JP3186206B2 - Outer container for electronic components - Google Patents

Outer container for electronic components

Info

Publication number
JP3186206B2
JP3186206B2 JP12654092A JP12654092A JP3186206B2 JP 3186206 B2 JP3186206 B2 JP 3186206B2 JP 12654092 A JP12654092 A JP 12654092A JP 12654092 A JP12654092 A JP 12654092A JP 3186206 B2 JP3186206 B2 JP 3186206B2
Authority
JP
Japan
Prior art keywords
container
polyester resin
outer container
aluminum plate
coated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP12654092A
Other languages
Japanese (ja)
Other versions
JPH05326347A (en
Inventor
法夫 吉賀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Plastics Inc
Original Assignee
Mitsubishi Plastics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Plastics Inc filed Critical Mitsubishi Plastics Inc
Priority to JP12654092A priority Critical patent/JP3186206B2/en
Publication of JPH05326347A publication Critical patent/JPH05326347A/en
Application granted granted Critical
Publication of JP3186206B2 publication Critical patent/JP3186206B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Laminated Bodies (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、電子部品用外装容
器に関する。さらに詳しくは、アルミニウム板からなる
有底円筒状の容器本体の外面に、特定の樹脂層を設けた
電子部品用外装容器に関する。特に、リード線が短くコ
ンデンサ本体に直接プリント基板に接触するアルミニウ
ム電解コンデンサや、コンデンサ本体側面部が同様に直
接基板に接触する横置きタイプのアルミニウム電解コン
デンサ等の外装容器として好適に使用できる、容器本体
と樹脂層間の接着性及び耐熱性に優れた電子部品用外装
容器に関する。
The present invention relates to an outer container for electronic parts. More specifically, the present invention relates to an outer container for electronic components in which a specific resin layer is provided on an outer surface of a bottomed cylindrical container body made of an aluminum plate. In particular, a container which can be suitably used as an outer container such as an aluminum electrolytic capacitor having a short lead wire and directly contacting a printed circuit board on a capacitor body, and a horizontal type aluminum electrolytic capacitor having a side surface portion of the capacitor body also directly contacting the board. The present invention relates to an outer container for electronic components having excellent adhesiveness and heat resistance between a main body and a resin layer.

【0002】[0002]

【従来の技術】アルミニウム電解コンデンサを構成する
コンデンサ素子を収納するための外装容器としては、通
常、アルミニウム板を絞り加工した有底円筒状の容器で
あって、コンデンサ素子の種類などを識別するために、
容器の外面に各種着色剤によって着色し、さらに記号な
どが印刷された収縮チューブで被覆したものが使用され
ている。
2. Description of the Related Art An outer container for accommodating a capacitor element constituting an aluminum electrolytic capacitor is usually a bottomed cylindrical container obtained by drawing an aluminum plate, and is used to identify the type of the capacitor element. To
A container is used in which the outer surface of a container is colored with various coloring agents and further covered with a shrink tube on which a symbol or the like is printed.

【0003】近年、プリント基板に実装される電子部品
の小型化が図られ、アルミニウム電解コンデンサも同様
に小型化される傾向にあり、さらにコンデンサのリード
線を短くして、コンデンサ本体下部が直接基板に接触す
ることでプリント基板とコンデンサ間の間隔を小さく
(低背化)し、無駄な空間を無くして高密度に実装する
ことが検討されている。また同様にて高密度実装を目的
として、コンデンサ本体側面部を直接配線基板表面に接
触させる、いわゆる横置きタイプのアルミニウム電解コ
ンデンサが検討されている。
In recent years, the size of electronic components mounted on a printed circuit board has been reduced, and aluminum electrolytic capacitors have also tended to be reduced in size. In order to reduce the space between the printed circuit board and the capacitor (reduce the height) by contacting the printed circuit board, and to eliminate wasteful space, high-density mounting is being studied. Similarly, for the purpose of high-density mounting, a so-called horizontal type aluminum electrolytic capacitor in which the side surface of the capacitor body directly contacts the surface of the wiring board has been studied.

【0004】低背化された小型のアルミニウム電解コン
デンサの場合、コンデンサ外装容器の外周の被覆材とし
て、従来から使用されている例えばポリ塩化ビニル系樹
脂からなる収縮チューブを使用すると、被覆材がプリン
ト配線板に直接接触しているため、プリント配線板表面
にリフロー法によりハンダ付けを行う際のハンダの温度
が高すぎると、ハンダの温度に影響されやすく、被覆さ
れた収縮チューブのプリント配線板に接触している部分
が熱劣化したり、溶解したりするという問題があった。
In the case of a small-sized aluminum electrolytic capacitor having a reduced height, when a conventionally used shrink tube made of, for example, a polyvinyl chloride resin is used as a coating material for the outer periphery of the capacitor outer container, the coating material is printed. If the solder temperature is too high when soldering to the printed wiring board surface by the reflow method because it is in direct contact with the wiring board, it is easily affected by the solder temperature, and the printed shrink tubing coated There has been a problem that the contacting part is thermally deteriorated or melted.

【0005】また、上記収縮チューブを用いずにアルミ
ニウム板の一方の面を、樹脂で被覆した樹脂被覆積層板
を用い、絞り加工によりコンデンサ外装容器を調製する
ことが検討されているが、この場合も上記と同様に熱劣
化の問題が生起し、この問題の解決が希求されていた。
[0005] In addition, it has been studied to prepare a capacitor exterior container by drawing using a resin-coated laminate in which one surface of an aluminum plate is coated with resin without using the above-mentioned shrinkable tube. As described above, a problem of thermal deterioration occurs as described above, and a solution to this problem has been desired.

【0006】[0006]

【発明が解決しようとする課題】本発明の目的は、つぎ
のとおりある。 1.耐熱性に優れた電子部品用外装容器を提供するこ
と。 2.アルミニウム板と被覆樹脂層との界面の接着性に優
れた電子部品用外装容器を提供すること。
The object of the present invention is as follows. 1. To provide an outer container for electronic parts having excellent heat resistance. 2. Provided is an outer container for electronic parts having excellent adhesion at an interface between an aluminum plate and a coating resin layer.

【0007】[0007]

【課題を解決するための手段】上記課題を解決するため
に、本発明では、アルミニウム板の一方の面が融点が2
40℃以上のポリエステル樹脂によって被覆されてなる
樹脂被覆アルミニウム板を、このポリエステル樹脂層が
外側面となるようにして絞り加工されてなり、絞り加工
後に、ポリエステル樹脂の融解開始温度〜加熱減量が1
0%以下の温度範囲で熱処理されてなることを特徴とす
る、電子部品用外装容器を提供する。
In order to solve the above-mentioned problems, according to the present invention, one surface of an aluminum plate has a melting point of 2%.
A resin-coated aluminum plate coated with a polyester resin having a temperature of 40 ° C. or higher is drawn so that the polyester resin layer becomes an outer surface, and after the drawing, the melting start temperature of the polyester resin to the heating loss is 1%.
Provided is an outer container for electronic parts, which is heat-treated in a temperature range of 0% or less.

【0008】[0008]

【発明の実施の形態】以下、本発明を詳細に説明する。
本発明に係る電子部品用外装容器は、アルミニウム板の
一方の面が特定の樹脂によって被覆されてなる。アルミ
ニウム板は、純アルミニウム板、アルミニウム合金板な
どが挙げられる。アルミニウム板の厚さは、薄すぎたり
厚すぎると絞り加工し難くいので、0.2〜0.5mmと
0.3mm前後が好ましい。
BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in detail.
The outer container for electronic components according to the present invention is formed by coating one surface of an aluminum plate with a specific resin. Examples of the aluminum plate include a pure aluminum plate and an aluminum alloy plate. The thickness of the aluminum plate is preferably 0.2 to 0.5 mm and about 0.3 mm because it is difficult to draw when the aluminum plate is too thin or too thick.

【0009】アルミニウム板の一方の面は、融点が24
0℃以上のポリエステル樹脂によって被覆されてなる。
ポリエステル樹脂は、電子部品用外装容器の外側面に配
置され、コンデンサ素子の種類などを識別するために、
着色されたり記号などが印刷される。変性ポリオレフィ
ン樹脂は、電子部品用外装容器の内側面に配置され、電
子部品用外装容器に絶縁性を付与する。
One side of the aluminum plate has a melting point of 24
It is coated with a polyester resin at 0 ° C. or higher.
Polyester resin is placed on the outer surface of the outer casing for electronic components, and to identify the type of capacitor element, etc.
Colored or symbols are printed. The modified polyolefin resin is disposed on the inner surface of the outer container for electronic components, and imparts insulation to the outer container for electronic components.

【0010】ポリエステル樹脂の融点が240未満であ
ると、樹脂の耐熱性が低すぎて、本発明の目的を達成す
ることができず、好ましくない。なお、本発明において
融点と、示差走査式熱量計(DSC)により測定した吸
熱ピ−クの温度を意味する。具体的なポリエステル樹脂
としては、ポリエチレンテレフタレ−ト、ポリエチレン
ナフタレ−ト、ポリ−1,4−シクロヘキサンジメチレ
ンテレフタレ−ト等が挙げられる。
If the melting point of the polyester resin is less than 240, the heat resistance of the resin is too low, so that the object of the present invention cannot be achieved, which is not preferable. In the present invention, it means the melting point and the temperature of an endothermic peak measured by a differential scanning calorimeter (DSC). Specific polyester resins include polyethylene terephthalate, polyethylene naphthalate, poly-1,4-cyclohexane dimethylene terephthalate, and the like.

【0011】アルミニウム板の表面に上記ポリエステル
樹脂を積層する方法としては、種々の方法があるが、
(1)予め製膜したポリエステル樹脂フィルムを、この樹
脂の融点以上に加熱したアルミニウム板に重ねて圧着し
てする溶融ラミネ−ト法、(2)予め製膜したポリエステ
ル系樹脂フィルムを、接着剤を介してアルミニウム板に
積層するドライラミネ−ト法、などによることができ
る。生産性の観点からは、前者の溶融ラミネ−ト法が好
ましい。ポリエステル樹脂フィルムの厚さは、10〜1
00μm、更に10〜50μmの範囲が絞り加工及び耐
熱性の観点から好ましい。
There are various methods for laminating the polyester resin on the surface of the aluminum plate.
(1) A melt lamination method in which a pre-formed polyester resin film is overlaid on an aluminum plate heated to a temperature equal to or higher than the melting point of the resin and pressure-bonded. And a dry laminating method of laminating on an aluminum plate through the above method. From the viewpoint of productivity, the former melt lamination method is preferred. The thickness of the polyester resin film is 10 to 1
The range of 00 μm, more preferably 10 to 50 μm, is preferable from the viewpoint of drawing and heat resistance.

【0012】上記の一方の面が特定のポリエステル樹脂
によって被覆されてなるアルミニウム板から、電子部品
用外装容器を調製するには、通常の多段式絞り加工機を
用い、ポリエステル樹脂層が外層になるように絞り加工
ればよい。得られる容器は、有底円筒状の容器である。
In order to prepare an outer container for electronic parts from an aluminum plate having one surface coated with a specific polyester resin, an ordinary multi-stage drawing machine is used, and the polyester resin layer becomes an outer layer. What is necessary is just to draw. The resulting container is a bottomed cylindrical container.

【0013】このように絞り加工して得られた容器は、
被覆ポリエステル樹脂の融解開始温度を最低温度とし、
加熱減量が10重量%以下の温度を最高温度とする温度
範囲として、熱処理する。絞り加工して得られた容器を
この温度範囲で熱処理すると、アルミニウム板と被覆ポ
リエステル樹脂層との界面の密着性を、大幅に改良する
ことができる。ポリエステル樹脂の融解開始温度は、ポ
リエステル樹脂の種類、分子量などにより若干差がある
が約210℃であり、加熱減量10重量%の温度は約4
00℃である。
The container obtained by drawing in this way is
The melting start temperature of the coated polyester resin is the lowest temperature,
The heat treatment is performed in a temperature range in which the temperature at which the weight loss on heating is 10% by weight or less is the maximum temperature. When the container obtained by drawing is heat-treated in this temperature range, the adhesion at the interface between the aluminum plate and the coated polyester resin layer can be significantly improved. The melting start temperature of the polyester resin is about 210 ° C., although there is a slight difference depending on the kind and molecular weight of the polyester resin.
00 ° C.

【0014】本発明に係る電子部品用外装容器は、アル
ミニウム板を被覆しているポリエステル樹脂が耐熱性に
優れているので、ハンダ付けを行う際に高温にさらされ
ても外側面の被覆層が劣化し難く、絶縁性も保たれるの
で、コンデンサ下部がプリント基板と直接接触するアル
ミニウム電解コンデンサ用外装容器や、コンデンサ本体
側面部が配線板と接触する横置きタイプのアルミニウム
電解コンデンサ等の外装容器として好適に使用できる。
In the outer container for electronic parts according to the present invention, the polyester resin coating the aluminum plate has excellent heat resistance, so that the outer surface coating layer is exposed even when exposed to high temperatures during soldering. Since it is hard to deteriorate and insulation is maintained, the outer container for aluminum electrolytic capacitors where the lower part of the capacitor is in direct contact with the printed circuit board, and the outer container such as the horizontal type aluminum electrolytic capacitor where the side of the capacitor body contacts the wiring board Can be suitably used.

【0015】[0015]

【実施例】以下、本発明を実施例に基いて詳細に説明す
るが、本発明は以下の記載例に限定されるものではな
い。
EXAMPLES The present invention will be described in detail below with reference to examples, but the present invention is not limited to the following examples.

【0016】[実施例] アルミニウム板(A1100P−H18、厚さ0.3m
m)の一法の面に、厚さが20μmのポリエチレンテレ
フタレ−ト(PET、融点260℃)からなるフイルム
を、溶融ラミネ−ト法によって積層してPET被覆アル
ミニウム積層板を得た。
[Example] Aluminum plate (A1100P-H18, thickness 0.3 m)
m) A film made of polyethylene terephthalate (PET, melting point: 260 ° C.) having a thickness of 20 μm was laminated on one side of the method by a melt lamination method to obtain a PET-coated aluminum laminate.

【0017】得られたPET被覆アルミニウム積層板を
用いて、ランス順送絞り金型によって7段の絞り加工を
行い、外側面がPETで被覆された径が10mm、高さが
20mm有底円筒容器を作成した。得られた有底円筒容器
を、240℃に加熱したホットプレ−ト上に有底円筒容
器の天面部が接触するように載置し、上から100gの
荷重を30秒間かけて天面部の変化の状態を観察した。
The obtained PET-coated aluminum laminate is subjected to a 7-step drawing process using a lance progressive drawing die, and the outer surface is coated with PET and has a diameter of 10 mm and a height of 20 mm. It was created. The obtained bottomed cylindrical container is placed on a hot plate heated to 240 ° C. so that the top surface of the bottomed cylindrical container is in contact with the container, and a load of 100 g is applied from the top for 30 seconds to change the top surface portion. The condition was observed.

【0018】その結果、上記の有底円筒容器は、ホット
プレ−トに接触た容器の天面部に変化が全く認められな
かった。また、上記容器を用いてコンデンサ素子を収納
し電解コンデンサとしての実用試験を行ったところ、上
記と同様にポリエチレンテレフタレ−トを被覆した容器
では問題がなかった。
As a result, in the bottomed cylindrical container, no change was observed in the top surface portion of the container in contact with the hot plate. Further, when a practical test as an electrolytic capacitor was carried out by housing the capacitor element using the above-mentioned container, no problem was found in the container coated with polyethylene terephthalate as described above.

【0019】[比較例] 実施例に記載の例において、積層フィルムを厚さが20
μmのポリブチレンテレフタレ−ト(PBT、融点22
4℃)に代え、実施例におけると同様の試験を行った。
有底円筒容器の天面部のホットプレ−トに接触した箇所
は、積層フィルムが溶融して小穴が開き、穴の径が時間
の経過とともに大きくなった。これはPBTの融点が2
24℃と低いために、240℃に加熱したホットプレ−
ト上でPBTフィルムが溶融して穴があいたためであ
り、穴の径は急激に大きくなることが観察された。
Comparative Example In the example described in the examples, the thickness of the laminated film was 20
μm polybutylene terephthalate (PBT, melting point 22
4 ° C.), and the same test as in the example was performed.
At the point of contact with the hot plate on the top surface of the bottomed cylindrical container, the laminated film melted and small holes were opened, and the diameter of the holes increased with time. This is because the melting point of PBT is 2
Hot press heated to 240 ° C because it is as low as 24 ° C
It was because the PBT film was melted on the substrate and a hole was formed, and the diameter of the hole was observed to increase rapidly.

【0020】[0020]

【発明の効果】本発明は、以上詳細に説明したとおりで
あり、次のような特別に有利な効果を奏し、その産業上
の利用価値は極めて大である。 1.本発明に係る電子部品用外装容器は、外側面を特定
のポリエステル樹脂層によって被覆しているので、ハン
ダ付けを行う際に高温にさらされても外側面の被覆層が
劣化し難く、絶縁性に優れている。 2.本発明に係る電子部品用外装容器は、絞り加工した
後に、ポリエステル樹脂の融解開始温度〜加熱減量が1
0%以下の温度範囲で熱処理されているので、アルミニ
ウム板と被覆樹脂層との界面の接着性に優れ、界面が剥
離し難い。
As described in detail above, the present invention has the following particularly advantageous effects, and its industrial value is extremely large. 1. Since the outer container for an electronic component according to the present invention has the outer surface covered with a specific polyester resin layer, the outer surface coating layer is hardly deteriorated even when exposed to high temperatures when performing soldering, and has an insulating property. Is excellent. 2. The outer container for electronic components according to the present invention has a polyester resin resin melting start temperature to heating loss of 1 after drawing.
Since the heat treatment is performed in a temperature range of 0% or less, the adhesiveness of the interface between the aluminum plate and the coating resin layer is excellent, and the interface is hardly peeled.

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 アルミニウム板の一方の面が融点が24
0℃以上のポリエステル系樹脂によって被覆されてなる
樹脂被覆アルミニウム板を、このポリエステル樹脂層が
外側面となるようにして絞り加工されてなり、絞り加工
後に、ポリエステル樹脂の融解開始温度〜加熱減量が1
0%以下の温度範囲で熱処理されてなることを特徴とす
る、電子部品用外装容器。
1. An aluminum plate having one surface having a melting point of 24
A resin-coated aluminum plate coated with a polyester resin at 0 ° C. or higher is drawn so that the polyester resin layer becomes the outer surface. After drawing, the melting start temperature of the polyester resin to the heat loss is reduced. 1
An outer container for electronic parts, which is heat-treated in a temperature range of 0% or less.
JP12654092A 1992-05-20 1992-05-20 Outer container for electronic components Expired - Fee Related JP3186206B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12654092A JP3186206B2 (en) 1992-05-20 1992-05-20 Outer container for electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12654092A JP3186206B2 (en) 1992-05-20 1992-05-20 Outer container for electronic components

Publications (2)

Publication Number Publication Date
JPH05326347A JPH05326347A (en) 1993-12-10
JP3186206B2 true JP3186206B2 (en) 2001-07-11

Family

ID=14937720

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12654092A Expired - Fee Related JP3186206B2 (en) 1992-05-20 1992-05-20 Outer container for electronic components

Country Status (1)

Country Link
JP (1) JP3186206B2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990064634A (en) * 1999-04-22 1999-08-05 손봉락 Electrolytic Capacitor Case
JP3803332B2 (en) * 2003-06-20 2006-08-02 アルペット カンパニー リミテッド Electronic component outer container, manufacturing method thereof, and electronic component mounted thereon
JP5173460B2 (en) * 2008-02-01 2013-04-03 太陽誘電株式会社 Electrochemical device and manufacturing method thereof
JP6774827B2 (en) * 2016-09-15 2020-10-28 昭和電工パッケージング株式会社 Coating material for rolled aluminum alloy plates for small electronic equipment cases

Also Published As

Publication number Publication date
JPH05326347A (en) 1993-12-10

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