JP3179086U7 - - Google Patents
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- Publication number
- JP3179086U7 JP3179086U7 JP2012002117U JP2012002117U JP3179086U7 JP 3179086 U7 JP3179086 U7 JP 3179086U7 JP 2012002117 U JP2012002117 U JP 2012002117U JP 2012002117 U JP2012002117 U JP 2012002117U JP 3179086 U7 JP3179086 U7 JP 3179086U7
- Authority
- JP
- Japan
- Prior art keywords
- fins
- recessed
- exchange system
- heat exchange
- manifold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201161512379P | 2011-07-27 | 2011-07-27 | |
US61/512,379 | 2011-07-27 | ||
US13/401,618 US9453691B2 (en) | 2007-08-09 | 2012-02-21 | Fluid heat exchange systems |
US13/401,618 | 2012-02-21 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP3179086U JP3179086U (ja) | 2012-10-18 |
JP3179086U7 true JP3179086U7 (fr) | 2014-06-05 |
Family
ID=46705693
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012002117U Expired - Lifetime JP3179086U (ja) | 2011-07-27 | 2012-04-11 | 流体熱交換システム |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP3179086U (fr) |
DE (1) | DE202012002974U1 (fr) |
TW (1) | TWI606224B (fr) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10365667B2 (en) | 2011-08-11 | 2019-07-30 | Coolit Systems, Inc. | Flow-path controllers and related systems |
US10364809B2 (en) | 2013-03-15 | 2019-07-30 | Coolit Systems, Inc. | Sensors, multiplexed communication techniques, and related systems |
JP6124742B2 (ja) | 2013-09-05 | 2017-05-10 | 三菱電機株式会社 | 半導体装置 |
US9445526B2 (en) * | 2014-12-22 | 2016-09-13 | Toyota Motor Engineering & Manufacturing North America, Inc. | Modular jet impingement assemblies with passive and active flow control for electronics cooling |
US11452243B2 (en) | 2017-10-12 | 2022-09-20 | Coolit Systems, Inc. | Cooling system, controllers and methods |
DE102018125375A1 (de) * | 2018-10-14 | 2020-04-16 | Han Xu Hardware Plastic Technological Co., Ltd. | Wassergekühlte hocheffizienz-wärmeableitungsvorrichtung |
US11662037B2 (en) | 2019-01-18 | 2023-05-30 | Coolit Systems, Inc. | Fluid flow control valve for fluid flow systems, and methods |
US11473860B2 (en) | 2019-04-25 | 2022-10-18 | Coolit Systems, Inc. | Cooling module with leak detector and related systems |
DE102020207966A1 (de) * | 2019-11-25 | 2021-05-27 | Volkswagen Aktiengesellschaft | Kühlanordnung für elektronische Komponenten eines Kraftfahrzeugs |
EP4150216A4 (fr) | 2020-05-11 | 2023-11-01 | Coolit Systems, Inc. | Unités de pompage de liquide, et systèmes et procédés associés |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4561040A (en) * | 1984-07-12 | 1985-12-24 | Ibm Corporation | Cooling system for VLSI circuit chips |
JPH10173114A (ja) * | 1996-12-13 | 1998-06-26 | Hitachi Ltd | マルチチップモジュールの冷却構造 |
JP4141613B2 (ja) * | 2000-03-09 | 2008-08-27 | 富士通株式会社 | 密閉サイクル冷凍装置および密閉サイクル冷凍装置用乾式蒸発器 |
JP2003243581A (ja) * | 2002-02-15 | 2003-08-29 | Fujikura Ltd | ヒートシンク |
WO2005096377A1 (fr) * | 2004-03-31 | 2005-10-13 | Hydrocool Pty Limited | Echangeur de chaleur |
JP2005351600A (ja) * | 2004-06-14 | 2005-12-22 | Nikkei Nekko Kk | アルミ製熱交換器及びそのスケール付着防止方法 |
JP2007180505A (ja) * | 2005-12-02 | 2007-07-12 | Matsushita Electric Ind Co Ltd | 電子部品の冷却装置 |
US7331378B2 (en) * | 2006-01-17 | 2008-02-19 | Delphi Technologies, Inc. | Microchannel heat sink |
WO2007104580A2 (fr) * | 2006-03-16 | 2007-09-20 | Behr Gmbh & Co. Kg | Échangeur thermique pour véhicule automobile |
JP4797954B2 (ja) * | 2006-11-30 | 2011-10-19 | アイコム株式会社 | 放熱フィンの冷却構造 |
US7762314B2 (en) * | 2007-04-24 | 2010-07-27 | International Business Machines Corporation | Cooling apparatus, cooled electronic module and methods of fabrication employing a manifold structure with interleaved coolant inlet and outlet passageways |
JP2011114206A (ja) * | 2009-11-27 | 2011-06-09 | Ryosan Co Ltd | フィン一体型ヒートシンク |
-
2012
- 2012-03-22 DE DE202012002974U patent/DE202012002974U1/de not_active Expired - Lifetime
- 2012-03-23 TW TW101110072A patent/TWI606224B/zh active
- 2012-04-11 JP JP2012002117U patent/JP3179086U/ja not_active Expired - Lifetime
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