JP3163764U - LED board - Google Patents

Abstract

An LED substrate having a structure in which an LED substrate on which a plurality of LED substrates are integrally arranged is constituted by a single LED substrate is provided. A circuit is formed on a surface of a base material 6 having high thermal conductivity via an insulator 7 containing a filler made of an inorganic material, and a plurality of LED elements 5 arranged along the circuit; The LED substrate 2 is a constant current element that supplies a constant current to the LED element, and the circuit is an LED substrate 2 that is a circuit having the same pattern formed on the surface of the substrate so as to be separated from each other. [Selection] Figure 2

Description

  The present invention relates to an LED illumination substrate, and more particularly to an LED substrate that can be used for a wide range of illumination by dividing a large number of LED elements and is excellent in heat dissipation.

  In recent years, various lighting devices using LEDs have been proposed and commercialized. Unlike conventional light source configurations, LEDs have a long life and low power consumption.

  Many planar lamp modules using LEDs that utilize this feature as light sources have been proposed. For example, there is an illuminating device in which components can be shared as much as possible while reducing the thickness (see Patent Document 1).

JP 2009-016094 A

  However, the technique proposed in Patent Document 1 is a configuration in which an LED board substrate on which a plurality of LEDs are mounted is attached to a heat radiating plate having various attachment holes, and the LED board is arranged at an arbitrary position and wide. Although it is possible to irradiate, mounting LED elements and other components, and a heat sink and mounting work are required, which complicates the manufacturing process and increases costs.

  In view of the above problems, the present inventor uses the LED element, which is a semiconductor component composed of a plurality of LED chips, to secure a necessary amount of light and to have the same pattern on a metal substrate having high thermal conductivity. By forming a plurality of circuits apart from each other, an LED substrate that can be used for a wide range of illumination has been provided.

  Therefore, the LED substrate of the present invention is an LED substrate on which a large number of LED elements are mounted, and a circuit is formed on the surface of a base material having high thermal conductivity via an insulator containing a filler made of an inorganic material. A plurality of LED elements arranged along the circuit and a constant current element for supplying a constant current to the LED element, and the circuit is a circuit having the same pattern formed on the surface of the substrate so as to be separated from each other. It is characterized by being.

  The base material used in the present invention is preferably a metal material having high thermal conductivity such as aluminum.

  According to the LED substrate according to the present invention, a plurality of circuits having the same pattern are formed on the substrate in a state of being separated from each other. Therefore, it is easy to mount LED elements and other electronic components, and the cost for assembling the substrates is required. It has the effect of not.

  Further, the LED substrate itself has a high thermal conductivity, and can effectively dissipate heat generated from the plurality of LED elements.

It is a top view which shows one Example of the conventional LED board. It is a top view which shows one Example of the LED board which concerns on this invention. It is side surface explanatory drawing of FIG.

  Hereinafter, although this invention is demonstrated, referring drawings which show an Example, it cannot be overemphasized that this invention is not limited to a present Example. FIG. 1 is a plan view showing an example of a conventional LED substrate, FIG. 2 is a plan view showing an embodiment of the LED substrate of the present invention, and FIG. 3 is an explanatory side view of FIG.

  As shown in FIG. 1, conventionally, a plurality of (four) LED substrates 2 are fixed to the surface of a heat radiating plate 1 having a heat radiating property such as Al by an adhesive (not shown) and screws 3. The LED element 5 emits light by being connected to an external power source (not shown) by the cable 4.

  The LED substrate 2 is formed of a metal base substrate on which a plurality of identical circuits are formed in advance. After being formed into a rectangular size, electronic components such as the LED elements 5 are mounted on the heat sink 1 at a predetermined interval. And are fixed by an adhesive (not shown) and screws 3. For this reason, time and expense are required for mounting electronic components such as the LED element 5 and mounting to the heat sink 1, resulting in an increase in cost.

  An embodiment of the present invention will be described with reference to FIGS. As shown in the figure, the LED substrate 2 of the present invention has a circuit (not shown) formed on a single base material 6 such as Al having high thermal conductivity via an insulator 7 containing a filler made of an inorganic material. An electronic component such as the LED element 5 is mounted on the circuit. The circuit arrangement position is the same as the conventional example of FIG.

  FIG. 3 is an explanatory side view of FIG. As shown in the figure, a plurality of LED elements 5 are directly mounted on the LED substrate 2. The LED substrate 2 of the present invention having this configuration is formed by separating a plurality of identical circuits on a single base material 6 having high thermal conductivity, and the electronic components such as the LED elements 5 are based on this single sheet. It can be mounted on the material 6 by a single mounting operation. Further, unlike the conventional LED substrate, it is not necessary to attach a plurality of LED substrates on the heat radiating plate with an adhesive or screws, and the LED substrate can be manufactured in a short time and at a low cost.

  And the LED board of said structure becomes easy to carry out the heat design of a lighting fixture directly from the base material 6 which has the heat | fever which generate | occur | produces the LED element 5 to high heat conductivity.

  As described above, according to the LED substrate of the present invention, a plurality of circuits having the same pattern are formed on the substrate in a state of being separated from each other, so that it is easy to mount LED elements and other electronic components, and the manufacturing cost is reduced. And since the base material of a LED board serves as the function of a heat sink, thermal efficiency is good.

DESCRIPTION OF SYMBOLS 1 Heat sink 2 LED board 3 Screw 4 Cable 5 LED element 6 Base material 7 Insulator

Claims (1)

  A LED substrate on which a large number of LED elements are mounted, and a circuit is formed on the surface of a base material having high thermal conductivity via an insulator containing a filler made of an inorganic material, and a plurality of elements arranged along the circuit. And a constant current element for supplying a constant current to the LED element, and the circuit is a circuit having the same pattern formed on the surface of the substrate so as to be spaced apart from each other.

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