JP3164311U - High color rendering light source module - Google Patents

Abstract

A light source module that emits warm white light with high color rendering properties is provided. A plurality of first LED chips that emit blue light, a second LED chip that emits red light, and a wavelength conversion layer are formed. The plurality of first LED chips and the plurality of second LED chips 30 are arranged on the substrate 10 and electrically connected to the substrate 10, and a plurality of wavelength conversion layers 40 made of resin containing fluorescent powder are provided. The first LED chip and the plurality of second LED chips 30 are sealed to form a convex lens, and the plurality of first LED chips and the plurality of second LED chips 30 are in a quantity of 2: 1. Placed on the substrate 10 in a ratio. The light emitted from the first LED chip and the second LED chip 30 is mixed by the wavelength conversion layer 40, so that the light source module emits warm white light with high color rendering properties. [Selection] Figure 2

Description

The present invention relates to a light source module, and more particularly to a light source module having a light emitting diode as a light source and having high color rendering properties.

A light emitting diode (LED) is an element made of a semiconductor, and emits light by converting electrical energy into light energy through a semiconductor compound. A light emitting diode has characteristics such as long life, high stability, and low power consumption. In the past, light emitting diodes have been used for indicator lights, traffic signals, signboard lights, etc. according to the color of light emitted, but with the advent of white LEDs, they have been applied to lighting equipment.

However, a white LED manufactured by combining a conventional blue LED chip with yellow fluorescent powder has a very high color temperature and uneven light emission because blue light occupies most of the emission spectrum. Furthermore, since the intensity | strength of the red part of an emission spectrum is weak, it has the problem that it is inferior to color rendering property. In addition, in the process of applying the resin during the manufacturing process of the light emitting diode, since the resin easily flows out to the side surface of the substrate, the LED chip sealing process is affected, and the mixed light becomes non-uniform. . These problems are a major drawback of white LEDs.

In order to solve the problem that the white LED is inferior in color rendering, some manufacturers add a red or green fluorescent powder in the white LED sealing process to lower the color temperature and improve the color rendering. The effect of increasing is achieved. However, when this method is adopted, it is difficult to control the uniformity of the concentration of the fluorescent powder, greatly increasing the difficulty of the manufacturing process, and the quality of the manufactured white LED does not reach a desired level.

In addition, some manufacturers have devised an optical module that emits white light using a secondary optical system by arranging a white LED and a red LED in one secondary lens. However, when actually applied, the white light emitting module emits red light that is clearly visible to the naked eye in addition to emitting the desired warm white light, resulting in poor overall light emission uniformity.

Moreover, when the above-mentioned secondary lens is pressed by an external force, it falls off and the LED chip cannot be protected. In addition, the secondary lens is thermally expanded and contracted due to heat generated when the white light emitting module is used for a long period of time, and as a result, the illumination brightness of the light source is lowered. Have.

JP 2006-232134 A

An object of the present invention is to provide a light source module that emits warm white light with high color rendering properties.

The high color rendering light source module of the present invention comprises a substrate, a plurality of first LED chips, a plurality of second LED chips, and a wavelength conversion layer. The plurality of first LED chips are disposed on the substrate and electrically connected to the substrate. The plurality of second LED chips are disposed on the substrate and electrically connected to the substrate and the plurality of first LED chips. The wavelength conversion layer seals the plurality of first LED chips and the plurality of second LED chips.

The plurality of first LED chips and the plurality of second LED chips are arranged on the substrate in a quantity ratio of 2: 1. The light emitted from the plurality of first LED chips and the plurality of second LED chips is mixed by the wavelength conversion layer, whereby the light source module emits warm white light with high color rendering properties.

The high color rendering light source module according to the present invention includes LED chips emitting two different light colors arranged in a predetermined quantity ratio, and the light emitted from the LED chips is formed by a wavelength conversion layer made of a resin containing fluorescent powder. By mixing, light having high color rendering properties can be emitted at a low color temperature. Since the light source module of the present invention has a simple manufacturing facility as compared with the conventional light source module, the manufacturing cost can be greatly reduced.

1 is a plan view showing a light source module with high color rendering properties according to a first embodiment of the present invention. 1 is a cross-sectional view showing a light source module with high color rendering properties according to a first embodiment of the present invention. It is the elements on larger scale which show the level | step difference of the light source module of high color rendering property by 1st Embodiment of this invention. It is a top view which shows the board | substrate of the high color rendering light source module by 2nd Embodiment of this invention.

DESCRIPTION OF EMBODIMENTS Embodiments showing the objects, features, and effects of the present invention will be described in detail with reference to the drawings.

(First embodiment)
Please refer to FIG. 1 and FIG. FIG. 1 is a plan view showing a high color rendering light source module according to a first embodiment of the present invention. FIG. 2 is a cross-sectional view illustrating a high color rendering light source module according to the first embodiment of the present invention.
As shown in FIGS. 1 and 2, the highly color-rendering light source module of the present invention includes a substrate 10, a plurality of first LED chips 20, at least one second LED chip 30, and a wavelength conversion layer 40. Prepare.

An annular step 12 surrounding these LED chips is formed on the substrate 10, whereby an island-shaped flat table 14 is defined on the substrate 10. In the present embodiment, the step 12 is formed in a circle on the substrate 10. The step 12 is formed by etching, electrolytic etching, or machining. The thickness of the substrate 10 is between 0.1 mm and 0.5 mm. The depth of the step 12 is between 0.03 mm and 0.1 mm.

Please refer to FIG. FIG. 3 is a partially enlarged view showing the steps of the light source module with high color rendering properties according to the first embodiment of the present invention. As shown in FIG. 3, a conduction angle θ is formed between the side wall 122 inside the step 12 and the surface 102 of the substrate 10. The guiding angle θ is an angle close to 90 degrees.

Please refer to FIG. 1 and FIG. 2 again. The conductor 16 is disposed through the substrate 10 on the island-like flat table 14. The outer edge of the conductor 16 is covered with an insulating layer 18 so that the conductor 16 and the substrate 10 are insulated.

The plurality of first LED chips 20 are arranged on the island-like flat table 14 and are electrically connected to the substrate 10 (not shown). The emission wavelength band of the first LED chip 20 is 455 nm to 465 nm, and emits blue light.

The plurality of second LED chips 30 are arranged on the island-shaped flat table 14 and are electrically connected to the substrate 10 and the plurality of first LED chips 20 (not shown). The emission wavelength band of the second LED chip 30 is 620 nm to 625 nm, and emits red light.

The plurality of first LED chips 20 and the plurality of second LED chips 30 are arranged in a 2: 1 quantity ratio. Thereby, the color rendering property of the whole light source module is improved, and the color rendering index of the whole light source module is increased to 90 or more.

Further, the plurality of first LED chips 20 and the plurality of second LED chips 30 are arranged on the island-like flat table 14 on the substrate 10 in an axisymmetric manner. The plurality of second LED chips 30 are concentrated on the central position of the island-like flat table 14. The plurality of first LED chips 20 are annularly arranged on the outer periphery of the plurality of second LED chips 30. Moreover, the arrangement | positioning space | interval of the some 2nd LED chip 30 is narrower than the some 1st LED chip 20, and by this arrangement system, the some 1st LED chip 20 and the some 2nd LED chip 30 are the same. The emitted light is uniformly mixed, and the light color uniformity of the entire light source module can be improved.

The wavelength conversion layer 40 contains photoluminescent fluorescent powder, absorbs short-wavelength blue light, and emits longer-wavelength light. The wavelength conversion layer 40 applies a resin containing these fluorescent powders to one surface of the substrate 10 on which the plurality of first LED chips 20 and the plurality of second LED chips 30 are arranged, and the plurality of first LED chips 20 and the plurality of first LED chips 30 are disposed. The LED chip 20 and the plurality of second LED chips 30 are covered. Further, the covering range of the wavelength conversion layer 40 is smaller than the region where the step 12 is defined. That is, the wavelength conversion layer 40 covers the island-shaped flat table 14 and seals the plurality of first LED chips 20 and the plurality of second LED chips 30 in a shape protruding and protruding in an arc shape. Further, since the step 10 is formed on the substrate 10, it is possible to prevent the wavelength conversion layer 40 from flowing into the step 12 from the island-like flat table 14 due to the surface tension of the wavelength conversion layer 40 itself. Thereby, the wavelength conversion layer 40 completely covers the plurality of first LED chips 20 and the plurality of second LED chips 30. Further, since the position of the wavelength conversion layer 40 is regulated on the island-like flat table 14, the light is mixed when the plurality of first LED chips 20 and the plurality of second LED chips 30 are not completely covered. Can be prevented from occurring. The wavelength conversion layer 40 can be formed with a light-transmitting glossy surface or a light-transmitting matte surface.

In addition, the position of the wavelength conversion layer 40 is regulated by the island-shaped flat table 14 and the plurality of first LED chips 20 and the plurality of second LED chips 30 can be completely sealed. Since the light rays emitted from the plurality of first LED chips 20 and the plurality of second LED chips 30 are emitted to the outside via the wavelength conversion layer 40, the light beam uniformity in the related art is not excellent. In addition, the light emission efficiency of the light source module can be significantly increased by setting the light diffusion angle to 160 degrees to 170 degrees by the light exit surface projecting in an arc shape.

When the light source module according to the present embodiment is actually turned on, the wavelength conversion layer 40 absorbs part of the blue light emitted from the plurality of first LED chips 20 and mixes with part of the blue light to generate white light. Is generated. The red light emitted from the plurality of second LED chips 30 does not excite the wavelength conversion layer 40, but the red light is generated by mixing light from the plurality of first LED chips 20 and the wavelength conversion layer 40. Second-order mixing with white light produces low color temperature white light.

Moreover, the uneven | corrugated surface (not shown) is formed in the upper surface of the island-like flat base 14 of the board | substrate 10 by sandblasting process, and the adhesive force of the wavelength conversion layer 40 can be improved. Further, letters or marks (not shown) can be formed on the island-like flat table 14 by etching, anodic dissolution or machining to achieve an advertising effect and an effect that makes the product stand out.

(Second Embodiment)
Please refer to FIG. It is a top view which shows the board | substrate of the high color rendering light source module by 2nd Embodiment of this invention. As shown in FIG. 4, the step 12 can be formed into an irregular circle such as an ellipse or a shape in which two circles are overlapped by etching, anodic dissolution or machining. Thereby, it is possible to prevent the wavelength conversion layer 40 from flowing and diffusing and flowing into the step 12 in the sealing step.

As described above, the high color rendering light source module according to the present invention has two different light color LED chips arranged in a predetermined quantity ratio, and light emitted from the LED chips is mixed by the wavelength conversion layer. High color rendering properties can be emitted at a low color temperature. Since the light source module of the present invention has a simple manufacturing facility as compared with a conventional light source module that is dimmed by fluorescent powder or a secondary optical method, the manufacturing cost can be greatly reduced. In addition, the step formed on the substrate can effectively prevent the wavelength conversion layer from flowing out to the side surface of the substrate.

The above description shows preferred embodiments of the present invention and does not limit the scope of the present invention. All changes or modifications of the equivalent effect based on the scope of the utility model registration claim of the present invention are included in the protection scope of the present invention.

DESCRIPTION OF SYMBOLS 10 Board | substrate 102 Surface 12 Level | step difference 122 Side wall 14 Island-like flat stand 16 Conductive layer 18 Insulating layer 20 1st LED chip 30 2nd LED chip 40 Wavelength conversion layer (theta) Conductive angle

Claims (9)

A substrate,
A plurality of first LED chips disposed on the substrate and electrically connected to the substrate;
A plurality of second LED chips disposed on the substrate and electrically connected to the substrate and the plurality of first LED chips;
A wavelength conversion layer made of a resin containing fluorescent powder that seals the plurality of first LED chips and the plurality of second LED chips, and
The plurality of first LED chips and the plurality of second LED chips are disposed on the substrate in a 2: 1 quantity ratio, the plurality of first LED chips and the plurality of second LEDs. A high color rendering light source module that emits warm white light having high color rendering properties by mixing light emitted from a chip with the wavelength conversion layer.   The step according to claim 1, wherein a step surrounding the LED chip is formed on the substrate, and an angle close to 90 degrees is formed between a side wall inside the step and the surface of the substrate. Color rendering light source module.   3. The light source module with high color rendering properties according to claim 2, wherein a covering range of the wavelength conversion layer is smaller than a region where the step is defined.   The high color rendering light source module according to claim 1, wherein the plurality of first LED chips and the plurality of second LED chips are arranged axially symmetrically on the substrate.   5. The light source module with high color rendering properties according to claim 4, wherein the plurality of first LED chips are annularly arranged around the plurality of second LED chips.   The wavelength conversion layer seals the plurality of first LED chips and the plurality of second LED chips in a shape protruding in an arc shape, and a spherical light exit surface is formed in the wavelength conversion layer. The light source module with high color rendering properties according to claim 1.   The light source module with high color rendering properties according to claim 6, wherein a diffusion angle of the light exit surface protruding in an arc shape is 160 degrees to 170 degrees.   2. The light source module with high color rendering properties according to claim 1, wherein the color rendering value of the light source module is 90 or more.   2. The high color rendering light source module according to claim 1, wherein the wavelength conversion layer contains a photoluminescent fluorescent powder.

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