor 66a and the distance sensor 66b by the above procedure becomes 5L. By appropriately adjusting the protrusion length of the wafer 41 and the mounting posture of the boat 41, the relative distance shift and the rotation shift generated between the wafer chuck 15 and the boat 41 can be eliminated, and the processing between the two can be eliminated. Positioning when the body W is delivered can be performed.

When diagnosing a shift between the wafer chuck 15 and the boat 41 in the above embodiment, the shift between the wafer chuck 15 and the boat 41 is measured by the same procedure as described above. . This measurement operation is repeated periodically, for example, monthly or weekly, and the change over time of the measured value obtained periodically is displayed, for example, by a graph or an approximate expression. Then, the progress of the relative displacement occurring between the wafer chuck 15 and the boat 41 is investigated. As described above, it is possible to predict and determine the replacement time of the wafer chuck 15 and the boat 41, the position adjustment time, and the like by considering the change in the relative displacement between the two.

As described above, according to the embodiment described above, both the wafer chuck 15 and the boat 41 are attached to the gripper-side jig 50 and the holder-side jig 51 by an extremely simple method. It is possible to accurately measure, diagnose and predict the relative displacement between the wafers, and also to accurately align the position where the workpiece W is transferred between the wafer chuck 15 and the boat 41.

In the above embodiments, the present invention is applied to a transfer device in a wafer cleaning apparatus. However, the present invention is not limited to this, and the present invention is not limited to this. The present invention can also be applied to other general processing apparatuses configured to transfer an object to and from a holder.

[0055]

According to the present invention, a very simple operation of mounting the gripper-side jig on the gripper and mounting the holder-side jig on the holder is achieved. There is an excellent effect that the relative displacement between the two when transferring the object to be processed can be accurately measured. By accurately measuring the relative displacement between the gripper and the holder in this manner, the positioning of the gripper and the holder can be performed. Further, by predicting a relative displacement that will occur between the gripper and the holder in the future, it is also possible to determine a time for replacing the holder, a time for adjusting the position, and the like.

[Brief description of the drawings]

FIG. 1 is a perspective view of a cleaning apparatus.

FIG. 2 is a perspective view of a transfer device on which a displacement measuring jig is mounted.

FIG. 3 is a perspective view of a wafer chuck and a boat.

FIG. 4 is a side view of a wafer chuck and a boat.

FIG. 5 is a front view of the holder-side jig.

FIG. 6 is a side view of the holder-side jig.

FIG. 7 is a sectional view taken along the arrow line of FIG. 5A-A.

FIG. 8 is a plan view of a gripper-side jig.

FIG. 9 is a front view of the gripper-side jig.

FIG. 10 is a side view of the jig on the gripper side.

FIG. 11 is an explanatory diagram of a measurement system.

[Explanation of symbols]

 15 Wafer chuck (gripping tool) 41 Boat (holding tool) 50 Jig for holding tool 51 Jig for holding tool 57 Reference surface 66a, 66b Distance sensor W Workpiece

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ identification code FI H01L 21/304 648 H01L 21/304 648B 648Z (58) Fields investigated (Int.Cl. ⁷ , DB name) H01L 21/68 B25J 13/08 B65G 49/07 H01L 21/304 648

Claims (13)

(57) [Claims] An object of the present invention is to provide a gripping groove for fitting a peripheral portion of an object to be processed.
A holding groove for fitting the gripper provided with the peripheral portion of the object to be processed is provided.
An apparatus for measuring a relative displacement between a holding tool and a holding tool when a workpiece is transferred between the holding tool and a holding tool, the holding tool side jig being detachably attached to the holding tool. comprising a tool, a holder-side jig to be detachably attached to the holder, a measuring means for measuring the distance between the retainer-side jig with their gripper side tool and gripper side tool Has a protruding portion fitted into the grip groove.
Are formed, and the jig on the holder side is engaged with the holding groove of the holder.
A projection is formed, and the measuring means includes one of the jig on the gripper side and the jig on the holder side.
That is positioned with respect to the projection
Other than the distance sensor, the jig on the gripper side and the jig on the holder side.
Positioned on the projection,
A device for measuring the misalignment between a gripper and a holder , consisting of a reference plane for measuring the distance of the object. 2. The method according to claim 1, wherein the distance sensor is a predetermined distance from the protrusion.
2. The device is positioned at a position separated by a horizontal distance.
The displacement measuring device of the gripper and the holder according to the above. 3. The reference plane is flush with the projection.
The gripper according to claim 1 or 2, wherein the gripper is positioned.
Holder misalignment measuring device. 4. The apparatus according to claim 1 , wherein two distance sensors are provided, and
4. The device for measuring the displacement between a gripper and a holder according to claim 1 , wherein one is provided . Wherein said distance sensor is shift measuring apparatus of the gripper and the holder of any one of claims 1, 2, 3 or 4 an LED displacement sensor. 6. The relative positioning of the holder and the gripping device when passing workpiece between the grippers and the holder, 請
Deviation measurement according to any of claims 1, 2, 3, 4 or 5
A method using the apparatus, with attaching the gripper side jig gripper, the holder is attached to the holder-side jig, by the measuring means and their gripper side tool holding A method of measuring a distance between tool-side jigs and performing relative positioning between a gripper and a holder so that the measured value matches a desired value. 7. The method according to claim 1, wherein
What is claimed is: 1. A measuring jig for constituting a displacement measuring device, which is detachable from a grasping tool or a holding tool, and has a distance sensor. 8. The jig for measuring a displacement between a gripper and a holder according to claim 7, comprising two of the distance sensors. 9. The jig according to claim 7, wherein the distance sensor is an LED displacement sensor. 10. The method according to claim 1, 2, 3, 4, or 5.
A measurement jig for constituting the displacement measuring device according to the above (1) , which is detachable from the grasping tool or the holding tool and has a reference surface for measuring a distance, and is used to measure a displacement between the holding tool and the holding tool. Jig. 11. An operation for measuring a relative displacement generated between the gripper and the holder by the method according to claim 6, and based on the measured value, the operation of the gripper or the holder is performed. A method for diagnosing misalignment between the gripper and the holder that determines the replacement time, position adjustment time, etc. 12. A processing apparatus for carrying an object to be processed into a processing tank configured to be capable of supplying a processing liquid and treating the object with the processing liquid, wherein the object to be processed is loaded into the processing tank. and gripping tools, in what holder for holding the workpiece which has been carried into the processing tank in the processing bath is arranged by gripping tool, claim 1, 2, 3, 4 or 5 Based on the measured value measured by the deviation measurement device described in
A cleaning apparatus comprising: a control unit configured to perform relative positioning between a gripper and a holder to transfer a workpiece between the gripper and the holder. 13. An object to be processed gripped by a gripper is loaded into a processing tank configured to be capable of supplying a processing liquid, and the loaded object is held by a holder in the processing tank. In the method of processing a processing object with a processing liquid, after the relative positioning of the holding tool and the holding tool is performed by the method according to claim 6, the transfer of the processing target object between the holding tool and the holding tool is performed. A cleaning method characterized by performing.