JP3161995B2 - Chip component supply device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting technique for mounting a chip component, which is one form of an electronic component, on a printed circuit board, and particularly to a bulk (bulb) cylindrical or square chip component. The present invention relates to a chip component supply device suitable for alignment and supply.

[0002]

2. Description of the Related Art Conventionally, Japanese Patent Application Publication No.
No. 82952, the upper end of the tubular feed path of the chip component is used as an inlet for the chip component, and the tubular feed path is continuously arranged from the up-down direction to the horizontal direction. At the lateral end where gravity from the subsequent chip component does not act, a component take-out opening and an air suction hole are provided, and a shutter that opens and closes the component take-out opening is provided, and the opening is closed by the shutter to close the opening. There has been proposed a chip component supply device that supplies the chip components in the tubular feeding path by air suction while keeping only the entrance open. The inlet at the upper end of the tubular feed path is inserted into the lower feed hole of the hopper containing a large number of bulk chip components, and when the hopper is moved up and down, the tip components are placed one by one into the tubular feed path. It is configured to fall from the entrance at the upper end. Further, Japanese Unexamined Patent Application Publication No.
No. 74,496 proposes a chip component supply device in which chip components enter and drop from an upper end of a tubular feeding path one by one from a hopper that moves up and down in a mounted state of a chip component supply case.

[0003]

The above-described conventional chip component supply apparatus includes a hopper that moves up and down in a state where the chip component supply case is mounted. The hopper connects the chip component storage space with the chip component supply case. It has a configuration in which it can be mounted and supplied to the storage space. Therefore, in the following description, the portion referred to as the hopper is referred to as a holder, and the storage space for chip components included in the holder is referred to as a hopper. The holder has a space that forms a hopper and accommodates a large number of loose chip components in the hopper. The hopper has an opening at the side of the hopper. The chip component supply case is mounted on the holder and the shutter is pulled up. Then, the chip part is supplied from the chip inlet into the hopper from the chip part supply case. By the way, in a mounting machine in which a supply table on which a plurality of chip component supply devices are mounted is moved to a position where a chip component is picked up by a suction head and a predetermined chip component supply device is positioned, a lateral acceleration is applied to a holder. Therefore, the chip component supply case mounted on the holder oscillates and unnecessarily agitates the contained chip component, thereby adversely affecting the chip component. Therefore, an object of the present invention is to more securely mount the chip component supply case on the holder. In particular, it is an object of the present invention to provide a chip component supply device which can be mounted so as to reliably hold against lateral runout.

[0004]

According to a first aspect of the present invention, there is provided a hopper (13) for accommodating a chip component, wherein a lower surface of a chip component supply case is provided. And a contact surface (71) on which the side surface of the chip component supply case contacts substantially in parallel.
Holding walls (72, 73) for holding the lower side of the chip component supply case on the support surface (70) side, and holding pieces (74) for holding and holding the side surfaces of the chip component supply case on the contact surface (71) side. , 75), and a chip component receiving port (1) communicating from the contact surface (71) to the hopper (13).
6), a holder (14) for fitting a chip component supply case with a chip component discharge port aligned with the receiving port (16), and communicating with the hopper (13) of the holder (14). And a separation pipe (22) inserted into the through hole (15) and having an upper end entering and exiting the hopper (13).

According to a second aspect of the present invention, the holding wall (7)
The chip component supply device according to claim 1, wherein the holding interval of (2, 73) is provided so as to be in a fitted state with substantially no gap with the width of the corresponding position of the chip component supply case.

According to a third aspect of the present invention, the holding wall (7
2 and 73) are respectively formed on the opposing surfaces.
7) is provided, and the chip component supply case is held by the holder (14).
When mounting on the chip component supply case,
A chip component supply device according to claim 1 or 2, wherein protruding surfaces are provided on both sides corresponding to (77), and the protruding surfaces are engaged with the concave portions (76, 77) and held so as not to come off upward.

According to a fourth aspect of the present invention, the holding piece (7
4 and 75) are provided with ridges (78, 79) on the side remote from the contact surface (71) in parallel with the contact surface (71), and the chip component supply case is mounted on the holder (14). In this case, the side surface of the chip component supply case is
When pressed in parallel to 1), the holding pieces (74, 75) are each bent outward and spread, and when the chip component supply case is mounted at a predetermined position, the holding pieces (74, 75).
The spread of the chip component returns to the original position, and the chip component supply case cannot be removed unless a predetermined force greater than the pressing force is applied to the chip component supply case.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a chip component supply device according to the present invention will be described below with reference to the drawings. FIG. 1 shows the overall configuration of an embodiment of a chip component supply apparatus embodying the present invention in a side view posture, and is mounted on a supply stand 9 (shown by a phantom line) of a mounting machine in this vertical direction. Then, the chip components are fed from right to left.

An auxiliary frame 10 is fixed to the upper part of the main body frame 1 and its rightward position with bolts to form a frame.
A slide guide 11 is erected and fixed to the right end of the auxiliary frame 10, and a holder 14 is attached to an upper part of a hopper base 12 which is slidably supported by the slide guide 11 in the vertical direction. In the right side of the hopper 13, a receiving port 16 is opened, and a chip component supply case 90 indicated by a virtual line is mounted on the holder 14, and the supply case 90 is provided. The chip components are supplied from the receiving port 16 into the hopper 13 from the inside. Then, auxiliary frame 1
A motor mounting plate 18 is fixed to the lower right end of the reference numeral 0, and a hopper elevating motor 19 is fixed to the mounting plate 18.
The motor 19 has a speed reducer integrated with a cam (or crank wheel) 20 fixed to the output rotation shaft. The cam 20 is connected to a cam follower (or link plate) 21 fixed to the hopper base 12. .
Accordingly, the rotation of the motor 19 causes the hopper base 12 to rotate.
The holder 14 (including the hopper 13) and the chip component supply case 90 perform reciprocating up and down movement integrally. FIG. 1 shows a lowered position of the holder 14 and the like.

On the upper part of the auxiliary frame 10, a separation pipe 2 is provided.
2 is vertically fixed by a fixing member 23 in the vertical direction. The separation pipe 22 has an upper part inserted into the through hole 15 of the holder 14 and an upper end protruding into the hopper 13.
The lower end of the separation pipe 22 is
When the hopper 13 rises, it is near the upper end of the through hole 15.

A guide groove 24 is provided continuously on the back surface of the auxiliary frame 10 in FIG. 1 in the vertical and horizontal directions. A guide cover is fixed to the back surface of the auxiliary frame 10 with bolts so as to cover the guide groove 24. The guide groove 24 constitutes a tubular feeding path, and the upper end of the guide groove 24 facing up and down is connected to the lower end of the separation pipe 22, and the chip component dropped from the separation pipe 22 is the guide groove 24. The left end of the guide groove 24 facing the lateral direction is connected to the right end of the chute groove 31, and the chip component fed into the guide groove 24 is fed by the chute groove 31. Into the tubular feeding path.

A chute base 3 is provided above the main body frame 1.
0 is fixed. The chute base 30 has a right end in contact with the left end of the auxiliary frame 10, and a left end in contact with a projection on the left end in the upper part of the main body frame 1. A chute groove 31 is provided on the upper surface of the chute base 30. Shoot groove 3
1, a chute lid 32 is fixed to the upper surface of the chute base 30 with bolts 33, and a chute groove 31 constitutes a tubular feeding path. The pipe hole of the separation pipe 22, the guide groove 24 and the chute groove 31 The feed path has a cross-sectional dimension that allows one cross-sectional shape of the chip component orthogonal to the feed direction to pass therethrough.

A component detection sensor 3 is disposed at a position midway along the guide groove 24. The component detection sensor 3 is a pass-through optical sensor, one of which serves as a light emitting portion and the other a light receiving portion across the guide groove 24. Light-transmitting holes (or grooves) so that light from the light-emitting part enters the light-receiving part when no chip component is present
Are formed so as to cross the guide groove 24. When the presence of a chip component is detected in the guide groove 24 between the light emitting portion and the light receiving portion of the component detection sensor 3, the motor 19
Is turned off, the vertical movement of the holder 14 including the hopper 13 is stopped, and the dropping of the chip components to the separation pipe 22 is stopped. The chip components are connected in a line from the chute groove 31 to the guide groove 24. When the aligned ends continuously block the light from the component detection sensor 3, the motor 19 stops. In this way, an appropriate number of chip components are present in the tubular feed path including the chute groove 31 and the guide groove 24.

The component stopper 4 is located at the left end of the tubular feeding path. The tip end of the fed chip component is blocked by a stopper end face 40 in the component stopper 4. The stopper end face 40 has an air suction port that functions when a shutter 43 that opens and closes the component take-out position 41 is closed. The air suction port passes through an air suction passage provided from the component stopper portion 4 to communicate with the main body frame 1. The joint 46 is connected to a negative pressure source such as a vacuum pump via a hose 47, and air is sucked from the inside of the component stopper 4 while the shutter 43 closes the component removal position 41. The negative pressure source shown in FIG. 1 includes a vacuum generator 48 that generates a negative pressure when pressure air is supplied, and a pressure air supply hose 49 to the vacuum generator 48.
And a pneumatic circuit including a pressure air source (not shown) for supplying pressure air to the hose 49 and a valve for interrupting the supply.

The shutter 43 has a concave groove 44 on the side surface, and is slidably held by the component stopper 4 with a shutter retainer 42. A drive lever 37 and an intermediate lever 36 are pivotally supported on a fulcrum shaft 39 fixed to the side surface of the main body frame 1, respectively. When the drive lever 37 engaged in the groove 44 is swung, the engagement pin 38
, The shutter 43 can be slid in the direction to open and close the component take-out position 41. A tension spring 45 is stretched between the left ends of the drive lever 37 and the intermediate lever 36, and the drive lever 37 rotates leftward relative to the fulcrum shaft 39, and the intermediate lever 36 biases rightward. The projection at the lower end of the drive lever 37 is always in contact with the stopper pin 50 fixed to the intermediate lever 36. Therefore, when the intermediate lever 36 is normally swung, the drive lever 37 is also swung integrally, and When the lever 36 is turned counterclockwise, a counterclockwise force is transmitted to the drive lever 37 via the bias of the tension spring 45.

A drive plate 34 is pivotally mounted on a fulcrum shaft 52 attached to the support plate 51, on which a support plate 51 is erected and fixed to the main body frame 1. A hole provided at each end of the connection lever 35 is pivotally connected to a pin 54 attached to the lower side of the drive lever 36 to form a link mechanism in which when the drive plate 34 is swung, the intermediate lever 36 is swung. Spring hook 55 on the side of body frame 1
A spring hook 56 is attached to the lower side of the drive plate 34, and a spring 57 for urging the spring hooks 55 and 56 in the pulling direction is stretched. 35, the intermediate lever 36 works clockwise, so that the drive lever 37 works clockwise through the stopper pin 50. Then, the shutter 43 moves clockwise from the engaging pin 38 through the concave groove 44. To the right end of the shutter 43 so that the chute cover 3
The spring 57 comes into contact with the left end of the shutter 2 and stops.
3 is urged in such a direction that the component take-out position 41 is always closed,
The upper side of the driving plate 34 is always lifted. Therefore, when the upper side of the driving plate 34 is pressed by the pressing lever provided in the mounting machine (arrow F), the driving plate 34 swings counterclockwise against the spring 57, and thus the intermediate lever 3 via the connecting lever 35.
6 swings counterclockwise. The counterclockwise swing of the intermediate lever 36 swings the drive lever 37 counterclockwise via the spring 45. The engagement pin 38 of the drive lever 37 pushes the shutter 43 to the left. Even if the shutter 43 reaches the left end and cannot be moved, if the push-down lever of the mounting machine is still pushed down, the intermediate lever 36 swings counterclockwise but the drive lever 37 cannot move the shutter 43, so the engaging pin As a result, the spring 45 expands. Separately, there is provided a driving member 59 pivotally supported by a fulcrum pin 58 fixed to the lower side of the main body frame 1, and the driving member 59
When the lower end of the mounter is pressed by the lower drive lever of the mounting machine, the shutter 43 can be moved from the lower side as well.

A set piece 60 is attached to the left end of the main body frame 1 and a lock claw 61 is attached to the lower side. The set piece 60 is engaged with the front wall of the supply table 9, and the lock pawl 61 is provided with a link plate 62, a lock lever 63 and a fulcrum plate 6.
4, a toggle mechanism is configured to be engaged with a corresponding portion of the supply table 9. The lock lever 63 can be detached from the supply table 9 when the lock lever 63 is pulled up as shown by a virtual line 63 ′. Then, it can be fixed and mounted on the supply table 9.

FIGS. 2 and 3 show only the holder 14 of the embodiment shown in FIG. 1. FIG. 3 shows the holder 14 from the side as in FIG. 1, and FIG. This shows a state viewed from above. In FIG. 2, the dividing surface and the fastening means are omitted, but in FIG. 3, the holder 14 is made of two symmetrical members having a dividing surface in a direction parallel to the paper surface, and the bolts 81, 82, 83, 84,
The holder 14 is fixed and assembled by fastening means such as 85.
Is provided with a convex portion 86 on the lower side, and fits into a corresponding hole of the hopper base 12 to position the holder 14. A through hole 15 is formed at the center of the convex portion 86 from the bottom of the hopper 13 to the lower surface of the convex portion 86. The hopper 13 is a space included in the holder 14, and a lid 80 is detachably attached to an upper opening thereof.

The chip component supply case 90 is mounted on the holder 14 as shown by the phantom line in FIG. 1, and the holder 14 has holding means for detachably mounting the chip component supply case 90, ie, in FIG. A support surface 70 that supports the lower surface of the supply case 90, a contact surface 71 with which the left side surface of the chip component supply case 90 contacts, FIG.
3, holding walls 72, 73 for holding the lower side of chip component supply case 90, concave portions 76, 77 provided on holding walls 72, 73, and holding and holding the left side surface of chip component supply case 90. Holding pieces 74 and 75 and holding piece 7
4 and 75 provided with ridges 78 and 79, respectively.
The support surface 70 and the contact surface 71 are adjacent to each other while crossing each other.
When mounting the chip component supply case 90 on the holder 14, first, the chip component supply case 90 is held from above by the holding wall 7.
2 and 73, the lower surface is placed on the support surface 70, and then the left side surface of the chip component supply case 90 is pressed parallel to the contact surface 71 from right to left. When reaching between the pieces 74 and 75, the holding pieces 74 and 75 are expanded by the protrusion dimensions of the ridges 78 and 79, respectively. At this time, the holding pieces 74 and 75 are each bent outward, but are made of a material having elasticity (for example, elasticity). The holding pieces 74 and 75 are at the original positions where the left side surface of the chip component supply case 90 abuts on the abutment surface 71 because a plastics or metal plate having the same is used. The ridges 78 and 79 fit in such a way as to return to. For example, since the grooves are prepared on both sides orthogonal to the left side surface of the chip component supply case 90, in a state where the chip component supply case 90 has the lower surface supported by the support surface 70 and the left side surface is in contact with the contact surface 71,
The chip component supply case 90 cannot be removed unless a predetermined force or more is applied from left to right. In addition, the width of the corresponding position of the chip component supply case 90 and the sandwiching walls 72 and 73.
Are provided so as to be in a fitted state with substantially no gap. However, since projecting surfaces are prepared on both sides orthogonal to the lower surface of the chip component supply case 90 at positions corresponding to the concave portions 76 and 77, chip component supply is provided. When the case 90 is pushed from right to left, the protruding surfaces coincide with the positions of the concave portions 76 and 77, and the protruding surfaces engage with the concave portions 76 and 77 to form the chip component supply case 9
0 is held so that it does not come off in the mounted state.

The color chip 87 is a two-stage cylindrical body having a convex cross section. FIGS. 1, 2 and 3 show the cylindrical body having a larger diameter in a posture viewed from the side. The smaller-diameter cylinder is inserted and fitted. The surface of the larger-diameter cylinder seen from the right side in FIGS. 1, 2 and 3 is colored. The through-holes 15 at the bottom of the hopper 13 also differ depending on the outer diameter of the separation pipe. Therefore, the colors are made to correspond to the colors so that the dimensions of the chip components accommodated in the hopper 13 can be easily identified.

Next, the operation of the overall configuration in the above embodiment will be described. First, the chip component supply case 90 is mounted on the holder 14, but the chip component supply case 90 is attached.
Alternatively, since the hopper 13 accommodates a large number of chip components, the chip component supply device operates in an upright posture. The chip component supply case 90 is positioned at a lateral position such that the protruding surfaces on both sides orthogonal to the lower surface of the chip component supply case 90 deviate from the positions of the holding walls 72 and 73.
Is inserted from above and the lower surface is placed on the support surface 70.
When the chip component supply case 90 is pushed laterally toward the contact surface 71, the projecting surfaces on both sides orthogonal to the lower surface of the chip component supply case 90 match the positions of the recesses 76 and 77, respectively. The side surface of the supply case 90 enters between the holding pieces 74 and 75, and the holding pieces 74 and 75 are widened by the protrusion dimension of the ridges 78 and 79 until the side surface of the chip component supply case 90 contacts the contact surface 70. When pushed in, the chip parts supply case 90 cannot be removed from the holder 14 unless the ridges 78 and 79 fit into, for example, grooves prepared in the chip part supply case 90 and apply a predetermined force or more.

When the discharge port shutter of the chip component supply case 90 is opened while being mounted on the holder 14, the chip components are supplied from the discharge port of the chip component supply case 90 into the hopper 13 through the receiving port 16. The chip components in 13 are naturally replenished so as to have a substantially constant amount based on the upper side of the receiving port 16. When the power supply switch 88 is closed with the chip component supply device mounted on the supply stand 9 of the mounting machine, the motor 19 rotates to cause the hopper 13 to reciprocate up and down through a cam (or crank) mechanism. The upper end of the separation pipe 22 projects into the hopper 13 when the hopper 13 is lowered.
The chip components housed therein fall into the separation pipe 22 one by one and fall. The chip components falling down the separation pipe 22 are continuously fed from the guide groove 24 to the tubular feeding path formed by the chute groove 31. Then, when the chip components are connected in a line from the chute groove 31 to the guide groove 24 and the aligned ends thereof continuously block the light of the component detection sensor 3, the motor 19 stops.

In the horizontal portion of the tubular feeding path formed by the chute groove 31, the feeding action to the chip component by gravity is lost, but the component take-out position 41 of the component stopper 4 is closed by the shutter 43, and only the upper end of the separation pipe 22 is closed. As a result, air is sucked from the inside of the component stopper portion 4 in an open state. As a result, the chip components in the horizontal portion of the tubular feeding path also receive the total supply force in the direction of the component stopper portion 4, and Stopper end face 4 in stopper section 4
Then, the chip component stops at the position of 0 and is positioned at the component take-out position 41.

When the chip component positioned at the component take-out position 41 is picked up by the suction pin of the mounting head provided in the mounting machine, the chip component connected in a line to the tubular feeding path including the chute groove 31 and the guide groove 24 is removed. Since the alignment end moves and does not block light from the component detection sensor 3, the motor 19 starts rotating and the hopper base 12 and the holder 1 are rotated.
Chip component supply case 9 mounted with 4 and hopper 13
0 performs reciprocating up and down movement, the chip component is a separation pipe 22
When the chip component falls into the hopper 13 and the chip component in the hopper 13 decreases, the chip component is naturally replenished from the chip component supply case 90 so as to have a substantially constant amount based on the upper side of the receiving port 16.

The mounting machine generally has a configuration in which a plurality of chip component supply devices are mounted on a supply table 9. A pickup position of a suction pin of a mounting head of the mounting machine is provided at a predetermined component removal position of the chip component supply device. The position 41 is fixed, and the supply table 9 is fixed and the suction pin is moved to select a predetermined chip component supply device, and the supply position of the suction pin is kept constant to move the supply table 9 to the predetermined position. In a configuration in which the chip component supply device is selected and in which the supply table 9 moves, a plurality of chip component supply devices are mounted in parallel, and the chip component supply device is moved in a direction orthogonal to the chip component supply direction. Move with
If an attempt is made to speed up the operation of the mounting machine, the movement of the supply table 9 also becomes faster, and the chip component supply case 90 mounted on the holder 14 of the chip component supply device receives a large acceleration.
Nipping walls 72, 73 and holding pieces 74, 75 of holder 14
Holds the direction in which the chip component supply case 90 receives the acceleration.

[0026]

As described above, according to the chip component supply apparatus of the present invention, the contact surface in which the support surface 70 on which the lower surface of the chip component supply case 90 is placed and the side surface of the chip component supply case 90 contact almost in parallel. The holding surface 7 is provided on the holder 14 so as to intersect the support surface 70 and the contact surface 71, and the holding wall 7 for holding the lower side of the chip component supply case 90 on the support surface 70 side.
2, 73 and a chip component supply case 90 on the contact surface 71 side.
When the chip component supply case 90 is mounted on the holder 14,
The lower side of the chip component supply case 90 is held between the holding walls 72 and 73, and the side surface of the chip component supply case 90 is
4 and 75, the support surface 70, the contact surface 71 and the holding wall 7 can be held even when the supply table 9 of the mounting machine on which the chip component supply device is mounted is moved in the lateral direction of the chip component supply device.
2, 73 and the holding pieces 74, 75 are the chip component supply case 9.
0, in particular, holding walls 72, 73 and holding piece 7
4 and 75 hold the chip component supply case 90 in the horizontal direction, so that the chip component supply case 90 mounted on the holder 14 can be prevented from swaying.
The gap between the chip parts 2 and 73 is provided so as to be in a fitted state with substantially no gap between the width of the position where the chip component supply case 90 is clamped, thereby preventing the chip component supply case 90 mounted on the holder 14 from swaying. The effect can be increased. In the description of the embodiment of the present invention, an example has been described in which the separation pipe 22 is fixed to the frame and the holder 14 reciprocates up and down. However, the holder 14 is fixed to the frame and reciprocates on the separation pipe 22 side. It may be moved up and down. In any case, the holder 14
The effect of the present invention is further ensured by supporting.

[Brief description of the drawings]

FIG. 1 is a side view of an overall configuration of an example of a chip component supply device embodying the present invention.

FIG. 2 shows only the holder 14 in a posture viewed from above.

FIG. 3 shows only the holder 14 in a posture viewed from the side.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Main body frame 3 Component detection sensor 4 Component stopper part 9 Supply stand 10 Auxiliary frame 13 Hopper 14 Holder 15 Through hole 16 Receiving port 19 Hopper elevating motor 22 Separation pipe 24 Guide groove 31 Shoot groove 41 Component take-out position 43 Shutter 70 Support surface 71 Contact surface 72, 73 Nipping wall 74, 75 Holding piece 76, 77 Recess 78, 79 Ridge 90 Chip component supply case

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-8-274496 (JP, A) JP-A-9-130088 (JP, A) JP-A 8-217185 (JP, A) JP-A 8- 90353 (JP, A) JP-A-2-56316 (JP, A) JP-A-2-28490 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) H05K 13/02

Claims (4)

(57) [Claims] A hopper (13) for accommodating chip components therein, and a support surface (70) on which a lower surface of the chip component supply case is mounted, and a contact surface where the side surface of the chip component supply case contacts substantially in parallel. 71) and holding walls (72, 73) for holding the lower side of the chip component supply case on the support surface (70) side.
And a holding piece (74, 75) for holding and holding the side surface of the chip component supply case on the contact surface (71) side, and a chip communicating with the hopper (13) from the contact surface (71). A holder (14) having a component receiving port (16), a chip component supply case being fitted to the receiving port (16) with a chip component outlet, and the hopper of the holder (14); The through hole (1) communicating with (13)
And a separation pipe (22) inserted into the hopper (5) and having an upper end entering and exiting the hopper (13). 2. The chip component supply device according to claim 1, wherein the holding interval of the holding walls is provided so as to be in a fitting state with substantially no gap between the width of a corresponding position of the chip component supply case. 3. When the chip component supply case is mounted on the holder (14), a concave portion (76, 77) is provided on each of the opposing surfaces of the holding walls (72, 73). The chip component supply device according to claim 1 or 2, wherein protruding surfaces are provided on both sides corresponding to (76, 77), and the protruding surfaces are engaged with the concave portions (76, 77) and held so as not to come off upward. 4. A chip component supply side provided with ridges (78, 79) on the side of the holding piece (74, 75) remote from the contact surface (71), respectively, in parallel with the contact surface (71). When the case is mounted on the holder (14), when the side surface of the chip component supply case is pushed parallel to the contact surface (71), the holding pieces (74, 75) are bent outward and spread, and the chip is opened. When the component supply case is mounted at a predetermined position, the spread of the holding pieces (74, 75) returns to the original position, and the chip component supply case cannot be removed unless a force greater than a predetermined force is applied. Item 4. The chip component supply device according to item 1, 2, or 3.