JP3152501B2 - Hybrid integrated circuit device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid integrated circuit device with a built-in microcomputer in which a microcomputer is mounted on an integrated circuit board and the function of the microcomputer can be checked.

[0002]

2. Description of the Related Art Microcomputers having stored information already written in a mask ROM are preferably used in various electronic devices. Most of these microcomputers are currently mounted on printed wiring boards together with control or drive integrated circuits. In various electronic devices that are required to be reduced in size and weight, a semiconductor integrated circuit (IC) chip is directly mounted on a printed wiring board by a technique called chip-on-board, and after required wiring is applied, The IC chip including the wiring portion is covered with a synthetic resin, and extremely small and light weight is achieved.

FIG. 4 shows a mounting structure of such a conventional microcomputer. FIG. 4 is a perspective view having a partial cross section of a conventional microcomputer, showing an insulating substrate (42) made of glass epoxy resin or the like having a conductive wiring pattern (41) formed on a main surface. A microcomputer (44) incorporated in a cerdip type package is mounted in the through hole (43). The microcomputer (44) has a header (45) and a cap (46), and the header (45) is adhered to a ceramic base (47) by an external lead (48) or a low-melting glass material. The header (45) has an element mounting portion (50) obtained by sintering a so-called gold paste in which a large amount of gold powder is mixed into glass, and is adhered on the low melting point glass material or the ceramic base material (47). A microcomputer chip (5) is mounted on the element mounting portion (50).
1) is mounted, and the electrode of the chip (51) and the external lead (48) are connected by a thin metal wire (52). The cap (46) seals the microcomputer chip (51) disposed on the header (45) with low-melting glass. The microcomputer (44) in which the microcomputer chip (51) is sealed in this way is fixed by soldering by inserting an external lead (48) into the through hole (43) of the insulating substrate (42). This through hole (43) is provided with a required wiring by the conductive wiring pattern (41), and is connected from a male connector terminal portion (55) provided at an end of the insulating substrate to a female connector (not shown). Connected to

The mounting structure of such a conventional microcomputer element is a microcomputer chip (5).
Compared with 1), the package outer shape is extremely large, and the package occupancy is not only three-dimensional but also several times the height of the chip, which is extremely disadvantageous for thinning. Further, after the external lead is inserted into the through hole (43), it is necessary to fix the lead with solder or the like. A further significant disadvantage is that the microcomputer element is once assembled into a package prior to mounting on an insulating substrate.

Here, the description has been given of the cerdip package type microcomputer element, but the above-described problem also occurs in the resin sealing type package. The mounting structure shown in FIG. 5 has already been used to solve such a problem. The microcomputer mounting structure shown in FIG. 5 will be described below. A chip mounting area (6) for mounting a microcomputer chip (61) on an insulating substrate (60) such as a glass-epoxy resin plate having a conductive wiring pattern (60b) formed on a main surface (60a).
0c), the wiring pattern (60b) is routed on the main surface (60a) from near this area and connected to a male connector terminal portion (not shown). The area (60c) includes a microcomputer chip (61)
Is mounted, and the surface electrode of the chip (61) and the wiring pattern (60b) are connected by a thin metal wire (62). Of course, one of the thin metal wires (62) is wired to a wiring pattern (60b) on which the chip (61) is mounted in order to connect to the substrate of the chip (61). The integrated circuit board on which the microcomputer is mounted is applied to various products such as an inverter air conditioner and a washing machine.

However, in the microcomputer mounting structure shown in FIG. 5, since the chip of the microcomputer is die-bonded on the printed circuit board, it goes without saying that the size is reduced. However, the miniaturization referred to here is merely a miniaturization of the microcomputer itself. Although not evident from FIG. 5, the peripheral circuit elements fixed around the microcomputer are constituted by electronic components such as discretes. ing. Therefore, when the entire system as an integrated circuit for a printed circuit board equipped with a microcomputer is viewed, the size of the printed circuit board is not increased and the size of the printed circuit board is increased as before, that is, to solve the problem that the entire system is enlarged. There has been proposed a hybrid integrated circuit device in which a chip-shaped microcomputer is directly mounted on an integrated circuit substrate having a conductive pattern formed on a metal substrate such as aluminum via an insulating resin layer.

[0007]

In general, when a chip microcomputer is mounted on an integrated circuit board, the microcomputer checks the leakage current and the like inside the microcomputer before mounting the microcomputer. Is secured. However, as described above, when a chip-shaped microcomputer is mounted on an insulated metal substrate, an abnormal leakage current is generated inside the microcomputer due to a heat process when brazing the microcomputer on a pad. In the conventional hybrid integrated circuit device, an abnormal leak current generated by a heat process after mounting a chip-shaped microcomputer cannot be detected, and even if the device becomes defective. The product may be used as it is, and a malfunction of the microcomputer may cause a secondary disaster.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to mount a microcomputer on an integrated circuit board, detect and measure a leak current inside the microcomputer, and detect an abnormal leak. An object of the present invention is to provide a hybrid integrated circuit device that detects only the presence or absence of generation of a current and includes only a microcomputer that has become a good product.

[0009]

Means for Solving the Problems The above-mentioned problems are solved,
In order to achieve the object, a hybrid integrated circuit device according to the present invention is connected to an integrated circuit board having a circuit pattern of a desired shape formed of copper foil on an insulating substrate and a circuit pattern at a desired position formed on the board. And a circuit element provided with a predetermined control signal output from the microcomputer and a peripheral circuit element connected to a conductive path on the substrate, the microcomputer including: A plurality of external signal conductors having a microcomputer pad connected to a microcomputer, a circuit pattern pad connected to the circuit pattern, and an external signal input pad for applying a predetermined signal from outside to the inside of the microcomputer. A road is provided. In addition, a hybrid integrated circuit device of the present invention includes an integrated circuit board in which a circuit pattern of a desired shape is formed by copper foil on an insulating substrate, A chip-shaped or resin-sealed microcomputer incorporating program data and a peripheral circuit element to which a predetermined control signal output from the microcomputer is supplied and which is connected to a conductive path on the substrate are connected. Having a microcomputer pad connected to the microcomputer, a circuit pattern pad connected to the circuit pattern, and an external signal input pad for applying a predetermined signal from outside to the inside of the microcomputer, A plurality of applied currents when measuring a leak current inside the microcomputer mounted on the substrate; Characterized in that a leakage current measurement conducting path. Further, the hybrid integrated circuit device of the present invention is an integrated circuit board in which a circuit pattern of a desired shape is formed by copper foil on an insulating board, and a circuit pattern at a desired position formed on the board and connected to a desired circuit pattern. A chip-shaped or resin-sealed microcomputer incorporating program data, a predetermined control signal output from the microcomputer is supplied, and peripheral circuit elements connected to the conductive path on the substrate, A plurality of leakage current measuring conductive paths provided near the microcomputer peripheral portion and through which an applied current flows when measuring a leak current inside the microcomputer mounted on the substrate; The conductive path has at least a measurement pad, a microcomputer connection pad and a peripheral conductive path connection pad, The serial microcomputer connection pad the microcomputer, the conductive path connecting pad is characterized by being respectively wire-bonded to the periphery of the conductive path.

[0010]

In the hybrid integrated circuit device constructed as described above, since a plurality of external signal conductive paths are provided in the vicinity of the peripheral portion of the microcomputer, the microcomputer uses the external signal conductive paths. The internal abnormal leak current can be detected while the microcomputer is mounted. Therefore, it is possible to remove the integrated circuit board on which the defective product having the abnormal leakage current generated in the microcomputer during the assembling process is mounted.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A hybrid integrated circuit device according to the present invention will be described below in detail with reference to the embodiments shown in FIGS. FIG. 1 is an enlarged perspective view of a main part of a hybrid integrated circuit device according to the present invention. This hybrid integrated circuit device is used as an independent electronic component, and is mainly used for electric appliances such as an inverter air conditioner and a washing machine.

As shown in FIG. 1, the hybrid integrated circuit device (1) includes an integrated circuit board (2), a conductive path (5) having a desired shape formed on the integrated circuit board (2), and a conductive path ( A microcomputer (6) (hereinafter referred to as a microcomputer) connected to the microcomputer (5), and a plurality of peripheral circuits connected to the conductive path (5) on the substrate (2) supplied with an output control signal from the microcomputer (6). Formed near the element (4) and the periphery of the microcomputer (6)
And only this microcomputer (6) is wire bonded.
The terminals of the microcomputer (6) and the conductive paths
The other peripheral circuit elements (4)
So that it does not affect
That is, each terminal of the microcomputer (6) and each conductive path are one-to-one.
It is constituted by a plurality of electrically independent external signal conductive paths (7) so as to be at a potential .

As the integrated circuit board (2), a hard board made of ceramic, glass epoxy, metal or the like is used. In this embodiment, a metal board excellent in heat dissipation and mechanical strength is used. As the metal substrate, for example, 0.5 to 1.
An aluminum substrate having a thickness of 0 mm is used. The substrate (2)
An aluminum oxide film is formed by well-known anodic oxidation on the surface of the substrate, and an insulating resin layer (3) such as epoxy or polyimide having a thickness of 10 to 70 μ is adhered to one main surface thereof. Further, on the insulating resin layer (3), a copper foil having a thickness of 10 to 70 [mu] m is attached simultaneously with the insulating resin layer by means such as a roller or a hot press.

On a copper foil surface provided on one main surface of the substrate (2), a conductive path having a desired shape is exposed by screen printing and masked with a resist, and a noble metal (gold, silver, platinum) is used.
A plating layer is plated on the copper foil surface. After that, the resist is removed and the copper foil (11) using the noble metal plating layer as a mask
Is etched to form a desired conductive path (5).
Here, the fineness of the conductive path (5) by screen printing is 0.1.
Since 5 mm is the limit, when a fine wiring pattern is required, a fine conductive path (5) up to about 2 μm can be formed by a known photolithography technique.

A conductive path (5) formed on a substrate (2)
Although not clearly shown in FIG. 1, an external lead terminal or an external connector is connected to the peripheral end of the substrate (2), which is formed substantially on the entire surface of the substrate (2) and extends the conductive path (5). The fixing pad to be formed is formed. And
At a desired position on the conductive path (5), the microcomputer (6), LS
A plurality of circuit elements (4) such as an I chip, a transistor, a chip capacitor, and a chip resistor and a printed resistor are fixedly mounted.

As is well known, the microcomputer (6) mainly stores a program processor (CPU) in a program memory.
This is an element that combines an input / output interface with M, ROM, and peripheral devices. The microcomputer (6) used in this embodiment stores predetermined program data (RO) in advance.
M) is a masked chip ROM-type microcomputer with a mask, and will be described below using a chip-type microcomputer (6). However, the microcomputer (6) is not limited to a chip-type microcomputer, A so-called DIP microcomputer of a stop type may be used.

In the vicinity of the periphery where the microcomputer (6) is mounted, there are provided a plurality of external signal conducting paths (7) capable of applying a predetermined signal from outside to the inside of the microcomputer (6). In this embodiment, VDD of the microcomputer (6),
Five external signal conductive paths (7) corresponding to the electrodes TEST, RES , VSS, and HOLD are provided. The number of the external signal conductive paths (7) differs depending on the function of the microcomputer (6), and the number is arbitrarily determined. The external signal conductive path (7) is connected to another microcomputer (6) by another circuit pattern (5).
Is formed in a state independent of the

Specifically, these external signal conductive paths (7) are independent before completion of the hybrid integrated circuit device, but are electrically connected to other circuit patterns (5) after completion. It will be in the state that was done. Furthermore, these external signal conducting paths (7) have at least three pads.
That is, a microcomputer pad (7A) for connection with the microcomputer (6), an external signal input pad (hereinafter, referred to as an input pad) (7B), and a circuit pattern pad (7) connected to another circuit pattern (5). 7C).

As shown in FIG. 1, the microcomputer pad (7C) extends to the vicinity of the microcomputer (6).
Bonding connection is made with a connection electrode of the microcomputer (6) using a wire having a diameter of about 40 μm. At the time of this bonding, the peripheral circuit element (4), for example, a chip-shaped circuit element such as an IC or an LSI, is simultaneously bonded and connected to the peripheral conductive path (5).

A predetermined voltage is applied to the input pad (7B), and an abnormal leakage current inside the microcomputer (6) is detected. For example, as shown in FIGS. 1 and 2, the input pad (7B) connected to the VDD and TEST electrodes of the microcomputer (6) is set to the positive side, and the input pad (7B) connected to the HOLD, VSS and RES electrodes. ) As GND and D
A voltage of 7.0 V is applied to detect an abnormal leak current generated inside the microcomputer (6). Note that abnormal leakage current
The detection method is performed by a conventionally well-known method.
For example, the TEST, HOLD and RES electrodes
Input pad (7B) to VDD or VSS electrode
Connected to the input pad (7B) connected to
By applying voltage between D-VSS, microcomputer
The operation enters the standby current measurement mode (6). still,
The microcomputer terminals and applied voltage to use
(6) It depends on each program. This mode is
Current (leakage current) when the microcomputer (6) is not operating
Current), the internal MOS transistor
Leakage current increases if there is an abnormality in the cell
Can be determined. At this time, VDD, TEST, HOL
Since a probe terminal is in contact with each input pad (7B) of D, VSS and RES, each input pad (7
B) On top is a solder (8). Therefore, as shown in FIG. 3, by piercing the probe terminal (9) into the solder (8) formed on each input pad (7B), the contact resistance between them can be reduced to a minimum, and the microcomputer ( 6)
It is possible to accurately detect the internal abnormal leak current.

The presence or absence of an abnormal leakage current of the microcomputer (6) is detected, and if it is larger than the reference level, it is treated as a defective product, and only a good product is advanced to the next step to complete a hybrid integrated circuit. In other words, when no abnormal leakage current is determined, the circuit pattern pad (7C) and another circuit pattern (5) are bonded to each other with a wire having a diameter of about 400 μm and interconnected with peripheral circuit elements. To complete the hybrid integrated circuit device equipped with the microcomputer (6).

[0022]

As described in detail above, according to the present invention,
By providing a plurality of external signal conductive paths (7) near the periphery of the microcomputer (6), after the microcomputer (6) is fixedly mounted on the integrated circuit board (2), the function of the microcomputer (6) is checked again. The microcomputer (6) that has become defective during the manufacturing process can be reliably removed. As a result, it is possible to provide a hybrid integrated circuit device equipped with an excellent quality microcomputer (6) with extremely little malfunction of the microcomputer (6).

[Brief description of the drawings]

FIG. 1 is an enlarged view of a main part of a perspective view showing the present invention.

FIG. 2 is a wiring diagram for measuring a leakage current of a microcomputer.

FIG. 3 is an enlarged sectional view of a main part when a probe terminal is brought into contact.

FIG. 4 is a perspective view showing a conventional example.

FIG. 5 is a perspective view showing a conventional example.

[Explanation of symbols]

 (1) hybrid integrated circuit device (2) integrated circuit board (3) insulating resin layer (4) circuit element (5) circuit pattern (conductive path) (6) microcomputer (7) conductive path for external signal input

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-4-167442 (JP, A) JP-A-4-167491 (JP, A) JP-A-4-167492 (JP, A) JP-A-4-167492 167493 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) G01R 31/28-31/3193 G01R 19/00-19/32 G06F 11/22 H05K 1/18

Claims (4)

(57) [Claims] An integrated circuit board having a circuit pattern of a desired shape formed of copper foil on an insulating substrate and a circuit pattern at a desired position formed on the board and containing desired program data. A microcomputer, to which a predetermined control signal output from the microcomputer is supplied and a peripheral circuit element connected to a conductive path on the substrate, and a microcomputer package connected to the microcomputer;
And a circuit pattern pad connected to the circuit pattern.
A predetermined signal from the outside to the microcomputer
A plurality of external signal input pads for applying
Hybrid integrated circuit characterized by providing conductive paths for external signals
Road equipment. 2. An integrated circuit board in which a circuit pattern of a desired shape is formed by copper foil on an insulating board, and a circuit pattern at a desired position formed on the board and having desired program data built therein. comprising a microcomputer chip-like or resin-sealed, and a circuit element surrounding the predetermined control signal is connected to the conductive path on the supplied and the substrate to be outputted from the microcomputer, the microcomputer Microcomputer package connected to
And a circuit pattern pad connected to the circuit pattern.
A predetermined signal from the outside to the microcomputer
And an external signal input pad for applying the signal.
Lead inside the microcomputer mounted on a board
Leakage current flowing when applying
Hybrid integrated circuit characterized by providing a conductive path for current measurement
apparatus. 3. An integrated circuit board in which a circuit pattern having a desired shape is formed by copper foil on an insulating board, and a circuit pattern at a desired position formed on the board and having desired program data built therein. A chip-shaped or resin-encapsulated microcomputer, a predetermined control signal output from the microcomputer is supplied, and a peripheral circuit element connected to a conductive path on the substrate and a peripheral portion of the microcomputer provided, the base
Lead inside the microcomputer mounted on a board
Leakage current flowing when applying
A current measuring conductive path, wherein the leak current measuring conductive path has at least a measuring pad, a microcomputer connecting pad and a peripheral conductive path connecting pad, and the microcomputer connecting pad is the microcomputer. A hybrid integrated circuit device, wherein the conductive path connection pads are respectively wire-bonded to peripheral conductive paths. 4. The hybrid integrated circuit device according to claim 3, wherein a solder layer is provided on the measurement pad.