JPS63201092U - - Google Patents
Info
- Publication number
- JPS63201092U JPS63201092U JP9060187U JP9060187U JPS63201092U JP S63201092 U JPS63201092 U JP S63201092U JP 9060187 U JP9060187 U JP 9060187U JP 9060187 U JP9060187 U JP 9060187U JP S63201092 U JPS63201092 U JP S63201092U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- pair
- moving mechanism
- cutting device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000926 separation method Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 claims 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Nonmetal Cutting Devices (AREA)
Description
添付図面は本考案の実施例を示し、第１図は集
合プリント回路基板の平面図、第２図は従来の丸
ノコ刃上による集合プリント回路基板の切断を示
す部分断面図、第３図は同じく丸ノコ刃による切
削を終えた集合プリント回路基板の部分断面図、
第４図は従来のハサミ状の工具による集合プリン
ト回路基板の切断を示す部分断面図、第５図は本
考案の集合プリント回路基板の切断原理を示す部
分断面図、第６図は本考案の切断装置の第１実施
例を示す断面図、第７図は第６図Ｚ矢視を示す正
面図、第８図は本考案の切断装置の第２実施例を
示す断面図、第９図は第８図のＺ矢視を示す正面
図、第１０図は本考案の切断装置の第３実施例を
示す断面図、第１１図は第１０のＺ矢視を示す正
面図である。
尚図中１……集合プリント回路基板、２……仮
想予定分離線、３……単位プリント回路基板、１
０……支持台、１５，２１……回転軸、１８，２
２……回転刃、２６……テーブル、３０……巻上
機、３５，３６，３９……歯車、４０……ガイド
、４１……送り台、４２……スライドガイド、４
３……スライド軸、４４……リードガイド、４５
……リード軸、４６……支持枠、である。
The accompanying drawings show an embodiment of the present invention, in which FIG. 1 is a plan view of an assembled printed circuit board, FIG. 2 is a partial cross-sectional view showing cutting of an assembled printed circuit board with a conventional circular saw blade, and FIG. A partial cross-sectional view of the assembled printed circuit board that has also been cut using a circular saw blade.
FIG. 4 is a partial cross-sectional view showing the cutting of an aggregate printed circuit board using a conventional scissor-like tool, FIG. 5 is a partial cross-sectional view showing the principle of cutting an aggregate printed circuit board of the present invention, and FIG. 7 is a front view showing the Z arrow direction in FIG. 6, FIG. 8 is a sectional view showing the second embodiment of the cutting device of the present invention, and FIG. 9 is a sectional view showing the first embodiment of the cutting device. FIG. 10 is a sectional view showing a third embodiment of the cutting device of the present invention, and FIG. 11 is a front view shown in the 10th Z direction. In the figure, 1...Collective printed circuit board, 2...Virtual planned separation line, 3...Unit printed circuit board, 1
0... Support stand, 15, 21... Rotating shaft, 18, 2
2... Rotating blade, 26... Table, 30... Winding machine, 35, 36, 39... Gear, 40... Guide, 41... Feeding stand, 42... Slide guide, 4
3...Slide axis, 44...Lead guide, 45
. . . lead shaft, 46 . . . support frame.
Claims (1)
刷された集合プリント回路基板を仮想予定分離線
に沿つて切断刃により切断して、単位プリント回
路基板とするためのプリント回路基板の切断装置
において； 互いに対向する一対の回転刃の刃先は同刃の基
部から先端に向けてテーパ面を形成すると共に同
対向する刃先の間隙を前記集合プリント基板の厚
さ以下に定めて前記回転刃を支持する回転軸を前
記支持台に回転自在に支持し、且つ仮想予定分離
線に沿つて、前記一対の回転刃の刃先と前記集合
プリント基板を相対的に移動せしめる移動機構を
設けたことを特徴とするプリント回路基板の切断
装置。 (2) 前記移動機構は前記支持台を固定し、集合
プリント基板を保持する保持台を前後左右に移動
するＸ―Ｙ移動機構とした実用新案登録請求の範
囲第１項記載のプリント回路基板の切断装置。 (3) 前記移動機構は前記一対の回転刃を支持す
る回転軸後部にそれぞれ歯車を固定し、同両歯車
を噛合し、同歯車の一方をモータの出力軸に固定
した歯車を介して回転駆動するように構成した実
用新案登録請求の範囲第１項記載のプリント回路
基板の切断装置。 (4) 前記移動機構は前記支持台に装着した送り
台に設けた一対のスライドガイドに係合する一対
のスライド軸と、同じく前記支持台に設けたリー
ドガイドに螺合するリード軸およびリード軸を回
転駆動するモータからなる実用新案登録請求の範
囲第１項記載のプリント回路基板の切断装置。[Claims for Utility Model Registration] (1) A method for cutting an assembled printed circuit board on which a large number of unit printed circuits are printed in a grid shape with a cutting blade along a virtual planned separation line to produce a unit printed circuit board. In a printed circuit board cutting device; the cutting edges of a pair of rotating blades facing each other form a tapered surface from the base of the blade toward the tip thereof, and the gap between the opposing blades is set to be less than or equal to the thickness of the assembled printed circuit board. a moving mechanism that rotatably supports a rotary shaft supporting the rotary blades on the support base, and relatively moves the blade edges of the pair of rotary blades and the assembled printed circuit board along a virtual planned separation line. A printed circuit board cutting device characterized in that: (2) The printed circuit board according to claim 1, wherein the moving mechanism is an XY moving mechanism that fixes the support base and moves the holding base that holds the printed circuit board assembly back and forth and left and right. Cutting device. (3) The moving mechanism has gears fixed to the rear part of the rotating shaft that supports the pair of rotary blades, both gears mesh with each other, and one of the gears is rotationally driven via a gear fixed to the output shaft of the motor. A printed circuit board cutting device according to claim 1, which is configured to cut a printed circuit board. (4) The moving mechanism includes a pair of slide shafts that engage with a pair of slide guides provided on a feed base mounted on the support base, and a lead shaft and a lead shaft that engage with lead guides that are also provided on the support base. A printed circuit board cutting device according to claim 1, which comprises a motor for rotationally driving a printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9060187U JPS63201092U (en) | 1987-06-12 | 1987-06-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9060187U JPS63201092U (en) | 1987-06-12 | 1987-06-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63201092U true JPS63201092U (en) | 1988-12-26 |
Family
ID=30950615
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9060187U Pending JPS63201092U (en) | 1987-06-12 | 1987-06-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63201092U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6130399A (en) * | 1984-07-17 | 1986-02-12 | ロ−ム株式会社 | Method of cutting printed circuit substrate |
| JPS6232794B2 (en) * | 1980-01-31 | 1987-07-16 | Casio Computer Co Ltd |
-
1987
- 1987-06-12 JP JP9060187U patent/JPS63201092U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6232794B2 (en) * | 1980-01-31 | 1987-07-16 | Casio Computer Co Ltd | |
| JPS6130399A (en) * | 1984-07-17 | 1986-02-12 | ロ−ム株式会社 | Method of cutting printed circuit substrate |
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