JP3167034U - Light emitting diode module structure - Google Patents

Abstract

There is provided a light emitting diode module structure which can be directly connected to a power supply and applied as a lamp without requiring an externally provided driver IC or other circuits. A light emitting diode module structure includes a lead frame provided with an electrode contact on one side, and at least one input end and an output end joined on the lead frame, wherein the input end is connected to the lead frame. A driver IC 2 electrically connected to the electrode contacts 11 and 12, a light emitting diode 3 bonded on the lead frame 1 and electrically connected to an output end of the driver IC 2, and a transparent structure in which a colloid is solidified. And a package 4 that is bonded on the lead frame 1 and covers the light emitting diode 3 to give an optical effect to the light emitting diode 3. [Selection diagram] FIG.

Description

  The present invention relates to a light source module, and more particularly, to a light emitting diode module structure that can be directly connected to a power source and applied as a lamp without the need for an external driver IC or other circuit.

  Generally, a package structure of a light emitting diode module structure includes a lead frame used for mounting the light emitting diode. The lead frame is made of an aluminum plate, a ceramic plate or a glass fiber plate, and electrode contacts are provided on the plate surface of the lead frame. In addition, one or more light emitting diodes (LEDs) are joined on the plate surface of the lead frame and are electrically connected to the electrode contacts. Moreover, after the sealing material is filled on the light emitting diode and solidified, it becomes a transparent structure for sealing the light emitting diode. The transparent structure gives a predetermined optical action to the light emitting diode.

  Generally, when the light emitting diode module structure is actually applied to a lamp, a voltage and a current corresponding to the light emitting diode must be applied. Therefore, the downstream company must stabilize the voltage and current using a driver IC, a resistor, and the like in advance without directly connecting a power source to the light emitting diode module structure. However, in the conventional lamp, elements such as a driver IC and a resistor are not directly joined on the substrate of the light emitting diode module structure but are arranged in the lamp. That is, the conventional light emitting diode module structure sealed with the above-described sealing material cannot be applied to a lamp due to a direct energization method. Therefore, the conventional light emitting diode module structure has a narrow application range, and it has been difficult to widely disseminate it to downstream contractors.

  Therefore, the present invention can simplify the package structure of the light emitting diode module structure, and can directly apply power, so that the light emitting diode module structure can be directly applied to the lamp without arranging a circuit in the lamp. Is disclosed.

  A main object of the present invention is to manufacture a light emitting diode module structure that can be directly energized by bonding at least one light emitting diode and a package to the lead frame because a driver IC and a resistor are arranged in advance on the lead frame. An object of the present invention is to provide a light emitting diode module structure having a wide application range.

  In order to solve the above-described problem, according to the first aspect of the present invention, a lead frame provided with an electrode contact on one side thereof, and joined on the lead frame, has at least one input end and output end, The input end is a driver IC electrically connected to the electrode contact of the lead frame, a light emitting diode joined to the lead frame and electrically connected to the output end of the driver IC, and a colloid is solidified. A light emitting diode module structure comprising: a transparent structure, and a package that is bonded onto the lead frame and covers the light emitting diode to provide an optical action to the light emitting diode. The

  In addition, it is preferable to further include at least one resistor that is joined to the lead frame, electrically connected between the output terminal of the driver IC and the light emitting diode, and disposed outside the package. .

  The driver IC, the light emitting diode, the package, and the resistor are preferably disposed on one side of the lead frame.

  In the lead frame, the driver IC and the resistor are preferably disposed on one surface, and the light emitting diode and the package are disposed on the other surface.

  The driver IC, the light emitting diode, the package, and the resistor are preferably disposed on both sides of the lead frame.

  Preferably, a ring body is joined to the lead frame, the light emitting diode is disposed in the ring body, and the package is filled in the ring body.

  The lead frame is preferably provided with a recess, the light emitting diode is disposed in the recess, and the package is preferably filled in the recess.

  A plurality of the light emitting diodes are preferably arranged.

  The lead frame is preferably a circular plate.

  The lead frame is preferably a strip-shaped plate.

  Since the light emitting diode module structure of the present invention is a design in which a driver IC and a resistor are arranged in advance on a lead frame, a downstream contractor supplied with the lead frame joins at least one light emitting diode and package to the lead frame. Thus, a light emitting diode module structure that can be directly energized can be manufactured. Therefore, the light emitting diode module structure of the present invention has a wide range of applications.

1 is a perspective view showing a lead frame of a light emitting diode module structure according to a first embodiment of the present invention; 1 is an exploded perspective view illustrating a light emitting diode module structure according to a first embodiment of the present invention; 1 is a perspective view showing a light emitting diode module structure according to a first embodiment of the present invention; FIG. 4 is a sectional view taken along line A-A ′ of FIG. 3. FIG. 5 is a perspective view illustrating a light emitting diode module structure according to a second embodiment of the present invention. FIG. 6 is a cross-sectional view taken along line B-B ′ of FIG. 5. FIG. 6 is a perspective view illustrating a light emitting diode module structure according to a third embodiment of the present invention. FIG. 8 is a cross-sectional view taken along line C-C ′ of FIG. 7. FIG. 10 is a perspective view illustrating a light emitting diode module structure according to a fourth embodiment of the present invention. FIG. 10 is a cross-sectional view taken along line D-D ′ of FIG. 9. FIG. 9 is a perspective view illustrating a light emitting diode module structure according to a fifth embodiment of the present invention. It is sectional drawing along line E-E 'of FIG. FIG. 10 is a perspective view illustrating a light emitting diode module structure according to a sixth embodiment of the present invention. It is sectional drawing along line F-F 'of FIG. FIG. 10 is a perspective view illustrating a light emitting diode module structure according to a seventh embodiment of the present invention. FIG. 16 is a cross-sectional view taken along line G-G ′ of FIG. 15.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. Note that the present invention is not limited thereby.

(First embodiment)
Please refer to FIGS. As shown in FIGS. 1 to 4, the light emitting diode module structure according to the first embodiment of the present invention includes a lead frame 1, a driver IC 2, at least one light emitting diode 3 and a package 4. The lead frame 1 (Lead frame) is a plate having a circular shape or other shapes. On one side of the lead frame 1, positive and negative electrode contacts 11, 12 to which a DC power source is connected and necessary circuits are provided. The driver IC 2 includes at least one input end and an output end, and is joined to the lead frame 1. The input end of the driver IC 2 is electrically connected to the electrode contact 11 of the lead frame 1 and used for connecting to a DC power source. The light emitting diode 3 and the package 4 are joined to the lead frame 1. The light emitting diode 3 is a bare chip or a sealed chip. The light emitting diode 3 is electrically connected to the output end of the driver IC 2 and the electrode contact 12 of the lead frame 1. The package 4 is a transparent structure obtained by solidifying an epoxy resin or other colloid. The package 4 is formed in a semicircular shape or other shapes, and covers the light emitting diode 3 to give a predetermined optical action to the light emitting diode 3. With the above structure, the light emitting diode module structure according to the first embodiment of the present invention is configured.

  Reference is again made to FIGS. As shown in FIGS. 1 to 4, at least one resistor 5 is further joined on the lead frame 1 of the light emitting diode module structure according to the first embodiment of the present invention. The resistor 5 is electrically connected between the output terminal of the driver IC 2 and the light emitting diode 3 and is disposed outside the package 4.

  As shown in FIGS. 1 to 4, in the light emitting diode module structure according to the first embodiment of the present invention, the driver IC 2 and the resistor 5 described above are arranged on the same side of the lead frame 1. In addition, one or a plurality of light emitting diodes 3 and a package 4 are joined on the same surface as the surface on which the driver IC 2 and the resistor 5 of the lead frame 1 are arranged by an associated supplier who is supplied with the lead frame 1.

(Second Embodiment)
Please refer to FIG. 5 and FIG. As shown in FIGS. 5 and 6, in the light emitting diode module structure according to the second embodiment of the present invention, the driver IC 2 and the resistor 5 are disposed on one surface of the lead frame 1. In addition, one or a plurality of light emitting diodes 3 and a package 4 are joined on the other surface of the lead frame 1 by a related contractor supplied with the lead frame 1.

(Third embodiment)
Please refer to FIG. 7 and FIG. As shown in FIGS. 7 and 8, in the light emitting diode module structure according to the third embodiment of the present invention, the driver IC 2, the resistor 5, and the light emitting diode 3 are disposed on both sides of the lead frame 1, respectively. In addition, one or a plurality of packages 4 are joined to both sides of the lead frame 1 by an associated contractor supplied with the lead frame.

(Fourth embodiment)
Please refer to FIG. 9 and FIG. As shown in FIGS. 9 and 10, in the light emitting diode module structure according to the fourth embodiment of the present invention, the plurality of light emitting diodes 3 are joined on the lead frame 1, thereby increasing the luminance of the light emitting diode module structure. It is done. The plurality of light emitting diodes 3 are connected in series or in parallel. Alternatively, first, one light emitting diode group in which a plurality of light emitting diodes 3 are connected in series and the other light emitting diode group in which a plurality of light emitting diodes 3 are connected in series may be connected in parallel. Thereby, the brightness | luminance of a light emitting diode module structure is raised.

(Fifth embodiment)
Please refer to FIG. 11 and FIG. As shown in FIGS. 11 and 12, in the light emitting diode module structure according to the fifth embodiment of the present invention, the ring portion 13 is joined to one side or both sides of the lead frame 1 in order to stabilize the package structure. Thereby, the operation | work which arrange | positions the one or several light emitting diode 3 on the lead frame 1 in the ring part 13, and fills the package 4 in the ring part 13 and solidifies can be simplified.

(Sixth embodiment)
Please refer to FIG. 13 and FIG. As shown in FIGS. 13 and 14, in the light emitting diode module structure according to the sixth embodiment of the present invention, the recess 14 is provided on one side or both sides of the lead frame 1. Thus, after one or more light emitting diodes 3 are arranged in the recess 14, the package 4 is filled in the recess 14 and solidified.

  Due to the structure of the ring portion 13 or the concave portion 14 described above, when a related contractor joins the light emitting diode 3 and the package 4 to the lead frame 1, the work of solidifying the package 4 can be simplified and the lead frame 1 emits light. The diode 3 and the package 4 can be stably joined.

(Seventh embodiment)
Please refer to FIG. 15 and FIG. As shown in FIGS. 15 and 16, the lead frame 1 of the light emitting diode module structure according to the seventh embodiment of the present invention is a belt-like plate. Further, the driver IC 2 and the resistor 5 described above are arranged on one side or both sides of the lead frame 1. In addition, a plurality of light emitting diodes 3 are arranged and bonded to one side or both sides of the lead frame 1 by an associated supplier to which the lead frame 1 is supplied. The colloid of the package 4 is filled on the light emitting diode 3 to form a transparent structure. The transparent package 4 gives a predetermined optical action to the light emitting diode 3. The light emitting diode module structure of the present invention may be constituted by the above structure.

  The package structure of the light emitting diode module structure of the present invention is such that the driver IC 2 and the resistor 5 are directly joined to one side or both sides of the lead frame 1 so that the light emitting diode 3 ( A bare chip or a sealed chip) can be directly bonded and sealed by the package 4. Thereby, the structure can be simplified and the cost can be reduced. Here, with the package structure of the light emitting diode module structure of the present invention, the voltage and current can be stabilized by the driver IC 2 when the electrode contacts 11 and 12 of the lead frame 1 are directly energized. Can emit light. That is, since the light emitting diode module structure of the present invention can be directly energized, a downstream trader or user can directly apply the light emitting diode module structure of the present invention to a lamp. That is, the light emitting diode module structure of the present invention has high applicability.

  The preferred embodiments of the present invention have been disclosed as described above so that those skilled in the art can understand them, but these do not limit the present invention in any way. Various changes and modifications can be made without departing from the spirit and scope of the present invention. Therefore, the scope of claims for utility model registration of the present invention should be broadly interpreted including such changes and modifications.

  In terms of industrial applicability, products using the light emitting diode module structure of the present invention can meet the demand of the light emitting diode industry.

1 Lead frame 2 Driver IC
3 Light emitting diode 4 Package 5 Resistance 11 Electrode contact 12 Electrode contact 13 Ring part 14 Recess

Claims (10)

A lead frame provided with electrode contacts on one side;
A driver IC joined on the lead frame and having at least one input end and output end, the input end being electrically connected to an electrode contact of the lead frame;
A light emitting diode bonded on the lead frame and electrically connected to the output end of the driver IC;
A light emitting diode module structure comprising: a transparent structure in which a colloid is solidified, and a package which is bonded onto the lead frame and covers the light emitting diode to give an optical action to the light emitting diode. .   The semiconductor device further includes at least one resistor that is joined to the lead frame, electrically connected between the output terminal of the driver IC and the light emitting diode, and disposed outside the package. The light emitting diode module structure according to claim 1.   3. The light emitting diode module structure according to claim 2, wherein the driver IC, the light emitting diode, the package, and the resistor are disposed on one side of the lead frame.   The light emitting diode module structure according to claim 2, wherein the driver IC and the resistor are disposed on one surface of the lead frame, and the light emitting diode and the package are disposed on the other surface.   3. The light emitting diode module structure according to claim 2, wherein the driver IC, the light emitting diode, the package, and the resistor are respectively disposed on both surfaces of the lead frame. A ring body is joined to the lead frame,
The light emitting diode is disposed in the ring;
6. The light emitting diode module structure according to claim 1, wherein the package is filled in the ring body. The lead frame is provided with a recess,
The light emitting diode is disposed in the recess;
6. The light emitting diode module structure according to claim 1, wherein the package is filled in the recess.   The light emitting diode module structure according to claim 1, wherein a plurality of the light emitting diodes are arranged.   The light emitting diode module structure according to claim 1, wherein the lead frame is a circular plate.   The light emitting diode module structure according to claim 1, wherein the lead frame is a belt-shaped plate.

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