JP3182013U - Substrate holding member - Google Patents

Substrate holding member Download PDF

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JP3182013U
JP3182013U JP2012007696U JP2012007696U JP3182013U JP 3182013 U JP3182013 U JP 3182013U JP 2012007696 U JP2012007696 U JP 2012007696U JP 2012007696 U JP2012007696 U JP 2012007696U JP 3182013 U JP3182013 U JP 3182013U
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substrate holding
substrate
holding member
guide
base
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宏治 元井
道明 松下
成昭 飯田
卓 榎木田
康典 豊田
秀和 木山
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Tokyo Electron Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0019—End effectors other than grippers

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  • Condensed Matter Physics & Semiconductors (AREA)
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  • Microelectronics & Electronic Packaging (AREA)
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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

【課題】基板保持アームに取り付けられる基板保持部材の交換に要する時間の短縮、作業者間差の是正および交換に要する費用を抑制することができる基板保持部材を提供する。
【解決手段】基板保持アームの一部を構成するフレーム部に取り付けられる基板保持部材は、フレーム部に取り付けられる土台部２０と、土台部２０上に取り付けられるガイド部３０とを備え、土台部２０とガイド部３０は互いに嵌合する土台部とガイド部に設けられた位置決め凹部２２と位置決め凸部３２を介して着脱可能に連結される。
【選択図】図６ＡThere is provided a substrate holding member capable of reducing the time required for replacement of a substrate holding member attached to a substrate holding arm, correcting a difference between workers, and suppressing costs required for replacement.
A substrate holding member attached to a frame portion constituting a part of a substrate holding arm includes a base portion 20 attached to the frame portion, and a guide portion 30 attached to the base portion 20, and the base portion 20 is provided. And the guide part 30 are detachably connected to each other via a base part and a positioning concave part 22 and a positioning convex part 32 provided in the guide part.
[Selection] Figure 6A

Description

本考案は、例えば半導体ウエハや液晶ディスプレイ用のガラス基板（ＦＰＤ基板）といった基板の搬送をするための基板搬送装置が有する基板保持アームの基板の保持部材に関する。   The present invention relates to a substrate holding member of a substrate holding arm included in a substrate transfer device for transferring a substrate such as a semiconductor wafer or a glass substrate (FPD substrate) for a liquid crystal display.

半導体デバイスやＦＰＤ基板の製造プロセスのひとつである基板上にレジストパターンを形成する工程は、基板例えば半導体ウエハ（以下、ウエハという。）にレジスト膜を形成し、フォトマスクを用いてこのレジスト膜を露光した後、現像処理を行うことにより所望のパターンを得る一連の工程により行われ、これら一連の工程は従来から塗布、現像装置によって行われている。   The step of forming a resist pattern on a substrate, which is one of the manufacturing processes of semiconductor devices and FPD substrates, is to form a resist film on a substrate, for example, a semiconductor wafer (hereinafter referred to as a wafer), and to apply this resist film using a photomask. After the exposure, a development process is performed to perform a series of steps for obtaining a desired pattern. These series of steps are conventionally performed by a coating and developing apparatus.

例えば、この塗布、現像装置でレジスト膜を基板に塗布する前後に冷却処理や加熱処理が行われる。例えばレジスト処理前には一旦基板の冷却処理が行われて次にレジスト塗布処理が行われる。また、現像処理においても現像処理の前後には冷却処理や加熱処理が行われるものである。   For example, a cooling process or a heating process is performed before and after the resist film is applied to the substrate by this coating and developing apparatus. For example, before the resist process, the substrate is once cooled, and then the resist coating process is performed. In the development process, a cooling process and a heating process are performed before and after the development process.

これら各処理ユニット間におけるウエハの搬送には、図１に示される基板保持アーム１１に基板が載置され行われる。基板保持アーム１１は、基板例えばウエハＷの外周をその半周以上に渡って囲む形態の例えばアルミニウムのフレーム部１００を有し、このフレーム部１００の内縁には例えば４個の基板保持部材１２が設けられている（特許文献１参照）。   The wafer is transferred between these processing units by placing the substrate on the substrate holding arm 11 shown in FIG. The substrate holding arm 11 has a frame portion 100 made of, for example, aluminum and surrounds the outer periphery of the substrate, eg, the wafer W, over a half circumference thereof. For example, four substrate holding members 12 are provided on the inner edge of the frame portion 100. (See Patent Document 1).

特開２０１０−２５８１７０号公報JP 2010-258170 A

ところで、装置立ち上げ時において、フレーム部１００に基板保持部材１２を取り付ける際は、作業者が専用冶具を用いて適正な取り付け位置を割り出して行われる。また、基板保持アーム１１によってウエハＷの搬送を何度も実行するのに伴い、ウエハＷとの接触により基板保持部材１２が磨耗した際は、フレーム部１００と基板保持部材１２を結合している図示しない固定ねじを取り外し新品の基板保持部材１２と交換する。その際、装置立ち上げ時と同様、改めて作業者が専用冶具を用いて基板保持部材１２を取り付ける。   By the way, when the apparatus is started up, when attaching the substrate holding member 12 to the frame unit 100, an operator uses an exclusive jig to determine an appropriate attachment position. Further, when the substrate holding member 12 is worn by contact with the wafer W as the transfer of the wafer W is performed many times by the substrate holding arm 11, the frame unit 100 and the substrate holding member 12 are combined. A fixing screw (not shown) is removed and replaced with a new substrate holding member 12. At that time, as in the case of starting up the apparatus, the worker again attaches the substrate holding member 12 using a dedicated jig.

しかしながら、専用冶具を用いて基板保持部材１２を取り付ける作業は取り付け位置を正確に割り出すために多くの時間を必要とし、また、メンテナンスに際して当該基板保持部材１２の交換を行うたびに取り付け位置を割り出す作業を要するため、装置ダウンタイムが増加する。また、作業者間で取り付け精度にばらつきが発生する。さらに、従来の基板保持部材１２は一体成型により形成されるため、一部に摩耗や破損が発生すると、基板保持部材１２全体を交換する必要があり維持費が増加する。   However, the operation of attaching the substrate holding member 12 using a dedicated jig requires a lot of time to accurately determine the attachment position, and the operation of determining the attachment position every time the substrate holding member 12 is replaced during maintenance. Therefore, the apparatus downtime increases. In addition, the installation accuracy varies among workers. Furthermore, since the conventional substrate holding member 12 is formed by integral molding, if a part of the substrate is worn or damaged, it is necessary to replace the entire substrate holding member 12 and the maintenance cost increases.

本考案はこのような事情の下になされたものであり、その目的はウエハブロックの交換に要する時間を削減し、なおかつ、基板保持部材１２の交換における作業者間差を是正すると共に、維持費の増加を抑制する基板保持部材を提供することにある。   The present invention has been made under such circumstances. The purpose of the present invention is to reduce the time required for exchanging the wafer block, correct the difference between workers in exchanging the substrate holding member 12, and maintain the maintenance cost. It is in providing the board | substrate holding member which suppresses the increase in this.

このため本考案は、基板の外周をその半周以上に渡って囲む形態を有するフレーム部を備える基板保持アームに取り付けられ、基板の周縁を載置して該基板を保持する基板保持部材であって、前記フレーム部上に取り付けられる土台部と、前記土台部上に取り付けられ基板の周縁部を滑降させて所定位置に案内するガイド部と、を備え、前記土台部と前記ガイド部は互いに嵌合する位置決め凹部と位置決め凸部を介して着脱可能に連結されることを特徴とする。   For this reason, the present invention is a substrate holding member that is attached to a substrate holding arm having a frame portion having a form surrounding the outer periphery of the substrate over more than half of its circumference, and holds the substrate by placing the periphery of the substrate. A base part attached on the frame part, and a guide part attached on the base part for sliding down a peripheral part of the substrate and guiding it to a predetermined position, and the base part and the guide part are fitted to each other The positioning concave portion and the positioning convex portion to be connected are detachably connected.

このように構成することによって、基板保持アームのフレーム部に取り付けられた土台部に対してガイド部を着脱可能に連結することで、メンテナンスに際してウエハブロックの交換を行うたび装置ダウンタイムの増加を最小限にすることができる。また、作業者間で取り付け精度にばらつきが発生することを抑制することができる。また、保持方式の異なるガイド部を容易に交換することができる。   With this configuration, the guide portion is detachably connected to the base portion attached to the frame portion of the substrate holding arm, thereby minimizing an increase in apparatus downtime each time the wafer block is replaced during maintenance. Can be limited. Moreover, it can suppress that dispersion | variation generate | occur | produces in attachment accuracy between operators. In addition, guide portions having different holding methods can be easily replaced.

本考案にける前記ガイド部は、前記フォークの内周方向に向かって伸びる支持受け部を備え、前記支持受け部の先端には基板裏面と当接し、基板を支持する当接部を備えることを特徴とする。   The guide portion according to the present invention includes a support receiving portion that extends in an inner circumferential direction of the fork, and includes a contact portion that contacts the back surface of the substrate and supports the substrate at a tip of the support receiving portion. Features.

このように構成することによって、摩耗が発生しやすいガイド部を交換対象部材に集約することができ、部分的な部材交換を行うことができる。   By comprising in this way, the guide part which is easy to generate | occur | produce wear can be collected on the member for exchange, and partial member exchange can be performed.

また本考案における前記ガイド部は、前記フォークの内周方向に向かって伸びる支持受け部を備え、前記支持受け部は基板の内周方向に向かって下り勾配に形成されることを特徴とする。   In the present invention, the guide portion includes a support receiving portion extending toward the inner peripheral direction of the fork, and the support receiving portion is formed in a downward gradient toward the inner peripheral direction of the substrate.

このように構成することによって、摩耗が発生しやすいガイド部を交換対象部材に集約することができ、部分的な部材交換を行うことができる。   By comprising in this way, the guide part which is easy to generate | occur | produce wear can be collected on the member for exchange, and partial member exchange can be performed.

また本考案における前記ガイド部と前記土台部は、ねじを前記ガイド部に設けられた貫通孔を貫通して前記土台部に設けられた挿通孔にねじ結合することにより連結され、前記土台部と前記フレーム部は、前記ガイド部に設けられた大径貫通孔より小径の頭部を有するねじを前記大径貫通孔および前記土台部に設けられた貫通孔を貫通して前記フレーム部にねじ結合することにより連結されることを特徴とする。   Further, the guide part and the base part in the present invention are connected by screwing through a through hole provided in the guide part and screwing into a through hole provided in the base part, and the base part and The frame portion is screw-coupled to the frame portion with a screw having a head having a diameter smaller than that of the large-diameter through hole provided in the guide portion, through the large-diameter through hole and the through-hole provided in the base portion. It is connected by doing.

このように構成することによって、土台部を位置決めされた位置に固定したままガイド部のみを交換することができる。   By comprising in this way, only a guide part can be replaced | exchanged, fixing the base part in the positioned position.

さらに本考案の前記ガイド部、前記土台部および前記フレーム部のうちの少なくとも前記ガイド部と前記土台部はマグネットにより連結されることを特徴とする。   Furthermore, at least the guide part and the base part among the guide part, the base part, and the frame part of the present invention are connected by a magnet.

このように構成することによって、作業者間で取り付け精度にばらつきが発生することを抑制することができる。   By comprising in this way, it can suppress that dispersion | variation generate | occur | produces in attachment accuracy between operators.

さらに本考案の前記ガイド部および前記土台部はポリベンゾイミダゾール、アルミニウム、ポリカーボネートおよびポリエーテルエーテルケトンのうちのいずれかの材質で形成されることを特徴とする。   Furthermore, the guide part and the base part of the present invention are formed of any material selected from polybenzimidazole, aluminum, polycarbonate, and polyetheretherketone.

このように構成することによって、ウエハブロックの耐摩耗性を向上することができる。   By comprising in this way, the abrasion resistance of a wafer block can be improved.

さらに本考案の前記ガイド部はポリベンゾイミダゾールの材質で形成され、前記土台部はアルミニウムの材質で形成されることを特徴とする。   Further, the guide part of the present invention is made of a polybenzimidazole material, and the base part is made of an aluminum material.

このように構成することによって、摩耗する可能性の高い箇所（ガイド部）に対しては耐摩耗性が高い部材を適用し、摩耗する可能性の低い箇所（土台部）に対しては安価な部材を適用することができ、維持費の増加を抑制することができる。   By comprising in this way, a member with high wear resistance is applied to a portion (guide portion) that is highly likely to be worn, and inexpensive to a portion (base portion) that is unlikely to be worn. A member can be applied and an increase in maintenance cost can be suppressed.

以上のように構成される本考案の基板保持部材を用いることにより、ウエハブロックの交換に要する時間を削減し、なおかつ、ウエハブロック交換における作業者間差をなくすと共に維持費の増加を抑制することができる。   By using the substrate holding member of the present invention configured as described above, the time required for exchanging the wafer block is reduced, and the difference between workers in exchanging the wafer block is eliminated and the increase in the maintenance cost is suppressed. Can do.

従来における基板保持部材を装着した基板保持アームを示す概略斜視図である。It is a schematic perspective view which shows the board | substrate holding arm with which the board | substrate holding member in the past was mounted | worn. 本考案に係る基板保持部材を備える基板搬送装置を示す概略斜視図である。It is a schematic perspective view which shows a board | substrate conveyance apparatus provided with the board | substrate holding member which concerns on this invention. 本考案に係る基板保持部材を装着した基板保持アームを示す概略斜視図である。It is a schematic perspective view which shows the board | substrate holding arm equipped with the board | substrate holding member which concerns on this invention. 本考案における土台部を示す斜視図である。It is a perspective view which shows the base part in this invention. 本考案におけるガイド部の斜視図（ａ）、裏面斜視図（ｂ）および側面図（ｃ）である。It is the perspective view (a), back surface perspective view (b), and side view (c) of the guide part in this invention. 本考案におけるガイド部の別の形態を示す斜視図（ａ）および側面図（ｂ）である。It is the perspective view (a) and side view (b) which show another form of the guide part in this invention. 本考案における土台部とガイド部を連結する前の状態の一部を断面で示す分解斜視図である。It is a disassembled perspective view which shows a part of state before connecting the base part and guide part in this invention in a cross section. 本考案における土台部とガイド部を連結した状態を示す斜視図（ａ）および本考案における位置決め凹所と位置決め凸部の嵌合状態を示す腰部拡大断面図（ｂ）である。It is the perspective view (a) which shows the state which connected the base part and guide part in this invention, and the waist part expanded sectional view (b) which shows the fitting state of the positioning recess and positioning convex part in this invention. 本考案に係る基板保持部材をフレーム部に取り付けた状態を示す斜視図（ａ）およびガイド部を取り外した状態を示す斜視図（ｂ）である。It is the perspective view (a) which shows the state which attached the board | substrate holding member based on this invention to the flame | frame part, and the perspective view (b) which shows the state which removed the guide part. 本考案における土台部の別の形態を示す斜視図（ａ）及び本考案におけるガイド部の別の形態を示す裏面斜視図（ｂ）である。It is the perspective view (a) which shows another form of the base part in this invention, and the back surface perspective view (b) which shows another form of the guide part in this invention.

以下に、本考案の実施形態について、添付図面に基づいて詳細に説明する。図２は、本考案に係る半導体ウエハを複数の基板処理ユニットに搬送するための基板搬送装置１０の概観である。この基板搬送装置１０は、複数の駆動軸を有して横移動自在（Ｙ軸）、回転方向自在（θ軸）、昇降自在（Ｚ軸）、水平方向進退自在（Ｘ軸）の動きによりウエハＷのウエハ受渡しを行うように制御される。ここでは、半導体処理装置全体についての詳細は省略する。   Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. FIG. 2 is an overview of a substrate transfer apparatus 10 for transferring a semiconductor wafer according to the present invention to a plurality of substrate processing units. The substrate transfer apparatus 10 has a plurality of drive shafts, and is capable of moving laterally (Y axis), freely rotating (θ axis), freely moving up and down (Z axis), and moving in a horizontal direction (X axis). Control is performed so as to deliver the wafer W. Here, details of the entire semiconductor processing apparatus are omitted.

次に図３について説明する。図３は、本考案における基板保持部材１２を装着した基板保持アーム１１の概観である。基板保持アーム１１は、例えば図３に示すように、直径３００ｍｍの円弧の外周の半周以上に渡って囲む形態を有するフレーム部１００を有し、その内縁の例えば４箇所の位置にはウエハＷの周縁を保持するための４個の基板保持部材１２が設けられている。図３に示す例では、基板保持アーム１１の内縁の円弧の中心位置とウエハＷの中心位置とが揃った状態で、ウエハＷが基板保持アーム１１上に保持されるような位置に４個の基板保持部材１２が取り付けられている。詳細な構成については後述する。   Next, FIG. 3 will be described. FIG. 3 is an overview of the substrate holding arm 11 to which the substrate holding member 12 is mounted in the present invention. For example, as shown in FIG. 3, the substrate holding arm 11 has a frame portion 100 having a shape that encloses over an outer circumference of a circular arc having a diameter of 300 mm, and has, for example, four positions on the inner edge of the wafer W. Four substrate holding members 12 for holding the periphery are provided. In the example illustrated in FIG. 3, four wafers W are held on the substrate holding arm 11 in a state where the center position of the arc of the inner edge of the substrate holding arm 11 and the center position of the wafer W are aligned. A substrate holding member 12 is attached. A detailed configuration will be described later.

なお、本実施の形態では、基板保持アーム１１の４箇所の位置に４個の基板保持部材１２が取り付けられている例を示すが、基板保持部材１２はウエハＷを保持することができる範囲で取り付けられてさえいればよい。   In this embodiment, an example is shown in which four substrate holding members 12 are attached to four positions of the substrate holding arm 11, but the substrate holding member 12 is within a range in which the wafer W can be held. It only has to be attached.

また、基板保持部材１２が基板保持アーム１１の内縁のいずれの箇所に取り付けられる場合にも、保持されるウエハＷの中心が取り付けられる全ての基板保持部材１２を結んで形成される多角形の内側にあることが望ましい。   In addition, when the substrate holding member 12 is attached to any position on the inner edge of the substrate holding arm 11, the inside of the polygon formed by connecting all the substrate holding members 12 to which the center of the wafer W to be held is attached. It is desirable to be in

次に図４および図５Ａについて説明する。図４は本考案における基板保持部材１２を構成する土台部２０について示し、また、図５Ａは本考案における基板保持部材１２を構成するガイド部３０について示す。   Next, FIG. 4 and FIG. 5A will be described. 4 shows the base portion 20 constituting the substrate holding member 12 in the present invention, and FIG. 5A shows the guide portion 30 constituting the substrate holding member 12 in the present invention.

土台部２０は、断面が扁平矩形の円弧状に形成されており、フレーム部１００の上方に土台部２０を大径ねじ４１で結合するための大径挿通孔２１、後述するガイド部３０を土台部２０の上方に結合する際に位置決めを行うための２個の位置決め凹部２２およびガイド部３０と土台部２０を小径ねじ４２で結合するための小径挿通孔２３を備える。なお、２個の位置決め凹部２２は一方が略円に等しい形状を有し、他方を楕円形状としてもよい。これにより後述する位置決め凸部３２の公差や変形による嵌合不備を防止することができる。   The base portion 20 is formed in an arc shape having a flat rectangular cross section, and a large-diameter insertion hole 21 for connecting the base portion 20 with a large-diameter screw 41 above the frame portion 100 and a guide portion 30 described later are the base. There are provided two positioning recesses 22 for positioning when coupled above the portion 20 and a small diameter insertion hole 23 for coupling the guide portion 30 and the base portion 20 with a small diameter screw 42. One of the two positioning recesses 22 may have a shape substantially equal to a circle, and the other may have an elliptical shape. Thereby, the fitting defect by the tolerance and deformation | transformation of the positioning convex part 32 mentioned later can be prevented.

図５Ａ（ａ），（ｂ）および（ｃ）に示すように、ガイド部３０は、断面が扁平矩形の円弧状の基部３０ａの内周側の辺部に土台部２０の内周辺部に係合する段部３０ｂを有し、基部３０ａにおける大径挿通孔２１と対応する位置に設けられ大径ねじ４１が貫通可能な径を持つ大径貫通孔３１、位置決め凹部２２に対応する位置に設けられた位置決め凸部３２および小径挿通孔２３と対応する位置に設けられガイド部３０と土台部２０を結合するための小径貫通孔３３を有している。この場合、大径貫通孔３１は大径挿通孔２１および大径挿通孔２１にねじ結合する取付ねじ４３の頭部より大径に形成されている。また、ガイド部３０は、基板非接触部位３４を有しウエハＷの端面の接触面積を抑えるように構成され、さらにウエハＷがずれていた場合には基板非接触部位３４の両端に設けられる傾斜部３５によって受け止めてウエハＷを下方に落とし込むように構成されている。これにより、ウエハＷはフレーム部１００の４箇所に装着された基板保持部材１２の規制面３６によって規制されて保持される。また、当接部３７は基板非接触部位３４から伸びる支持受け部３８の先端に設けられている。   As shown in FIGS. 5A (a), (b) and (c), the guide portion 30 is engaged with the inner peripheral side of the base portion 20 on the inner peripheral side portion of the arc-shaped base portion 30a having a flat rectangular cross section. A large diameter through-hole 31 having a diameter through which the large-diameter screw 41 can pass, provided in a position corresponding to the large-diameter insertion hole 21 in the base 30a, and provided in a position corresponding to the positioning recess 22. A small-diameter through-hole 33 is provided at a position corresponding to the positioning convex portion 32 and the small-diameter insertion hole 23 provided to couple the guide portion 30 and the base portion 20 together. In this case, the large-diameter through hole 31 is formed to have a larger diameter than the large-diameter insertion hole 21 and the head of the mounting screw 43 that is screwed to the large-diameter insertion hole 21. Further, the guide portion 30 has a substrate non-contact portion 34 and is configured to suppress the contact area of the end surface of the wafer W. Further, when the wafer W is displaced, the guide portion 30 is inclined at both ends of the substrate non-contact portion 34. The wafer W is received by the portion 35 and dropped down. As a result, the wafer W is regulated and held by the regulation surfaces 36 of the substrate holding member 12 mounted at four locations of the frame unit 100. The contact portion 37 is provided at the tip of a support receiving portion 38 extending from the substrate non-contact portion 34.

ちなみに、上記実施の形態において、支持受け部３８は、図５Ｂに示すように当接部３７を設けず先端に向かうに従って下降するように角度をつけてもよい。すなわち、支持受け部３８は保持したウエハＷの内周方向に向かって下り勾配に形成されていてもよい。また、土台部２０およびガイド部３０は、例えばポリベンゾイミダゾール、アルミニウム、ポリカーボネートおよびポリエーテルエーテルケトンのいずれかの材質で形成されてもよい。さらに土台部２０はアルミニウムの材質で形成され、ガイド部３０はポリベンゾイミダゾールの材質で形成されてもよい。   Incidentally, in the above embodiment, the support receiving portion 38 may be angled so as to descend toward the tip without providing the contact portion 37 as shown in FIG. 5B. That is, the support receiving portion 38 may be formed in a downward gradient toward the inner peripheral direction of the held wafer W. Moreover, the base part 20 and the guide part 30 may be formed of any material of, for example, polybenzimidazole, aluminum, polycarbonate, and polyetheretherketone. Further, the base portion 20 may be formed of an aluminum material, and the guide portion 30 may be formed of a polybenzimidazole material.

次に図６Ａ〜図６Ｃを参照して、本考案における基板保持部材１２をフレーム部１００に取り付ける手順およびガイド部３０を交換する手順について示している。まず、図６Ａに示す状態から図６Ｂ（ｂ）に示すように、位置決め凹部２２に位置決め凸部３２を嵌めこむ。次に、図６Ｂに示すように、小径ねじ４２を小径貫通孔３３に貫通させ、小径挿通孔２３にねじ結合する。そして、図６Ｃ（ａ）に示すように、取付ねじ４３を大径貫通孔３１を介して大径挿通孔２１に貫通させ、フレーム部１００に形成された、大径挿通孔２１に対応する位置に設けられた図示しない挿通孔にねじ結合する。これにより、作業者間で取り付け精度にばらつきが発生するのを抑制することができる。   Next, with reference to FIGS. 6A to 6C, a procedure for attaching the substrate holding member 12 to the frame portion 100 and a procedure for replacing the guide portion 30 in the present invention will be described. First, as shown in FIG. 6B (b), the positioning convex portion 32 is fitted into the positioning concave portion 22 from the state shown in FIG. 6A. Next, as shown in FIG. 6B, the small-diameter screw 42 is passed through the small-diameter through hole 33 and screwed to the small-diameter insertion hole 23. Then, as shown in FIG. 6C (a), the attachment screw 43 is passed through the large-diameter insertion hole 21 via the large-diameter through-hole 31, and the position corresponding to the large-diameter insertion hole 21 formed in the frame portion 100. And is screwed into an insertion hole (not shown) provided in. Thereby, it can suppress that dispersion | variation generate | occur | produces in attachment accuracy between operators.

また、ガイド部３０を交換する場合は、図６Ｃ（ａ）の状態から小径ねじ４２のみを取り外した後、図６Ｃ（ｂ）に示すように、土台部２０はフレーム部１００に固定されたままガイド部３０のみを交換することができる。これにより、摩耗したガイド部３０のみを交換することができる。   When the guide portion 30 is replaced, after removing only the small diameter screw 42 from the state of FIG. 6C (a), the base portion 20 remains fixed to the frame portion 100 as shown in FIG. 6C (b). Only the guide part 30 can be replaced. Thereby, only the worn guide part 30 can be replaced.

なお、上記実施の形態において、フレーム部１００、土台部２０およびガイド部３０は夫々ねじを用いて結合したが、少なくとも土台部２０とガイド部３０はマグネットを用いて連結してもよい。   In the above embodiment, the frame part 100, the base part 20, and the guide part 30 are coupled using screws, but at least the base part 20 and the guide part 30 may be connected using magnets.

例えば、図７に示すように、土台部２０の上面側の一部に磁性部５１を設け、ガイド部３０における磁性部５１と対応する位置に磁性部５１に吸着可能なマグネット５０を設けて、フレーム部１００に固定された土台部２０に対してガイド部３０を着脱可能に連結するようにしてもよい。なお、マグネット５０を土台部２０に設け、磁性部５１をガイド部３０に設けてもよい。また、土台部２０とフレーム部１００とを同様にマグネットを利用して連結するようにしてもよい。   For example, as shown in FIG. 7, a magnetic part 51 is provided on a part of the upper surface side of the base part 20, and a magnet 50 that can be attracted to the magnetic part 51 is provided at a position corresponding to the magnetic part 51 in the guide part 30. You may make it connect the guide part 30 with respect to the base part 20 fixed to the flame | frame part 100 so that attachment or detachment is possible. The magnet 50 may be provided on the base portion 20 and the magnetic portion 51 may be provided on the guide portion 30. Moreover, you may make it connect the base part 20 and the frame part 100 similarly using a magnet.

図７において、その他の部分は上記実施形態と同じであるので、同一部分には同一符号を付して説明は省略する。   In FIG. 7, the other parts are the same as in the above embodiment, so the same parts are denoted by the same reference numerals and description thereof is omitted.

以上、本考案の好ましい実施の形態について記述したが、本考案は係る特定の実施の形態に限定されるものではなく、実用新案登録請求の範囲に記載された本考案の要旨の範囲内において、種々の変形・変更が可能である。   The preferred embodiments of the present invention have been described above, but the present invention is not limited to such specific embodiments, and within the scope of the present invention described in the claims of the utility model registration, Various modifications and changes are possible.

また、本考案は、塗布現像装置のみならず、基板洗浄装置、成膜装置、エッチング装置、接着・剥離装置その他の各種装置に適用することが可能である。また、本考案は、半導体基板ガラス基板その他の各種基板を搬送する装置に適用することが可能である。   The present invention can be applied not only to a coating and developing apparatus, but also to a substrate cleaning apparatus, a film forming apparatus, an etching apparatus, an adhesion / peeling apparatus, and other various apparatuses. Further, the present invention can be applied to an apparatus for transporting a semiconductor substrate glass substrate and other various substrates.

Ｗ ウエハ（基板）
１１ 基板保持アーム
１２ 基板保持部材
２０ 土台部
２１ 大径挿通孔
２３ 小径挿通孔
３０ ガイド部
３１ 大径貫通孔
３３ 小径貫通孔
３８ 支持受け部
４１ 大径ねじ
４２ 小径ねじ
４３ 取付ねじ
１００ フレーム部 W Wafer (Substrate)
11 Substrate holding arm 12 Substrate holding member 20 Base portion 21 Large diameter insertion hole 23 Small diameter insertion hole 30 Guide portion 31 Large diameter through hole 33 Small diameter through hole 38 Support receiving portion 41 Large diameter screw 42 Small diameter screw 43 Mounting screw 100 Frame portion

Claims (7)

基板の外周をその半周以上に渡って囲む形態を有するフレーム部を備える基板保持アームに取り付けられ、基板の周縁を載置して該基板を保持する基板保持部材であって、
前記フレーム部上に取り付けられる土台部と、
前記土台部上に取り付けられ基板の周縁部を滑降させて所定位置に案内するガイド部と、を備え、
前記土台部と前記ガイド部は互いに嵌合する位置決め凹部と位置決め凸部を介して着脱可能に連結されることを特徴とする基板保持部材。 A substrate holding member that is attached to a substrate holding arm including a frame portion having a form that surrounds the outer periphery of the substrate over more than half of its circumference, and holds the substrate by placing the periphery of the substrate,
A base part mounted on the frame part;
A guide part that is mounted on the base part and slides down the peripheral part of the substrate and guides it to a predetermined position;
The substrate holding member, wherein the base portion and the guide portion are detachably connected to each other via a positioning concave portion and a positioning convex portion that are fitted to each other. 前記ガイド部は、前記フレーム部の内周方向に向かって伸びる支持受け部を備え、
前記支持受け部の先端には基板裏面と当接し、基板を支持する当接部を備えることを特徴とする請求項１記載の基板保持部材。 The guide portion includes a support receiving portion extending toward the inner peripheral direction of the frame portion,
The substrate holding member according to claim 1, further comprising a contact portion that contacts the back surface of the substrate and supports the substrate at a tip of the support receiving portion. 前記ガイド部は、前記フレーム部の内周方向に向かって伸びる支持受け部を備え、
前記支持受け部は基板の内周方向に向かって下り勾配に形成されることを特徴とする請求項１記載の基板保持部材。 The guide portion includes a support receiving portion extending toward the inner peripheral direction of the frame portion,
The substrate holding member according to claim 1, wherein the support receiving portion is formed in a downward gradient toward the inner peripheral direction of the substrate. 前記ガイド部と前記土台部は、ねじを前記ガイド部に設けられた貫通孔を貫通して前記土台部に設けられた挿通孔にねじ結合することにより連結され、前記土台部と前記フレーム部は、前記ガイド部に設けられた大径貫通孔より小径の頭部を有するねじを前記大径貫通孔および前記土台部に設けられた貫通孔を貫通して前記フレーム部にねじ結合することにより連結されることを特徴とする請求項１ないし３のいずれかに記載の基板保持部材。   The guide part and the base part are connected by screwing a screw through a through hole provided in the guide part and screwing into an insertion hole provided in the base part, and the base part and the frame part are A screw having a head smaller in diameter than the large-diameter through hole provided in the guide portion is connected by screwing to the frame portion through the large-diameter through hole and the through-hole provided in the base portion. The substrate holding member according to any one of claims 1 to 3, wherein the substrate holding member is formed. 前記ガイド部、前記土台部および前記フレーム部のうちの少なくとも前記ガイド部と前記土台部はマグネットにより連結されることを特徴とする請求項１ないし３のいずれかに記載の基板保持部材。   4. The substrate holding member according to claim 1, wherein at least the guide part and the base part of the guide part, the base part, and the frame part are connected by a magnet. 5. 前記ガイド部および前記土台部はポリベンゾイミダゾール、アルミニウム、ポリカーボネートおよびポリエーテルエーテルケトンのうちのいずれかの材質で形成されることを特徴とする請求項１記載の基板保持部材。   The substrate holding member according to claim 1, wherein the guide portion and the base portion are made of any one of polybenzimidazole, aluminum, polycarbonate, and polyetheretherketone. 前記ガイド部はポリベンゾイミダゾールの材質で形成され、前記土台部はアルミニウムの材質で形成されることを特徴とする請求項６記載の基板保持部材。   The substrate holding member according to claim 6, wherein the guide portion is made of a polybenzimidazole material, and the base portion is made of an aluminum material.
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JP2014197625A (en) * 2013-03-29 2014-10-16 東京エレクトロン株式会社 Adjustment tool for substrate transport mechanism and adjustment method using adjustment tool
JP2016167531A (en) * 2015-03-10 2016-09-15 株式会社荏原製作所 Substrate transfer hand
JP2017539089A (en) * 2014-11-26 2017-12-28 フォン アルデンヌ ゲーエムベーハー Substrate holding device, substrate transport device, processing arrangement, and method for processing a substrate

Family Cites Families (5)

* Cited by examiner, † Cited by third party
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JP2003142554A (en) * 2002-10-16 2003-05-16 Dainippon Screen Mfg Co Ltd Substrate-retaining apparatus and substrate-conveying apparatus
KR20060127505A (en) * 2005-06-07 2006-12-13 삼성전자주식회사 Device for transferring wafer
KR20070048937A (en) * 2005-11-07 2007-05-10 세메스 주식회사 Apparatus for transfer wafer
KR101534357B1 (en) * 2009-03-31 2015-07-06 도쿄엘렉트론가부시키가이샤 Substrate support device and substrate support method
JP2010258170A (en) 2009-04-23 2010-11-11 Tokyo Electron Ltd Substrate holding member, substrate transfer arm, and substrate carrier

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014197625A (en) * 2013-03-29 2014-10-16 東京エレクトロン株式会社 Adjustment tool for substrate transport mechanism and adjustment method using adjustment tool
JP2017539089A (en) * 2014-11-26 2017-12-28 フォン アルデンヌ ゲーエムベーハー Substrate holding device, substrate transport device, processing arrangement, and method for processing a substrate
US10770324B2 (en) 2014-11-26 2020-09-08 VON ARDENNE Asset GmbH & Co. KG Substrate holding device, substrate transport device, processing arrangement and method for processing a substrate
JP2016167531A (en) * 2015-03-10 2016-09-15 株式会社荏原製作所 Substrate transfer hand

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