JP3165820B2 - Method and apparatus for cutting circuit board - Google Patents

Method and apparatus for cutting circuit board

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Publication number
JP3165820B2
JP3165820B2 JP33673492A JP33673492A JP3165820B2 JP 3165820 B2 JP3165820 B2 JP 3165820B2 JP 33673492 A JP33673492 A JP 33673492A JP 33673492 A JP33673492 A JP 33673492A JP 3165820 B2 JP3165820 B2 JP 3165820B2
Authority
JP
Japan
Prior art keywords
circuit board
cutting
groove
cutters
cutter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP33673492A
Other languages
Japanese (ja)
Other versions
JPH06155379A (en
Inventor
利昭 山本
洋行 大平
勉 安井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Priority to JP33673492A priority Critical patent/JP3165820B2/en
Publication of JPH06155379A publication Critical patent/JPH06155379A/en
Application granted granted Critical
Publication of JP3165820B2 publication Critical patent/JP3165820B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、電子部品を複数個取り
の一枚ものに形成した広面積の回路基板に実装すること
により回路構成した後、当該基板を各回路単位に切断す
るのに適用される回路基板の切断方法及び装置に関する
ものである。
BACKGROUND OF THE INVENTION The present invention relates to a method for cutting a circuit board into individual circuit units after mounting a plurality of electronic parts on a large-area circuit board formed on a single circuit board. The present invention relates to a circuit board cutting method and apparatus to be applied.

【0002】[0002]

【従来の技術】一般に、回路組立体の生産性を高めるべ
く、回路基板を複数個取りの広面積な一枚ものに形成
し、所定の電子部品を実装させて回路構成した後、その
回路基板を各回路単位に切断することにより回路組立体
として製造することが行なわれている。
2. Description of the Related Art Generally, in order to increase the productivity of a circuit assembly, a plurality of circuit boards are formed on a single large-area circuit board, and predetermined electronic components are mounted thereon to form a circuit. Is cut into individual circuit units to produce a circuit assembly.

【0003】従来、この回路組立体の製造にあたり、回
路基板としては分割の基準線となるV溝を上下対の回転
カッターで板面に予め設けたものが用いられている。ま
た、電子部品を実装後に押切り装置の回転カッターでV
溝に沿って切断することにより各回路単位に分割するよ
うにされている。
Conventionally, in manufacturing this circuit assembly, a circuit board in which a V-groove serving as a reference line for division is provided in advance on a plate surface by a pair of upper and lower rotary cutters is used. After mounting the electronic components, V
By cutting along the groove, it is divided into each circuit unit.

【0004】然し、これでは部品実装後の回路基板を押
切り装置で切断するときに回転カッターの各刃先をV溝
と位置合せし難く、ストレスが回路基板に加わることか
ら回路基板の実装部品に悪影響を及ぼす虞れがある。
However, in this case, it is difficult to align each cutting edge of the rotary cutter with the V-groove when cutting the circuit board after component mounting by the push-off device, and stress is applied to the circuit board. There is a risk of adverse effects.

【0005】[0005]

【発明が解決しようとする課題】本発明は、カッター刃
のV溝に対する位置ズレや回路基板の送り速度に対する
カッター刃の周速ズレ等を発生させず、機械的なストレ
スを回路基板に与えないで回路基板を効率よく円滑に切
断できるよう改良した回路基板の切断方法及び装置を提
供することを目的とする。
SUMMARY OF THE INVENTION The present invention does not cause a positional shift of the cutter blade with respect to the V-groove or a circumferential speed shift of the cutter blade with respect to the feed speed of the circuit board, and does not apply mechanical stress to the circuit board. It is an object of the present invention to provide a method and an apparatus for cutting a circuit board which can be cut efficiently and smoothly.

【0006】[0006]

【課題を解決するための手段】本発明の請求項1に係る
回路基板の切断方法においては、回路基板を搬送手段で
水平送りする途上に、まず、回路基板の送り方向と逆方
向に回転駆動する上下対の溝切りカッターで連続直線状
のV溝を該回路基板の表裏面に刻設し、次いで、回路基
板の送り方向と順方向に回転駆動する上下対の複数組備
えられた押切りカッターでV溝の切込み量を徐々に増や
すV溝の切込み加工を施すようにされている。
In the method for cutting a circuit board according to the first aspect of the present invention, while the circuit board is horizontally fed by the transport means, first, the circuit board is rotationally driven in a direction opposite to the feeding direction of the circuit board. A continuous linear V-groove is engraved on the front and back surfaces of the circuit board with a pair of upper and lower groove cutting cutters, and then a plurality of pairs of upper and lower pairs are driven to rotate in the forward direction of the circuit board in the feed direction. A V-groove cutting process for gradually increasing the V-groove cutting amount by a cutter is performed.

【0007】本発明の請求項2に係る回路基板の切断装
置においては、回路基板を水平送りする搬送手段を備
え、その搬送手段による回路基板の送り路内に、回路基
板の送り方向と逆方向に回転駆動する上下対の溝切りカ
ッターを備えると共に、各刃先を溝切りカッターの刃先
より延長線上に位置させて回路基板の送り方向と順方向
に回転駆動する上下対の押切りカッターを複数組備え、
連続直線状のV溝を溝切りカッターで回路基板の表裏面
に刻設してから、このV溝の切込み量を複数組の押切り
カッターで徐々に増やす切断機構として各カッターを配
列することにより構成されている。
According to a second aspect of the present invention, there is provided an apparatus for cutting a circuit board, comprising: a conveying means for horizontally feeding the circuit board; A pair of upper and lower pairs of cutting cutters, which are driven to rotate in the forward direction with respect to the circuit board feed direction, with each cutting edge being positioned on an extension of the cutting edge of the groove cutting cutter. Prepared,
A continuous linear V-groove is engraved on the front and back surfaces of the circuit board with a groove cutter, and then the cutters are arranged as a cutting mechanism that gradually increases the cut amount of the V-groove with a plurality of sets of press cutters. It is configured.

【0008】[0008]

【作用】本発明に係る回路基板の切断方法及び装置で
は、連続直線状のV溝を回路基板の送り方向と逆方向に
回転駆動する上下対の溝切りカッターで回路基板の表裏
面に刻設することにより、以後の押切りに要する連続直
線状のV溝を効率よく確実に刻設でき、また、そのV溝
の切込み加工を回路基板の送り方向と順方向に回転駆動
する押切りカッターでしかも複数組備えられた押切りカ
ッターで切込み量を徐々に増やすことにより施すため、
大きなストレスを回路基板に与えないで回路基板を効率
よく切断できる。
In the method and apparatus for cutting a circuit board according to the present invention, a continuous linear V-groove is engraved on the front and back surfaces of the circuit board by a pair of upper and lower groove cutters which are driven to rotate in a direction opposite to the feed direction of the circuit board. By doing so, a continuous linear V-groove required for subsequent cutting can be efficiently and reliably carved, and the V-groove is cut by a cutting cutter that is driven to rotate in the forward direction of the circuit board in the forward direction. Moreover, since the cutting amount is gradually increased with multiple sets of press cutters,
The circuit board can be cut efficiently without applying a large stress to the circuit board.

【0009】[0009]

【発明の実施の形態】以下、添付図面を参照して説明す
れば、図示の切断装置はガラスエポキシ基板やポリイミ
ド基板等のような電子部品を実装する回路基板を切断す
るのに用いられる。その回路基板は回路組立体が複数個
取り可能な広面積を有する一枚ものに形成され、板面に
は所定の回路構成する電子部品が予め装着されている。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS With reference to the accompanying drawings, the illustrated cutting apparatus is used for cutting a circuit board on which electronic components such as a glass epoxy board and a polyimide board are mounted. The circuit board is formed into a single sheet having a wide area from which a plurality of circuit assemblies can be taken, and electronic components constituting a predetermined circuit are mounted on the board surface in advance.

【0010】その切断装置は、板面を別処理で各回路単
位に分離するのに用いられるスリットが回路基板の搬送
方向と直交する方向に設けられた回路基板の板面に複数
列一方向の切断処理を施すものとして構成されている。
In the cutting apparatus, slits used to separate the board surface into individual circuit units by separate processing are provided in a direction perpendicular to the conveying direction of the circuit board. It is configured to perform a cutting process.

【0011】図1は切断装置の全体を概略的に側面で示
すものであり、その切断装置は搬送手段1による回路基
板の送り路に、上下対の溝切りカッター2を備えると共
に、各上下対の押切りカッター3,4,5,6…を複数
組備えることにより構成されている。
FIG. 1 schematically shows the entire cutting apparatus in a side view. The cutting apparatus includes an upper and lower pair of groove cutting cutters 2 on a feed path of a circuit board by a conveying means 1. . Are provided in plural sets.

【0012】その溝切りカッター2並びに押切りカッタ
ー3,4,5,6…の対は、各回転軸20a,20b並
びに30a,30b、40a,40b、50a,50
b、60a,60bの同軸上に所定の間隔を隔てて複数
枚並列的に装備することにより、回路基板を単軸方向の
複数個所で切断できるよう配列されている。
The pair of the grooving cutter 2 and the pressing cutters 3, 4, 5, 6,... Is formed by the respective rotating shafts 20a, 20b and 30a, 30b, 40a, 40b, 50a, 50.
A plurality of circuit boards are arranged in parallel at predetermined intervals on the same axis as b, 60a, and 60b, so that the circuit boards are arranged so as to be cut at a plurality of locations in the uniaxial direction.

【0013】回路基板の搬送手段1としては、回路基板
の搬送方向と平行する片側部で片持ち挟持するチャック
等を有するXYテーブルが備え付けられている。その搬
送手段1によっては、板面を水平に保って回路基板を一
方向に所定の速度で送れると共に、回路基板を片持ち挟
持することから基板保持によるにストレスを与えず、ま
た、後述する溝加工による肉厚移動を許容できる。
As the circuit board transfer means 1, an XY table having a chuck or the like which cantileverly clamps at one side parallel to the circuit board transfer direction is provided. Depending on the transporting means 1, the circuit board can be fed in one direction at a predetermined speed while keeping the board surface horizontal, and since the circuit board is cantilevered, no stress is given by holding the board. Thickness movement due to processing can be tolerated.

【0014】溝切りカッター2としては刃身を超鋼合金
で形成し、ダイヤモンドを刃先部に取り付けた丸鋸状の
刃形形状を有するものを装備できる。この溝切りカッタ
ー2は、同一の駆動モータ21を駆動力として回動する
よう装備されている。
As the grooving cutter 2, a cutter having a circular saw-like blade shape in which the blade body is formed of a super-steel alloy and diamond is attached to the blade tip can be provided. The grooving cutter 2 is equipped to rotate using the same drive motor 21 as a driving force.

【0015】その駆動モータ21は、ギヤボックス22
に内蔵されたギヤー22a,22b,22cを介してタ
イミングベルト23a,23b…を回転軸20a,20
bに懸架することにより上下対の溝切りカッター2を回
動するよう備え付けられている。この駆動モータ21に
より、溝切りカッター2は搬送手段1による回路基板の
送り速度と周速を同期させて回路基板の送り方向と逆方
向に回転駆動するよう装備されている。
The drive motor 21 includes a gear box 22
Are connected to the rotation shafts 20a, 20b via gears 22a, 22b, 22c built in the motor.
The upper and lower pairs of groove cutting cutters 2 are provided so as to rotate by suspending the cutters 2b. The drive motor 21 is provided so that the groove cutting cutter 2 is rotated in the direction opposite to the feed direction of the circuit board by synchronizing the feed speed and the peripheral speed of the circuit board by the transfer means 1.

【0016】その溝切りカッター2の側部には、図2で
示す如く溝切り加工に伴って回路基板を押込み支持する
上下対の円板ガイド24a,24bが備え付けられてい
る。この円板ガイド24a,24bは溝切りカッター2
の各回転軸20a,20bを挿通する筒体25a,25
bの外周に嵌装配置され、回路基板の送りに応じて従動
空転するよう装備されている。
As shown in FIG. 2, a pair of upper and lower disk guides 24a and 24b are provided on the side of the grooving cutter 2 for pushing and supporting the circuit board in accordance with the grooving process. These disk guides 24a, 24b
Cylindrical bodies 25a, 25 through which the respective rotary shafts 20a, 20b are inserted.
It is fitted and arranged on the outer periphery of b and is equipped so as to be driven and idle according to the feed of the circuit board.

【0017】その溝切りカッター2はV溝を回路基板の
表裏面に刻設するものであり、このV溝加工に伴う切粉
を集塵するべく、図3で示すように静電ブラシ26a,
26bを備えたバキュームカバー27a,27bの内部
に収容配置されている。
The grooving cutter 2 engraves V-grooves on the front and back surfaces of the circuit board. In order to collect chips generated by the V-groove processing, as shown in FIG.
The vacuum covers 27a and 27b provided with the inner cover 26b are accommodated and arranged.

【0018】なお、溝切りカッター2は回路基板の肉厚
を体積移動させてV溝を刻設できるものであればよく、
電着ダイヤモンドカッターやロジンダイヤモンドカッタ
ー等を用いることができる。
The groove cutter 2 may be any cutter capable of engraving a V-groove by moving the thickness of the circuit board by volume.
An electrodeposited diamond cutter, a rosin diamond cutter, or the like can be used.

【0019】上下対の押切りカッター3,4,5,6…
は、各刃先を溝切りカッター2の刃先の延長線上に整合
位置させて夫々所定の切込み量を持つよう装備されてい
る。これら各対の押切りカッター3,4,5,6…は、
同一の駆動モータ31を動力として回動可能に備え付け
られている。
A pair of upper and lower cutters 3, 4, 5, 6,...
Is provided so that each cutting edge is aligned with an extension of the cutting edge of the grooving cutter 2 and has a predetermined cutting amount. Each of these pairs of press cutters 3, 4, 5, 6 ...
It is provided rotatably using the same drive motor 31 as power.

【0020】その駆動モータ31は、ギヤボックス32
に内蔵されたギヤー32a,32b,32cを介してタ
イミングベルト33a,33b…を各回転軸30a,3
0b、40a,40b、50a,50b、60a,60
bに懸架することにより、各対の押切りカッター3,
4,5,6…を同じ周速で回転駆動するよう連結されて
いる。この押切りカッター3,4,5,6…の各周速は
搬送手段1による回路基板の送り速度と同期され、ま
た、回転方向は回路基板の送り方向と全て順方向になる
よう取り付けられている。
The drive motor 31 includes a gear box 32
The timing belts 33a, 33b,... Are connected via the gears 32a, 32b, 32c built in
0b, 40a, 40b, 50a, 50b, 60a, 60
b, each pair of press cutters 3,
Are connected to rotate at the same peripheral speed. The peripheral speeds of the press cutters 3, 4, 5, 6,... Are synchronized with the feed speed of the circuit board by the transport means 1, and the rotation direction is set so as to be all forward with the feed direction of the circuit board. I have.

【0021】複数組装備された各対の押切りカッター
3,4,5,6…のうち、1段目から3段目程までには
図4で示すような刃身の中心線に刃先を有する円形カッ
ターが備えられている。また、その押切りカッター3,
4,5は刃先を上下で一線上に整合位置させて切込み量
を徐々に増やすよう配設されている。この押切りカッタ
ーの各対3,4,5は切断工程を任意に増設するよう数
を増やすことができ、それによって一回の切込み量を少
なくすることができる。
Of the pairs of press cutters 3, 4, 5, 6,... Provided in a plurality of sets, the cutting edge is positioned at the center line of the blade as shown in FIG. A circular cutter is provided. In addition, the press cutter 3,
Nos. 4 and 5 are arranged so that the cutting edges are aligned with each other vertically and the cutting amount is gradually increased. The number of each pair of the cutting cutters 3, 4, 5 can be increased so that the number of cutting steps can be arbitrarily increased, so that the amount of cut per operation can be reduced.

【0022】最終段階の押切りカッター6としては、図
5で示すような各刃先の側面を上下で摺接する円形カッ
ターを装備するとよい。この円形カッターによっては回
路基板の切断面を扁平面にトリミングできると共に、ガ
ラスエポキシ基板等の切断面にはみ出す繊維も切除でき
て高精度な切断面に仕上げることができる。
As the push cutter 6 in the final stage, it is preferable to equip a circular cutter as shown in FIG. With this circular cutter, the cut surface of the circuit board can be trimmed to a flat surface, and the fiber protruding from the cut surface of a glass epoxy substrate or the like can also be cut off, so that a highly accurate cut surface can be finished.

【0023】また、各対の押切りカッター3,4,5,
6…は基板厚みにおける中心点を基準に切込み量を任意
に設定できるようにするべく、図6で示すように各カッ
ターホルダー34a,34b、41a,41b、51
a,51b、61a,61bで上下に微調整できるよう
装備されている。それによると、摩耗した刃を再研磨し
た後再使用できることからも好ましい。
Each pair of press cutters 3, 4, 5,
.. Represent the cutter holders 34a, 34b, 41a, 41b, 51 as shown in FIG. 6 so that the cutting depth can be set arbitrarily based on the center point in the substrate thickness.
a, 51b, 61a, and 61b are provided so as to be finely adjusted up and down. According to this, it is preferable because the worn blade can be reused after being polished again.

【0024】このように構成する回路基板の切断装置で
は、回路基板を搬送手段1で水平送りすることにより溝
切りカッター2の対間に送り込むと、図7で示すように
各刃先2a,2bが回路基板10の端縁から板面にくい
込んで連続直線のV溝11を表裏面に刻設する。
In the circuit board cutting apparatus thus constructed, when the circuit board is fed horizontally by the conveying means 1 to be sent between the pair of grooving cutters 2, the cutting edges 2 a and 2 b as shown in FIG. A continuous straight V-groove 11 is engraved on the front and back sides of the circuit board 10 from the edge of the circuit board.

【0025】その溝切り加工は、連続直線状のV溝11
を回路基板10の送り方向と逆方向に回転駆動する上下
対の溝切りカッター2で回路基板10の表裏面に刻設す
るため、以後の押切りに要する連続直線状のV溝11を
効率よく確実に刻設できる。
The grooving is performed by a continuous linear V-groove 11.
Are engraved on the front and back surfaces of the circuit board 10 by a pair of upper and lower groove cutting cutters 2 that are driven to rotate in the direction opposite to the feed direction of the circuit board 10, so that the continuous linear V-grooves 11 required for subsequent cutting can be efficiently formed. Engraved reliably.

【0026】それと共に、溝切りカッター2の回転軸2
0a,20b上に装備された両側部の円板ガイド24
a,24bが回路基板の送りに応じて従動空転すること
により回路基板を上下から押込み支持する。このため、
回路基板は振動するのを押えられて振動によるストレス
を受けることがなく、また、円板ガイド24a,24b
の周速ズレによるストレスも受けることもない。
At the same time, the rotating shaft 2 of the grooving cutter 2
Disc guides 24 on both sides mounted on 0a, 20b
The circuit boards a and 24b are driven and idle in accordance with the feed of the circuit board to push and support the circuit board from above and below. For this reason,
The circuit board is restrained from vibrating and does not receive stress due to the vibration, and the disk guides 24a, 24b
There is no stress due to the deviation in peripheral speed.

【0027】この溝切り加工に伴って生ずる切粉は、静
電ブラシ26a,26bで飛散を防止しつつV溝の溝内
乃至は板面よりバキューム27a,27bで吸引除去で
きる。
Chips generated by the groove cutting process can be sucked and removed by vacuums 27a and 27b from the inside of the V groove or from the plate surface while preventing scattering by the electrostatic brushes 26a and 26b.

【0028】そのV溝加工後、回路基板10に対しては
上下対の複数組備えられた押切りカッター3,4,5,
6…でV溝11の切込み加工を引続いて施す。この切込
み加工はV溝加工と同一工程内で行うため、図8で示す
ように各刃先3a,3bをV溝11と位置ズレさせない
で正確に位置合せでき、回路基板が位置ズレによるスト
レスを受けることがない。
After the V-groove processing, a plurality of upper and lower pairs of press cutters 3, 4, 5, and 5 are provided on the circuit board 10.
In 6 ..., the V groove 11 is subsequently cut. Since this notch processing is performed in the same step as the V-groove processing, the cutting edges 3a and 3b can be accurately aligned without being displaced from the V-groove 11, as shown in FIG. Nothing.

【0029】また、押切りカッター3,4,5,6…の
各対は回路基板の送り速度と周速を同期させて回転駆動
し、V溝の切込み加工を回路基板の送り方向と順方向に
回転駆動すると共に、切込み量を徐々に増やすことによ
り押切りするため、大きなストレスを回路基板に与えな
いで回路基板を効率よく切断できる。
Each pair of the press cutters 3, 4, 5, 6,... Is driven to rotate while synchronizing the feed speed and the peripheral speed of the circuit board, and cuts the V-grooves in the forward direction and the forward direction of the circuit board. In addition, the circuit board is driven to rotate, and the cutting is performed by gradually increasing the cutting amount, so that the circuit board can be efficiently cut without applying a large stress to the circuit board.

【0030】押切り加工の最終段階においては、上述し
た各刃先が摺接する円形カッターによる押切りカッター
6が備えられているため、回路基板10の切断面は図9
で示すようにガラス繊維等のはみ出しのない扁平な面に
正確に切断できる。
In the final stage of the press-cutting process, since the above-mentioned press-cutting cutter 6 of a circular cutter with which each cutting edge slides is provided, the cut surface of the circuit board 10 is shown in FIG.
As shown by, it is possible to cut accurately into a flat surface without protruding glass fiber or the like.

【0031】上述した溝切り加工工程においては、回路
基板が振動しないよう円板ガイド24a,24bで上下
から押えられているため、押切りカッター3,4,5,
6…を溝切りカッター2と近接位置させることにより溝
切り加工と押切り加工とを同じ回路基板に同時に施すよ
うにもできる。
In the above-described grooving step, the circuit boards are pressed from above and below by the disk guides 24a and 24b so as not to vibrate.
.. Are positioned close to the grooving cutter 2 so that grooving and press-cutting can be performed simultaneously on the same circuit board.

【0032】その切断が終了すると、図1で示す如く搬
送手段1が回路基板の送り方向前方に配置されたベルト
コンベア7の上に移動するのに伴って、各回路単位に切
断された基板毎にベルトコンベア7の上に転送される。
When the cutting is completed, as shown in FIG. 1, as the transporting means 1 moves on the belt conveyor 7 arranged in front of the circuit board in the feeding direction, each of the boards cut in each circuit unit Is transferred onto the belt conveyor 7.

【0033】[0033]

【発明の効果】以上の如く、本発明に係る回路基板の切
断方法及び装置に依れば、機械的なストレスを回路基板
に与えないで正確に切断でき、また、予め板面に実装さ
れた電子部品に対して悪影響を及ぼすのを防ぐことがで
きる。
As described above, according to the method and the apparatus for cutting a circuit board according to the present invention, the circuit board can be cut accurately without applying a mechanical stress to the circuit board, and can be mounted on a board surface in advance. It is possible to prevent adverse effects on electronic components.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明に係る回路基板の切断装置を概略的に側
面で示す説明図である。
FIG. 1 is an explanatory diagram schematically showing a side view of a circuit board cutting apparatus according to the present invention.

【図2】同装置に装備される溝切りカッター並びに円板
ガイドを一部切欠正面で示す説明図である。
FIG. 2 is an explanatory diagram showing a partially cut front view of a groove cutter and a disk guide provided in the apparatus.

【図3】同装置に装備される溝切りカッターをバキュー
ムカバーによる収容状態で示す説明図である。
FIG. 3 is an explanatory view showing a groove cutting cutter provided in the apparatus in a housed state by a vacuum cover.

【図4】同装置に装備される押切りカッターの一つを部
分正面で示す説明図である。
FIG. 4 is an explanatory diagram showing a partial front view of one of the push cutters provided in the apparatus.

【図5】同装置に装備される他の押切りカッターを部分
正面で示す説明図である。
FIG. 5 is an explanatory view showing another push cutter provided in the same apparatus in a partial front view.

【図6】同装置に装備される押切りカッターをホルダー
と共に示す説明図である。
FIG. 6 is an explanatory view showing a push cutter together with a holder provided in the apparatus.

【図7】同装置の溝切りカッターによる溝切り状態を示
す説明図である。
FIG. 7 is an explanatory view showing a groove cutting state by a groove cutter of the apparatus.

【図8】同装置の押切りカッターによる押切り状態を示
す説明図である。
FIG. 8 is an explanatory view showing a push-off state by a push-off cutter of the apparatus.

【図9】同装置の押切りカッターで切断された基板の端
面を示す説明図である。
FIG. 9 is an explanatory view showing an end face of a substrate cut by a push cutter of the apparatus.

【符号の説明】[Explanation of symbols]

1 回路基板の搬送手段 2 上下対の溝切りカッター 3,4,5,6 上下対の押切りカッター DESCRIPTION OF SYMBOLS 1 Conveying means of a circuit board 2 Upper and lower pair of groove cutting cutters 3, 4, 5, 6 Upper and lower pair of cutting cutters

───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平4−115896(JP,A) 特開 昭62−201772(JP,A) 実開 平1−164090(JP,U) 実開 平4−125517(JP,U) 実開 昭58−150414(JP,U) (58)調査した分野(Int.Cl.7,DB名) B26D 3/00 - 3/06 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-4-115896 (JP, A) JP-A-62-201772 (JP, A) JP-A 1-164090 (JP, U) JP-A 4-164 125517 (JP, U) Japanese Utility Model Showa 58-150414 (JP, U) (58) Field surveyed (Int. Cl. 7 , DB name) B26D 3/00-3/06

Claims (2)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 回路基板を搬送手段で水平送りする途上
に、まず、回路基板の送り方向と逆方向に回転駆動する
上下対の溝切りカッターで連続直線状のV溝を該回路基
板の表裏面に刻設し、次いで、回路基板の送り方向と順
方向に回転駆動する上下対の複数組備えられた押切りカ
ッターでV溝の切込み量を徐々に増やすV溝の切込み加
工を施すようにしたことを特徴とする回路基板の切断方
法。
In the course of horizontally feeding a circuit board by a conveying means, first, a continuous straight V-shaped groove is formed on the front side of the circuit board by an upper and lower pair of groove cutters which are driven to rotate in a direction opposite to the feeding direction of the circuit board. Engraved on the back surface, and then cut the V-groove to gradually increase the cut amount of the V-groove with a plurality of upper and lower pairs of push cutters that are driven to rotate in the forward direction and the forward direction of the circuit board. A method for cutting a circuit board, comprising:
【請求項2】 回路基板を水平送りする搬送手段を備
え、その搬送手段による回路基板の送り路内に、回路基
板の送り方向と逆方向に回転駆動する上下対の溝切りカ
ッターを備えると共に、各刃先を溝切りカッターの刃先
より延長線上に位置させて回路基板の送り方向と順方向
に回転駆動する上下対の押切りカッターを複数組備え、
連続直線状のV溝を溝切りカッターで回路基板の表裏面
に刻設してから、このV溝の切込み量を複数組の押切り
カッターで徐々に増やす切断機構として各カッターを配
列したことを特徴とする回路基板の切断装置。
2. A transfer device for horizontally feeding a circuit board, and a pair of upper and lower groove cutters that are driven to rotate in a direction opposite to the feed direction of the circuit board in a feed path of the circuit board by the transfer device. Equipped with a plurality of pairs of upper and lower push cutters, each of which is positioned on an extension from the edge of the grooving cutter and is driven to rotate in the forward direction with respect to the circuit board feed direction,
After engraving continuous linear V-grooves on the front and back surfaces of the circuit board with a groove cutter, the cutters were arranged as a cutting mechanism for gradually increasing the cutting amount of the V-groove with a plurality of sets of push-off cutters. Characteristic circuit board cutting device.
JP33673492A 1992-11-24 1992-11-24 Method and apparatus for cutting circuit board Expired - Fee Related JP3165820B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP33673492A JP3165820B2 (en) 1992-11-24 1992-11-24 Method and apparatus for cutting circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33673492A JP3165820B2 (en) 1992-11-24 1992-11-24 Method and apparatus for cutting circuit board

Publications (2)

Publication Number Publication Date
JPH06155379A JPH06155379A (en) 1994-06-03
JP3165820B2 true JP3165820B2 (en) 2001-05-14

Family

ID=18302230

Family Applications (1)

Application Number Title Priority Date Filing Date
JP33673492A Expired - Fee Related JP3165820B2 (en) 1992-11-24 1992-11-24 Method and apparatus for cutting circuit board

Country Status (1)

Country Link
JP (1) JP3165820B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100361682B1 (en) * 2000-04-24 2002-11-22 봉문근 Cutting Method of Print Circuit Board
JP2007136638A (en) * 2005-11-22 2007-06-07 Japan Crown Cork Co Ltd Weakened line processing method for cap of synthetic resin, and device therefor

Also Published As

Publication number Publication date
JPH06155379A (en) 1994-06-03

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