JPH0679689A - Printed circuit board dividing machine - Google Patents

Printed circuit board dividing machine

Info

Publication number
JPH0679689A
JPH0679689A JP23503492A JP23503492A JPH0679689A JP H0679689 A JPH0679689 A JP H0679689A JP 23503492 A JP23503492 A JP 23503492A JP 23503492 A JP23503492 A JP 23503492A JP H0679689 A JPH0679689 A JP H0679689A
Authority
JP
Japan
Prior art keywords
printed circuit
circuit board
blade
tip
cutting line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP23503492A
Other languages
Japanese (ja)
Inventor
Tokuji Hashimoto
篤治 橋本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP23503492A priority Critical patent/JPH0679689A/en
Publication of JPH0679689A publication Critical patent/JPH0679689A/en
Withdrawn legal-status Critical Current

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Abstract

PURPOSE:To provide a printed circuit board dividing machine which does not use any press die solely devoted, can cut even along a curved line, is versatile, and presents possibility of automating of the operation. CONSTITUTION:A printed circuit board dividing machine is composed of an upper cutter 1 which is rotatably equipped at the tip with a small dia. disc-form cutting edge 1, is movable vertically, and with which a specified pressure can be impressed, a lower cutter 2 which is equipped at the tip with a disc-form cutting edge 32 in similar arrangement in such a manner as confronting the upper cutter 1, and an X-Y table 5 where a printed circuit board 4 is secured and which moves a cutting line 44 while in contact with the tip of the lower cutter 2 in accordance with a control program, wherein the upper cutter 1 sinks, contacts the cutting line 44 of the board 4, and cuts it while a specified pressure is impressed. Further it is so constituted that the upper and lower cutters 1, 2 make axial rotation along the cutting line 44 of the board 4, or so configured that a lower cutter 22 is equipped at the tip with a small spherical surface or a small rotatable sphere in lien of disc-form cutting edge 32 and that an ultrasonic vibratory energizing means 8 is furnished to apply a micro- vibration in vertical direction to either of the upper cutter 1 or lower cutter 22.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、複数個を割り付けたプ
リント基板を分割するプリント基板分割機に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board dividing machine for dividing a printed circuit board into which a plurality of printed circuit boards are allocated.

【0002】電子機器に使用するガラスエポキシ基材や
フレキシブル基板によるプリント配線板にあっては、生
産上、一枚の定尺基板に複数個を割り付けて製造し、部
品を実装してから後にプリント基板を切断分割する、多
数個取り方式が多く採用されている。
In the production of a printed wiring board made of a glass epoxy base material or a flexible substrate used for electronic equipment, a plurality of printed wiring boards are produced by allocating them to a single standard length substrate, and after mounting the components, printing is performed. A multi-cavity method of cutting and dividing a substrate is often used.

【0003】かように、部品実装後に切断するには、作
業が安全確実に行われ、損傷を与えることなく歩留り10
0%であることが要求され、且つ自動化が図れることが要
望される。
As described above, when cutting after mounting the components, the work is performed safely and surely, and the yield is 10 without damage.
It is required to be 0% and it is desired to be able to achieve automation.

【0004】[0004]

【従来の技術】図4に従来例のV形切断ラインを入れた
分割方法を示し、(a) はプリント基板、(b) は分割方法
の断面斜視図、(c) は分割方法の断面斜視図、図5
は従来例のルータ加工とV形切断ラインを入れた分割方
法のプリント基板、図6は従来例の薄板プリント基板の
分割方法のプリント基板を示す。
2. Description of the Related Art FIG. 4 shows a conventional dividing method including a V-shaped cutting line. (A) is a printed circuit board, (b) is a sectional perspective view of the dividing method, and (c) is a sectional perspective view of the dividing method. Figure, Figure 5
FIG. 6 shows a printed circuit board of a conventional example of a dividing method including a router processing and a V-shaped cutting line, and FIG. 6 shows a printed circuit board of a conventional example of a thin printed circuit board dividing method.

【0005】電子機器に使用するガラスエポキシ基材や
フレキシブル基板によるプリント配線板は、材料や製造
上の効率の点から、一般に外形寸法の標準化(定尺)が
行われ、多数個取り方式が採用されている。
Printed wiring boards using glass epoxy base materials and flexible substrates used in electronic equipment are generally standardized (standard size) in external dimensions from the viewpoint of material and manufacturing efficiency, and a multi-cavity method is adopted. Has been done.

【0006】この定尺のプリント基板に、部品を実装し
た後に切断分割する方法は、従来から製品の形状や板
厚、材料により次のような各種手段がとられている。 V形切断ラインを入れた分割方法 (1) 円板刃方式或いは切断刃方式…分割方法 図4の(a) に示すように、プリント基板4には、個々の
プリント配線板41の外形に沿って、両面からV形状の溝
のV形切断ライン45が所定の残り代を残して対向して刻
まれ、図示では直交して格子状に刻設してある。
As a method of cutting and dividing parts after mounting the components on this fixed-size printed circuit board, various means as described below have been taken depending on the shape, plate thickness and material of the product. Dividing method with V-shaped cutting line (1) Disc blade method or cutting blade method ... Dividing method As shown in Fig. 4 (a), the printed board 4 is formed along the outline of each printed wiring board 41. Then, V-shaped cutting lines 45 of V-shaped grooves are carved facing each other with a predetermined remaining margin from both sides, and in the drawing, they are carved in a grid pattern at right angles.

【0007】このV形切断ライン45に沿って切断するの
は、図4の(b) に示すように、回転自在で周縁に刃を付
けた円板刃36,37 が上下に接近して対向させ、図示省略
するが、一方の円板刃37が動力により回転駆動してお
り、円板刃36,37 の間にプリント基板4のV形切断ライ
ン45を通すことにより、残り代が切断されて分割され
る。
As shown in FIG. 4 (b), the disc blades 36 and 37, which are rotatable and have a peripheral edge, approach each other along the V-shaped cutting line 45 by vertically approaching each other. Although not shown, one disc blade 37 is rotationally driven by power, and the V-shaped cutting line 45 of the printed circuit board 4 is passed between the disc blades 36, 37 to cut the remaining margin. Will be divided.

【0008】(2) 円板刃方式…分割方法 一方の円板刃36と、これに対向する円板刃37の代わり
に、図4の(c) に示すように、プラスチックの厚円板で
周面に逃げ用のV溝39が刻設され、図示省略の駆動部に
より回転駆動する回転円板38が備えられ、その所定間隔
にプリント基板4のV形切断ライン45を通し、残り代が
折曲しながら押し切られ分割される。 ルータ加工とV形切断ラインを入れた分割方法 図5に示すように、プリント基板49には、個々のプリン
ト配線板48の外形に沿って、継ぎ部47を残してルータ加
工して切断した切断部46が設けられ、長い継ぎ部47には
両面にV形切断ライン45が刻設して継ないである。
(2) Disc blade system ... Dividing method Instead of the disc blade 36 on one side and the disc blade 37 facing it, a thick disc of plastic is used as shown in FIG. 4 (c). A V-shaped groove 39 for relief is engraved on the peripheral surface, and a rotary disk 38 that is rotationally driven by a drive unit (not shown) is provided, and a V-shaped cutting line 45 of the printed circuit board 4 is passed through at a predetermined interval to leave the remaining margin. It is pressed and divided while being bent. Router Processing and Dividing Method with V-shaped Cutting Lines As shown in FIG. 5, the printed board 49 is cut along the contours of the individual printed wiring boards 48 by leaving the joints 47 and processing the router. A portion 46 is provided, and a V-shaped cutting line 45 is engraved on both sides of the long joint portion 47 and is not joined.

【0009】従って、この継ぎ部47とV形切断ライン45
の継ぎ部を専用型によりプレス切断して分割する。 薄いプリント基板の分割方法 図6に示すように、厚さ0.2 mm程度以下の薄いプリント
基板42には、個々のプリント配線板41の外形に沿ってプ
レス加工し、切断部46と継ぎ部47が交互に設けてある。
Therefore, this joint 47 and the V-shaped cutting line 45
The joint part of is cut by pressing with a dedicated mold and divided. Method for dividing thin printed circuit board As shown in FIG. 6, a thin printed circuit board 42 having a thickness of about 0.2 mm or less is pressed along the outer shape of each printed wiring board 41, and cut portions 46 and joints 47 are formed. They are provided alternately.

【0010】このプリント基板42単独では取扱難く、こ
れを取扱易く破損させないために、個々のプリント配線
板41に掛からないように周縁部(図示斜線部)を補強板
7に接着材にて接着する。
This printed circuit board 42 is difficult to handle by itself, and in order to handle it easily and not to damage it, the peripheral edge portion (the hatched portion in the figure) is adhered to the reinforcing plate 7 with an adhesive so as not to touch the individual printed wiring boards 41. .

【0011】この接着した状態のまま部品が実装され、
最後に、継ぎ部47を専用型によりプレス切断して分割す
る。従って、図示省略するが、継ぎ部47の下側の補強板
7の部分にはプレス型の逃げ穴があけてある。
The parts are mounted in this adhered state,
Finally, the joint part 47 is cut by a dedicated mold and divided. Therefore, although not shown, a press-type relief hole is formed in the portion of the reinforcing plate 7 below the joint 47.

【0012】[0012]

【発明が解決しようとする課題】しかしながら、 V形切断ライン45を入れた分割方法は、基本的に直
線対応のみであるために適用が限定される。 ルータ加工の切断部46、又は薄板プリント基板42の
プレス加工の切断部46による分割は、その継ぎ部47を切
断するための専用プレス型を必要とし、高価となり、且
つそのプレス型の着脱段取り工数も発生し、非経済的、
非効率となる。 等の問題点があった。
However, the dividing method in which the V-shaped cutting line 45 is inserted is limited in its application because it basically corresponds only to a straight line. Dividing the cutting portion 46 of the router processing or the cutting portion 46 of the press working of the thin printed circuit board 42 requires a dedicated press die for cutting the joint portion 47, which is expensive, and the number of man-hours for attaching and detaching the press die is high. Also occurs, uneconomical,
It becomes inefficient. There were problems such as.

【0013】本発明は、かかる問題点に鑑みて、専用の
プレス型を用いず、曲線状の切断もでき、汎用性があり
且つ作業の自動化も可能なプリント基板分割機を提供す
ることを目的とする。
In view of the above problems, it is an object of the present invention to provide a printed circuit board dividing machine which can cut a curved line without using a dedicated press die, has general versatility and can be automated. And

【0014】[0014]

【課題を解決するための手段】上記目的は、図1の本発
明の原理構成図に示す如く、 [1] 複数個を割り付けたプリント基板を分割するプリン
ト基板分割機であって、小径の円板刃31を先端に回動自
在に備え、所定の距離を上下動でき且つ下向きに所定の
押力が印加できる上刃1と、上刃1に対向して小径の円
板刃(32)を先端所定位置に回動自在に備える下刃2と、
プリント基板4を固定し、制御プログラムにより切断ラ
イン44を前記下刃2の先端に接して移動させるXYテー
ブル5と、から構成し、上刃1が下降し、プリント基板
4の切断ライン44に接し、所定押圧を加えて切断する、
本発明のプリント基板分割機により達成される。 [2] 更に、上刃1と下刃2とがプリント基板4の切断ラ
イン44に沿って軸回動するように構成した、本発明の上
記プリント基板分割機によっても適えられる。 [3] 又、下刃2の円板刃32の代わりに、小球面33又は回
動自在な小球34を先端に備える下刃22とし、且つ上刃1
又は下刃22の何れかに、上下方向に所定の微振動を加え
る超音波励振手段8を設けた、本発明の上記プリント基
板分割機によっても達成される。 [4] 更に、下刃2の代わりに、下刃2と、下刃22とを複
数種類備え、プリント基板4の種類に応じて選択使用す
る選択手段6を備える、本発明の上記プリント基板分割
機によっても適えられる。
The above-mentioned object is, as shown in the principle configuration diagram of the present invention in FIG. 1, [1] a printed circuit board dividing machine for dividing a printed circuit board into which a plurality of printed wiring boards are allocated, and having a small diameter circle. A plate blade 31 is rotatably provided at the tip, and an upper blade 1 capable of vertically moving a predetermined distance and applying a predetermined pressing force downward, and a disc blade (32) having a small diameter facing the upper blade 1 are provided. A lower blade 2 rotatably provided at a predetermined position on the tip,
It is composed of an XY table 5 which fixes the printed circuit board 4 and moves the cutting line 44 in contact with the tip of the lower blade 2 by a control program. The upper blade 1 descends and contacts the cutting line 44 of the printed circuit board 4. , Apply a predetermined pressure to cut,
This is achieved by the printed board dividing machine of the present invention. [2] Further, the above-mentioned printed board dividing machine of the present invention, which is configured such that the upper blade 1 and the lower blade 2 are pivoted along the cutting line 44 of the printed board 4, is also applicable. [3] Further, instead of the disc blade 32 of the lower blade 2, the lower blade 22 is provided with a small spherical surface 33 or a rotatable small ball 34 at the tip, and the upper blade 1
Alternatively, the above-mentioned printed board dividing machine of the present invention, in which either one of the lower blades 22 is provided with the ultrasonic wave excitation means 8 for applying a predetermined fine vibration in the vertical direction, is also achieved. [4] Further, in place of the lower blade 2, a plurality of types of the lower blade 2 and the lower blade 22 are provided, and the selection means 6 selectively used according to the type of the printed circuit board 4 is provided. It can be adapted depending on the machine.

【0015】[0015]

【作用】即ち、図1の(a) の如く、上下に円板刃31,32
を対向させ、その間にプリント基板4の切断ライン44を
位置させ、押圧を加えるので切断でき、XYテーブル5
の移動により切断ライン44に沿ってプリント基板4が移
動するので、切断ライン44の通りに切断され分割され
る。
Operation: That is, as shown in FIG. 1A, the disc blades 31 and 32 are vertically arranged.
Are opposed to each other, the cutting line 44 of the printed circuit board 4 is positioned between them, and pressure is applied to cut the XY table 5.
The printed circuit board 4 is moved along the cutting line 44 by the movement of, so that it is cut and divided along the cutting line 44.

【0016】この際、上刃1と下刃2は、小径の円板刃
31,32 の刃線方向が接した切断ライン44の方向に常に向
くように軸回動自在としてあれば、直線のみならず曲線
状の切断ライン44であってもこれに追従し切断すること
ができる。
At this time, the upper blade 1 and the lower blade 2 are disc blades having a small diameter.
If the shafts are rotatable so that they are always oriented in the direction of the cutting line 44 with which the 31,32 blade lines are in contact, it is possible to follow and cut not only a straight cutting line 44 but also a curved cutting line 44. it can.

【0017】切断ライン44の継ぎ部47には、プリント基
板4の厚さにより、所定厚の残り代を残してV形切断ラ
イン44を設けたり、薄く所定の押圧にて切断可能な厚さ
の場合には、何もV形切断ライン44を刻設する必要はな
い。
Depending on the thickness of the printed circuit board 4, a V-shaped cutting line 44 is provided in the joint portion 47 of the cutting line 44 with a remaining margin of a predetermined thickness, or a V-shaped cutting line 44 is thin and can be cut by a predetermined pressure. In some cases, it is not necessary to engrave any V-shaped cutting line 44.

【0018】又、図1の(b) の如く、下刃2の円板刃32
の代わりに、先端を小球面33とし、上下方向にプリント
基板4,42の板厚に応じて所定パワーの超音波振動を加え
る超音波励振手段8を設けた下刃22により、より円滑且
つ小曲げ径の切断ライン44に追従して切断することがで
き、且つ下刃22の切断ライン44向きの軸回動が不用とな
る。
Further, as shown in FIG. 1B, the disc blade 32 of the lower blade 2
Instead of, the tip is made a small spherical surface 33, and a lower blade 22 provided with an ultrasonic wave excitation means 8 for applying ultrasonic vibration of a predetermined power in the vertical direction according to the plate thickness of the printed circuit boards 4, 42 is made smoother and smaller. The cutting can be performed following the cutting line 44 having the bending diameter, and the pivotal movement of the lower blade 22 toward the cutting line 44 is unnecessary.

【0019】勿論、超音波励振手段8は下刃22側でな
く、上刃1に設けても同じ効果が得られる。更に、図1
の(c) の如く、この小球面33の代わりに、小球34を回動
自在に取付けることにより、更に円滑に切断できる。
Of course, the same effect can be obtained even if the ultrasonic excitation means 8 is provided not on the lower blade 22 side but on the upper blade 1. Furthermore, FIG.
As shown in (c), the small sphere 34 is rotatably attached in place of the small sphere 33, so that the small sphere 34 can be cut more smoothly.

【0020】このような下刃22は切断能力はないので、
下側の補助板7に接着して取扱う薄いプリント基板42に
最も効果的であり、上刃1のみで切断できる薄板のプリ
ント基板4に適し、切断ライン44には何も前述従来例の
切断部46を設けなくても差支えない。
Since such a lower blade 22 has no cutting ability,
It is most effective for the thin printed circuit board 42 that is handled by adhering to the lower auxiliary plate 7, and is suitable for the thin printed circuit board 4 that can be cut only by the upper blade 1, and the cutting line 44 has no cutting part of the above-mentioned conventional example. It does not matter if 46 is not provided.

【0021】尚、プリント基板4をXYテーブル5に位
置合わせして固定すれば、プログラムにより該プリント
基板4のデータに従い、下刃2,22の上に切断ライン44を
接して移動し、上刃1は対向して所定の押圧を加えるの
で、自動的に切断することができる。
If the printed board 4 is aligned and fixed to the XY table 5, the cutting line 44 is moved onto the lower blades 2 and 22 according to the data of the printed board 4 by the program, and the upper blade is moved. Since 1 is opposed to and applies a predetermined pressure, it can be cut automatically.

【0022】かくして、本発明により、専用のプレス型
を用いず、曲線状の切断もでき、汎用性があり且つ作業
の自動化も可能なプリント基板分割機を提供することが
可能となる。
Thus, according to the present invention, it is possible to provide a printed circuit board dividing machine which can perform curved cutting without using a dedicated press die, has general versatility, and can be automated in operation.

【0023】[0023]

【実施例】以下図面に示す実施例によって本発明を具体
的に説明する。全図を通し同一符号は同一対象物を示
す。図2に本発明の一実施例を示し、(a) は構成斜視
図、(b) は側断面図、図3に本発明の一実施例の制御系
統図を示す。
DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail with reference to the embodiments shown in the drawings. Throughout the drawings, the same reference numerals denote the same objects. FIG. 2 shows an embodiment of the present invention, (a) is a configuration perspective view, (b) is a side sectional view, and FIG. 3 is a control system diagram of one embodiment of the present invention.

【0024】本実施例は、最大外形 110×60cmの各種板
厚のプリント基板に対応できる汎用の自動分割機であ
り、図2 の(a)(b)に示す如く、プリント基板4又は補強
板7に接着させた薄いプリント基板42は、基台の上に据
え付けられたXYテーブル5に載置され縁部が固定され
る。
The present embodiment is a general-purpose automatic dividing machine which can handle printed boards having a maximum outer diameter of 110 × 60 cm and various thicknesses. As shown in FIGS. 2 (a) and 2 (b), the printed board 4 or the reinforcing board is used. The thin printed circuit board 42 adhered to 7 is placed on the XY table 5 mounted on the base and the edge is fixed.

【0025】上刃1は上方の突き出たアームの先部に垂
下され、先端に10mmφの円板刃31を回動自在に軸支し、
その上部には、軸回動手段91を経て移動押圧手段92が組
み込まてある。
The upper blade 1 is hung on the tip of an upwardly protruding arm, and a 10 mmφ disc blade 31 is rotatably supported at its tip.
The moving and pressing means 92 is incorporated in the upper part thereof via the shaft rotating means 91.

【0026】XYテーブル5の内部中央には、2個の下
刃2,22が選択手段6を介して、上刃1の真下に対向して
立設され、下刃2は先の上刃1と同じに、先端には10mm
φの円板刃32が回動自在に軸支され、その下部には軸回
動手段91が取付けてある。
In the center of the inside of the XY table 5, two lower blades 2 and 22 are erected upright under the upper blade 1 via a selecting means 6, and the lower blade 2 is the upper blade 1 of the tip. Same as, 10mm at the tip
A disk blade 32 of φ is rotatably supported, and a shaft rotating means 91 is attached to the lower part thereof.

【0027】下刃22は、先端に4mmφの鋼の小球34が回
動自在に嵌着され、その下部に超音波励振手段8が設け
てある。軸回動手段91は、詳細を図示省略するが、パル
スモータから歯車を介して 360度を高精度に軸回動駆動
される。
A small ball 34 of 4 mmφ steel is rotatably fitted to the tip of the lower blade 22, and an ultrasonic wave exciting means 8 is provided below the small ball 34. Although not shown in detail in the drawings, the shaft rotating means 91 is driven by a pulse motor through a gear to rotate the shaft with high accuracy at 360 degrees.

【0028】移動押圧手段92は、詳細を図示省略する
が、エアプランジャを駆動源にストッパを組合せ、所定
のストロークの移動と押圧を加える。超音波励振手段8
は、約1MHzの発振器と圧電振動板とから成り、負荷状
態にて上下方向最大振幅 0.3mmまで可変できるものであ
る。
Although not shown in detail, the movement pressing means 92 combines an air plunger as a driving source with a stopper to move and press a predetermined stroke. Ultrasonic excitation means 8
Is composed of an oscillator of about 1 MHz and a piezoelectric vibrating plate, and can be varied up to a maximum amplitude of 0.3 mm in the vertical direction under load.

【0029】選択手段6は、ターンテーブル61に下刃2,
22を配設し、モータ駆動により回動させて何れかを選択
して定位置に停止させ、定位置下部の受け部62に保持さ
れ、各下刃2,22の先端が定位置に到達するように競り上
がり、セットされる。
The selection means 6 comprises a turntable 61, a lower blade 2,
22 is provided, and is rotated by a motor to select one of them and stop it at a fixed position, and it is held by a receiving portion 62 below the fixed position, and the tips of the lower blades 2, 22 reach the fixed position. Bid up and set.

【0030】終了の場合は、下降して使用済下刃2,22を
ターンテーブル61に保持させてから、保持部を解放して
待機する。交換の場合は、受け部62が待機状態になる
と、直ちにターンテーブル61が回動して次ぎ下刃2,22を
選択して停止し、前記の保持〜セットの動作が行われ
る。
In the case of the end, the used lower blades 2, 22 are lowered to hold the used lower blades 2, 22 on the turntable 61, and then the holding portion is released to stand by. In the case of replacement, when the receiving portion 62 enters the standby state, the turntable 61 immediately rotates to select and stop the next lower blades 2 and 22, and the above holding to setting operations are performed.

【0031】この自動分割機は、図3の制御系統図に示
すように制御されて、自動化が行われる。即ち、制御プ
ログラムやびプリント基板毎のデータを記憶したフロッ
ピーディスク(FDD)と、このFDDにより刃部制御
器とXYテーブル制御器を制御するプログラムコントロ
ーラがあり、更に、XYテーブル制御器はX軸駆動部と
Y軸駆動部とを制御し、刃部制御器は上刃制御部と下刃
制御部とを制御し、更に下刃制御部は刃種選択部と受け
部制御部とを制御する。
This automatic divider is controlled as shown in the control system diagram of FIG. 3 to be automated. That is, there is a floppy disk (FDD) that stores a control program and data for each printed circuit board, and a program controller that controls the blade controller and the XY table controller by this FDD. Further, the XY table controller is an X-axis controller. The drive unit and the Y-axis drive unit are controlled, the blade unit controller controls the upper blade control unit and the lower blade control unit, and the lower blade control unit controls the blade type selection unit and the receiving unit control unit. .

【0032】動作は、プリント基板4又は補強板7に縁
部を接着材にて固着した薄いプリント基板42を、XYテ
ーブル5の可動部に位置合わせして固定させ、スタート
させると、XYテーブル制御器から指令してX軸駆動
部、Y軸駆動部が所定に動作してプリント基板4,42が移
動し、切断ライン44の切断個所が上刃1の真下位置に来
る。
The operation is performed by aligning and fixing the thin printed circuit board 42, the edges of which are fixed to the printed circuit board 4 or the reinforcing plate 7 with an adhesive material, to the movable part of the XY table 5 and starting the XY table control. The X-axis drive unit and the Y-axis drive unit operate in accordance with a predetermined command to move the printed circuit boards 4 and 42, and the cutting point of the cutting line 44 comes to a position directly below the upper blade 1.

【0033】一方、刃部制御器を通し下刃制御部が働
き、刃種選択部がターンテーブル61を回動させて指定の
下刃2,22の何れかを選択し、続いて受け部制御部がその
下刃2,22を保持し競り上がりプリント基板4,42の下面に
先端を接する。この際、下刃2の場合には、更に、軸回
動手段91を駆動させて円板刃32を切断ライン44の方向に
刃線方向をあわせる。
On the other hand, the lower blade control unit operates through the blade controller, the blade type selection unit rotates the turntable 61 to select one of the designated lower blades 2 and 22, and then the receiving unit control. The part holds the lower blades 2, 22 and bids up to contact the lower surfaces of the printed circuit boards 4, 42 with their tips. At this time, in the case of the lower blade 2, the shaft rotating means 91 is further driven to align the disc blade 32 with the direction of the cutting line 44.

【0034】次に、上刃制御器が働き、軸回動手段91を
駆動させて円板刃31を切断ライン44の方向に刃線方向を
あわせるように軸回動しながら、上刃1を下降させプリ
ント基板4,42に当接させ、更に、所定押圧を加える。下
刃22の場合には押圧と同時に受け部制御部により超音波
励振手段8を所定出力にて駆動させる。更に、XYテー
ブル制御器によりプリント基板4,42を切断ライン44に沿
って切断区間を移動させて切断して行く。
Next, the upper blade controller operates to drive the shaft rotating means 91 to rotate the disk blade 31 so that the blade line direction is aligned with the cutting line 44, and the upper blade 1 is moved. It is lowered and brought into contact with the printed circuit boards 4 and 42, and further, a predetermined pressure is applied. In the case of the lower blade 22, the ultrasonic wave excitation means 8 is driven at a predetermined output by the receiving portion control portion at the same time as pressing. Further, the XY table controller moves the cutting section along the cutting line 44 to cut the printed boards 4 and 42.

【0035】切断個所は、V型切断ライン45に沿って連
続的に切断することもあれば、既にプリント基板4,42に
ルータ加工やプレス加工にて継ぎ部47を飛び飛びに残し
て切断部46が設けられ、その継ぎ部47のみを切断するこ
ともできる。
The cutting portion may be continuously cut along the V-shaped cutting line 45, or the cutting portion 46 may be already left on the printed circuit boards 4 and 42 by router processing or press processing, leaving the joint portions 47 scattered. Is provided and only the joint portion 47 can be cut.

【0036】切断を行わない状態でのプリント基板4,42
の移動時には、上刃1及び下刃2,22は、プリント基板4,
42の移動に支障を与えないように、プリント基板4,42か
ら先端が少し離れて位置するようにしてある。
Printed circuit boards 4 and 42 without cutting
When moving the upper blade 1 and the lower blade 2,22,
In order not to hinder the movement of 42, the tip is located slightly away from the printed circuit boards 4, 42.

【0037】尚、本発明の自動分割機では、個々のプリ
ント配線板41はプリント基板4,42から切り落としせず
に、略平ら状態を維持する最小個所の継ぎ部47を残して
切断させ、終了後にプリント基板4,42をXYテーブル5
から取外してから個々に分割するようにしている。これ
は、切断時に切離してしまうと、部品実装されたプリン
ト配線板41が内部に落ち込み、損傷することのないよう
にするためである。
In the automatic dividing machine according to the present invention, the individual printed wiring boards 41 are not cut off from the printed boards 4 and 42, but are cut off leaving the joint portion 47 at the minimum portion that maintains a substantially flat state, and the operation is completed. Later the printed circuit boards 4, 42 are placed on the XY table 5.
It is designed to be detached from and then divided into individual pieces. This is to prevent the printed wiring board 41 on which the components are mounted from falling into the inside and being damaged if separated when cut.

【0038】このように、プリント基板4,42を装着すれ
ば、後は全て自動的に切断作業が行われる。本実施例は
一例を示したものであり、各部の形状、寸法、材料は上
記のものに限定するものではない。
As described above, when the printed circuit boards 4 and 42 are mounted, the cutting work is automatically performed thereafter. This embodiment shows an example, and the shapes, dimensions, and materials of the respective parts are not limited to the above.

【0039】本実施例は下刃2と下刃22の2個を備えた
装置であったが、その下刃の種類と個数はこれに限定す
るものではなく、これに対応してその選択手段6を備え
ればよい。
The present embodiment is an apparatus provided with two lower blades 2 and 22. However, the type and number of the lower blades are not limited to this, and the selecting means corresponding to this. 6 may be provided.

【0040】又、選択手段6、超音波励振手段8、軸回
動手段91及び移動押圧手段92の原理機構は上記のものに
限定するものではない。
Further, the principle mechanism of the selecting means 6, the ultrasonic exciting means 8, the shaft rotating means 91 and the moving pressing means 92 is not limited to the above.

【0041】[0041]

【発明の効果】以上の如く、本発明のプリント基板分割
機により、 専用切断型が不要となる。
As described above, the printed board dividing machine of the present invention eliminates the need for a dedicated cutting die.

【0042】小径円板刃31,32 と、その刃線方向が軸回
動手段91により任意に変えられることにより、任意形状
の切断ライン44に対応できる汎用機である。 プリント基板4,42毎の切断段取りはプログラム及び
データの変更のみで可能となり、容易である。 自動化製造ラインの中に組み込みし易い。 薄いプリント基板42の補強板7にプレス抜き用の逃
げ穴が必要なくなり、補強板7の構造が簡単となる。 等の効果が得られ、生産性向上に寄与すること著しい。
The small-diameter disc blades 31, 32 and the blade line direction thereof can be arbitrarily changed by the shaft rotating means 91, so that the general-purpose machine can cope with the cutting line 44 having an arbitrary shape. The cutting setup for each of the printed circuit boards 4 and 42 can be easily performed by only changing the program and data. Easy to incorporate into automated production lines. Since the relief plate 7 of the thin printed board 42 does not need a relief hole for press removal, the structure of the reinforcement plate 7 is simplified. It is remarkable that the above effects can be obtained and contribute to the improvement of productivity.

【図面の簡単な説明】[Brief description of drawings]

【図1】 本発明の原理構成図FIG. 1 is a block diagram of the principle of the present invention.

【図2】 本発明の一実施例 (a) 構成斜視図 (b) 側断面図FIG. 2 is an embodiment of the present invention (a) configuration perspective view (b) side sectional view

【図3】 本発明の一実施例の制御系統図FIG. 3 is a control system diagram of an embodiment of the present invention.

【図4】 従来例のV形切断ラインを入れた分割方法 (a) プリント基板 (b) 分割方法の断面斜視図 (c) 分割方法の断面斜視図FIG. 4 is a dividing method including a conventional V-shaped cutting line (a) a printed circuit board (b) a sectional perspective view of the dividing method (c) a sectional perspective view of the dividing method

【図5】 従来例のルータ加工とV形切断ラインを入れ
た分割方法のプリント基板
FIG. 5 is a printed circuit board of a conventional method of processing a router and a dividing method including a V-shaped cutting line.

【図6】 従来例の薄板プリント基板の分割方法のプリ
ント基板
FIG. 6 is a printed circuit board of a conventional method for dividing a thin printed circuit board.

【符号の説明】[Explanation of symbols]

1 上刃 2,22 下刃 4,
42,49 プリント基板 5 XYテーブル 6 選択手段 7
補強板 8 超音波励振手段 31,32,36,37 円板刃 33
小球面 34 小球 38 回転円板 39
V溝 41,48 プリント配線板 44 切断ライン 45
V型切断ライン 46 切断部 47 継ぎ部 61
ターンテーブル 62 受け部 91 軸回動手段 92
移動押圧手段
1 Upper blade 2,22 Lower blade 4,
42,49 Printed circuit board 5 XY table 6 Selection means 7
Reinforcement plate 8 Ultrasonic excitation means 31,32,36,37 Disc blade 33
Small spherical surface 34 Small spherical surface 38 Rotating disk 39
V-groove 41,48 Printed wiring board 44 Cutting line 45
V-type cutting line 46 Cutting part 47 Joint part 61
Turntable 62 Receiver 91 Axial rotation means 92
Moving and pushing means

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 複数個を割り付けたプリント基板を分割
するプリント基板分割機であって、 小径の円板刃(31)を先端に回動自在に備え、所定の距離
を上下動でき且つ下向きに所定の押力が印加できる上刃
(1) と、 該上刃(1) に対向して小円板状の回動自在の円板刃(32)
を先端所定位置に備える下刃(2) と、 プリント基板(4) を固定し、制御プログラムにより切断
ライン(44)を前記下刃(2) の先端に接して移動させるX
Yテーブル(5) と、から構成し、 該上刃(1) が下降し、該プリント基板(4) の切断ライン
(44)に接し、所定押圧を加えて切断することを特徴とす
るプリント基板分割機。
1. A printed circuit board dividing machine for dividing a plurality of printed circuit boards into which a small diameter disc blade (31) is rotatably provided at its tip, and is capable of moving up and down a predetermined distance and facing downward. Upper blade that can apply a predetermined pressing force
(1) and a small disc-shaped rotatable disc blade (32) facing the upper blade (1)
Fix the lower blade (2) with the tip at the predetermined position and the printed circuit board (4), and move the cutting line (44) in contact with the tip of the lower blade (2) by the control program X
The Y table (5) and the upper blade (1) descends, and the cutting line of the printed circuit board (4)
A printed circuit board dividing machine which is in contact with (44) and cuts by applying a predetermined pressure.
【請求項2】 上刃(1) と下刃(2) とがプリント基板
(4) の切断ライン(44)に沿って軸回動することを特徴と
する、請求項1記載のプリント基板分割機。
2. The upper blade (1) and the lower blade (2) are printed circuit boards.
The printed circuit board dividing machine according to claim 1, wherein the printed circuit board dividing machine pivots along a cutting line (44) of (4).
【請求項3】 下刃(2) の円板刃(32)の代わりに、小球
面(33)又は回動自在な小球(34)を先端に備える下刃(22)
とし、且つ上刃(1) 又は該下刃(22)の何れかに、上下方
向に所定の微振動を加える超音波励振手段(8) を設けた
ことを特徴とする、請求項1及び請求項2記載のプリン
ト基板分割機。
3. A lower blade (22) provided with a small spherical surface (33) or a freely rotatable small ball (34) at the tip instead of the disc blade (32) of the lower blade (2).
And an ultrasonic excitation means (8) for applying a predetermined slight vertical vibration to either the upper blade (1) or the lower blade (22). Item 2. The printed circuit board divider according to Item 2.
【請求項4】 請求項1記載の下刃(2) の代わりに、請
求項1又は請求項2記載の下刃(2) と、請求項3記載の
下刃(22)とを複数種類備え、プリント基板(4) の種類に
応じて選択使用する選択手段(6) を備えることを特徴と
する、請求項1記載のプリント基板分割機。
4. A plurality of types of lower blades (2) according to claim 1 or claim 2 and lower blades (22) according to claim 3 in place of the lower blade (2) according to claim 1. 2. The printed circuit board dividing machine according to claim 1, further comprising selection means (6) which is selectively used according to the type of the printed circuit board (4).
JP23503492A 1992-09-03 1992-09-03 Printed circuit board dividing machine Withdrawn JPH0679689A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23503492A JPH0679689A (en) 1992-09-03 1992-09-03 Printed circuit board dividing machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23503492A JPH0679689A (en) 1992-09-03 1992-09-03 Printed circuit board dividing machine

Publications (1)

Publication Number Publication Date
JPH0679689A true JPH0679689A (en) 1994-03-22

Family

ID=16980109

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23503492A Withdrawn JPH0679689A (en) 1992-09-03 1992-09-03 Printed circuit board dividing machine

Country Status (1)

Country Link
JP (1) JPH0679689A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1022100A1 (en) * 1999-01-21 2000-07-26 Ultex Corporation Ultrasonic vibration cutting method and apparatus
EP1359612A2 (en) * 2002-04-24 2003-11-05 Sanyo Electric Co., Ltd. Methods of manufacturing a hybrid integrated circuit device
JP2005123606A (en) * 2003-09-25 2005-05-12 Sanyo Electric Co Ltd Hybrid integrated circuit device and manufacturing method therefor
KR100880328B1 (en) * 2001-11-02 2009-01-28 티에치케이 가부시끼가이샤 Scribing device
US7964957B2 (en) 2007-12-26 2011-06-21 Sanyo Electric Co., Ltd. Circuit substrate, circuit device and manufacturing process thereof
WO2012032925A1 (en) * 2010-09-07 2012-03-15 シーシーエス株式会社 Led wiring board and light irradiation apparatus
DE102023109769B3 (en) 2023-04-18 2024-09-26 Contexo Gmbh Device for making a slot in a workpiece

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1022100A1 (en) * 1999-01-21 2000-07-26 Ultex Corporation Ultrasonic vibration cutting method and apparatus
KR100390250B1 (en) * 1999-01-21 2003-07-04 가부시키가이샤 아루테쿠스 Ultrasonic vibration cutting method and apparatus
CN1143762C (en) * 1999-01-21 2004-03-31 株式会社厄泰克斯 Ultrasonic vibrative cutting method and its device
KR100880328B1 (en) * 2001-11-02 2009-01-28 티에치케이 가부시끼가이샤 Scribing device
EP1359612A2 (en) * 2002-04-24 2003-11-05 Sanyo Electric Co., Ltd. Methods of manufacturing a hybrid integrated circuit device
EP1359612A3 (en) * 2002-04-24 2006-04-19 Sanyo Electric Co., Ltd. Methods of manufacturing a hybrid integrated circuit device
JP2005123606A (en) * 2003-09-25 2005-05-12 Sanyo Electric Co Ltd Hybrid integrated circuit device and manufacturing method therefor
US7964957B2 (en) 2007-12-26 2011-06-21 Sanyo Electric Co., Ltd. Circuit substrate, circuit device and manufacturing process thereof
WO2012032925A1 (en) * 2010-09-07 2012-03-15 シーシーエス株式会社 Led wiring board and light irradiation apparatus
JP2012059793A (en) * 2010-09-07 2012-03-22 Ccs Inc Led wiring board and light irradiation device
CN103081146A (en) * 2010-09-07 2013-05-01 Ccs株式会社 LED wiring board and light irradiation apparatus
DE102023109769B3 (en) 2023-04-18 2024-09-26 Contexo Gmbh Device for making a slot in a workpiece

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Effective date: 19991130