JP3160987B2 - Assembly structure of autofocus module - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an assembling structure of a passive type autofocus module used by being incorporated in an autofocus camera or the like.

[0002]

2. Description of the Related Art As is well known, an autofocus camera incorporates a passive autofocus module that couples a subject to a one-dimensional image sensor through a lens, processes the video signal, and measures the distance to the subject. Have been. 3 and 4 show an assembly structure of a conventional autofocus module. In the drawings, 1 is an autofocus IC, 2 is a pair of left and right separator lenses, and 3 is equipped with a separator lens 2 for autofocus. This is a light-shielding box combined with the light receiving surface side of IC1. In addition, the above-mentioned auto focus IC 1
In this example, an IC chip provided with a pair of photosensor arrays arranged in a straight line is accommodated in a clear mold or ceramic package 1a, and a light receiving window 1b is formed in the center of the upper surface of the package 1a. Reference numeral 1c denotes an external lead pulled out of the package 1a.

In order to assemble the autofocus module body, a grooved mounting leg 3a, which is formed in advance on the bottom side of the light-shielding box 3, is superimposed on the upper surface of the package of the autofocus IC 1, and an adhesive 4 is applied between the two. And glue them together. Here, as the adhesive 4, an ultraviolet curing adhesive is generally used, and the adhesive 4 is cured by irradiating ultraviolet rays from the side in parallel with the mounting leg 3a.

In the specification of the conventional autofocus IC employed in the autofocus module having such a configuration, the length of the IC chip is relatively small with respect to the longitudinal dimension of the package 1a, and both ends of the package in the longitudinal direction and the light receiving window are provided. There is a fairly large surface area between the portions 1b.
Therefore, in the conventional assembly structure, both ends in the longitudinal direction of the upper surface of the autofocus IC package are defined as bonding portions between the light shielding box 3 and the package 1 is provided on the light shielding box 3 side.
mounting legs 3 on two sides facing both ends in the longitudinal direction of a
a is formed and the two are joined with the adhesive 4.

[0005]

By the way, in the specification of the recent new autofocus IC, the number of sensors per photosensor array tends to increase, and accordingly, the area of the light receiving window on the package becomes long. It has become.
For this reason, the remaining surface area at both ends along the longitudinal direction of the package is reduced, and a sufficient adhesive surface area necessary for fixing the light shielding box so as not to be hung on the light receiving window cannot be secured. As a result, if the conventional assembly structure described above is used, the IC
Adhesion between the package and the light-shielding box becomes unstable.

SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and has as its object to provide an assembly structure of an autofocus module which solves the above-mentioned problems and is configured to sufficiently cope with a new specification autofocus IC. Is to do.

[0007]

In order to achieve the above object, in the assembly structure of the present invention, the bonding portion between the package and the light-shielding box is formed along the longitudinal direction of the package.
It is defined on both sides of the upper surface, and attachment legs are provided on the two bottom sides of the light-shielding box facing the adhesion portion and adhered.

Further, as an embodiment of the above-mentioned structure, mounting legs provided on both sides of the light-shielding box are partially cut out and arranged alternately, an ultraviolet-curable adhesive is used as an adhesive, and There is a configuration in which ultraviolet light is irradiated from the left and right sides to cure the adhesive.

[0009]

According to the above arrangement, the light-shielding box is provided on both the left and right sides parallel to the longitudinal direction of the IC package, so that the light receiving window of the IC package can be used regardless of the specifications of the autofocus IC chip. It is possible to secure a surface area which is necessary and sufficient for bonding the mounting leg of the light-shielding box to the upper surface side while avoiding it.

Further, according to the configuration in which the mounting legs provided on the bottom two sides of the light-shielding box facing the adhesive surface area are partially cut out and arranged alternately, the ultraviolet curable adhesive is used as the adhesive. However, by projecting the ultraviolet rays from the left and right sides of the light-shielding box, a part of the light beam is radiated to the rear surface side of the mounting legs arranged on the opposite side through the cutout portions of the mounting legs. As a result, ultraviolet rays are radiated from both the front and back sides of the mounting leg to the ultraviolet-curing adhesive interposed between the mounting leg of the light-shielding box and the IC package. The agent can be reliably cured.

[0011]

Embodiments of the present invention will be described below with reference to the drawings. In each embodiment, the same members corresponding to FIGS. 3 and 4 are denoted by the same reference numerals. Embodiment 1: In FIGS. 1A and 1B, a light-shielding box 3 combined with a package 1a of an autofocus IC 1
At the bottom side, mounting leg portions 3a are formed so as to bulge on two left and right sides parallel to the longitudinal direction of the IC package 1a. Then, in order to assemble the autofocus module by bonding the light-shielding box 3 to the package 1a, an adhesive 4 (indicated by oblique lines) is applied to the end surface of the mounting leg 3a, and then this is attached to the package 1a. And cured on both sides of the upper surface. In this embodiment, the adhesive 4
For example, a room temperature curing type adhesive is used.

According to this configuration, even when the size of the IC chip is long and a sufficient adhesive surface area cannot be secured between both ends in the longitudinal direction of the package 1a incorporating the IC chip and the light receiving window 1b, Between the mounting leg 3a and the two sides along the longitudinal direction of the IC package 1a.
An adhesive surface area having a sufficient width can be ensured so as not to cover the light receiving window 1b, and a strong connection by the adhesive 4 can be obtained.

Embodiment 2 FIGS. 2A and 2B show an embodiment corresponding to claim 2 of the present invention. The package 1a of the autofocus IC 1 is shielded from light in a direction parallel to its longitudinal direction. The mounting legs 3a that protrude from the bottom two sides of the box 3 are partially cut out and formed to be alternately arranged on the left and right. An ultraviolet curing adhesive is used as the adhesive 4, and when the adhesive 4 is cured in the assembled state of the module, the ultraviolet light sources 5 arranged on the left and right sides of the light shielding box 3 as shown in FIG. Irradiate ultraviolet rays to the bonding part. In this case, a part of the projected light beam is attached to the mounting leg 3a.
(Not shown) (a gap between the upper surface of the IC package 1a and the bottom surface of the light-shielding box 3) into the light-shielding box, and irradiates the adhesive portion from the back side of the mounting legs arranged on the opposite side. Therefore, the adhesive 4 is irradiated with ultraviolet rays from the front and back of the light-shielding box 3, and is reliably cured without leaving uncured portions.

[0014]

As described above, according to the assembling structure of the present invention, both sides of the upper surface along the longitudinal direction of the autofocus IC package are used as the bonding surface areas, and the mounting legs of the light-shielding box are bonded thereto with the adhesive. Autofocus I of various specifications with different photosensor array lengths.
Also for C, the necessary bonding surface area is secured and the IC package and the light-shielding box can be firmly bonded and assembled.

Further, in a configuration in which the mounting legs of the light-shielding box are partially cut out and arranged alternately on the left and right, when an ultraviolet-curable adhesive is used as the adhesive, ultraviolet light is emitted from both the front and back sides of the light-shielding box. Irradiation can reliably cure the adhesive without leaving uncured portions.

[Brief description of the drawings]

FIG. 1 is an assembly configuration diagram corresponding to a first embodiment of the present invention, in which (a) is an exploded perspective view, and (b) is a bottom view of a light-shielding box.

FIGS. 2A and 2B are assembly configuration diagrams corresponding to Embodiment 2 of the present invention, wherein FIG. 2A is an exploded perspective view and FIG. 2B is a bottom view of a light-shielding box.

FIG. 3 is an exploded perspective view of a conventionally implemented autofocus module assembly.

FIG. 4 is a side view showing the assembled state of FIG. 3;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Autofocus IC 1a Package 1b Light-receiving window part 2 Lens 3 Light-shielding box 3a Mounting leg part 4 Adhesive 5 Ultraviolet light source

Claims (3)

(57) [Claims] 1. An auto-focus module comprising an auto-focus IC and a light-shielding box equipped with an optical lens, wherein a mounting part of the light-shielding box is superimposed on an upper surface of a package of the auto-focus IC and adhered with an adhesive. The auto-focus IC
External leads protrude from inside the longitudinal side of the package.
The package and the light-shielding box of the package are fixed on both sides of the upper surface along the longitudinal direction of the package, and two legs at the bottom of the light-shielding box facing the adhesive are provided and bonded. Assembling structure of the autofocus module. 2. The assembly structure according to claim 1, wherein the mounting legs provided on both sides of the light-shielding box are partially cut out and arranged alternately, and an ultraviolet-curing adhesive is used as an adhesive, and the light-shielding is performed. An assembly structure of an autofocus module, wherein the adhesive is cured by irradiating ultraviolet rays from left and right sides of the box. 3. The auto-focus module according to claim 1, wherein the auto-focus IC includes a pair of photosensor arrays linearly arranged along a longitudinal direction of the package. Assembly structure.