JP3199944U - Led直管ランプ - Google Patents
Led直管ランプ Download PDFInfo
- Publication number
- JP3199944U JP3199944U JP2015003456U JP2015003456U JP3199944U JP 3199944 U JP3199944 U JP 3199944U JP 2015003456 U JP2015003456 U JP 2015003456U JP 2015003456 U JP2015003456 U JP 2015003456U JP 3199944 U JP3199944 U JP 3199944U
- Authority
- JP
- Japan
- Prior art keywords
- tube
- lamp tube
- lamp
- led straight
- straight tube
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
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Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
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- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V15/00—Protecting lighting devices from damage
- F21V15/01—Housings, e.g. material or assembling of housing parts
- F21V15/015—Devices for covering joints between adjacent lighting devices; End coverings
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- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/27—Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
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- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/27—Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
- F21K9/272—Details of end parts, i.e. the parts that connect the light source to a fitting; Arrangement of components within end parts
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- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V13/00—Producing particular characteristics or distribution of the light emitted by means of a combination of elements specified in two or more of main groups F21V1/00 - F21V11/00
- F21V13/02—Combinations of only two kinds of elements
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- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V15/00—Protecting lighting devices from damage
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
- F21V17/101—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening permanently, e.g. welding, gluing or riveting
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
- F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/02—Arrangement of electric circuit elements in or on lighting devices the elements being transformers, impedances or power supply units, e.g. a transformer with a rectifier
- F21V23/023—Power supplies in a casing
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V25/00—Safety devices structurally associated with lighting devices
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
- F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Common Detailed Techniques For Electron Tubes Or Discharge Tubes (AREA)
Abstract
Description
ガラスの軟化点と転移点の間の温度域において、Na2OまたはK2Oを含むガラスをリチウム溶融塩に浸し、ガラス中のNaイオンまたはそれらよりも半径が小さい溶融塩中のLiイオンと置換させ、室温に冷却した後、Liイオンを含む表面層と、NaイオンまたはKイオンを含む内面層との膨張係数が異なるため、表面には圧縮応力が残って強化される。同時に、ガラス中にAl2O3、TiO2等の成分が含まれていると、イオン交換により、膨張係数の非常に小さい結晶ができ、冷却後のガラス表面に非常に強い圧縮応力が生じ、強度が700MPaに達するガラスが得られる。
低温イオン交換法は、ガラスの転移温度より低い温度域において、表面層のアルカリイオン(例えば、Naイオン)よりイオン半径の大きい1価の陽イオン(例えば、Kイオン)をNaイオンで置換させ、Kイオン表面層に移動させる。例えば、Na2O+CaO+SiO2系統のガラスは、400℃以上の熔融塩に十数時間浸すことが可能である。低温型イオン交換法は、高い強度が容易に得られることができ、処理方法が簡単であり、ガラス表明の透明性を損なわなく、変形しない等の特徴がある。
脱アルカリ法は、亜硫酸ガスと水分を含む高温雰囲気において、Pt触媒を利用してガラス処理を行い、Na+イオンをガラス表面層から浸出させ、亜硫酸と反応させることで、表面層はSiO2リッチ層になったため、表面層が低膨張性のガラスになり、冷却すると圧縮応力が生じる。
表面結晶法は、高温型イオン交換法と異なり、熱処理のみによって表面層に膨張係数の低い微結晶が形成され、強化させる方法である。
ケイ酸ナトリウム強化法は、ケイ酸ナトリウム(水ガラス)の水溶液を、100℃以上の数大気圧の状態において処理を行い、表面層に引っかけ傷の付け難い高強度なガラスが得られる。
図18に示すように、本実施の形態におけるランプ管1は、ランプ管1の内面に密着する基板2(または、可撓性回路基板)を加えて、さらに、拡散層13を含み、光源202からの光は拡散層13を透過し、ランプ管1から取り出される。
図23に示すように、光源202は、さらに、溝202aを有するリードフレーム202bと、溝202aに設置されるLED結晶粒18と備えるように改良されてもよい。ここで特に説明したいことは、従来のLED結晶粒18は、その長さと幅との比例が約1:1となる正方形の形状である。しかし、本考案におけるLED結晶粒18は長尺の矩形であってもよく、その長さと幅の比例は2:1〜10:1の範囲としてもよい。望ましい範囲は2.5:1〜5:1であり、最も好適な範囲は3:1〜4.5:1である。これにより、LED結晶粒18の長手方向をランプ管1の長手方向に沿うように、LED結晶粒18を配列することで、LED結晶粒18の平均電流密度及びランプ管1全体の配光等の問題が改善される。
101 端部
102 本体
103 渡り部
2 基板
201 雌型プラグ
202 光源
202a 溝
202b リードフレーム
2a 配線層
2b 誘電層
3 キャップ
301 中空導電ピン
302 絶縁管
302a 第1管
302b 第2管
302c 切り欠き部
302d 金属部材を支持する部位
302e 他の部分
303 熱伝導部
310 凸部
313 支持部
4 粘着ペーストシート
5 電源
501 雄型プラグ
502 金属ピン
6 熱接着剤
7 基板絶縁ペーストシート
701 貫通孔
8 光源ペーストシート
9 金属部材
901 孔構造
903 圧痕構造
11 感応コイル
12 反射膜
12a 孔
13 拡散層
15 第1側壁
15a 第1側壁の内面
16 第2側壁
18 LED結晶粒
Claims (22)
- ランプ管と、前記ランプ管に設置され、光源が設けられる基板とを含むLED直管ランプであって、
前記ランプ管の内周面には、さらに、周方向に沿って、前記ランプ管の内周面の一部を占める反射膜が設けられる
ことを特徴とするLED直管ランプ。 - 前記反射膜には、前記基板と対応するように孔が設けられ、前記基板が前記孔に設けられる
ことを特徴とする請求項1に記載のLED直管ランプ。 - 孔の大きさは、前記基板を収納するように前記基板より大きい
ことを特徴とする請求項2に記載のLED直管ランプ。 - 前記基板は前記反射膜の上に設けられる
ことを特徴とする請求項1に記載のLED直管ランプ。 - 前記基板は、前記ランプ管の周方向において、前記反射膜の片側に位置する
ことを特徴とする請求項4に記載のLED直管ランプ。 - 前記基板は、前記ランプ管の周方向における両側に、それぞれ、反射膜を有し、前記基板の周方向に沿う両側における反射膜の面積が実質的に同じである
ことを特徴とする請求項4に記載のLED直管ランプ。 - 前記反射膜は、前記基板の片側において、前記ランプ管の周方向に沿って延伸する
ことを特徴とする請求項1に記載のLED直管ランプ。 - 前記反射膜は、前記基板の両側において、前記ランプ管の周方向に沿って延伸する
ことを特徴とする請求項1に記載のLED直管ランプ。 - 前記ランプ管は、さらに、拡散層を含み、
前記光源からの光は、前記拡散層を透過し、前記ランプ管から出射する
ことを特徴とする請求項4〜8のいずれか一項に記載のLED直管ランプ。 - 前記拡散層は、前記光源に塗布または覆われる拡散コーティング層である
ことを特徴とする請求項9に記載のLED直管ランプ。 - 前記拡散層は、ランプ管の内周面に塗布または覆われる拡散コーティング層である
ことを特徴とする請求項9に記載のLED直管ランプ。 - 前記拡散層は、光源と接触せず、光源の外を被るように設けられる拡散シートである
ことを特徴とする請求項9に記載のLED直管ランプ。 - 前記反射膜の前記ランプ管の周方向に沿って延伸する長さと、前記ランプ管の内周面全周との比率は、0.3〜0.5の範囲である
ことを特徴とする請求項1〜8のいずれか一項に記載のLED直管ランプ。 - 前記反射膜の反射率は85%よりも大きい
ことを特徴とする請求項13に記載のLED直管ランプ。 - 前記反射膜の厚みは140μm〜350μmである
ことを特徴とする請求項13に記載のLED直管ランプ。 - 前記基板は、可撓性回路基板である
ことを特徴とする請求項13に記載のLED直管ランプ。 - さらに、電源を含み、
前記可撓性回路基板は、一層の配線層を有し、
前記光源は、前記配線層に設けられ、前記配線層を介して、前記電源と電気的に接続されている
ことを特徴とする請求項16に記載のLED直管ランプ。 - 前記可撓性回路基板は、さらに、前記配線層の表面を覆い、インク材料の回路保護層を含む
ことを特徴とする請求項16に記載のLED直管ランプ。 - 前記光源は、溝を有するリードフレームと、前記溝に設けられるLED結晶粒を含み、前記リードフレームは第1側壁と第2側壁を有し、前記第1側壁は前記第2側壁よりも低い
ことを特徴とする請求項16に記載のLED直管ランプ。 - 前記ランプ管は、本体と端部とを有し、
前記端部の外径は前記本体の外径よりも小さく、
前記キャップは、前記端部を外嵌している
ことを特徴とする請求項1に記載のLED直管ランプ。 - 前記端部と前記本体との間には、渡り部が形成されている
ことを特徴とする請求項20に記載のLED直管ランプ。 - 前記渡り部の長さは、1mm〜4mmである
ことを特徴とする請求項21に記載のLED直管ランプ。
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