JP3189225B2 - Chip component supply device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting technique for mounting a chip component, which is one form of an electronic component, on a printed circuit board, and particularly to a bulk (bulb) cylindrical or square chip component. The present invention relates to a chip component supply device suitable for alignment and supply.

[0002]

2. Description of the Related Art Conventionally, Japanese Patent Application Publication No.
No. 82952, the upper end of the tubular feed path of the chip component is used as an inlet for the chip component, and the tubular feed path is continuously arranged from the up-down direction to the horizontal direction. At the lateral end where gravity from the subsequent chip component does not act, a component take-out opening and an air suction hole are provided, and a shutter that opens and closes the component take-out opening is provided, and the opening is closed by the shutter to close the opening. A chip component supply device that feeds the chip components in the tubular feed path by air suction with only the entrance open is shown. In Japanese Patent Application Laid-Open No. 8-274496, a chip component supply device is disclosed. A chip component supply device in which a hopper connected to an upper end mounts a chip component supply case has been proposed. JP-A-8-222889 discloses that
It has a storage section that stores a plurality of loose chip components and has a reflection plate that receives and reflects light from a sensor radiated from the outside, and the remaining amount of the chip components in the storage section reaches a predetermined amount. There is disclosed an electronic component supply device for detecting the fact.

[0003]

In the above-described conventional chip component supply apparatus, a large number of bulk chip components are stored in advance in a hopper connected to the upper end of a tubular feed path for chip components, or the hopper is provided with a hopper. When mounting the chip component supply case, when a chip component supply case containing a large number of bulk chip components is mounted, a predetermined number of chip components are stored in the hopper from the chip component supply case discharge port through the hopper receiving port. In each case, a predetermined number of chip components are stored in a hopper. By the way, when the supply of the chip components is performed, the quantity of the chip components housed in the hopper will soon decrease, and when the hopper mounts the chip component supply case, the chip component supply case becomes empty first, and then As the number of chip components stored in the hopper decreases, as a result, when the number of chip components stored in the hopper decreases, the predetermined supply capability of the chip component supply device cannot be obtained.

[0004] A first object of the present invention is to solve the above problems,
It is to detect that the number of chip components housed in the hopper has reached an amount that makes it impossible to obtain the predetermined supply capability of the chip component supply device, and obtain a trigger for replenishment and other measures. It is in.

A second object of the present invention is to provide a case in which the chip component supply case is first emptied when the hopper is mounted with the chip component supply case, and then the number of chip components contained in the hopper is reduced. In order to detect that the number of components has reached a level at which the predetermined supply capacity of the component supply device cannot be obtained, an empty chip component supply case and a new chip component supply case containing chip components are separated. To get a chance to exchange.

A third object of the present invention is to obtain a simple structure for detecting the quantity integrated with a hopper in each of the chip component supply devices so that the number of chip components housed in the hopper is reduced. The purpose is to individually detect that the number of chips has reached a level that makes it impossible to obtain the predetermined supply capacity of the device.A plurality of chip component supply devices are arranged on a fixed supply table, and a mounting head that moves above it is mounted. In a configuration in which a chip component supply device is selected and picked up by a suction pin of a mounting head, the above first and second objects are easily achieved.

[0007]

In order to achieve the above object, a chip component supply device according to the present invention has a chip component accommodating space inside, and a chip component receiving port communicating with the accommodating space on one side. A hopper for fitting a chip component supply case with a chip component receiving port aligned with the chip component receiving port, and a hopper having an upper end inserted into a through hole communicating with the accommodation space of the hopper, A separation pipe into and out of which the chip space enters and exits, and a chip pipe is inserted and dropped one by one, and is held above the housing space of the hopper, and has a light emitting means and a detecting means. A means for irradiating light from the light emitting means to a random surface on which chip components in the accommodation space are gathered, and detecting light reflected from the surface by the detection means to output an electric signal. The sensor detects a level position on the surface, and a level position corresponding to a state where the chip component is not present in the chip component supply case, and a predetermined supply of the chip component falling into the separation pipe. The output operation is performed within a range from a level position corresponding to a state in which the amount of chip components in the accommodation space is reduced to the extent that the capability cannot be obtained.

The direction of the light from the light emitting means and the direction of the reflected light from the surface are inclined with respect to the direction in which the separation pipe enters and exits the through hole, and the sensor is provided above the housing space of the hopper. May be held.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a chip component supply device according to the present invention will be described below with reference to the drawings.

FIG. 1 is an overall front view showing an example of a chip component supply device embodying the present invention. FIG. 1 shows a chip component supply device viewed from the side. The chip component 2 is set on a supply table 1 (indicated by a virtual line) and fed from right to left. A main frame 9 and an auxiliary frame 10 are fixed to the right end thereof with bolts to form a frame. A slide guide 1 is provided at the right end of the auxiliary frame 10.
1, a holder 14 is mounted on an upper portion of a hopper base 12 supported vertically slidably by the slide guide 11. The holder 14 has a space forming the hopper 13, and has a large number of roses. The chip component 2 is accommodated, a receiving port 16 is opened on the right side of the hopper 13, and the chip component supply case 90 is mounted on the holder 14,
The chip components 2 are supplied from the supply case 90 into the hopper 13 through the receiving port 16. Then, the auxiliary frame 10
A motor mounting plate 18 is fixed to the lower right side of the motor, and a hopper elevating motor 19 is fixed to the mounting plate 18. The motor 19 has a speed reducer integrated with a cam (or The cam 20 is fixedly connected to the hopper base 12 via a cam follower (or link) 21. Then, the hopper base 12, the holder 14, and the hopper 13 reciprocate up and down by the rotation of the motor 19. FIG. 1 shows a lowered position of the hopper 13 and the like.

The separation pipe 2 is provided above the auxiliary frame 10.
2 are vertically fixed by a fixing member 23 in the vertical direction. The separation pipe 22 has an upper part inserted into the through hole 15 and an upper end protruding into the hopper 13. The upper end protrudes into the hopper 13 and is near the upper end of the through hole 15 when the hopper 13 is raised.

A guide groove 24 is provided continuously on the back surface of the auxiliary frame 10 in FIG. 1 in the vertical and horizontal directions. A guide cover is fixed to the back surface of the auxiliary frame 10 with bolts so as to cover the guide groove 24. The guide groove 24 constitutes a tubular feeding path, and the upper end of the guide groove 24 facing up and down is connected to the lower end of the separation pipe 22. The left end of the guide groove 24 facing the lateral direction is connected to the right end of the chute groove 31,
The chip component 2 fed into the guide groove 24 is the chute groove 3
1 and is fed continuously.

The chute base 3 is provided above the main body frame 9.
0 is fixed. The right end of the chute base 30 is in contact with the left end of the auxiliary frame 10, and the left end is in contact with the left end protrusion on the upper part of the main body frame 9. The upper surface of the chute base 30 is orthogonal to the feeding direction. The chute groove 31 is provided so that the cross-sectional shape of the chip component 2 can pass through. The chute lid 32 is fixed to the upper surface of the chute base 30 with bolts 33 so as to cover the chute groove 31 and the chute groove 31 is formed in a tubular feeding path Is configured.

A component detection sensor 3 is disposed at a position halfway in the guide groove 24. The component detection sensor 3 is a pass-through optical sensor, one of which serves as a light emitting portion and the other serves as a light receiving portion across the guide groove 24. In addition, a light transmitting hole (or groove) is formed so as to cross the guide groove 24 so that light of the light emitting unit enters the light receiving unit when the chip component 2 is not present.
When the presence of the chip component 2 is detected in the guide groove 24 between the light emitting portion and the light receiving portion of the component detection sensor 3, the power of the motor 19 is automatically turned off and the vertical movement of the holder 14 including the hopper 13 is stopped. When the chip components 2 are continuously arranged in a line from the chute groove 31 to the guide groove 24 and the aligned ends thereof continuously block the light of the component detection sensor 3, the motor is stopped. 1
9 stops. This ensures that an appropriate number of chip components 2 are present in the tubular feed path including the chute groove 31 and the guide groove 24.

A component stopper portion 4 is located at the left end of the tubular feeding path. The tip end of the fed chip component 2 is blocked by a stopper end surface 40 in the component stopper portion 4. There is an air suction port (not shown) that functions when the shutter 43 that opens and closes the take-out position 41 is closed. The air suction port passes through an air suction passage provided from the component stopper portion 4 to the main body frame 9, and from a joint 46 to a hose. The shutter 43 is connected to a negative pressure source such as a vacuum pump via 47, and sucks air from inside the component stopper portion 4 with the shutter 43 closing the component removal position 41. The negative pressure source of FIG. 1 supplies a pressure air supply hose 49 to a vacuum generator 48 that generates a negative pressure when supplying pressure air,
The air pressure circuit includes a pressure air source (not shown) for supplying pressure air to the hose 49 and a valve for interrupting the supply.

The shutter 43 has a concave groove 44 on the side surface, and is slidably held on the component stopper 4 by a shutter retainer 42. A drive lever 37 and an intermediate lever 36 are pivotally supported on a fulcrum shaft 39 fixed to the side surface of the main body frame 9 so as to be swingable. An engagement pin 38 is fixed to an upper portion of the drive lever 37 and a recess provided on a shutter 43. When the drive lever 37 engaged in the groove 44 is swung, the engagement pin 38
, The shutter 43 can be slid in the direction to open and close the component take-out position 41. A tension spring 45 is stretched between the left ends of the drive lever 37 and the intermediate lever 36, and the drive lever 37 rotates leftward relative to the fulcrum shaft 39, and the intermediate lever 36 biases rightward. The projection at the lower end of the drive lever 37 is always in contact with the stopper pin 50 fixed to the intermediate lever 36. Therefore, when the intermediate lever 36 is normally swung, the drive lever 37 is also swung integrally, and When the lever 36 is turned clockwise, the stopper pin 50 pushes the protrusion, and the intermediate lever 36
Is transmitted counterclockwise to the drive lever 37 via the bias of the tension spring 45.

A drive plate 34 is pivotally mounted on a fulcrum shaft 52 attached to the support plate 51, on which a support plate 51 is erected and fixed to the body frame 9, and a pin 53 attached below the drive plate 34 A hole provided at each end of the connection lever 35 is pivotally connected to a pin 54 attached to the lower side of the drive lever 36 to form a link mechanism in which when the drive plate 34 is swung, the intermediate lever 36 is swung. A spring hook 55 is attached to the side of the body frame 9.
A spring hook 56 is attached to the lower side of the drive plate 34, and a spring 57 for urging the spring hooks 55 and 56 in the pulling direction is stretched. 35, the intermediate lever 36 works clockwise, so that the drive lever 37 works clockwise through the stopper pin 50. Then, the shutter 43 moves clockwise from the engaging pin 38 through the concave groove 44. To the right end of the shutter 43 so that the chute cover 3
The spring 57 comes into contact with the left end of the shutter 2 and stops.
3 is urged in such a direction that the component take-out position 41 is always closed,
The upper side of the driving plate 34 is always lifted. Therefore, when the push-down lever of the mounting machine pushes the upper side of the drive plate 34, the drive plate 34 swings counterclockwise against the spring 57.
Then, the intermediate lever 36 is pivoted counterclockwise through the connecting lever 35.
5, the engagement pin 38 of the drive lever 37 moves the shutter 43 to the left, and even if the shutter 43 reaches the left end and cannot move, the push-down lever of the mounting machine is provided. Is still pushed down, the intermediate lever 36 swings counterclockwise but the drive lever 37 cannot move with the engagement pin 38 because the shutter 43 cannot move, and the spring 45 expands. Separately, a drive member 59 pivotally supported by a fulcrum pin 58 fixed to the lower side of the main body frame 9 is provided. When a lower end of the drive member 59 is pressed by a drive claw provided on the mounting machine, The shutter 43 can be moved from the side.

A set piece 60 is attached to the left end of the body frame 9 and a lock claw 61 is attached to the lower side. The set piece 60 is engaged with the front wall of the supply table 1, and the lock claw 61 is provided with a link plate 62, a lock lever 63, and a fulcrum plate 6.
4, a toggle mechanism is configured to engage with a corresponding portion of the supply table 1. The lock lever 63 can be removed from the supply table 1 when the lock lever 63 is pulled up as shown by a virtual line 63 ′, and the lock lever 63 is in a state shown by a solid line. Then, the state can be set to the supply table 1.

FIG. 2 is a cross-sectional view showing an example of a hopper 13 embodying the present invention, which is shown in a posture viewed from the side. The hopper 13 is a space which is included in a holder 14 manufactured by plastic molding and includes a conical surface 17. That is, the holder 14 except for the lid 80 forms two symmetrical members having a dividing surface in a direction parallel to the paper surface, and faces each other with fastening means such as bolts 81, 82, 83, 84, 85 and the like. The member constituting the holder 14 is further provided with a convex portion 86, a support portion 87, a concave portion 88, and a plurality of groove portions 89, and is assembled so that the level detection sensor 7 is sandwiched between the two members. The sensor body 70 has a configuration in which the distal end portion is fitted into the concave portion 88 and the neck portion is supported by the support portion 8.
7 and the projection 86, so that the sensor body 7
The cable 71 that has exited from 0 is fitted into the plurality of grooves 89 and pulled out through a space included in the holder 14 and different from the hopper 13. The other end of the cable 71 is a connector 72.

The detection light 8 is indicated by a dashed line from the sensor body 70 toward the chip component 2. The actual detection light 8 has a spread, and the dashed line indicates the center of the detection light 8. The detection light 8 is composed of light emitted from the sensor body 70 and light reflected from the chip component 2. The sensor body 70 detects light reflected by the light emitting means and the object (the chip component 2 in this case). Means for outputting an electric signal of the detection means to the alarm means from the cable 71 through the connector 72, and detecting the reflected light returned by applying light from the light emitting means toward the object and reflecting the light. The configuration itself is known as a reflection type optical sensor. The level position of a large number of loose chip components 2 accommodated in the hopper 13 is not stable as an object, but according to experiments, a beam sensor EX of Sunkus Co., Ltd. The type 10 can use a limited reflection type (diffuse light type). The detection distance of the beam sensor is indicated as 2 to 25 mm (center 10 mm), but the detection distance is shorter (the chip component 2 in the hopper 13). Is large and the level position is high) in a state where the chip components 2 are lost in the supply case 90 (even when the chip components 2 are not in the supply case 90, the chip components 2 in the hopper 13 are still sufficiently supplied. From the side where the detection distance is large (the number of chip components 2 in the hopper 13 is small and the level position is low), the inside of the hopper 13 is so small that the predetermined supply capacity cannot be obtained. What is necessary is just to detect a period until the chip component 2 is lost.
Detection was possible using the beam sensor.

It is suitable for detecting the position of a random surface on which the chip parts 2 in the hopper 13 are gathered that the detection light 8 is a diffused light having a spread centering on the direction indicated by the dashed line. As shown in FIG. 2, by arranging the right side of the sensor main body 70 upward with respect to the vertical direction of the hopper 13, the detection light 8 detects the level position of the chip component 2 closer to the receiving port 16. Thus, the side where the detection distance is short is configured to more reliably reflect the state in which the chip component 2 is lost in the supply case 90.

Next, the operation of the overall configuration in the above embodiment will be described. First, supply case 9 to holder 14
0, the outlet shutter of the supply case 90 is opened, the chip component 2 is supplied from the supply case 90 into the hopper 13 through the receiving port 16, and the supply case 90 is mounted on the holder 14 as it is. Hopper 13
The chip components 2 are naturally replenished so as to have a substantially constant amount based on the upper side of the receiving port 16. When the power switch is turned on, the motor 19 rotates and causes the hopper 13 to reciprocate up and down through a cam (or crank) mechanism. The tip contained in the hopper 13 when the upper end of the separation pipe 22 projects into the hopper 13 when the hopper 13 is lowered, and the upper end of the separation pipe 22 coincides with the bottom of the conical surface 17 when the hopper 13 is raised. The parts 2 enter the separation pipe 22 one by one while being agitated by the separation pipe 22 and fall. The chip parts 2 that have fallen off the separation pipe 22 continue from the guide groove 24 to the tubular feeding path consisting of the chute groove 31 and are fed. Then, the chip components 2 are connected in a line from the chute groove 31 to the guide groove 24,
When the aligned ends continuously block the light from the component detection sensor 3, the motor 19 stops.

In the horizontal portion of the tubular feeding path formed by the chute groove 31, the feeding action to the chip component 2 by gravity is lost, but the component take-out position 41 of the component stopper 4 is closed by the shutter 43 and the upper end of the separation pipe 22 is closed. Air is sucked from the inside of the component stopper portion 4 in a state where only the opening is opened. As a result, the chip component 2 in the horizontal portion of the tubular feeding path also receives the feeding force in the direction of the component stopper portion 4 and receives the leading edge chip. The component 2 comes into contact with the stopper end face 40 in the component stopper portion 4 and stops, and the leading-edge chip component 2 is positioned at the component take-out position 41.

When the chip component 2 positioned at the component take-out position 41 is picked up by the suction pin of the mounting head, an aligned end of the chip components 2 which are arranged in a line in the tubular feeding path including the chute groove 31 and the guide groove 24. The motor 19 starts rotating and the hopper base 12, the holder 14 and the hopper 13 reciprocate up and down, and the chip part 2 falls into the separation pipe 22 and falls, When the number of chip components 2 in 13 decreases, the supply is naturally replenished from supply case 90 to a substantially constant amount based on the upper side of receiving port 16.
Eventually, when the supply case 90 is emptied, even if the chip components 2 in the hopper 13 are reduced, replenishment is interrupted and a constant amount cannot be maintained.

The level detecting sensor 7 uses a detection light 8 consisting of a light emission from the sensor body 70 and a reflected light from the chip component 2 at the level position for detecting a level position fluctuating according to the number of the chip components 2 in the hopper 13. The level detection sensor 7 has a limit of the detection distance from the sensor body 70 to the chip component 2 at the level position, and the side where the detection distance is short corresponds to the state where the chip component 2 is lost in the supply case 90. The level of the hopper 13 is adjusted so that the predetermined supply capacity cannot be obtained.
Output to the alarm means of the level detection sensor 7 which adjusts to a level position corresponding to the state where the number of the chip components 2 has decreased, or selects and uses a level detection sensor 7 capable of detecting the range of the two level positions. Is transmitted via the cable 71 and the connector 72. The output operation is such that the switching circuit is turned on when the reflected light from the chip component 2 exceeds a predetermined light amount, or the switching circuit is turned on without reflected light. Turn off when the amount of reflected light exceeds a predetermined light amount, and select one of them to constitute an alarm means.

The alarm means is an electric circuit which operates by turning on and off the switching circuit of the level detection sensor 7. Since the alarm light is simply given by flashing, a chip component supply device having each level detection sensor 7 is provided. In a device in which the supply means is configured by arranging a plurality of such components, it is possible to identify and display the output of the level detection sensor 7 of which chip component supply device, and to issue an alarm by voice. What is important is that the detection light 8 is a diffused light, although the important point is that stable detection can be obtained even if the level detection by the level detection sensor 7 is repeated as described above. This is suitable for detecting the level position of the random surface on which the chip components 2 in the hopper 13 are gathered.

[0027]

As described above, according to the chip component supply apparatus of the present invention, a sensor is held and provided above the receiving space of the chip component of the hopper, and the sensor has a light emitting means and a detecting means. The light from the light emitting means is applied to a random surface on which chip components are gathered in the housing space, and the detecting means detects reflected light from the surface to output an electric signal, and the sensor Detects the level position of the front surface, and sets the level position corresponding to the state where the chip component is lost in the chip component supply case, to the extent that the predetermined supply capability of the chip component falling into the separation pipe cannot be obtained. Since the output operation is performed within the range of the level position corresponding to the state where the number of chip components in the housing space is reduced, first, a predetermined supply capability of the chip component supply device is obtained. Doo is it becomes possible to treatment of the replenishment like before becoming impossible, also, it is possible to know the state in which the chip component is lost in the chip component supply case,
It is possible to prepare a new chip component supply case and replace it in a timely manner.Furthermore, each of the chip component supply devices has a simple configuration that holds the main body of the sensor at the top of the hopper and pulls out the cable to the outside In particular, a plurality of chip component supply devices are arranged on a fixed supply table, and a mounting head that moves above the device selects the chip component supply device and picks up with the suction pin of the mounting head. In the configuration, since each chip component supply device includes a sensor for individually detecting the level position, the effect that the configuration can be easily achieved is great.

[Brief description of the drawings]

FIG. 1 is a front view showing an entire chip component supply apparatus embodying the present invention.

FIG. 2 is a cross-sectional view illustrating an example of a hopper embodying the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Supply stand 2 Chip component 3 Component detection sensor 4 Component stopper part 7 Level detection sensor 8 Detection light 9 Main body frame 10 Auxiliary frame 13 Hopper 14 Holder 15 Through hole 16 Receiving port 19 Hopper elevating motor 22 Separation pipe 24 Guide groove 31 Chute Groove 41 Component take-out position 43 Shutter 70 Sensor main body 71 Cable 86 Convex part 87 Support part 88 Recess 90 Chip part supply case

Continuation of front page (56) References JP-A-8-274496 (JP, A) JP-A-8-222889 (JP, A) JP-A-6-188591 (JP, A) JP-A-1-183200 (JP) , A) Hikaru 1-84496 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) H05K 13/02 B65G 65/34

Claims (2)

(57) [Claims] 1. A chip component accommodating space is provided inside, and a chip component receiving port communicating with the accommodating space is provided on one side surface, and a chip component outlet is aligned with the chip component receiving port. A hopper in which a chip component supply case is mounted, and a chip component inserted in a through hole communicating with the accommodation space of the hopper, and an upper end thereof enters and exits the accommodation space of the hopper, and each chip component accommodated in the accommodation space is one by one. A separating pipe that enters and falls, is held above the housing space of the hopper, has a light emitting unit and a detecting unit, and emits light from the light emitting unit to a random surface on which chip components of the housing space are gathered. And a sensor for detecting the reflected light from the surface by the detection means and outputting an electric signal. The sensor detects a level position on the surface and supplies the chip component. Corresponding to the level position corresponding to the state where the chip components are lost in the case, and the state where the amount of the chip components in the housing space is reduced to the extent that the predetermined supply capability of the chip components falling into the separation pipe is not obtained. A chip component supply device that performs an output operation within a range of a level position to be set. 2. The sensor according to claim 1, wherein the direction of the light from the light emitting means and the direction of the reflected light from the surface are inclined with respect to a direction in which the separation pipe enters and exits the through hole. The chip component supply device according to claim 1, wherein