JP3143826B2 - Bonding device with dispenser - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the coating position accuracy of adhesive, etc., and bonding position accuracy by simultaneously displaying the syringe top end and substrate as well as the substrate and chip, using an image-recognition camera. SOLUTION: A vertical observation optical system 11 is moved between a syringe 6 and a substrate 36 to set a lower focus of an image-recognition camera 15 on the substrate 36, the syringe 6 is lowered until the top end of a precision nozzle 19 of the syringe 6 aligns with an upper focus of the camera 15, a substrate stage 16 is moved in X- and Y-axis directions to align an adhesive coating position on the substrate 36 with the top end of the nozzle 19, and the syringe 6 is lowered to coat adhesive on the substrate 36. The optical system 11 is inserted between a semiconductor chip fixed to a chip vacuum chucking tool and substrate 36 to display the chip and specified position on the substrate 36 at once using the camera 15, the substrate 36 is moved relatively to align with the chip, and the chip is bonded to the substrate 36 using the chucking tool.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonding apparatus for mounting a semiconductor chip or the like on a substrate, and a coating position of a dispense unit for precisely applying a coating material such as an adhesive or a flux or a resin onto the substrate. And a bonding apparatus with a dispenser for improving the positioning accuracy of a bonding unit for bonding a semiconductor chip or the like to a substrate.

[0002]

2. Description of the Related Art Heretofore, there has been a case where alignment of a substrate and a semiconductor chip in a bonding unit is performed by image processing in order to improve the accuracy. But,
A dispensing unit for applying an adhesive or the like often requires precise application. In the dispensing unit, the setting of the adhesive application position per chip is performed by setting and inputting the coordinate value with respect to the origin, and the origin is set to the first detected value, and the second and subsequent workpieces are set in a separate menu. Was inputting the coordinate data of the mounting position.

However, the setting of the substrate on the substrate stage is based on the outline of the substrate. Therefore, when the accuracy of the application position of the adhesive is required to be higher than the electrode pattern accuracy with respect to the outline, there is a problem that the dispersion becomes large. . In order to solve such a problem, it has become necessary to perform positioning of the dispensing unit by image recognition.

[0004]

SUMMARY OF THE INVENTION According to the present invention, the tip of a syringe and a substrate are simultaneously displayed by an image recognition camera to improve the accuracy of the application position of an adhesive or the like, and the same image recognition camera and the substrate are used. An object of the present invention is to provide a bonding apparatus with a dispenser that can also display a chip at the same time and improve the alignment accuracy of bonding.

[0005]

SUMMARY OF THE INVENTION In order to solve the above problems, the present invention provides a dispenser with a syringe, a substrate stage movable relative to the syringe in the XYZ axis directions, and a chip suction tool. In a bonding apparatus having an image recognition camera capable of observing an object at the same time, a substrate stage relatively moves so that the substrate comes under the syringe, and one image recognition camera is inserted between the syringe and the substrate. At the same time, a predetermined position on the substrate is displayed, the substrate is relatively moved so as to be aligned with the nozzle of the syringe, and when the position is aligned, the syringe is applied to the substrate. The substrate stage moves relatively to the lower side, and is used between the chip and the substrate sucked by the chip suction tool in the first step.
Insert the same image recognition camera as the one used, display the chip and the predetermined position on the substrate at the same time, move the substrate relative to the chip, and when the position is aligned, the chip suction tool A bonding apparatus with a dispenser, which comprises a second step of bonding the same.

[0006]

Embodiments of the present invention will be described below with reference to the drawings. One embodiment of a bonding apparatus with a dispenser used in the present invention will be described with reference to FIG. 5. First, the bonding apparatus includes a substrate driving unit, a dispense unit, a bonding unit, a mount unit, and an image recognition unit.

The substrate drive unit includes an X-axis drive mechanism 1 for moving the substrate 36 in the X-axis direction (lateral direction) and a Y-axis drive mechanism 2 for moving the substrate 36 in the Y-axis direction (front-rear direction). It has an XY table 3 placed thereon. still,
Although not shown, a θ-axis (rotation in a horizontal plane) table is usually set on the XY table 3, and a substrate stage (not shown in FIG.
6).

In the present embodiment, the relative movement of the substrate stage 16 (including the substrate 36 according to the claims) to the syringe 6 in the XY-axis direction and the bonding tool 9 or the mounting tool (mount head 10 is shown, and the mounting tool itself is not shown).
The relative movement in the axial direction is performed by the X-axis drive mechanism 1 and the Y-axis drive mechanism 2.

On the other hand, a Z-axis drive mechanism 7 for simultaneously moving the tip suction tool and the syringe 6 up and down by the servomotor 5 is attached to the gantry 4. The Z-axis drive mechanism 7 is a Z-axis ball screw (in FIG. 5). A Z-axis driving member 8 that moves up and down (not shown and indicated by reference numeral 41 in FIG. 2) is provided.

Referring to FIG. 2, the Z-axis driving mechanism 7 transmits the rotation of the servo motor 5 to the Z-axis ball screw 41 via the coupling 40, and the nut 20 screwed to the Z-axis ball screw 41. The vertical movement of the Z-axis driving member 8 is performed via the. Syringe 6 and substrate 3 according to the present embodiment
The relative movement of the substrate 6 in the Z-axis direction and the relative movement of the substrate 36 and the semiconductor chip 35 in the Z-axis direction are performed by the Z-axis drive mechanism 7.

The Z-axis drive member 8 has a syringe 6 of a dispense unit, a bonding head 9 as a suction tool, and a mount head 10 mounted thereon. And
An upper / lower observation optical system 11 is provided with an optical system driving mechanism 12 at a position where it can enter between the substrate stage 16 and the syringe 6 and between the bonding tool 9 as a suction tool or the mount tool. In this embodiment, the bonding head 9 and the mount head 10 may be the same as those members in a conventional bonding apparatus.

FIG. 1 shows a vertical observation optical system 1 having an adhesive supply device 13, a syringe 6, a bonding head 14 having a bonding tool 9, and an image recognition camera 15.
FIG. 2 is a layout diagram showing a positional relationship between a substrate stage 16 and a substrate 36 for fixing the substrate 36.

The syringe 6 is connected to an adhesive supply device 13 (not shown) and receives the adhesive intermittently as required. Precision nozzle 1 at the lower end of syringe 6
9 is mounted, and the adhesive is applied to the upper surface of the substrate 36 by the precision nozzle 19.

The syringe 6 is attached to the Z-axis drive member 8 and is moved up and down by the Z-axis drive mechanism 7 in principle. However, the syringe shown in FIGS. An auxiliary drive mechanism is provided.

The syringe auxiliary driving mechanism includes a Z-axis driving member 8.
The syringe drive unit 18 is mounted on the Z-axis drive member 8 so as to be vertically slidable with the slide unit 21 interposed therebetween.
The upper part of the syringe drive unit 18 is connected to the cylinder rod 23 of the cylinder 17 fixed to the upper part of the Z-axis drive member 8, and the syringe drive unit 18 is configured to move up and down by the operation of the cylinder 17 (air cylinder in the embodiment). ing. Note that the syringe 6 is the syringe drive unit 1
8 is held by a holder 22 formed at the lower end.

According to the present invention, there is provided a bonding apparatus having an image recognition camera capable of simultaneously observing two objects,
This is the vertical observation optical system 11. Vertical observation optical system 11
As shown in FIG. 3, an upper observation opening and a lower observation opening are opened in a housing, and a prism 24 that receives light from both openings and an image from the prism 24 is recognized by the image recognition camera 1.
The half mirror 25 and the reflection mirror 26 to be sent to the light source 5 are arranged in a housing.

That is, the image of the tip of the syringe 6 is taken in from the upper observation opening, refracted by the prism 24, passes through the half mirror 25, and passes through the image recognition camera 15
Is recognized by On the other hand, the image of the substrate 36 is taken in from the lower observation opening, is refracted by the prism 24, is reflected by the reflection mirror 26 and the half mirror 25, and is recognized by the image recognition camera 15. The dashed-dotted arrow in FIG. 3 indicates the path of the image light, and the image taken into the image recognition camera 15 is simultaneously displayed on a display (not shown).

Before and after applying the adhesive, the upper and lower observation optical system 11 enters between the two to observe the tip of the syringe 6 (the tip of the precision nozzle 19 in the embodiment) and the substrate 36, and retreats when the adhesive is applied. However, before bonding, it is necessary to move between the semiconductor chip 35 and the substrate 36 adsorbed by the bonding tool 9 or the mount tool to observe the semiconductor chip 35 and the substrate 36, and to retreat at the time of bonding.
An optical system driving mechanism 12 is provided.

As shown in FIG. 4, the optical system drive mechanism 12 mounts a bracket 34 for holding the vertical observation optical system 11 on a Y-axis slide unit 33, and uses a motor (not shown) and a Y-axis drive ball screw to drive the Y-axis. An axis (a front-rear direction in FIG. 4) can be driven, a mounting plate 32 of the Y-axis slide mechanism can be moved up and down by a micrometer 31, and a bracket 30 holding the up-and-down driving mechanism is connected to an X-axis motor 27, a belt 28 It is attached to the X-axis ball screw 29 of the X-axis drive mechanism composed of the axis ball screw 29.

Although the present invention requires two steps, the first step is a syringe-related operation step when the steps are described in Examples. First, in the first step, first, the syringe 6 is lowered by the cylinder 17. That is, the transition from the positional relationship in FIG. 1 to the positional relationship in FIG. Second, the vertical observation optical system 11 moves between the syringe 17 and the substrate 36. Third, the lower focus of the image recognition camera 15 is focused on the substrate 36 by the micrometer 31 for fine adjustment of the upper and lower observation optical system 11. Fourth, the syringe 6 is lowered by driving the servo motor 5 until the tip of the precision nozzle 19 of the syringe 6 matches the upper focus of the image recognition camera 15. The drive amount at this time is stored as a set value. Fifth, the substrate stage 16 is moved in the X and Y directions by the operation of the X-axis drive mechanism 1 and the Y-axis drive mechanism 2 while viewing the image, and the position of the substrate 36 where the adhesive is to be applied and the precision nozzle of the syringe 6 Positioning of the tip of 19 is performed. Sixth, the vertical observation optical system 11 is retracted. Seventh,
The syringe 6 is further lowered by the drive of the servo motor 5 to apply the adhesive to the substrate 36. Eighth, the syringe 6 is raised by the drive of the servomotor 5. Ninth, the syringe 6 is raised by the cylinder 17 and returns to the original position.

The first step is completed as described above. From the second step, the third focusing step is not required.
That is, the driving amount of the servo motor in the operation of lowering the tip of the precision nozzle 19 of the syringe 6 to the upper focus of the image recognition camera 15 is performed according to the set value stored in the first step.

According to the embodiment, except when the adhesive is supplied,
Since the inside of the syringe 6 has a slightly negative pressure, even if a little adhesive remains at the tip of the precision nozzle 19 immediately after application, it is already sucked when the image is captured by the image recognition camera 15. No adhesive remains on the tip of the 19.

The second step is an operation step related to a chip suction tool. In many cases, a bonding tool 9 is used as shown in FIG. 1, but a mounting tool is used when it is not necessary to perform bonding. .

In the second step, after the first step, the substrate stage 16 relatively moves so that the substrate 36 comes under the chip suction tool, and the semiconductor chip 35 and the substrate 36 sucked by the chip suction tool are moved. The vertical observation optical system 11 is inserted into
The image recognition camera 15 simultaneously displays a predetermined position on the semiconductor chip 35 and the substrate 36, and displays the substrate 36 on the semiconductor chip 3.
The chip 35 is relatively moved so as to match the position of the chip 5, and when the position is matched, the chip suction tool bonds the chip 35 to the substrate 36.

In the above embodiment, the example in which the first step is performed only once has been described. However, in the case where the application position extends to a plurality of places, the first step is performed a plurality of times before shifting to the second step. It goes without saying that it is done. In the above embodiment, the adhesive is used as the coating agent. However, it is needless to say that an ultraviolet curable resin, a flux, a cream solder, a paste or the like may be used.

[0026]

The present invention has the following effects.
First, the present invention is to simultaneously observe the tip of the syringe and the observation of the substrate with an image recognition camera capable of observing two objects at the same time and display them simultaneously, so that the application position is set by image recognition. This makes it possible to apply an adhesive or the like with high positional accuracy. This is particularly effective when a minute application is required.

Second, since the images can be recognized when bonding the chip and the substrate, the alignment at the time of bonding is also highly accurate.

Third, the present invention has an image recognition camera capable of simultaneously observing two objects, and this image recognition camera moves and observes the substrate and the chip as well as observes the syringe and the substrate. Therefore, four image recognitions can be performed by one image recognition camera, and the number of image recognition cameras required for image recognition can be reduced.

[Brief description of the drawings]

FIG. 1 is a layout view of main members showing an embodiment of the present invention.

FIG. 2 is an explanatory view showing a state in which a vertical observation optical system is arranged between a syringe and a substrate.

FIG. 3 is an explanatory diagram showing an observation state of a syringe and a substrate.

FIG. 4 is a front view showing a driving mechanism of a vertical observation optical system.

FIG. 5 is a perspective view showing the entire bonding apparatus with a dispenser;

[Explanation of symbols]

 1. . . . . . 1. X-axis drive mechanism . . . . . 2. Y-axis drive mechanism . . . . . XY table 4. . . . . . Mount 5. . . . . . Servo motor 6. . . . . . Syringe 7. . . . . . 7. Z-axis drive mechanism . . . . . 8. Z-axis drive member . . . . . Bonding tool 10. . . . . Mount head 11. . . . . Vertical observation optical system 12. . . . . Optical system drive mechanism 13. . . . . Resin supply device 14. . . . . Bonding head 15. . . . . Image recognition camera 16. . . . . Substrate stage 17. . . . . Cylinder 18. . . . . Syringe drive unit 19. . . . . Precision nozzle 20. . . . . Nut 21. . . . . Slide unit 22. . . . . Holder 23. . . . . Cylinder rod 24. . . . . Prism 25. . . . . Half mirror 26. . . . . Reflection mirror 27. . . . . X-axis motor 28. . . . . Belt 29. . . . . X-axis ball screw 30, 34. . Bracket 31. . . . . Micrometer 32. . . . . Mounting plate 33. . . . . Y-axis slide unit 35. . . . . Chip 36. . . . . Substrate 40. . . . . Coupling 41. . . . . Z axis ball screw

Continuation of the front page (56) References JP-A-61-36941 (JP, A) JP-A-7-74191 (JP, A) JP-A-4-206746 (JP, A) JP-A-1-119903 (JP) , A) JP-A-6-283559 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01L 21/52

Claims (1)

(57) [Claims] 1. A dispenser with a syringe, a substrate stage movable relative to the syringe in XYZ axis directions,
In a bonding apparatus having a chip suction tool and an image recognition camera capable of simultaneously observing two objects,
The substrate stage moves relatively so that the substrate comes under the syringe, inserts one image recognition camera between the syringe and the substrate, and simultaneously displays the syringe tip and a predetermined position on the substrate,
First, the substrate is moved relative to the nozzle of the syringe so that the substrate is aligned with the nozzle. When the substrate is aligned, the first step in which the syringe is applied to the substrate, and then, the substrate stage is relatively moved so that the substrate is under the chip suction tool Between the chip and the substrate sucked by the chip suction tool in the first step.
Insert the same image recognition camera as the image recognition camera, and simultaneously display the chip and the predetermined position on the substrate, move the substrate relatively so that it is aligned with the chip, and when the position is aligned, the chip suction tool attaches the chip to the substrate A bonding apparatus with a dispenser, comprising a second step of bonding.