JP2018093342A - Prism unit, solid-state imaging device and method for manufacturing solid-state imaging device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To increase the manufacturing precision of a solid-state imaging device to increase the reliability of a product.SOLUTION: A prism unit 12 according to the art hereof comprises: a multi-plate type wavelength-separation prism 14 having light-emitting face to which an image sensor 21R is attached; and a fixing plate 15 fixed to each side face of the multi-plate type wavelength-separation prism 14. In a side edge portion of the wavelength-separation prism 14 on the side of the light-emitting face, a concave portion 26 is formed. The concave portion 26 may be formed in both side edge portions of the wavelength-separation prism 14 on the light-emitting face side.SELECTED DRAWING: Figure 4

Description

  The present technology relates to a prism unit. More specifically, the present invention relates to a prism unit including a multi-plate type wavelength resolving prism to which a solid-state imaging device is attached and a fixed plate fixed to the wavelength resolving prism.

  Conventionally, when manufacturing a solid-state imaging device equipped with a multi-plate type wavelength resolving prism in a color video camera or various industrial optical instruments, a prism unit is attached to a front plate and a solid-state imaging device (image sensor) is attached. The image pickup device mounting substrate is mounted on the prism surface of the prism unit. Here, when the solid-state imaging device is attached to the prism unit, not only the imaging position of each channel of the wavelength resolving prism and the light-receiving imaging surface of the solid-state imaging device are matched (focused), but also the solid-state imaging device for each channel is received. It must be determined in consideration of adjustment of the tilt of the surface (single blur) and registration between each channel (parallel and rotation of the plane perpendicular to the optical axis).

  After the adjustment, the solid-state image sensor is attached to the prism unit by joining the solid-state image sensor and the prism unit with an adhesive, and irradiating the adhesive with ultraviolet rays (UV light) and curing the solid-state image sensor. The element is fixed to the prism unit.

  Specifically, for example, in Patent Document 1, at least one of the adhesion surfaces of the emission end of the color separation prism and the spacer and the adhesion surface of the solid-state imaging device or the element seat and the spacer is described. It is disclosed that one of the bonding surfaces is a surface having fine irregularities. As a result, a large resistance force is not generated in the movement of the spacer, and as a result, the thickness of the photocurable adhesive is made uniform, and the registration can be prevented from changing when the photocurable adhesive is cured. It is said that.

  In addition, for example, in Patent Document 2, when an imaging element is fixed to a prism, the imaging element mounted on the substrate is first adhered to the fixing plate, and then the imaging element non-mounting surface of the fixing plate and the prism are fixed. The fixing member coated with the adhesive is imaged on the fixing plate by applying an ultraviolet curable adhesive on the fixing member fixing the side surface to the image sensor non-mounting surface side of the fixing plate and the side surface side of the prism. It is disclosed that the surface on which the element is not mounted is slid and applied to the side surface of the prism, and finally the ultraviolet curable adhesive is cured by irradiating ultraviolet rays. Accordingly, the fixing member and the prism can be fixed by line contact, and the amount of adhesive having a linear expansion coefficient different from that of the prism can be reduced to the minimum.

JP 2007-060112 A JP 2008-103846 A

  However, in the techniques of Patent Documents 1 and 2, for example, when the interval between the prism and the imaging device is narrow and there is almost no gap for irradiating ultraviolet rays, it is difficult to irradiate the adhesive portion with an appropriate amount of ultraviolet rays. There is a possibility that the fixing strength between the prism and the image sensor is weakened. As a result, the solid-state imaging device light-receiving surface for each channel may be blurred and registration shift between the channels may occur, so that the solid-state imaging device cannot be manufactured with high accuracy and the reliability of the product is also reduced. There may be a problem.

  The present technology has been made in view of such a situation, and an object of the present technology is to provide an imaging element unit that improves the manufacturing accuracy of the solid-state imaging device and improves the reliability of the product.

  In order to solve the above problems, the present technology includes a multi-plate prism having a light exit surface to which a solid-state imaging device is attached, and fixed plates fixed to both side surfaces of the multi-plate prism, and the light exit surface of the prism Provided is a prism unit in which a concave portion is formed in a side edge portion on the side. In addition, the recessed part may be formed in the both-sides edge part by the side of the light emission surface of a prism.

  In addition, the present technology is fixed to a solid-state imaging device, an imaging device mounting substrate on which the solid-state imaging device is mounted, a multi-plate prism having a light emission surface to which the solid-state imaging device is attached, and both side surfaces of the multi-plate prism. There is provided a solid-state imaging device comprising: a prism unit, and a prism unit having a concave portion formed in a side edge on the light exit surface side of the prism.

  In addition, in the present technology, a process of assembling an image sensor unit by attaching a solid-state image sensor to a substrate surface of an image sensor mounting substrate, and fixing plates on both sides of a multi-plate prism having a light exit surface, A step of assembling the prism unit by forming a recess in the side edge portion on the exit surface side, a step of fixing the image sensor unit with an adhesive to the light exit surface of the multi-plate prism, and a step on the light exit surface side of the prism And a step of irradiating the concave portion formed on the side edge with ultraviolet rays to cure the adhesive, and a method for manufacturing a solid-state imaging device.

  According to the present technology, the manufacturing accuracy of the solid-state imaging device can be increased and the reliability of the product can be improved. In addition, the effect described here is not necessarily limited, and may be any effect described in the present technology.

It is a perspective view showing typically the appearance of the optical device for image sensors concerning one embodiment of this art. It is a side view showing typically the optical device for image sensors concerning one embodiment of this art. It is a front view showing typically the sensor mounting board concerning one embodiment of this art. It is an enlarged side view showing typically a part of prism unit concerning one embodiment of this art. It is a perspective view showing typically the appearance of the sensor unit attachment device concerning one embodiment of this art. It is a perspective view showing typically the appearance which the optical device for image sensors concerning one embodiment of this art decomposed. It is a flow figure showing a manufacturing process of an optical device for image sensors concerning one embodiment of this art. It is an enlarged side view showing typically a part of prism unit concerning other embodiments of this art.

  Hereinafter, preferred embodiments for carrying out the present technology will be described with reference to the drawings. The embodiment described below shows an example of a typical embodiment of the present technology, and the scope of the present technology is not interpreted narrowly. In addition, in the present technology, any of the following embodiments and modifications thereof can be combined with each other.

<Embodiment 1>
An optical device for a solid-state imaging device (image sensor) to which a prism unit according to an embodiment of the present technology is applied will be described.

[overall structure]
FIG. 1 is a perspective view schematically showing an appearance of an optical device for an image sensor to which a prism unit according to an embodiment of the present technology is applied. FIG. 2 is a side view schematically showing an optical device for an image sensor to which a prism unit according to an embodiment of the present technology is applied. The image sensor optical device 1 according to this embodiment includes an optical device front plate 11, a prism unit 12, and three sensor units 13R, 13G, and 13B.

[Optical device front plate]
The optical device front plate 11 is joined to the prism unit 12 and attached to a lens of a camera which is an example of a solid-state imaging device.

[Prism unit]
For example, the prism unit 12 is mounted between the optical device front plate 11 and the sensor units 13R, 13G, and 13B, and transmits optical information incident from a lens (not shown) to the sensor units 13R, 13G, and 13B. doing.

  The prism unit 12 has a light exit surface that emits light incident from the front plate 11 of the optical device. The prism unit 12 is a three-plate type wavelength resolving prism 14 that is an example of a multi-plate type, and is fixed to the left and right side surfaces of the wavelength resolving prism 14. And a plate 15. The fixed plate 15 is provided with a plurality of projecting portions 25 for joining the sensor units 13R, 13G, and 13B to the same surface as the light exit surface of the wavelength resolving prism 14. As an example, the protrusion 25 of the present embodiment has a wedge-shaped tip, but the shape of the protrusion 25 is not limited thereto. Further, as the material of the fixed plate 15, for example, a metal plate having a thermal expansion coefficient approximate to that of the material of the wavelength resolving prism 14, or a ceramic plate that has been metallized on the joint surface with the sensor units 13R, 13G, and 13B is used. ing.

  Further, groove-shaped concave portions 26 are formed on both side edges of the wavelength resolving prism 14 and the fixing plate 15 on the light exit surface side to the sensor units 13R, 13G, and 13B. In the present embodiment, the groove-like recess 26 is formed in a substantially V shape in plan view. In the present embodiment, the groove-shaped recess 26 is formed in the fixed plate 15, but the groove-shaped recess 26 may not be formed in the fixed plate 15.

[Sensor unit]
The sensor unit 13R is configured by attaching an image sensor 21R, a sensor mounting board 22R, and a connector 23R in this order. Similarly, the sensor units 13G and 13B are configured by attaching image sensors 21G and 21B, sensor mounting boards 22G and 22B, and connectors 23G and 23B in this order, respectively. Note that the image sensors 21R, 21G, and 21B may be either CMOS image sensors or CCD image sensors, for example.

  A plurality of protrusions 25 provided on the fixing plate 15 are bonded to the side surface of the image sensor 21R of the sensor unit 13R and the surface of the sensor mounting substrate 22R by an adhesive 28. Between the surface of the image sensor 21R mounted on the surface of the sensor mounting substrate 22R and the light exit surface of the wavelength resolving prism 14, a mask 24R formed of a resilient material for blocking light and preventing entry of dust and the like is mounted. It has been.

  Similarly, a plurality of protrusions 25 provided on the fixing plate 15 are bonded to the side surfaces of the image sensors 21G and 21B of the sensor units 13G and 13B and the surfaces of the sensor mounting substrates 22G and 22B with an adhesive 28, respectively. . Between the surfaces of the image sensors 21G and 21B attached to the surfaces of the sensor mounting substrates 22G and 22B and the light exit surface of the wavelength resolving prism 14, elastic materials for light shielding and preventing entry of dust and the like are formed. Masks 24G and 24B are attached.

[Sensor mounting board]
FIG. 3 is a front view showing the sensor mounting board of the first embodiment. The sensor mounting board according to the present embodiment will be described with reference to FIGS. 2 and 3. In the present embodiment, the sensor mounting board 22R of the sensor unit 13R will be described as an example of the sensor mounting board.

  The sensor mounting board 22R of the sensor unit 13R has a rectangular planar shape, and has a V at the center of the short side on the left side when viewed from the upper surface side (the side to be joined to the protruding portion 25 of the wavelength resolving prism 14) on which the image sensor 21R is mounted. One V-shaped concave portion 31 is formed, and two V-shaped concave portions 32a and 32b are formed at upper and lower corners of the short side on the right side when viewed from the upper surface side where the image sensor 21R is mounted.

  The sensor mounting board 22R of the present embodiment has one V-shaped concave portion 31 formed at the center of the short side on the left side when viewed from the top surface side, and V-shaped at the upper and lower corners of the short side on the right side when viewed from the top surface side. Although the two concave portions 32a and 32b are formed, the sensor mounting substrate of the present technology is not limited to this, and the positions of the concave portion 31 and the concave portions 32a and 32b of the sensor mounting substrate 22R may be reversed left and right. . Moreover, as long as the asymmetrical recessed part is formed in the opposing edge | side, the sensor attachment board | substrate of this technique may not only be 3 but the number of a recessed part may be 4 or 5 or more, and the position of a recessed part Is not limited to the middle of the short side and the upper and lower corners of the short side. Further, the shape of the recess is not limited to the V shape, and may be a U shape or the like. However, it is desirable that the position of the recess is formed at a position close to both corners of the short side so that a space for forming the wiring or the like on the substrate can be widened.

  The V-shaped recesses 31, 32a, 32b formed on the sensor mounting board 22R of the present embodiment are used to hold the sensor mounting board 22R with the arm or the like of the mounting device when the sensor mounting board 22R is joined to the prism unit 12. . In this way, by forming the left and right asymmetric V-shaped concave portions 31 and the concave portions 32a and 32b on the opposite sides of the sensor mounting substrate 22R, the upper and lower sides of the sensor mounting substrate 22R are manufactured when the image sensor optical device 1 is manufactured. It is possible to prevent the wrong direction from being gripped by an arm or the like in the opposite direction. For this reason, the image sensor 21R can be joined to the prism unit 12 in an appropriate direction.

[Mounting the sensor unit]
FIG. 4 is an enlarged side view schematically showing a part of the prism unit of the present embodiment. A method of attaching the sensor unit to the prism unit of the present embodiment will be described with reference to FIG. In the present embodiment, a method for attaching the sensor unit 13R of Embodiment 1 to the prism unit 12 will be described as an example of a method for attaching the sensor unit.

  The groove-shaped concave portions 26 formed at both side edges on the light exit surface side of the wavelength resolving prism 14 of the present embodiment are respectively parallel surfaces 41 and parallel to the light exit surface to which the image sensor 21R is attached. And an inclined surface 42 inclined at an inclination angle θ in a direction in which the distance from the light emitting surface is increased. In this embodiment, the inclination angle θ of the inclined surface 42 is formed at 45 degrees, but the inclination angle θ of the present invention is not limited to this, and the angle formed between the incident light on the inclined surface 42 and the reflected light is 90. The inclination angle θ can be set to be degrees. Thereby, more ultraviolet rays (UV light) incident on the inclined surface 42 from a direction parallel to the parallel surface 41 can be reflected in a direction perpendicular to the incident direction.

  In the present embodiment, first, ultraviolet curable adhesives 28 are filled in the gaps between the inner side surface of the protruding portion 25 and the side surface of the image sensor 21 </ b> R at two locations of the fixing plate 15. Next, UV light is irradiated toward the adhesive 28 from a direction perpendicular to both side surfaces of the image sensor 21R. Here, when the UV light is irradiated from a direction perpendicular to both side surfaces of the image sensor 21R, the protrusion 25 is transmitted to irradiate the adhesive 28, and the adhesive 28 cannot be directly irradiated with the UV light. . Further, from the structure of the prism unit 12 and the sensor unit 13R, UV light is emitted from a direction perpendicular to the light exit surface of the wavelength resolving prism 14 toward the gap between the inner side surface of the protrusion 25 and the side surface of the image sensor 21R. Irradiation requires difficulty.

  Therefore, in the present embodiment, a part of the UV light irradiated from the direction perpendicular to both side surfaces of the image sensor 21R is incident on the inclined surface 42 of the groove-shaped recess 26 of the wavelength resolving prism 14 and reflected by the inclined surface 42. The UV light is applied to the adhesive 28 in the gap between the inner side surface of the protrusion 25 and the side surface of the image sensor 21R. Similarly, the UV light can be applied to the adhesive 28 in the gap between the inner side surface of the protrusion 25 and the side surfaces of the image sensors 21G and 21B.

  As described above, in the prism unit 12 of the present embodiment, the groove 28 having the inclined surface 42 is formed in the wavelength resolving prism 14, so that the UV light cannot be directly applied to the adhesive 28. The adhesive 28 can be irradiated with an appropriate amount of UV light even when the gap between the imaging element and the imaging element is narrow and there is almost no gap for irradiating UV light. For this reason, it is possible to prevent the image sensor 21R, 21G, 21B for each channel from receiving a single blur on the light receiving surface or a registration shift between the channels. Therefore, according to the present technology, it is possible to increase the manufacturing accuracy of the image sensor optical device 1 and the solid-state imaging device including the image sensor optical device 1 and to improve the reliability of the product.

  In the present embodiment, the inclination angle θ of the inclined surface 42 is formed at 45 degrees, but the inclination angle θ of the present technology is not limited to this. Further, the inclined surface 42 may have a reflecting member that reflects UV light. Thereby, the reflectance of the UV light incident on the inclined surface 42 can be increased. The filling position of the adhesive 28 is not limited to the gap between the inner side surface of the protruding portion 25 and the side surface of the image sensor 21R, and the prism unit 12 and the sensor units 13R, 13G, and 13B are fixed and the inclined surface 42 is fixed. Any position can be used as long as it can directly irradiate the UV light reflected by. The material of the wavelength resolving prism 14 is not particularly limited, and may be filter glass, white plate glass, blue plate glass, or the like as long as it has ultraviolet selective permeability.

[Sensor unit mounting device]
FIG. 5 is a perspective view schematically showing the external appearance of a sensor unit mounting apparatus that joins the sensor unit of this embodiment to a prism unit. The sensor unit mounting apparatus according to the present embodiment will be described with reference to FIG.

  The sensor unit mounting device 51 according to the present embodiment includes a main body 52, a right arm 53, and a left arm 54. At the tip of the right arm 53, a cylindrical arm tip 55 that can be inserted into the recess 31 formed in the sensor mounting substrate 22R is formed. At the tip of the left arm 54, two cylindrical arm tips 56a and 56b that can be inserted into the recesses 32a and 32b formed in the sensor mounting board 22R are formed. The sensor mounting substrate 22R is held by the arm tip 55 and the arm tips 56a and 56b, and the sensor unit 13R is joined to the prism unit 12.

In this embodiment, with respect to the sensor unit mounting device 51, the left-right direction is the X-axis direction, the up-down direction is the Y-axis direction, the front-back direction is the Z-axis direction, and the rotation angles around the X-axis, Y-axis, and Z-axis are _X, and theta _Y and theta _Z. The sensor unit mounting device 51 operates the right arm 53 and the left arm 54 in the X-axis direction to grip the sensor mounting board 22R, and moves the main body 52 in the Z-axis direction to bring the sensor unit 13R closer to the prism unit 12. Then, the positions of the six axes of the X axis, Y axis, Z axis, θ _X direction, θ _Y direction, and θ _Z direction are adjusted and positioned accurately, and the sensor unit 13R is attached to the prism unit 12.

[Manufacturing procedure of optical device for image sensor]
FIG. 6 is a perspective view schematically showing an exploded appearance of the optical device for an image sensor according to the present embodiment. In FIG. 6, as an example, a manufacturing process of assembling the optical device front plate 11, the prism unit 12, and the sensor unit 13R is shown. FIG. 7 is a flowchart showing manufacturing steps of the image sensor optical device according to the present embodiment. An example of a manufacturing procedure of the image sensor optical device will be described with reference to FIGS.

  In step S701, the sensor unit 13R is assembled. Specifically, first, one V-shaped concave portion 31 is formed at the center of the short side on the left side when viewed from the side of the sensor mounting substrate 22R that is joined to the protruding portion 25 of the wavelength resolving prism 14, and the wavelength resolving prism 14 Two V-shaped recesses 32a and 32b are formed at the upper and lower corners of the short side on the right side when viewed from the side joined to the protrusion 25.

  Next, the image sensor 21R is attached by soldering or the like to the joint surface of the sensor mounting substrate 22R in which the concave portion 31 and the concave portions 32a and 32b are formed with the wavelength resolving prism 14, and the mask 24R is attached to the surface of the image sensor 21R. Then, the connector 23R is attached to the surface opposite to the surface to which the image sensor 21R is attached of the sensor attachment substrate 22R. Similarly, the sensor units 13G and 13B are also assembled. When the sensor units 13R, 13G, and 13B are assembled by the above steps, the process proceeds to step S702.

  In step S702, the prism unit 12 is assembled. Specifically, first, fixing plates 15 are fixed to the left and right side surfaces of the three-plate type wavelength resolving prism 14, respectively. Next, groove-shaped recesses 26 each having a substantially V-shaped planar shape are formed on both side edges of the wavelength resolving prism 14 and the fixing plate 15 on the light exit surface side to the sensor units 13R, 13G, and 13B. The groove-shaped recess 26 includes a parallel surface 41 parallel to the light emission surface to which the image sensor 21R is attached, and an inclined surface 42 inclined at an inclination angle θ in a direction in which the distance from the parallel surface 41 to the light emission surface increases. , To have. Thus, when the prism unit 12 is assembled, the process proceeds to step S703. In addition, the process of step S701 and the process of step S702 may be reversed in procedure, and work may be performed from either step.

  In step S703, the prism unit 12 assembled in step S702 is attached to the optical device front plate 11.

  In step S704, the attachment positions of the sensor units 13R, 13G, and 13B are adjusted (coarse adjustment and fine adjustment), and the sensor units 13R, 13G, and 13B are fixed to the prism unit 12.

  As an example, as shown in FIG. 5, the arm tip 55 and the arm tips 56a and 56b of the sensor unit mounting device 51 are inserted into the recess 31 and the recesses 32a and 32b of the sensor mounting board 22R to grip the sensor mounting board 22R. To do. At the same time, the sensor mounting substrates 22G and 22B are held by the other two sensor unit mounting devices 51, respectively. Thus, when the mounting positions of the sensor units 13R, 13G, and 13B are adjusted and the sensor units 13R, 13G, and 13B are fixed to the prism unit 12, the process proceeds to step S705.

  In step S <b> 705, the sensor units 13 </ b> R, 13 </ b> G, and 13 </ b> B are irradiated with UV light to attach the sensor units 13 </ b> R, 13 </ b> G, and 13 </ b> B to the prism unit 12. Specifically, for example, an ultraviolet curable adhesive 28 is filled between the joint surface of the protruding portion 25 of the fixing plate 15 and the surface of the sensor mounting substrates 22R, 22G, and 22B, and the wavelength resolving prism 14 is formed there. The adhesive 28 is cured by irradiating the UV light reflected by the inclined surface 42 of the groove-shaped recess 26, and the sensor mounting substrates 22 R, 22 G, and 22 B are bonded to the fixing plate 15. If the sensor units 13R, 13G, and 13B are attached to the prism unit 12 by this process, the process proceeds to step S706.

  In step S706, it is determined whether or not the sensor units 13R, 13G, and 13B are properly attached to the prism unit 12. If it is properly attached and “YES”, the manufacturing process is finished, and the completed optical device 1 for image sensor is attached to a solid-state imaging device such as a camera. If the sensor units 13R, 13G, and 13B are not properly attached to the prism unit 12 and the determination is “NO”, the process returns to step S704, and the attachment positions of the sensor units 13R, 13G, and 13B are adjusted again, and the sensor units 13R, 13R, 13G and 13B are fixed to the prism unit 12.

<Embodiment 2>
FIG. 8 is an enlarged side view schematically showing a part of the prism unit of the second embodiment. A method of attaching the sensor unit to the prism unit of the present embodiment will be described with reference to FIG. The present embodiment is different from the first embodiment in that a reflector 81 that reflects UV light is attached to both side portions of the wavelength resolving prism 14 that is located at the center of the prism unit 80 and is joined to the sensor unit 13R. Is a point. In the present embodiment, a method for attaching the sensor unit 13B to the prism unit 80 will be described as an example.

  When the sensor unit 13B is attached to the prism unit 80 of the present embodiment, first, the UV light is reflected by the reflection plate 81 located on the side surface portion (downward in FIG. 8) of the wavelength resolving prism 14 on the side where the sensor unit 13B is attached. Next, as shown in FIG. 8, the reflected UV light is incident on the inclined surface 42 </ b> B, so that the UV light further reflected by the inclined surface 42 </ b> B is reflected on the inner side surface of the protrusion 25 and the side surface of the image sensor 21 </ b> B. It is possible to directly irradiate the adhesive 28 filled in the gap between the two. Similarly, the gap between the inner side surface of the projecting portion 25 and the side surface of the image sensor 21G is filled by irradiating the reflecting plate 81 positioned on the side where the sensor unit 13G is attached (upper side in FIG. 8) with UV light. The adhesive 28 can be directly irradiated with UV light.

  Therefore, the prism unit 80 according to the present embodiment includes the reflector 81 on the side surface of the wavelength resolving prism 14 so that the intervals between the sensor units 13R, 13G, and 13B fixed to the prism unit 80 are narrow. Even when UV light cannot be irradiated from the direction perpendicular to the side surfaces of 21R, 21G, and 21B, the adhesive 28 can be irradiated with an appropriate amount of UV light. Therefore, the same effects as those of the first embodiment can be obtained.

DESCRIPTION OF SYMBOLS 1 Image sensor optical apparatus 11 Optical apparatus front plate 12, 80 Prism unit 13R, 13G, 13B Sensor unit 14 Prism 15 Fixing plate 21R, 21G, 21B Image sensor 22R, 22G, 22B Sensor mounting board 23R, 23G, 23B Connector 24R, 24G, 24B Mask 25 Protruding portion 26 Groove-shaped recess 28 Adhesive 31, 32a, 32b V-shaped recess 41 Parallel surface 42 Inclined surface 51 Sensor unit mounting device 52 Main body 53, 54 Arm 55, 56a, 56b Arm Tip 81 Reflector

Claims (7)

A multi-plate prism having a light exit surface to which a solid-state image sensor is attached;
A fixing plate fixed to both side surfaces of the multi-plate prism;
With
A prism unit in which a concave portion is formed on a side edge of the prism on the light exit surface side.   2. The prism unit according to claim 1, wherein the concave portion is formed at both side edges of the prism on the light exit surface side.   3. The prism unit according to claim 1, wherein the concave portion has an inclined surface that is inclined in a direction in which a distance from the light emitting surface is increased.   The prism unit according to claim 3, wherein the inclined surface is inclined 45 degrees with respect to the light exit surface.   The prism unit according to claim 3 or 4, wherein the inclined surface has a reflecting member that reflects ultraviolet rays.   A solid-state imaging device comprising: a solid-state imaging device; an imaging device mounting substrate on which the solid-state imaging device is mounted; and the prism unit according to any one of claims 1 to 5 joined to the imaging device mounting substrate. apparatus. Assembling an image sensor unit by attaching a solid-state image sensor to the substrate surface of the image sensor mounting substrate;
A step of assembling a prism unit by fixing fixing plates to both side surfaces of a multi-plate prism having a light exit surface, forming a recess in a side edge portion of the prism on the light exit surface side, and
Fixing the imaging element unit to the light exit surface of the prism with an adhesive;
Curing the adhesive by irradiating ultraviolet rays onto a concave portion formed on a side edge of the prism on the light exit surface side; and
A method for manufacturing a solid-state imaging device including: