JP3146277B2 - Lead forming and processing equipment for semiconductor devices - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead forming device for a semiconductor device, and more particularly to a lead forming process for a semi-finished product in a semiconductor device manufacturing process.

[0002]

2. Description of the Related Art Conventionally, in a process of manufacturing a semiconductor device, a QFP (Quad Flat Package) or an SOP (Small Outline Package) has been used.
In the case of the e) type semiconductor device, after the encapsulating step, the solder plating step, the lead cutting step, and the frame piece separating step are completed, a lead forming step of bending the lead is performed.

As shown in FIG. 11, a lead forming apparatus for performing this lead forming step includes holding portions 41 and 42 for holding a semiconductor device 12 and a semiconductor device 12.
Lead fixing claw 43 for fixing the base of the lead 13
44, lead forming claws 45a, 45b, 46a, 46b for holding the tip of the lead 13 and forming the lead;
X-direction moving tables 47, 49 and Z-direction moving tables 48, 50 for moving the lead forming claws 45a, 45b, 46a, 46b, and a camera 5 for recognizing the position of the lead 13.
1 and a recognition device 52.

A lead 1 is formed by the lead forming apparatus.
When the molding process 3 is performed, first, the semiconductor device 12 is held by the holding portions 41 and 42, and the root portions of the leads 13 are fixed by the lead fixing claws 43 and 44.

The leading ends of the left leads 13 fixed by the lead fixing claws 43, 44 are connected to lead forming claws 45a, 45b.
Between the lead 13 and the tip of the lead 13 on the right side.
6a and 46b.

Then, as shown in FIG. 12, the lead forming claws 45a, 45b, 46a, 46b are moved by the X-direction moving tables 47, 49 and the Z-direction moving tables 48, 50.
The lead 13 is bent by being moved in an arc shape (directions of arrows E and F) while slightly moving in the direction and the Z direction.

The above lead forming apparatus is described in detail in Japanese Patent Application Laid-Open No. 5-308112.

[0008]

In the above-described conventional lead forming apparatus, the lead of the semiconductor device is formed between lead forming claws, and the clamping force of the lead forming claw on the lead is constant.

Accordingly, even when the type and size of the semiconductor device are different, the clamping force of the lead forming claw on the lead is constant, so that the pressure applied per unit area depends on the type and size of the semiconductor device. They may be different, which may lead to quality deterioration or the like.

Further, since the holding force of the semiconductor device by the holding portion is constant, when the semiconductor device is warped, stable lead forming may not be performed due to the warp.

Further, since the semiconductor device is held by the holding portion and the root portion of the lead is fixed by the lead fixing claw, the lead is formed while applying an excessive load to the semiconductor device or the lead. As a result, the semiconductor device or the leads are greatly consumed (weared), and accidents in which one of them is damaged frequently occur.

Furthermore, when leads are formed on each of the four sides as in a QFP type semiconductor device, the leads on each of the opposing sides are molded and then once held by the holding section. Must be released, the orientation of the semiconductor device must be changed, and the semiconductor device must be held again by the holding unit.

Accordingly, an object of the present invention is to solve the above-mentioned problems, to perform stable lead molding without deteriorating quality or breakage, and to automatically change the side to be molded. It is an object of the present invention to provide a lead forming and processing apparatus capable of performing the above.

[0014]

According to a first aspect of the present invention, there is provided a lead forming and processing apparatus for a semiconductor device, which holds a semiconductor device having leads formed on at least opposing sides.
What is claimed is: 1. A lead forming apparatus for a semiconductor device, comprising: a lead portion holding a leading end portion of a lead; And a cradle for holding
The variable and the pressing member for crimping the lead to the cradle, a first pressure varying means for varying the holding force of the tip portion of the lead, the crimping force to the lead of the pressing member
2 pressure variable means , the first pressure variable means and the
The second pressure variable means is stored according to the type of the semiconductor device.
And a personal computer for setting the holding force and the crimping force .

The lead forming processing apparatus of the second semiconductor device according to the present invention, in addition to the above configuration, before the crimping force to the lead holding force and the pressing member at the tip portion of the lead
There is provided a means for variably controlling according to an external instruction from the personal computer .

The lead forming processing apparatus of the third semiconductor device according to the present invention, in addition to the above configuration, the personal con
The lead according to the type of the semiconductor device.
And the holding force of the tip of the
There is provided storage means for storing the crimping force .

According to a fourth aspect of the present invention, there is provided a lead forming and processing apparatus for a semiconductor device, further comprising means for rotating and driving the pedestal, in addition to the above-described structure.

A fifth semiconductor device lead forming and processing apparatus according to the present invention holds a semiconductor device having leads formed on at least respective sides facing each other, and holds the leading end of the leads to form the leads. What is claimed is: 1. A lead forming apparatus for a semiconductor device, comprising: a semiconductor device fitted with a recess in which a lower half portion of the semiconductor device fits; a pressing member for crimping and a first pressure varying means for varying the holding force of the tip portion of the lead, the second pressure-friendly for varying the pressing force to the semiconductor device of the pressing member
Variable means , the first pressure variable means and the second pressure
Holding force and pressure corresponding to the type of the semiconductor device
A personal computer for setting the wearing strength .

According to a sixth aspect of the present invention, in addition to the above configuration, the lead forming and processing apparatus for a semiconductor device according to the present invention further includes a holding force of the tip of the lead and a pressing force of the pressing member to the semiconductor device from the personal computer. A means for variably controlling according to an external instruction is provided.

The lead forming processing apparatus of the seventh semiconductor device according to the present invention, in addition to the above configuration, the personal con
The lead according to the type of the semiconductor device.
Force of the tip portion of the semiconductor device and the semiconductor device of the pressing member
Storage means for storing the pressing force to the storage device .

According to an eighth aspect of the present invention, there is provided an apparatus for processing a lead of a semiconductor device according to the present invention, in addition to the above-described structure, a means for rotating and driving the pedestal.

According to a ninth semiconductor device lead forming and processing apparatus of the present invention, in the above structure, the pressing member may be
It has a plurality of movable pins that can move up and down according to the shape of the contact surface with the semiconductor device.

[0023]

DESCRIPTION OF THE PREFERRED EMBODIMENTS First, the operation of the present invention will be described below.

The lead or the semiconductor device is crimped with a pressing part to a receiving base holding the semiconductor device and the lead, which includes a concave portion into which the lower half of the semiconductor device fits, and the crimping force is applied by a pressure variable portion and a lifting actuator. In addition to being variable, the holding force of the tip portion by the lead forming claw when forming the lead is made variable by the pressure variable section and the actuator. As a result, quality deterioration and defective lead molding (defective lead molding dimensions) can be eliminated, and high quality and stable lead molding can be performed. In addition, the cradle for holding the semiconductor device and the leads and the holding component are rotationally driven by the NC motor.

Thus, while the semiconductor device and the lead are held by the receiving table and the holding part, the lead on the other side which has not been formed can be automatically moved to the lead forming claw side. The tact-up lead molding process can be performed by the unit configuration, and the cost of the apparatus itself can be reduced.

Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a front view of one embodiment of the present invention, and FIG. 2 is a side view of one embodiment of the present invention. In these figures, a cradle 1, a holding part 2, lead forming claws 3a, 3b, 4a, 4b, actuators 5, 6,
Molding parts 7, 8, pressure variable parts 9, 16 and NC (Num
electrically controlled) motor 1
0, 14, a holding unit 11, and a lifting actuator 15.

The cradle 1 has a concave portion which has been processed in advance according to the outer shape of the semiconductor device 12 (the shape of the portion below the lead 13). Hold the root part. The cradle 1 can be replaced according to the type of the semiconductor device 12.
That is, it is detachable from the NC motor 10 and is driven to rotate by the NC motor 10.

The holding part 2 is pressed against the base 1 side of the lead 13 of the semiconductor device 12 held by the base 1. In this case, the pressing force of the holding component 2 against the lead 13 is changed by moving the holding unit 11 in the vertical direction (the direction of arrow B) by the lifting actuator 15.

The lead forming claws 3a, 3b, 4a, and 4b are the leads 1 formed on opposing sides of the semiconductor device 12.
3 is formed by bending each. At this time, the lead forming claw 3
a, 3b and the lead forming claw 4
The holding force of the lead 13 by a and 4b is configured to be variable by actuators 5 and 6, respectively.

The molding portions 7 and 8 are provided with lead molding claws 3a, 3b,
It comprises an X-direction moving table and a Z-direction moving table that move in an arc while finely moving 4a and 4b in the X and Z directions.

The pressure variable section 9 controls the operation of varying the holding force of the lead forming claws 3a, 3b, 4a, 4b on the lead 13 by the actuators 5, 6. The pressure varying unit 16 vertically moves the holding unit 11 by the lifting / lowering actuator 15, and variably controls the pressing force of the holding component 2 against the lead 13.

The NC motor 10 rotates the cradle 1 in the direction of arrow A. The NC motor 14 rotates the holding part 2 in the direction of arrow A. Note that the NC motors 10 and 14 rotate the receiving table 1 and the presser component 2 in synchronization with each other.

FIGS. 3 and 4 are diagrams showing the operation sequence of the forming process of the lead 13 according to one embodiment of the present invention. FIGS. 1 to 4 show a lead 13 according to an embodiment of the present invention.
The operation sequence of the forming process will be described. It is assumed that the semiconductor device 12 is of a QFP type and leads 13 are formed on each side (four sides) of the outer periphery.

After the semiconductor device 12 is set on the receiving table 1, the holding unit 11 is lowered by the lifting actuator 15, and the lead 13 is crimped by the pressing component 2 (FIG. 3A).
reference]. Thereby, the semiconductor device 12 and the lead 13
Is held (clamped) by the receiving table 1 and the holding part 2.

In this state, the lead forming claws 3a, 3b, 4a, 4b are moved to the tip of the lead 13 by the forming portions 7, 8, and the distance between the lead forming claws 3a, 3b and the lead forming are formed by the actuators 5, 6. The distance between the claws 4a and 4b is reduced so that the lead forming claws 3a, 3b, 4a and 4
b holds and clamps the tip of the lead 13 [see FIG. 3B]. At this time, the lead forming claws 3a,
The holding force of the lead 13 by 3b, 4a, 4b can be changed by the actuators 5, 6.

Thereafter, the lead forming claws 3a, 3b, 4
The leads 13 are bent by slightly moving the a and 4b in the X-direction and Z-direction movement tables of the forming units 7 and 8 in the X and Z directions while moving them in an arc shape [FIG.
(C)].

When the bending of the pair of opposing sides of the semiconductor device 12 with respect to the leads 13 is completed, the lead forming claws 3 are formed.
a, 3b, 4a, and 4b, the holding of the leading end portion of the lead 13 is released, and the NC motor 1 is held while the semiconductor device 12 and the lead 13 are held by the receiving table 1 and the holding component 2.
The holder 1 and the holding part 2 are rotated by 90 ° by 0 and 14, and the leads 13 on the other side which are not formed are moved to the lead forming claws 3a, 3b, 4a and 4b [FIG. 4 (a)].
reference].

In this state, the lead forming claws 3a, 3b, 4a, 4b are moved to the tip of the lead 13 by the forming portions 7, 8, and the distance between the lead forming claws 3a, 3b and the lead forming are formed by the actuators 5, 6. The distance between the claws 4a and 4b is reduced so that the lead forming claws 3a, 3b, 4a and 4
The lead 13 is held (clamped) with the leading end of the lead 13 interposed therebetween. At this time, the holding force of the lead 13 by the lead forming claws 3a, 3b, 4a, 4b can be changed by the actuators 5, 6.

Thereafter, the lead forming claws 3a, 3b, 4
The leads 13 are bent by moving the a and 4b in an arc shape while slightly moving them in the X and Z directions on the X and Z movement tables of the forming sections 7 and 8 [FIG.
(B)].

When the bending of the lead 13 is completed, the holding part 11 is raised by the lifting actuator 15, and the holding component 2 is separated from the lead 13 to remove the semiconductor device 1.
The lead 2 and the lead 13 are released (unclamped) from the receiving table 1 and the holding part 2 (see FIG. 4C).

FIG. 5 is a block diagram showing the configuration of the pressure variable section 9 of FIG. In the figure, a pressure variable unit 9 includes a personal computer (hereinafter, referred to as a personal computer) 17, a converter 18, a controller 19, and an electropneumatic regulator 20.
And an electromagnetic valve 21.

The personal computer 17 is a host device for setting the air pressure supplied to the actuators 5 and 6. The converter 18 transmits the contents set by the personal computer 17 to the controller 19.

The controller 19 supplies a set electric signal to the electropneumatic regulator 20 according to the set contents from the personal computer 17 inputted through the converter 18. The electropneumatic regulator 20 supplies a control air pressure proportional to the set electric signal from the controller 19 to the solenoid valve 21.

The solenoid valve 21 switches the control air pressure from the electropneumatic regulator 20 to supply the control air pressure to the actuators 5 and 6, and variably controls the holding force of the lead 13 by the lead forming claws 3a, 3b, 4a and 4b.

Hereinafter, the lead forming claws 3a, 3b, 4a, 4
FIG. 1B shows the variable control of the holding force of the lead 13 by b.
This will be described with reference to FIG. 2 and FIG.

When the holding force of the lead 13 by the lead forming claws 3a, 3b, 4a, 4b is changed, first, the personal computer 1
At 7, the air pressure supplied to the actuators 5, 6 is set.

In this case, if the air pressure is stored in a memory device (not shown) of the personal computer 17 in association with the type and size of the semiconductor device 12, the type and size of the semiconductor device 12 can be stored in the personal computer 17. It is also possible to automatically set the air pressure simply by inputting the air pressure.

The air pressure set by the personal computer 17 is transmitted to the controller 19 through the converter 18. Since the controller 19 supplies an electric signal corresponding to the set air pressure to the electropneumatic regulator 20, the control air pressure corresponding to the electric signal is supplied from the electropneumatic regulator 20 to the solenoid valve 21.

When the lead forming claws 3a, 3b, 4a, 4b clamp the lead 13, the control air pressure is supplied from the solenoid valve 21 to the actuators 5, 6, so that the actuator 5, which is controlled by the control air pressure, By the operation of 6, the holding force of the lead 13 by the lead forming claws 3a, 3b, 4a, 4b is changed.

As a result, the clamping force of the lead 13 can be varied for each type of the semiconductor device 12, so that
Since the clamping force on the lead 13 is constant, it is possible to remove factors that lead to quality deterioration, such as dents, shorts and scratches due to solder scraping, and bending, which have occurred in the prior art.

FIG. 6 shows a semiconductor device 1 using the cradle 1 of FIG.
FIG. 7 is a view showing the holding operation of the semiconductor device 12 and the lead 13 by the receiving table 1 and the holding component 2 of FIG. 1. In these figures, the pedestal 1 is processed in advance in accordance with the outer shape of the semiconductor device 12, has a recess in which a portion of the semiconductor device 12 below the lead 13 is fitted, and is fitted in the recess. The semiconductor device 12 and the base of the lead 13 are held.

In this state, the leads 13 of the semiconductor device 12
Is pressed by the holding part 2, and the lead 13 is crimped to the receiving table 1 side by the holding part 2. In this case, the pressing force of the pressing component 2 against the lead 13 is changed by the vertical movement of the holding unit 11 by the lifting actuator 15.

FIG. 8 is a view showing the operation of holding the semiconductor device 12 and the leads 13 by the pedestal according to another embodiment of the present invention, and FIG. 9 is a diagram showing the semiconductor by the pedestal and pressing parts of another embodiment of the present invention. FIG. 4 is a diagram illustrating a holding operation of the device 12 and the lead 13.

In these figures, the pedestal 1 is processed in advance according to the outer shape of the semiconductor device 12 and
And a holding pin 2 for supporting the bottom surface of the semiconductor device 12 fitted in the recess.
2 to 24, and holds the semiconductor device 12 and the roots of the leads 13 fitted in the recesses.

In this state, the upper surface of the semiconductor device 12 is pressed by the movable pins 26 to 28 of the holding part 25, and the holding part 25 is pressed.
The semiconductor device 12 is pressed against the receiving table 1. In this case, the pressing force of the holding component 25 against the semiconductor device 12 is changed by the vertical movement of the holding unit 11 by the lifting actuator 15.

Here, the movable pins 26 to 2 of the pressing part 25
8 is urged downward by a compression coil spring 30 and is held by a bush 29 so as to be movable up and down (in the direction of arrow D).

Therefore, the movable pins 26 to 28 are adapted to the shape of the upper surface of the semiconductor device 12, that is, to a warped portion (a mountain-shaped portion) or a warped portion (a valley-shaped portion). Since the lead 13 is moved up and down, the lead 13 can be formed without imposing an excessive load on the semiconductor device 12 or the lead 13 by the pressing component 25. Therefore, the semiconductor device 12 or the leads 13 are not consumed (wear) severely, and it is possible to prevent an accident in which one of them is damaged.

FIG. 10 is a block diagram showing the structure of the pressure variable section 16 of FIG. In the figure, the pressure variable section 16 includes a personal computer 17, a converter 18, a controller 31, an electropneumatic regulator 32, and a solenoid valve 33.

The personal computer 17 is a host device for setting the air pressure supplied to the lifting actuator 15.
The converter 18 transmits the contents set by the personal computer 17 to the controller 31.

The controller 31 supplies a set electric signal to the electropneumatic regulator 32 according to the set contents from the personal computer 17 inputted through the converter 18. The electropneumatic regulator 32 supplies a control air pressure proportional to the set electric signal from the controller 31 to the solenoid valve 33.

The solenoid valve 33 switches the control air pressure from the electropneumatic regulator 32 and supplies it to the lifting actuator 15 to variably control the holding force of the lead 13 (or the semiconductor device 12) by the holding part 2 (or the holding part 25). I do.

Hereinafter, the holding part 2 (or the holding part 2)
The variable control of the holding force of the lead 13 (or the semiconductor device 12) according to 5) will be described with reference to FIG. 1, FIG. 2 and FIG.

When the holding force of the lead 13 (or the semiconductor device 12) by the holding part 2 (or the holding part 25) is changed, first, the lifting actuator 1
Set the air pressure to be supplied to 5.

In this case, if the air pressure is stored in a memory device (not shown) of the personal computer 17 in association with the type and size of the semiconductor device 12, the type and size of the semiconductor device 12 can be stored in the personal computer 17. It is also possible to automatically set the air pressure simply by inputting the air pressure.

The air pressure set by the personal computer 17 is transmitted to the controller 31 through the converter 18. Since the controller 31 supplies an electric signal corresponding to the set air pressure to the electropneumatic regulator 32, the control air pressure corresponding to the electric signal is supplied from the electropneumatic regulator 32 to the solenoid valve 33.

When the holding part 2 (or the holding part 25) clamps the lead 13 (or the semiconductor device 12),
Since the control air pressure is supplied from the solenoid valve 33 to the lifting actuator 15, the operation of the lifting actuator 15 controlled by the control air pressure causes the pressing component 2 to move.
The holding force of the lead 13 (or the semiconductor device 12) by the (or the holding component 25) is varied.

As a result, the clamping force of the lead 13 (or the semiconductor device 12) can be varied for each type of the semiconductor device 12, so that the clamping force on the lead 13 (or the semiconductor device 12) is constant. It is possible to remove factors that lead to quality deterioration, such as dents, shorts and scratches due to solder scraping, and bending, which have occurred in the technology.

The cradle 1 is moved by the arrow A by the NC motor 10.
, And the holding part 2 is rotated in the direction of arrow A by the NC motor 14, so that the receiving table 1 and the holding part 2 are rotated.
Accordingly, the receiving table 1 and the holding component 2 can be rotated while holding the semiconductor device 12 and the leads 13. Therefore, the leads 13 on the other side that are not formed can be automatically moved to the lead forming claws 3a, 3b, 4a, 4b.

With the above-described configuration, it is possible to perform tact-forming lead molding with a simplified unit configuration, and to reduce the cost of the apparatus itself.

As described above, the semiconductor device 12 includes the concave portion into which the lower half thereof is fitted, and includes the semiconductor device 12 and the lead 1.
3 on the support 1 holding the lead 3
Alternatively, the semiconductor device 12 is crimped, the crimping force is made variable by the pressure variable unit 16 and the lifting actuator 15, and the lead forming claws 3 a,
By making the holding force of the distal end portion 3b, 4a, 4b variable by the pressure variable portion 9 and the actuators 5, 6, quality deterioration and lead molding defect (lead molding dimensional defect) are eliminated, and high quality and stable leads are obtained. Molding can be performed.

The receiving table 1 for holding the semiconductor device 12 and the leads 13 and the holding parts 2 and 25 are mounted on the NC motor 1.
When the semiconductor device 12 and the lead 13 are held by the cradle 1 and the holding parts 2 and 25, the lead 13 on the other side which has not been formed is automatically turned into the lead forming claw 3a by being rotationally driven at 0 and 14. , 3b, 4a, and 4b, the lead molding process can be performed with a simplified unit configuration and the tact time can be increased, and the cost of the apparatus itself can be reduced.

[0072]

As described above, according to the present invention, the pressing member and the lead are press-bonded to the cradle that includes the recess in which the lower half of the semiconductor device fits and that holds the semiconductor device and the lead. By making the crimping force variable and the holding force of the tip portion when forming the lead variable, it is possible to perform stable lead molding without causing quality deterioration, breakage, etc. There is an effect that the side can be changed automatically.

[Brief description of the drawings]

FIG. 1 is a front view of one embodiment of the present invention.

FIG. 2 is a side view of one embodiment of the present invention.

3A is a diagram showing a state in which the semiconductor device is set on the cradle of FIG. 1; FIG. 3B is a diagram showing a state in which the lead forming claw of FIG. FIG. 3C is a diagram illustrating bending of a lead by the lead forming claw of FIG. 1.

FIG. 4A is a diagram showing a state in which a cradle and a holding part are rotated while holding the semiconductor device and the leads of FIG. 1;
FIG. 2B is a diagram illustrating bending of the lead by the lead forming claw of FIG. 1, and FIG. 2C is a diagram illustrating a state in which the holding of the semiconductor device and the lead by the cradle and the holding component of FIG. 1 is released.

FIG. 5 is a block diagram illustrating a configuration of a pressure variable unit in FIG. 1;

FIG. 6 is a diagram showing an operation of holding the semiconductor device and leads by the cradle of FIG. 1;

FIG. 7 is a diagram showing an operation of holding the semiconductor device and the lead by the receiving table and the holding component of FIG. 1;

FIG. 8 is a diagram showing a holding operation of a semiconductor device and leads by a pedestal according to another embodiment of the present invention.

FIG. 9 is a view showing a holding operation of a semiconductor device and leads by a receiving table and holding parts according to another embodiment of the present invention.

FIG. 10 is a block diagram illustrating a configuration of a pressure variable unit in FIG. 1;

FIG. 11 is a view showing a configuration of a conventional lead forming apparatus.

FIG. 12 is a view showing lead forming processing by a conventional lead forming apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Receiving stand 2, 25 Pressing part 3a, 3b, 4a, 4b Lead forming claw 5, 6 Actuator 7, 8 Molding part 9, 16 Pressure variable part 10, 14 NC motor 11 Holding part 12 Semiconductor device 13 Lead 15 Lifting actuator 17 Personal computer 18 Transducer 19, 31 Controller 20, 32 Electropneumatic regulator 21, 33 Solenoid valve 22-24 Holding pin 26-28 Movable pin 29 Bush 30 Compression coil spring

────────────────────────────────────────────────── ─── Continuation of front page (56) References JP-A-5-129492 (JP, A) JP-A-4-157760 (JP, A) JP-A-7-321273 (JP, A) (58) Field (Int.Cl. ⁷ , DB name) H01L 23/50 B21D 5/01

Claims (9)

(57) [Claims] 1. A lead forming apparatus for a semiconductor device, comprising: a semiconductor device having leads formed on at least respective sides facing each other; and holding the tip of the leads to form the leads. A receiving device that includes a concave portion in which the lower half of the device fits and that holds the semiconductor device and its lead fitted in the concave portion, a pressing member that presses the lead to the receiving portion, and holding of a tip portion of the lead; First pressure variable means for varying the force, second pressure variable means for varying the pressing force of the holding member to the lead, the first pressure variable means and the second pressure variable hand.
Apply a holding force and a crimping force according to the type of the semiconductor device to the step.
A lead forming apparatus comprising: a setting personal computer . 2. The personal computer as claimed in claim 1, wherein a holding force at a leading end of the lead and a pressing force of the pressing member against the lead are applied to the personal computer.
2. The lead forming apparatus according to claim 1, further comprising means for variably controlling the apparatus according to an external instruction from a computer . 3. The personal computer according to claim 2 , wherein
Holding force at the tip of the lead according to the type of conductor device
And a memory for storing a pressing force of the pressing member to the lead.
The lead forming apparatus according to claim 1, further comprising a storage means . 4. The lead forming apparatus according to claim 1, further comprising means for rotating and driving the pedestal. 5. A lead forming apparatus for a semiconductor device for holding a semiconductor device having leads formed on at least respective sides facing each other, and holding the tip of the lead to form the lead. A receiving portion for holding a semiconductor device and a lead thereof including a concave portion fitted to the lower half of the device and holding the lead, a pressing member for pressing the front semiconductor device to the receiving portion, and a tip portion of the lead; a first pressure varying means for varying the holding force, the second pressure-friendly for varying the pressing force to the semiconductor device of the pressing member
Variable means , the first pressure variable means and the second pressure
Holding force and pressure corresponding to the type of the semiconductor device
A lead forming apparatus comprising: a personal computer for setting an applied force . 6. The personal computer as claimed in claim 1, wherein a holding force at a tip of the lead and a pressing force of the pressing member against the semiconductor device are applied to the personal computer.
6. The lead forming apparatus according to claim 5, further comprising means for variably controlling the apparatus according to an external instruction from a computer . 7. The personal computer, comprising:
Holding force at the tip of the lead according to the type of conductor device
And a pressing force of the pressing member to the semiconductor device.
6. The lead forming apparatus according to claim 5, further comprising a storage unit . 8. The lead forming apparatus according to claim 5, further comprising means for rotating and driving the receiving table. 9. The lead according to claim 5, wherein the pressing member includes a plurality of movable pins that can move up and down according to the shape of the contact surface with the semiconductor device. Forming equipment.