JP3187661B2 - Method of manufacturing structure for reducing charge and structure thereof - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention covers an electronic component such as a liquid crystal display, a semiconductor wafer, etc., in order to prevent an abrupt discharge from occurring when the electronic component is peeled off from the mount of a processing apparatus. The present invention relates to a method of manufacturing a structure that forms the mounting surface of the above, and the structure.

[0002]

2. Description of the Related Art For example, when manufacturing a liquid crystal display which is one of electronic parts, a glass substrate of the liquid crystal display is rubbed to align liquid crystals. This rubbing is performed by fixing a glass substrate on a mounting table and then rolling a roller around which a cloth is wound on the alignment film of the glass substrate.

[0003]

By the way, the glass substrate and the mounting table are charged by such a rubbing process, and the glass substrate and the mounting table are contact-charged because they are in close contact with each other. Therefore, when the glass substrate is peeled off from the mounting table, a peeling charge having a large potential is generated between the glass substrate and the mounting table, and a rapid discharge phenomenon occurs between them. As a result of this rapid discharge phenomenon, problems such as breakage of the glass substrate due to the impact and breakage of its electric circuit have occurred. Such a problem is also observed when processing other electronic components such as a semiconductor wafer. The present invention has been made in view of the above circumstances, and alleviates the occurrence of a sudden discharge phenomenon due to peeling charging when an electronic component is peeled off from a mounting table, and reduces contact charging between the electronic component and the mounting table. It is an object of the present invention to provide a method for manufacturing a structure and a structure capable of alleviating the problem.

[0004]

SUMMARY OF THE INVENTION In order to achieve the above object, the present invention is to cover an electronic component in order to prevent an abrupt discharge from occurring when the electronic component is peeled off from the mount. And a method of manufacturing a structure constituting a mounting surface of an electronic component, wherein the particle size is obtained by mixing a conductive oxide powder and a metal oxide powder with alumina powder.
A porous body having a porosity of 1 to 20% is formed on the surface of the base of the mounting base by spraying a powder of 0 μm or less, and then the porous body is ground to produce the flat mounting surface. Therefore, this mounting surface should have a maximum surface roughness of 10 μm or more and a surface electric resistance of 10 ⁶ to 10 ¹⁰ Ω · cm.
It is characterized in that it is made to.

[0005]

[Function] The surface electric resistance value of the mounting surface is 10 ⁶ to 10 ¹⁰ Ω.
By setting to cm, the movement of the electrons on the mounting table becomes slow, and it is possible to prevent the occurrence of sudden discharge when the electronic component is peeled off from the mounting table of the processing device. Also,
By making the structure a porous body, the contact area between the mounting surface of the mounting base and the electronic component is reduced, and contact charging,
Since the potential of the peeling charge can be reduced and the mounting surface can adsorb moisture, generation of static electricity on the mounting surface and the electronic component can be suppressed.

Here, as the conductive oxide, ZnO,
SnO ₂ , TiO ₂ or the like is used. As the metal oxide, Al ₂ O ₃ , Sb ₂ O ₅ , Nb ₂ O ₅ or the like is used. Also,
Examples of the thermal spraying method include a gas melting method in which an oxygen gas, an acetylene gas, or the like is used as a combustion flame to spray a powdery material, or a powder spraying method in which an arc is discharged in an inert gas such as an argon gas or a hydrogen gas. Plasma spraying method in which the raw material is sprayed.

The porosity is preferably not more than 20%.
If it exceeds 0%, the strength of the structure becomes insufficient. The surface electric resistance ^{10 6} ~10 10 Ω · cm is preferred, while the rapid discharge occurs in the following 10 ⁶ Ω · cm, it becomes impossible to discharge gradually in the ¹⁰ 10 Ω · cm or more. Further, since the structure is porous, the maximum height of the surface roughness is necessarily 10 μm or more. In the case where the structure is manufactured alone, the structure may be manufactured not by the above-described method by thermal spraying but by a method of firing by conventional means. Processing for flattening the fired product may be performed by so-called grinding or blasting.

[0008]

[Experimental Example] An experimental example of the present invention will be described. A mixture of alumina and titanium oxide is sprayed onto a metal plate at various mixing ratios to produce various test pieces. Table 1 shows the measurement results of the electric resistance.
Note that a digital insulation resistance meter (type 2426) manufactured by Yokogawa Electric Corporation was used for the measurement.

Table 1

According to Table 1, the porosity is 10 to 15 when the titanium oxide content is 13% by weight and the alumina content is 87% by weight.
%, Maximum surface roughness 20μm, surface electric resistance 1
0 ⁶ to 10 ⁸ , which proves that the object of the present invention is met.

[0011]

[Comparative example] Size 300mm x 300mm x 0.7mm
A liquid crystal display glass substrate is fixed on a mounting table of a rubbing device using a double-sided tape (total thickness 85 μm ± 10 μm), and the material of the mounting table is made of an aluminum alloy which is a base of the mounting table; Using a base of an aluminum alloy mounting base coated with the structure of the present invention, rubbing for aligning the liquid crystal is performed, and then the static electricity charged on the mounting base when the glass substrate is peeled off from the mounting base. Was measured.
The measured and recorded results are shown in FIG.

In this case, as a rubbing device, a LAB-5 type manufactured by Shinto Kogyo Co., Ltd. was used. This rubbing device is configured such that a rubbing cloth (manufactured by Yoshikawa Kako Co., Ltd.) having a thickness of 1.85 mm is wound on a roll having a diameter of 148 mm, and a mounting table for mounting electronic components can be horizontally moved at a speed of 30 mm / sec. It is. Also, as a measuring device of the potential of static electricity, TI-300 manufactured by Otsubo Electric Co., Ltd.
A mold was used. The measurement results were recorded using LR-8100 model manufactured by Yokogawa Electric Corporation. The room temperature was 21 ° C. and the humidity was 65%.

From FIG. 1, it can be seen that when the mounting base is made of the structure of the present invention, the charging potential is very small, that is, about ４ as compared with the case where the mounting base is not used.

[0014]

As is clear from the above description, the present invention provides a method of spraying a powder having a particle size of 150 μm or less, which is obtained by mixing a conductive oxide powder and a metal oxide powder, on alumina powder. A porous body having a porosity of 1 to 20% is formed on the surface of the mother body, and then the porous body is ground to produce the flat mounting surface. The maximum height is 10 μm or more and the surface electric resistance value is 10 ⁶ to 10 ¹⁰ Ω · cm, so that it is possible to alleviate the sudden discharge caused by peeling charging when the electronic component is peeled off from the mounting table, An excellent effect is obtained such that contact electrification with the mounting table can be reduced.

[Brief description of the drawings]

FIG. 1 shows a rubbing of a glass substrate of a liquid crystal panel using a mounting base having a structure of the present invention and a mounting base made of an aluminum alloy, and immediately after that, the glass substrate is peeled off from the mounting base. 4 is a comparison graph showing the results of measuring and recording the potential of static electricity charged on the substrate.

[Table 1]

Continuation of the front page (58) Field surveyed (Int. Cl. ⁷ , DB name) C23C 4/10 C04B 38/00 H05K 13/02 H01B 5/14

Claims (2)

(57) [Claims] 1. A method of manufacturing a structure for covering an electronic component and forming a mounting surface of the electronic component in order to prevent a sudden discharge when the electronic component is peeled from the mount of the processing apparatus. And a particle diameter of 150 obtained by mixing a conductive oxide powder and a metal oxide powder with alumina powder.
A porous body having a porosity of 1 to 20% is formed on the surface of the base of the mounting base by spraying a powder having a particle size of μm or less, and then the porous body is ground to produce the flat mounting surface. Therefore, this mounting surface should have a maximum surface roughness of 1
A method for producing a charge-mitigating structure, characterized in that the surface electric resistance is set to 0 μm or more and the surface electric resistance is set to 10 ⁶ to 10 ¹⁰ Ω · cm. 2. A structure that covers said mounting base and constitutes a mounting surface of said electronic component, in order to prevent a sudden discharge from occurring when the electronic part is peeled off from the mounting base of the processing apparatus, wherein the ZnO is a structure. , SnO ₂ , TiO _{2, and} other conductive oxides mixed with a small amount of metal oxides, such as Al ₂ O ₃ , Sb ₂ O ₅ , Nb ₂ O _5, and 10 to 20% by weight, with the remainder being alumina powder The mixture is fired and then processed to form a porous body having a porosity of 1 to 20%, a maximum surface roughness of 10 μm or more, and a surface electric resistance of 10 ⁶ to 10 ¹⁰ Ω · cm. Structure for charging relaxation.