JP3156566U - Potting range limited structure - Google Patents
Potting range limited structure Download PDFInfo
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- JP3156566U JP3156566U JP2009007525U JP2009007525U JP3156566U JP 3156566 U JP3156566 U JP 3156566U JP 2009007525 U JP2009007525 U JP 2009007525U JP 2009007525 U JP2009007525 U JP 2009007525U JP 3156566 U JP3156566 U JP 3156566U
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- Prior art keywords
- potting
- potting material
- connector
- partition
- range
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Abstract
【課題】組立性を低下させず、且つポッティング材のせき止めとなる構造を提供する。【解決手段】ポッティング材が硬化するまでの流出防止のせき止め構造を、筐体に着脱可能な別ピースである隔離部品１として設ける。ＬＣＤ部品２１のケーブルを差し込むためのコネクタ２２を有する基板２０は、絶縁および防水のため、ポッティング材で覆う構造となっている。その前記箇所のポッティング範囲を限定するため、隔離部品１を用いてポッティング材が硬化するまでの流出をせき止める。また、狭い範囲にあるコネクタ２２の接続操作性を損なうことのないようにするため、隔離部品１はコネクタ２２を接続後に実装する。【選択図】図１The present invention provides a structure that does not deteriorate assemblability and serves as a dam for potting materials. A damming structure for preventing outflow until the potting material is hardened is provided as an isolation part 1 which is a separate piece detachable from the housing. The substrate 20 having the connector 22 for inserting the cable of the LCD component 21 is structured to be covered with a potting material for insulation and waterproofing. In order to limit the potting range of the said part, the outflow until a potting material hardens | cures using the isolation | separation component 1 is stopped. In addition, the isolation component 1 is mounted after the connector 22 is connected so as not to impair the connection operability of the connector 22 in a narrow range. [Selection] Figure 1
Description
本考案は、範囲を限定するポッティング処理を行うものに関する。 The present invention relates to a potting process for limiting a range.
従来、ポッティング範囲を限定するためには筐体側にポッティング材をせき止めるための突起や壁などの囲い構造を設けることが一般的であった（例えば特許文献１）。 Conventionally, in order to limit the potting range, it has been common to provide an enclosure structure such as a protrusion or a wall for blocking the potting material on the housing side (for example, Patent Document 1).
しかしながら、前記の様に筐体側にポッティング材せき止めのための突起や壁などを予め設けておくと、コネクタ等の配線、接続時に前記の突起や壁などの構造に指や手が当たり、組立て作業の妨げとなるため、組立て時の作業性を低下させる問題があった。 However, if projections or walls for potting material blocking are provided in advance on the housing side as described above, the structure of the projections and walls, etc., hits the structure of the projections and walls when connecting and connecting the connectors, etc. Therefore, there is a problem that the workability at the time of assembly is lowered.
そこで、本考案の課題は、組立性を低下させず、且つポッティング材のせき止めとなる構造を提供することを目的とする。 Therefore, an object of the present invention is to provide a structure that does not deteriorate assemblability and serves as a dam for potting materials.
上記の課題を解決するために、本考案は、プリント基板に搭載された所定の電子部品を絶縁または防水のためのポッティング材で覆う範囲を限定する構造であって、上下が開いた多面体またはリング状の閉域を形成する隔壁を前記プリント基板または筐体とは別の部材で構成し、前記隔壁をポッティング材で覆うべき前記電子部品を囲うように装着し、ポッティング材を注入する際に硬化前のポッティング材が流出することを防止することを特徴とする。 In order to solve the above-described problems, the present invention is a structure that limits a range in which a predetermined electronic component mounted on a printed circuit board is covered with a potting material for insulation or waterproofing, and is a polyhedron or ring having an open top and bottom A partition that forms a closed area is formed of a member different from the printed circuit board or the housing, and the partition is mounted so as to surround the electronic component to be covered with a potting material, and before the potting material is cured, This prevents the potting material from flowing out.
本考案によれば、ポッティング材のせき止め構造部が着脱可能であるため、コネクタ等の配線、接続を行った後に前記ポッティング材のせき止め構造部を組み込むことができるので、従来のようにポッティング材のせき止め構造が組立て作業の妨げにならず、組立ての作業性が向上する。 According to the present invention, since the potting material damming structure is detachable, the potting material damming structure can be incorporated after wiring and connection of a connector or the like. The damming structure does not interfere with the assembling work, and the assembling workability is improved.
以下、図面を参照して本考案の実施の形態について詳細を説明する。
図１は本考案による一実施例の構成を示す斜視図である。
１はポッティング材をせき止めるための部品(以下、隔壁部品と呼称)、１０は筐体ケース、２０は基板、２１はＬＣＤ部品、２２はＬＣＤ部品２１のケーブルを差し込むためのコネクタである。
ポッティング材は隔壁部品１の内に充填する。(図３参照)
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
FIG. 1 is a perspective view showing a configuration of an embodiment according to the present invention.
The potting material is filled in the
図２は、図１の隔壁部品１を実装する前の状態を示す。
組立ての際には、まず図２の状態時にＬＣＤ部品２１のケーブルをコネクタ２２に差し込み、その後に隔壁部品１を実装する。
隔壁部品１を実装後、隔壁部品１内の空間にポッティング材６０を充填する。(ポッティング材６０の充填については図３参照)
FIG. 2 shows a state before the
When assembling, the cable of the
After mounting the
従来の構造では、隔壁部品１にあたるものと筐体ケース１０にあたるものが一体化していた。そのため、コネクタなどを接続する際などに作業スペースが狭く、作業性が悪かった。
しかし、本案件の構造では隔壁部品１と筐体ケース１０が分離できるため、コネクタ２２の接続時には隔壁部品１を実装せず、前記コネクタ２２の接続完了後に前記隔壁部品１を実装することにより組立性を妨げることがないため、作業性を向上させられる。
In the conventional structure, the one corresponding to the
However, since the
なお、本案件は上記実施形態に限定されるものではなく、以下の様に変形し、実施することができる。
(1)ポッティング材を充填する箇所が複数ある場合、隔壁部品を複数の別ピースに分け、必要に応じた箇所に設置することが可能である。この様な構成にすることにより、せき止め構造による組立性の妨げを最小限に抑えることができる。
(2)上述(1)とは別の実施形態として、ポッティング材を充填する箇所が複数ある場合でも、その全てのポッティング部(ポッティング部１１１、１１２)に対して、図４の様に１個のピースである隔壁部品１００にて対応することで組立工数と部品点数の削減ができる。
In addition, this case is not limited to the said embodiment, It can deform | transform and implement as follows.
(1) When there are a plurality of places where the potting material is filled, it is possible to divide the partition wall parts into a plurality of separate pieces and install them at places as required. By adopting such a configuration, it is possible to minimize the hindrance to assembling by the damming structure.
(2) As an embodiment different from the above (1), even when there are a plurality of portions to be filled with the potting material, one piece as shown in FIG. 4 is provided for all the potting portions (
１ 隔壁部品
１０ 筐体ケース
２０ 基板
２１ ＬＣＤ部品
２２ コネクタ（ＬＣＤ部品２１と）
３０ 隔壁部品(隔壁部品１の断面)
４０ 筐体ケース（筐体１０の断面）
５０ 基板（基板２０の断面）
５１ コネクタ（コネクタ２２の断面）
６０ ポッティング材
１００ 隔壁部品
１１１ ポッティング部（ポッティング材充填箇所）
１１２ ポッティング部（ポッティング材充填箇所）
DESCRIPTION OF
30 Bulkhead parts (cross section of bulkhead parts 1)
40 Case Case (Cross Section of Case 10)
50 substrate (cross section of substrate 20)
51 Connector (cross section of connector 22)
60
112 Potting part (potting material filling point)
Claims (2)
上下が開いた多面体またはリング状の閉域を形成する隔壁を前記プリント基板または筐体とは別の部材で構成し、前記隔壁をポッティング材で覆うべき前記電子部品を囲うように装着し、ポッティング材を注入する際に硬化前のポッティング材が流出することを防止することを特徴とするポッティング範囲限定構造。 It is a structure that limits a range in which a predetermined electronic component mounted on a printed circuit board is covered with a potting material for insulation or waterproofing,
A partition that forms a polyhedron with an open top and bottom or a ring-shaped closed region is formed of a member different from the printed circuit board or the housing, and the partition is mounted so as to surround the electronic component to be covered with a potting material. A potting range limiting structure characterized in that the potting material before curing is prevented from flowing out when injecting.
前記隔壁はプリント基板の離れた部位に搭載された複数の電子部品を囲む複数の上下が開いた多面体またはリング状の隔壁を一体化したことを特徴とするポッティング範囲限定構造。 The structure of claim 1,
A potting range-limited structure characterized in that the partition wall is formed by integrating a plurality of open and closed polyhedrons or ring-shaped partition walls that surround a plurality of electronic components mounted on remote parts of a printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009007525U JP3156566U (en) | 2009-10-23 | 2009-10-23 | Potting range limited structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009007525U JP3156566U (en) | 2009-10-23 | 2009-10-23 | Potting range limited structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP3156566U true JP3156566U (en) | 2010-01-07 |
Family
ID=54860342
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009007525U Expired - Fee Related JP3156566U (en) | 2009-10-23 | 2009-10-23 | Potting range limited structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3156566U (en) |
-
2009
- 2009-10-23 JP JP2009007525U patent/JP3156566U/en not_active Expired - Fee Related
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