JP3161640U - Universal board - Google Patents

Abstract

The present invention provides a universal board that improves work efficiency when soldering parts and conductors and prevents short circuits. A plurality of terminal insertion holes 12 are arranged in a grid pattern in a multi-row, multi-column manner and spaced apart from each other, and a plurality of electrodes 13 are provided so as to surround each terminal insertion hole 12. The protrusions 20 made of an insulator are arranged on a straight line with a space between each other so as to be positioned between the electrodes 13 so as to be shifted from the rows and columns of the terminal insertion holes 12. [Selection] Figure 2

Description

  The present invention relates to a universal substrate in which terminal insertion holes are formed in a lattice shape.

  Conventionally, a universal substrate is known in which a plurality of terminal insertion holes are formed in an insulating substrate, and a copper foil is provided on the back surface of the insulating substrate on which a component is mounted on the front surface side so as to surround each terminal insertion hole (for example, , See Patent Document 1). In this type of universal substrate, components are mounted on the surface side of the insulating substrate, terminals extending from each component are inserted into the terminal insertion holes, and the tip of the terminal is a metal foil (such as copper foil) on the back surface side of the insulating substrate ( Soldered to the electrode). And the lead wire for connecting between the terminals of each component is drawn around the back side of the insulating substrate, and the lead wire is soldered to the copper foil to which the terminal of each component is attached, thereby forming an electronic circuit.

Japanese Utility Model Publication No. 61-106076

However, in the above conventional configuration, when a plurality of copper foils are connected with a conductor, it is difficult to wire the conductor if there is a bending flaw in the conductor. May come into contact with the adjacent copper foil, it may cause a short circuit.
The present invention has been made in view of the above-described circumstances, and an object of the present invention is to provide a universal substrate that improves work efficiency when soldering components and conductors and prevents a short circuit.

  In order to achieve the above-described object, the present invention provides a plurality of terminal insertion holes in an insulating substrate arranged in a grid pattern in a multi-row, multi-column manner and spaced apart from each other, and surrounding each terminal insertion hole. The electrodes are provided, and the protrusions formed of an insulator are provided on a straight line at intervals from each other so as to be positioned between the electrodes so as to be shifted from the rows and columns of the terminal insertion holes. To do.

  The said structure WHEREIN: You may arrange | position the said protrusion in the middle between the electrodes which adjoin diagonally.

  According to the present invention, a plurality of terminal insertion holes are arranged in a grid pattern in a multi-row, multi-column manner, spaced apart from each other, and provided with a plurality of electrodes so as to surround each terminal insertion hole. For example, when connecting a plurality of electrodes with conducting wires, the protrusions formed by the objects are arranged on a straight line with a space between each electrode so as to be positioned between the electrodes so as to be shifted from the rows and columns of the terminal insertion holes. Moreover, since the conducting wire is supported and stabilized by the projections along the plurality of projections, the conducting wires can be easily wired linearly, and the working efficiency can be improved. Moreover, since a conducting wire can be wired linearly, it can prevent that a conducting wire contacts an adjacent electrode, As a result, a short circuit can be prevented.

It is a perspective view which shows the universal substrate which concerns on embodiment of this invention from the back surface side. It is a top view which shows a universal board | substrate from the back surface side. It is a figure which shows the III-III cross section of FIG. It is a figure which shows the attachment method of protrusion, (A) is sectional drawing which shows a universal substrate before protrusion is attached, (B) is sectional drawing which shows a universal substrate after protrusion is attached. It is a top view which expands and shows a part of universal substrate from the back side.

Embodiments of the present invention will be described below with reference to the drawings.
FIG. 1 is a perspective view showing the universal substrate according to the present embodiment from the back side. FIG. 2 is a plan view showing the universal substrate from the back side, and FIG. 3 is a cross-sectional view taken along the line III-III in FIG.
The universal substrate 10 is a circuit substrate used for electrical work, circuit experiment, test jig, etc. As shown in FIGS. 1 and 2, a plurality of terminal insertion holes 12 are formed in the insulating substrate 11, respectively. A plurality of electrodes (copper foil) 13 are provided so as to surround the terminal insertion holes 12. The plurality of terminal insertion holes 12 are arranged in a lattice pattern at intervals from each other over a linear multi-row multi-column. Each electrode 13 is formed in a circular shape substantially concentric with the terminal insertion hole 12, and is provided on the back surface 11 </ b> A of the insulating substrate 11. The plurality of electrodes 13 are arranged at intervals.

  As shown in FIG. 3, in the universal substrate 10, a plurality of components 14 are mounted on the surface 11B side of the insulating substrate 11, and terminals 14A extending from the components 14 are inserted into the terminal insertion holes 12, and the tips of the terminals 14A The part is soldered to the electrode 13 on the back surface 11 </ b> A side of the insulating substrate 11. And the conducting wire 15 for connecting between the terminals 14A of each component 14 is drawn to the back surface 11A side of the insulating substrate 11, and the conducting wire 15 is soldered to the electrode 13 to which the terminal 14A of each component 14 is attached. An electronic circuit is configured. As the conducting wire 15, a bare wire that is not covered with a conductor or a covered wire that is covered with an insulator or the like is used. In FIG. 1, the component 14 and the conductive wire 15 are omitted, and only one resistor is illustrated as the component 14 in FIG. 3.

  In addition, the universal substrate 10 is provided with a plurality of protrusions 20 formed of a material that is an insulator and has excellent heat resistance, for example, the same material as the insulating substrate 11. Although each protrusion 20 of this Embodiment is formed in the column shape which has a hemispherical convex top surface, the shape of the protrusion 20 is not limited to this. As shown in FIG. 1 and FIG. 2, the plurality of protrusions 20 are arranged on a straight line with a space from each other so as to be positioned between the four electrodes 13 adjacent to each other with a row and a column shifted from the terminal insertion holes 12. Is arranged. Further, the protrusion 20 is disposed at an intermediate position between the electrodes 13 adjacent in the oblique direction.

4A and 4B are views showing a method of attaching the protrusions 20, FIG. 4A is a cross-sectional view showing the universal substrate 10 before the protrusions 20 are attached, and FIG. 4B is a view after the protrusions 20 are attached. 1 is a cross-sectional view showing a universal substrate 10.
The protrusion 20 is attached to the universal substrate 10 with its flat bottom surface adhered to the back surface 11A of the insulating substrate 11 using a silicon-based adhesive (not shown). For the adhesive, epoxy, ceramic, etc. can be used in addition to silicon. The protrusion 20 itself may be formed of an epoxy, silicon, or ceramic adhesive.

Next, the operation of the protrusion 20 will be described.
FIG. 5 is an enlarged plan view showing a part of the universal substrate 10 from the back side.
In the universal substrate 10, as shown in FIGS. 2 and 5, a plurality of protrusions 20 are arranged in a linear multi-row multi-column, and the protrusions 20 serve as a guide when wiring the conductors 15. Incorrect wiring can be prevented. Thereby, also when connecting the electrodes 13 separated by the conducting wire 15, the conducting wire 15 can be easily wired by placing the conducting wire 15 along the plurality of protrusions 20. Moreover, since the protrusion 20 is disposed in the middle between the electrodes 13 adjacent in the oblique direction, even if the conductor 15 is wired along the plurality of protrusions 20, the conductor 15 is positioned on the electrode 13. It can be easily soldered to the electrode 13.

For example, as shown in FIG. 2, when the electrodes 13 </ b> A to 13 </ b> B are linearly connected by the conducting wire 15, even if the conducting wire 15 has a bending wrinkle, Since the lead wire 15 is supported and stabilized by the plurality of protrusions 20, the lead wire 15 can be easily wired linearly and the lead wire 15 can be easily soldered.
On the other hand, even when the substantially linear conducting wire 15 is bent and connected at an angle from the electrode 13C to the electrode 13D, the plurality of projections 20 support the conducting wire 15 by placing the conducting wire 15 along the projection 20. Since the shape of the conducting wire 15 is difficult to return, the conducting wire 15 can be easily wired and the conducting wire 15 can be easily soldered.

Further, even when the conducting wire 15 is wired at an angle, the wiring 15 can be arranged linearly before and after the bent portion of the conducting wire 15, so that the wiring is arranged and erroneous wiring of the conducting wire 15 can be prevented. In this way, miswiring of the lead wire 15 can be prevented and the lead wire 15 can be easily wired, so that the work time for attaching the lead wire 15 can be shortened. Furthermore, by conducting the conducting wire 15 linearly, the conducting wire 15 can be prevented from coming into contact with the adjacent electrode 13, and as a result, a short circuit can be prevented.
In addition to this, as shown in FIG. 5, when a plurality of conductors 15 are arranged close to each other, the insulation performance between the adjacent conductors 15 is increased by sandwiching the protrusions 20 between the adjacent conductors 15. Therefore, it is possible to prevent a short circuit between the adjacent conductors 15.

  Further, since the plurality of protrusions 20 are arranged so as to be shifted from the rows and columns of the electrodes 13 arranged in a grid pattern, when the protrusions 20 are arranged between the electrodes 13 adjacent in the row direction or the column direction, respectively. In comparison, the number of protrusions 20 can be reduced.

  As described above, according to the present embodiment, a plurality of terminal insertion holes 12 are arranged in a grid pattern in the insulating substrate 11 so as to be spaced apart from each other over multiple rows and columns. A plurality of electrodes 13 are provided so as to surround, and the protrusions 20 formed of an insulator are provided so as to be positioned between the four electrodes 13 adjacent to each other with a row and a column shifted from the terminal insertion holes 12. . With this configuration, when the plurality of electrodes 13 are connected by the lead wires 15, the lead wires 15 are supported by the protrusions 20 by the lead wires 15 along the plurality of protrusions 20, so that the lead wires 15 are wired linearly. It becomes easy to make it possible to improve work efficiency. Moreover, since the conducting wire 15 can be wired linearly, it can prevent that the conducting wire 15 contacts the adjacent electrode 13, and can prevent a short circuit as a result.

However, the above embodiment is an aspect of the present invention, and it is needless to say that the embodiment can be appropriately changed without departing from the gist of the present invention.
For example, in the above embodiment, the copper foil as the electrode 13 is provided on the back surface 11A of the insulating substrate 11, but it may be provided on both surfaces of the insulating substrate, or the copper foil on both surfaces of the insulating substrate may be inserted into the terminal. You may connect by the through-hole plating given to the inner surface of a hole. Moreover, the external shape of copper foil is not limited to a circle.

10 Universal substrate 11 Insulating substrate 12 Terminal insertion hole 13 Electrode (copper foil)
20 protrusions

Claims (2)

  A plurality of terminal insertion holes are arranged in a grid pattern in a multi-row, multi-column manner, spaced apart from each other on the insulating substrate, and a plurality of electrodes are provided so as to surround each terminal insertion hole, and a protrusion formed of an insulator is provided. A universal substrate characterized by being provided on a straight line with a space between each other so as to be positioned between the electrodes so as to be shifted from the rows and columns of the terminal insertion holes.   The universal substrate according to claim 1, wherein the protrusion is disposed in the middle between electrodes adjacent in an oblique direction.

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