JP3160987B2 - Assembly structure of autofocus module - Google Patents

Assembly structure of autofocus module

Info

Publication number
JP3160987B2
JP3160987B2 JP01721492A JP1721492A JP3160987B2 JP 3160987 B2 JP3160987 B2 JP 3160987B2 JP 01721492 A JP01721492 A JP 01721492A JP 1721492 A JP1721492 A JP 1721492A JP 3160987 B2 JP3160987 B2 JP 3160987B2
Authority
JP
Japan
Prior art keywords
light
package
adhesive
shielding box
auto
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP01721492A
Other languages
Japanese (ja)
Other versions
JPH05219424A (en
Inventor
道子 堀口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP01721492A priority Critical patent/JP3160987B2/en
Publication of JPH05219424A publication Critical patent/JPH05219424A/en
Application granted granted Critical
Publication of JP3160987B2 publication Critical patent/JP3160987B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Measurement Of Optical Distance (AREA)
  • Automatic Focus Adjustment (AREA)
  • Solid State Image Pick-Up Elements (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、オートフォーカスカメ
ラなどに組み込んで使用するパッシブ方式のオートフォ
ーカスモジュールの組立構造に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an assembling structure of a passive type autofocus module used by being incorporated in an autofocus camera or the like.

【0002】[0002]

【従来の技術】周知のようにオートフォーカスカメラに
は、被写体をレンズを通じて一次元のイメジセンサに結
合させ、その映像信号を処理して被写体までの距離を測
距するパッシブ方式のオートフォーカスモジュールが組
み込まれている。図3,図4は従来におけるオートフォ
ーカスモジュールの組立構造を表したものであり、図に
おいて、1はオートフォーカスIC、2は左右一対に並
ぶセパレータレンズ、3はセパレータレンズ2を装備し
てオートフォーカスIC1の受光面側に組合わせた遮光
ボックスである。また、前記のオートフォーカスIC1
は直線状に並ぶ一対のホトセンサアレイを設けたICチ
ップをクリアモールド,あるいはセラミック製のパッケ
ージ1aに収容し、パッケージ1aの上面中央に受光窓
部1bを形成したものである。なお、1cはパッケージ
1aから引出した外部リードを示す。
2. Description of the Related Art As is well known, an autofocus camera incorporates a passive autofocus module that couples a subject to a one-dimensional image sensor through a lens, processes the video signal, and measures the distance to the subject. Have been. 3 and 4 show an assembly structure of a conventional autofocus module. In the drawings, 1 is an autofocus IC, 2 is a pair of left and right separator lenses, and 3 is equipped with a separator lens 2 for autofocus. This is a light-shielding box combined with the light receiving surface side of IC1. In addition, the above-mentioned auto focus IC 1
In this example, an IC chip provided with a pair of photosensor arrays arranged in a straight line is accommodated in a clear mold or ceramic package 1a, and a light receiving window 1b is formed in the center of the upper surface of the package 1a. Reference numeral 1c denotes an external lead pulled out of the package 1a.

【0003】そして、オートフォーカスモジュール体を
組立てるには、遮光ボックス3の底部側にあらかじめ膨
出形成した溝付きの取付け脚部3aをオートフォーカス
IC1のパッケージ上面に重ね合わせ、両者間を接着剤
4で一体に接着する。ここで、接着剤4としては一般に
紫外線硬化型接着剤を用い、取付け脚部3aと平行に側
方から紫外線を照射して接着剤4を硬化させるようにし
ている。
In order to assemble the autofocus module body, a grooved mounting leg 3a, which is formed in advance on the bottom side of the light-shielding box 3, is superimposed on the upper surface of the package of the autofocus IC 1, and an adhesive 4 is applied between the two. And glue them together. Here, as the adhesive 4, an ultraviolet curing adhesive is generally used, and the adhesive 4 is cured by irradiating ultraviolet rays from the side in parallel with the mounting leg 3a.

【0004】また、かかる構成のオートフォーカスモジ
ュールに採用した従来のオートフォーカスICの仕様で
は、パッケージ1aの長手寸法に対してICチップの長
さが比較的小さく、パッケージの長手方向の両端と受光
窓部1bの間にはかなり余裕のある面域が残っている。
そこで、従来の組立構造ではオートフォーカスICパッ
ケージの上面長手方向の両端部分を遮光ボックス3との
間の接着部に定め、遮光ボックス3側にはパッケージ1
aの長手方向の両端部と向かい合う二辺に取付け脚部3
aを形成して両者間を接着剤4で接合するようにしてい
る。
In the specification of the conventional autofocus IC employed in the autofocus module having such a configuration, the length of the IC chip is relatively small with respect to the longitudinal dimension of the package 1a, and both ends of the package in the longitudinal direction and the light receiving window are provided. There is a fairly large surface area between the portions 1b.
Therefore, in the conventional assembly structure, both ends in the longitudinal direction of the upper surface of the autofocus IC package are defined as bonding portions between the light shielding box 3 and the package 1 is provided on the light shielding box 3 side.
mounting legs 3 on two sides facing both ends in the longitudinal direction of a
a is formed and the two are joined with the adhesive 4.

【0005】[0005]

【発明が解決しようとする課題】ところで、最近の新し
いオートフォーカスICの仕様では、ホトセンサアレイ
当たりのセンサ数が増大する傾向にあり、これに伴って
パッケージ上での受光窓部の領域も長大になっている。
このためにパッケージの長手方向に沿った両端部の残余
面域が狭まり、遮光ボックスを受光窓部に掛からないよ
う固定するために必要な十分な接着面域が確保できな
い。この結果、前記した従来の組立構造のままではIC
パッケージと遮光ボックスとの接着が不安定となる。
By the way, in the specification of the recent new autofocus IC, the number of sensors per photosensor array tends to increase, and accordingly, the area of the light receiving window on the package becomes long. It has become.
For this reason, the remaining surface area at both ends along the longitudinal direction of the package is reduced, and a sufficient adhesive surface area necessary for fixing the light shielding box so as not to be hung on the light receiving window cannot be secured. As a result, if the conventional assembly structure described above is used, the IC
Adhesion between the package and the light-shielding box becomes unstable.

【0006】本発明は上記の点にかんがみなされたもの
であり、その目的は前記の課題を解決して新仕様のオー
トフォーカスICにも十分対応できるように構成したオ
ートフォーカスモジュールの組立構造を提供することに
ある。
SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and has as its object to provide an assembly structure of an autofocus module which solves the above-mentioned problems and is configured to sufficiently cope with a new specification autofocus IC. Is to do.

【0007】[0007]

【課題を解決するための手段】上記目的を達成するため
に、本発明の組立構造においては、パッケージ遮光ボ
ックスとの間の接着部をパッケージの長手方向に沿った
上面両サイドに定め、この接着部と向かい合う遮光ボッ
クスの底部二辺に取付け脚部を設けて接着するものとす
る。
In order to achieve the above object, in the assembly structure of the present invention, the bonding portion between the package and the light-shielding box is formed along the longitudinal direction of the package.
It is defined on both sides of the upper surface, and attachment legs are provided on the two bottom sides of the light-shielding box facing the adhesion portion and adhered.

【0008】また、前記構成の実施態様として、遮光ボ
ックスの両サイドに設けた取付け脚部を部分的に切欠い
て互い違いに配列するとともに、接着剤に紫外線硬化型
接着剤を用い、かつ遮光ボックスの左右側方より紫外線
を照射して接着剤を硬化させるようにした構成がある。
Further, as an embodiment of the above-mentioned structure, mounting legs provided on both sides of the light-shielding box are partially cut out and arranged alternately, an ultraviolet-curable adhesive is used as an adhesive, and There is a configuration in which ultraviolet light is irradiated from the left and right sides to cure the adhesive.

【0009】[0009]

【作用】上記の構成によれば、ICパッケージの長手方
向と平行な左右両サイドに遮光ボックスとの接着部を定
めたので、オートフォーカスICチップの仕様に関係な
く、ICパッケージの受光窓部を避けて上面側に遮光ボ
ックスの取付け脚部を接着するために必要,かつ十分な
幅の面域を確保することができる。
According to the above arrangement, the light-shielding box is provided on both the left and right sides parallel to the longitudinal direction of the IC package, so that the light receiving window of the IC package can be used regardless of the specifications of the autofocus IC chip. It is possible to secure a surface area which is necessary and sufficient for bonding the mounting leg of the light-shielding box to the upper surface side while avoiding it.

【0010】また、前記の接着面域と向かい合う遮光ボ
ックスの底部二辺に設けた取付け脚部を部分的に切欠い
て互い違いに配列した構成によれば、接着剤に紫外線硬
化型接着剤を用い場合でも、遮光ボックスの左右側方よ
り紫外線を投光することにより、光線の一部は取付け脚
の切欠部分を通じて反対側サイドに並ぶ取付け脚部の裏
面側に照射されることになる。これにより、遮光ボック
スの取付け脚部とICパッケージとの間に介在する紫外
線硬化型接着剤に対して紫外線が取付け脚部の表,裏の
両面から照射されので、未硬化部分を残すことなく接着
剤を確実に硬化させることができる。
Further, according to the configuration in which the mounting legs provided on the bottom two sides of the light-shielding box facing the adhesive surface area are partially cut out and arranged alternately, the ultraviolet curable adhesive is used as the adhesive. However, by projecting the ultraviolet rays from the left and right sides of the light-shielding box, a part of the light beam is radiated to the rear surface side of the mounting legs arranged on the opposite side through the cutout portions of the mounting legs. As a result, ultraviolet rays are radiated from both the front and back sides of the mounting leg to the ultraviolet-curing adhesive interposed between the mounting leg of the light-shielding box and the IC package. The agent can be reliably cured.

【0011】[0011]

【実施例】以下本発明の実施例を図面に基づいて説明す
る。なお、各実施例において、図3,図4と対応する同
一部材には同じ符号が付してある。 実施例1:図1(a),(b)において、オートフォーカ
スIC1のパッケージ1aに組合わせる遮光ボックス3
の底部側には、ICパッケージ1aの長手方向と平行な
左右二辺に取付け脚部3aが膨出形成されている。そし
て、遮光ボックス3をパッケージ1aに接着してオート
フォーカスモジュールを組立てるには、前記の取付け脚
部3aの端面に接着剤4(斜線を付して表す)を塗布し
た上で、これをパッケージ1aの上面両サイドに重ね合
わせて硬化処理する。なお、この実施例では、接着剤4
として例えば常温硬化型の接着剤を用いるものとする。
Embodiments of the present invention will be described below with reference to the drawings. In each embodiment, the same members corresponding to FIGS. 3 and 4 are denoted by the same reference numerals. Embodiment 1: In FIGS. 1A and 1B, a light-shielding box 3 combined with a package 1a of an autofocus IC 1
At the bottom side, mounting leg portions 3a are formed so as to bulge on two left and right sides parallel to the longitudinal direction of the IC package 1a. Then, in order to assemble the autofocus module by bonding the light-shielding box 3 to the package 1a, an adhesive 4 (indicated by oblique lines) is applied to the end surface of the mounting leg 3a, and then this is attached to the package 1a. And cured on both sides of the upper surface. In this embodiment, the adhesive 4
For example, a room temperature curing type adhesive is used.

【0012】かかる構成によれば、ICチップの寸法が
長く、これを組み込んだパッケージ1aの長手方向の両
端と受光窓部1bとの間に十分な接着面域が確保できな
い場合でも、遮光ボックス3の取付け脚部3aとICパ
ッケージ1aの長手方向に沿った両サイドとの間には、
受光窓部1bに掛からないように十分な幅の接着面域を
確保して接着剤4による強固な結合を得ることができ
る。
According to this configuration, even when the size of the IC chip is long and a sufficient adhesive surface area cannot be secured between both ends in the longitudinal direction of the package 1a incorporating the IC chip and the light receiving window 1b, Between the mounting leg 3a and the two sides along the longitudinal direction of the IC package 1a.
An adhesive surface area having a sufficient width can be ensured so as not to cover the light receiving window 1b, and a strong connection by the adhesive 4 can be obtained.

【0013】実施例2:図2(a),(b)は本発明の請
求項2に対応する実施例を示すものであり、オートフォ
ーカスIC1のパッケージ1aに対し、その長手方向に
平行な遮光ボックス3の底部二辺に膨出形成した取付け
脚部3aは、部分的に切欠いて左右で互い違いに並ぶよ
う形成されている。そして、接着剤4には紫外線硬化型
接着剤を用い、モジュールの組立状態で接着剤4を硬化
する際には、(b)図のように遮光ボックス3の左右両
側に配した紫外線光源5より接着部に向けて紫外線を照
射する。この場合に、投光光線の一部は取付け脚部3a
の切欠部分(ICパッケージ1aの上面と遮光ボックス
3の底面との間の隙間)を通じて遮光ボックス内に進入
し、反対側サイドに並ぶ取付け脚部の裏面側から接着部
を照射する。したがって、接着剤4は遮光ボックス3の
表,裏から紫外線が照射されることになり、未硬化部分
を残すことなく確実に硬化される。
Embodiment 2 FIGS. 2A and 2B show an embodiment corresponding to claim 2 of the present invention. The package 1a of the autofocus IC 1 is shielded from light in a direction parallel to its longitudinal direction. The mounting legs 3a that protrude from the bottom two sides of the box 3 are partially cut out and formed to be alternately arranged on the left and right. An ultraviolet curing adhesive is used as the adhesive 4, and when the adhesive 4 is cured in the assembled state of the module, the ultraviolet light sources 5 arranged on the left and right sides of the light shielding box 3 as shown in FIG. Irradiate ultraviolet rays to the bonding part. In this case, a part of the projected light beam is attached to the mounting leg 3a.
(Not shown) (a gap between the upper surface of the IC package 1a and the bottom surface of the light-shielding box 3) into the light-shielding box, and irradiates the adhesive portion from the back side of the mounting legs arranged on the opposite side. Therefore, the adhesive 4 is irradiated with ultraviolet rays from the front and back of the light-shielding box 3, and is reliably cured without leaving uncured portions.

【0014】[0014]

【発明の効果】以上述べたように本発明の組立構造によ
れば、オートフォーカスICパッケージの長手方向に沿
った上面両サイドを接着面域としてここに遮光ボックス
の取付け脚部を接着剤で接合するようにしたので、ホト
センサアレイ長が異なる各種仕様のオートフォーカスI
Cに対しても、必要な接着面域を確保してICパッケー
ジと遮光ボックスとの間を強固に接着して組立てること
ができる。
As described above, according to the assembling structure of the present invention, both sides of the upper surface along the longitudinal direction of the autofocus IC package are used as the bonding surface areas, and the mounting legs of the light-shielding box are bonded thereto with the adhesive. Autofocus I of various specifications with different photosensor array lengths.
Also for C, the necessary bonding surface area is secured and the IC package and the light-shielding box can be firmly bonded and assembled.

【0015】また、遮光ボックスの取付け脚部を部分的
に切欠いて左右互い違いに配列させた構成では、接着剤
に紫外線硬化型接着剤を使用した場合に、紫外線を遮光
ボックスの表,裏両面から照射して接着剤を未硬化部分
を残すことなく確実に硬化させることができる。
Further, in a configuration in which the mounting legs of the light-shielding box are partially cut out and arranged alternately on the left and right, when an ultraviolet-curable adhesive is used as the adhesive, ultraviolet light is emitted from both the front and back sides of the light-shielding box. Irradiation can reliably cure the adhesive without leaving uncured portions.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の実施例1に対応する組立構成図であ
り、(a)は分解斜視図、(b)は遮光ボックスの底面
FIG. 1 is an assembly configuration diagram corresponding to a first embodiment of the present invention, in which (a) is an exploded perspective view, and (b) is a bottom view of a light-shielding box.

【図2】本発明の実施例2に対応する組立構成図であ
り、(a)は分解斜視図、(b)は遮光ボックスの底面
FIGS. 2A and 2B are assembly configuration diagrams corresponding to Embodiment 2 of the present invention, wherein FIG. 2A is an exploded perspective view and FIG. 2B is a bottom view of a light-shielding box.

【図3】従来実施されているオートフォーカスモジュー
ル組立体の分解斜視図
FIG. 3 is an exploded perspective view of a conventionally implemented autofocus module assembly.

【図4】図3の組立状態を表す側面図FIG. 4 is a side view showing the assembled state of FIG. 3;

【符号の説明】[Explanation of symbols]

1 オートフォーカスIC 1a パッケージ 1b 受光窓部 2 レンズ 3 遮光ボックス 3a 取付け脚部 4 接着剤 5 紫外線光源 DESCRIPTION OF SYMBOLS 1 Autofocus IC 1a Package 1b Light-receiving window part 2 Lens 3 Light-shielding box 3a Mounting leg part 4 Adhesive 5 Ultraviolet light source

Claims (3)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】オートフォーカスICに光学レンズを装備
の遮光ボックスを組合わせて構成したオートフォーカス
モジュールであり、オートフォーカスICのパッケージ
上面に遮光ボックスの取付け脚部を重ね合わせて接着剤
で接着したものにおいて、前記オートフォーカスICの
外部リードが前記パッケージの長手方向の側面内から突
出し、前記パッケージ遮光ボックスとの間の接着部を
パッケージの長手方向に沿った上面両サイドに定め、こ
の接着部と向かい合う遮光ボックスの底部二辺に取付け
脚部を設けて接着したことを特徴とするオートフォーカ
スモジュールの組立構造。
1. An auto-focus module comprising an auto-focus IC and a light-shielding box equipped with an optical lens, wherein a mounting part of the light-shielding box is superimposed on an upper surface of a package of the auto-focus IC and adhered with an adhesive. The auto-focus IC
External leads protrude from inside the longitudinal side of the package.
The package and the light-shielding box of the package are fixed on both sides of the upper surface along the longitudinal direction of the package, and two legs at the bottom of the light-shielding box facing the adhesive are provided and bonded. Assembling structure of the autofocus module.
【請求項2】請求項1記載の組立構造において、遮光ボ
ックスの両サイドに設けた取付け脚部を部分的に切欠い
て互い違いに配列するとともに、接着剤に紫外線硬化型
接着剤を用い、かつ遮光ボックスの左右側方より紫外線
を照射して接着剤を硬化させたことを特徴とするオート
フォーカスモジュールの組立構造。
2. The assembly structure according to claim 1, wherein the mounting legs provided on both sides of the light-shielding box are partially cut out and arranged alternately, and an ultraviolet-curing adhesive is used as an adhesive, and the light-shielding is performed. An assembly structure of an autofocus module, wherein the adhesive is cured by irradiating ultraviolet rays from left and right sides of the box.
【請求項3】請求項1記載の組立構造において、オート
フォーカスICが、そのパッケージの長手方向に沿って
直線状に並ぶ一対のホトセンサアレイを内蔵しているこ
とを特徴とするオートフォーカスモジュールの組立構
造。
3. The auto-focus module according to claim 1, wherein the auto-focus IC includes a pair of photosensor arrays linearly arranged along a longitudinal direction of the package. Assembly structure.
JP01721492A 1992-02-03 1992-02-03 Assembly structure of autofocus module Expired - Fee Related JP3160987B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP01721492A JP3160987B2 (en) 1992-02-03 1992-02-03 Assembly structure of autofocus module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP01721492A JP3160987B2 (en) 1992-02-03 1992-02-03 Assembly structure of autofocus module

Publications (2)

Publication Number Publication Date
JPH05219424A JPH05219424A (en) 1993-08-27
JP3160987B2 true JP3160987B2 (en) 2001-04-25

Family

ID=11937698

Family Applications (1)

Application Number Title Priority Date Filing Date
JP01721492A Expired - Fee Related JP3160987B2 (en) 1992-02-03 1992-02-03 Assembly structure of autofocus module

Country Status (1)

Country Link
JP (1) JP3160987B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002202448A (en) * 2000-12-28 2002-07-19 Fuji Electric Co Ltd Automatic focusing module and molding method of its lens and molding die

Also Published As

Publication number Publication date
JPH05219424A (en) 1993-08-27

Similar Documents

Publication Publication Date Title
JP7099103B2 (en) The camera module
CN109581785B (en) Camera module for reducing stray light and photosensitive assembly thereof
JP2013168918A (en) Image reading device and image formation device
US7522355B2 (en) Lens unit and manufacturing method thereof
JP6629966B2 (en) Adhesive structure, imaging device, and in-vehicle camera
US5377038A (en) Scanning optical system
JP2000066089A (en) Optical sensor and optical unit
WO2019062610A1 (en) Camera module for reducing stray light and photosensitive assembly thereof, and electronic device
JPH11109270A (en) Cylindrical lens and optical scanning device using same
JP3160987B2 (en) Assembly structure of autofocus module
KR101993898B1 (en) Camera module and method of manufacturing it
JP2023083330A (en) camera
JP4129154B2 (en) Imaging module
JP6057538B2 (en) Imaging device
JP2821513B2 (en) Synthetic resin lens for laser scanning
WO2023032295A1 (en) Sensor module and method for manufacturing sensor module
JPH05210046A (en) Assembly structure of autofocus module
JP7225964B2 (en) Light shielding member and camera
JP2636627B2 (en) Bonding method for solid-state imaging device
JPS6338907A (en) Optical multiplexing/demultiplexing module
JP2018093342A (en) Prism unit, solid-state imaging device and method for manufacturing solid-state imaging device
JP2000231051A (en) Focus detector
KR20230051693A (en) Optical line sensor member and manufacturing method thereof
JPH08152548A (en) Light source device and method for mounting light source device
JPH114045A (en) Laser beam generating device

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080223

Year of fee payment: 7

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090223

Year of fee payment: 8

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090223

Year of fee payment: 8

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313113

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090223

Year of fee payment: 8

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

LAPS Cancellation because of no payment of annual fees