JP2513052B2 - Flip chip mounting equipment - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a device for mounting a flip chip equipped with bump electrodes for an integrated circuit device on a wiring board. The present invention relates to a device suitable for flip chip mounting provided with an extremely narrow array pitch.

[Conventional technology]

In integrated circuit devices that drive display panels and printers,
Since it is required to drive as many loads as pixels or printing elements with a chip size as small as possible, and connections are required for each load, hundreds of connection points must be arranged on a small chip of several mm square. I have to. In such a multi-terminal integrated circuit device, it is difficult to arrange the connection pads for wire bonding in the related art at a narrow pitch and the connection work becomes very troublesome, so bump electrodes of gold or solder are used as external connection points. The flip chip to be used is very advantageous in terms of chip manufacturing and mounting.

The outline of mounting suitable for such a multi-terminal flip chip will be outlined with reference to FIG.

FIG. 3 (a) shows a case where the bump electrode is solder. To mount the flip chip 1 having a large number of bump electrodes 2a on the wiring substrate 3 in which the wiring conductors 5 are arranged on the insulating substrate 4, solder is used. After the flip chip 1 is lightly pressed against the wiring substrate 3 heated to the melting temperature to bring the solder bump electrode 2a into contact with the corresponding wiring conductor 5 to melt it, the pressing force is removed to reduce the surface tension of the molten solder. The chips 1 are used to cool the chips 1 in a state of being self-aligned with the wiring board 3 to solidify the solder.

FIG. 3 (b) shows a case where the bump electrode is gold or copper. First, a small amount of resin 6 is put on the wiring board 3, and then the flip chip 1 is strongly pressed against this to wire the bump electrode 2b such as gold. The resin 6 is photo-cured or heat-cured in a state where it is in good conductive contact with the conductor 5 to maintain the conductive contact state by utilizing the shrinkage force and the adhesive force when the resin 6 is cured, and seal the contact portion with the resin. Protect by stopping.

[Problems to be Solved by the Invention]

However, in the above-mentioned conventional method, if the number of connection points of the flip chip is increased and the arrangement pitch of the bump electrodes is narrowed accordingly, it is difficult to ensure the uniformity of connection, and the chip alignment during mounting is difficult. Becomes difficult.

If the number of bump electrodes on a flip chip exceeds about 100, the maximum width of bump height variation increases, so when mounting, the flip chip is pressed against the wiring board with considerable pressure and the bumps with a large height are pressed. Although the contact with the wiring conductor is made uniform by deforming the electrode, if the influence of the warp of the flip chip or the unevenness of the wiring board overlaps, the contact with the wiring conductor will be incomplete in the bump electrode with a small height. Prone. When the bump electrode is solder, the non-uniformity that occurs when it is melted is considerably reduced, but when the bump electrode is gold, etc., the non-uniform contact pressure remains as an imperfect connection until the end, so it is extremely extreme. In that case, a connection failure occurs in which the bump electrode is not connected to the wiring conductor at all.

When the number of bump electrodes increases, the arrangement pitch becomes narrower accordingly, and when the arrangement pitch becomes 50 μm or less, it is necessary to suppress the positional deviation between the flip chip and the wiring substrate during mounting to about 10 μm or less. Conventionally, this alignment is usually performed by aligning the outer shape of the flip chip with the mark on the wiring board.
It is not always easy to reduce the thickness to μm or less. In the case of solder bump electrodes, if there is misalignment, molten solder will flow and short circuits between connection points will easily occur. Even if the alignment by self-alignment described above is used, the array pitch of bump electrodes should be 40 μm or less. Have difficulty. In the case of the gold bump electrode, there is no problem of short circuit, but the nonuniformity of the connection naturally increases due to the displacement.

When the bump electrode array pitch is narrow, the so-called TA
Although the B method or the inner lead bonding method can be used, the leads and the space therefor are additionally required, so that the face-down bonding of the flip chip is most advantageous as shown in FIG.

An object of the present invention is to provide a mounting apparatus that solves such problems and can improve the uniformity of connection and the alignment accuracy even when there are many connection points.

[Means for solving the problem]

According to the present invention, the pressing means for performing the first-step operation and the second-step operation, the pressing rod movably operated by the pressing means in a direction other than the pressing direction, and the holding means for holding the flip chip on the tip surface thereof. A chip pressing mechanism, a substrate holding mechanism having a transparent substrate pedestal and a wiring board holding means, an optical means for detecting the positions of the flip chip and the wiring board through the substrate pedestal, a chip pressing mechanism and a substrate. Positioning means for adjusting the relative position of the holding mechanism is provided in the mounting device, the flip chip is held by the tip end surface of the pressure rod on the board pedestal, and the pressure means is operated in the first stage. Position is adjusted by the position adjusting means while detecting the positions of both by the optical means in the state where they are brought close to each other, and then the pressing means is moved to the second position.
The above-mentioned object is achieved by fixedly connecting the bump electrode to the wiring conductor in the staged operation.

In order to cause the pressurizing means to perform the first-stage operation described above and the second-stage operation having a smaller movement amount, the first-stage cylinder and the second-stage cylinder having a smaller stroke are used. It is advantageous to use a combined dual pneumatic or hydraulic cylinder mechanism. Especially, the second-stage cylinder is controlled by a pressure regulating valve or the like to raise the operating pressure at a predetermined speed and then maintain it at a predetermined value. Is desirable.

The simplest connection between the pressing means and the chip pressing mechanism, which is movable in directions other than the pressing direction, is a free connection using steel balls, for example. The area of the tip of the pressure rod of the chip pressure mechanism should be larger than the area of the flip chip, but this tip surface should be hardened or hardened by mounting a high-hardness metal or cemented carbide. It is desirable to maintain the uniformity of the connection over a long period of time.

As the flip chip holding means of the chip pressing mechanism and the wiring board holding means of the substrate holding mechanism, for example, a vacuum suction method is easy to use and highly practical.

In the present invention, a transparent substrate is used as the substrate holder of the substrate holding mechanism as described above. However, when the bump electrodes of the flip chip are gold or the like and the ultraviolet curable resin is used at the time of mounting, It is advantageous to use quartz glass having a high ultraviolet transmittance for the substrate pedestal.

It is preferable to use a stereomicroscope with a deep depth of focus as the optical means, and it is advantageous to combine it with a video camera or monitor TV in order to improve the efficiency of the mounting work, and also to use a pattern recognition device. As a result, the mounting process can be fully automated.

As the position adjusting means, an xy operating device or an angle operating device can be appropriately combined and used as usual, and this is provided on one side of the chip processing mechanism and the substrate holding mechanism to adjust the relative position between them. That's fine.

The flip-chip mounting apparatus of the present invention can be applied to general flip-chip mounting including bump electrodes made of solder, gold, copper or the like.

[Action]

As described in the configuration of the preceding paragraph, in the flip-chip mounting apparatus according to the present invention, the pressing means that performs the first-stage operation and the second-stage operation with a smaller movement amount is used. The flip chip held on the tip surface of the pressure rod of the chip pressure mechanism operated by the one-step operation is brought close to the wiring board held on the transparent substrate holder of the substrate holding mechanism. In the imminent state, it is possible to accurately detect the position or relative positional deviation between the flip chip and the wiring board by the optical means through the transparent board support.

The position adjusting means adjusts the relative position of the chip pressing mechanism and the substrate holding mechanism based on the accurate detection result.
In the present invention, the displacement between the flip chip and the wiring board is adjusted to 10 μm or less at the maximum so that the two are precisely aligned, and the pressurizing means is operated in the second stage without changing the position of the flip chip. The bump electrode is brought into contact with the wiring conductor of the wiring board.

At this time, since the pressure rod of the chip pressure mechanism that holds the flip chip is movably operated by this pressure means in a direction other than the pressure direction, the pressure means applies pressure during the second stage operation. Even if the pressure rod moves a little in the lateral direction, the pressure rod makes the bump electrode of the flip chip contact the wiring conductor of the wiring substrate in the above-described precisely aligned state without being affected by this, and the so-called The bump electrode in the flip chip can be pressed against the wiring conductor with uniform pressure without causing one-sided pressing.

In this pressing state, even if the mounting surface of the wiring board is slightly inclined, the pressure rod that presses the flip chip thereon can take a posture corresponding thereto. In the device of the present invention, the inclination of the flip chip with respect to the wiring board can be suppressed to within several μm when the chip size is 10 mm, and therefore, it can be said that the flip chip is not actually pushed.
In this pressed state, the bump electrodes having a large height in the flip chip are deformed by, for example, about 20% at the maximum, so that the heights of the bump electrodes are made uniform.

The procedure for fixedly connecting the bump electrode and the wiring conductor in the state where the pressurizing means is operated in the second stage differs depending on the type of the bump electrode. In the case of the gold bump, the resin is photo-cured or thermo-cured in the pressed state. In the case of solder bumps, the pressed state is once released, the flip chip and the wiring board are self-aligned as described above with molten solder, and preferably, the solder is solidified by cooling again in the pressed state.

〔Example〕

Hereinafter, embodiments of the present invention will be specifically described with reference to the drawings. FIG. 1 shows a configuration example of a main part of a flip-chip mounting apparatus of the present invention for each main operating state. FIG. 1 (a) shows a case where a flip chip and a wiring board are held at respective predetermined locations. FIG. 2B shows the state of the pressurizing means during the first stage operation, and FIG. 7C shows the state during the second stage operation. Hereinafter, in this embodiment, the flip chip 1 is provided with a gold bump electrode 2, an ultraviolet curable resin 6 is used to mount it on the wiring board 3, and the wiring board 3 is provided with a transparent glass insulating substrate 4. Shall be used.

The pressurizing means 10 shown in the upper part of FIG. 1 (a) is composed of a two-stage cylinder mechanism which is pneumatically or hydraulically operated in this embodiment. It is shown as a representative. The pressure rod 21 of the tip pressure mechanism 20 shown on the lower side thereof is guided movably in the vertical direction of the figure by the position adjusting means 50 simply shown in the figure, and by a means such as a spring (not shown). The steel ball 22 in the recess of the upper end surface is urged so as to always come into contact with the lower end surface of the operating rod of the pressurization mechanism 10, and receives a force from the pressurization mechanism 10 only in the downward pressurizing direction in the drawing. It is like this. In this example of the pressure rod 21, the lower end surface 21a serves both as a pressing surface and a holding surface for the flip chip 1, and a suction hole 23 connected to a vacuum pump is provided at the center thereof as a holding means. Further, in this embodiment, the pressing tip surface 21a is subjected to a quenching treatment so as not to be dented by the flip chip 1 during long-term use. It should be noted that the position adjusting means 50 is, for example, a position operation device in the x, y and θ directions.

The substrate holding mechanism 30 shown in the lower part of FIG. 1 (a) includes a transparent substrate pedestal 31, which is quartz glass in this example, and a support plate 32.
It is fitted into a recess 32a on the upper surface of the board so as to project only slightly, and a plurality of suction holes 33 are arranged around the board pedestal 31 to hold the wiring board 3, and the board pedestal of the support plate 32 is provided. 31
The lower side is an opening, and its conical surface is finished as a mirror surface 32b.

A charging head 85 supported by an arm 84 is shown in the center of FIG. In this head 85, the flip chip 1 is placed on a receiving seat 86 made of Teflon or the like mounted on the upper surface thereof, and the wiring board 3 is mounted on the lower surface thereof at a position shown in the drawing by vacuum suction by a suction hole 88. . Next, by moving the position of the head 85 close to the board pedestal 31 and cutting off the suction from the suction holes 88, the wiring board 3 is transferred onto the board pedestal 31 to be adsorbed and held, and the position is pressed. By pressing the rod 21 close to the rod 21 and ejecting the compressed air from the ejection hole 87, the flip chip 1 is floated from the seat 86 and the pressure rod.
It is adapted to be moved to the tip surface 21a of 21 and to be adsorbed and held by it.

FIG. 1 (b) shows a state in which the pressing means 10 is operated in the first stage. As described above, the flip chip 1 is attached to the pressure rod 21.
After the wiring board 3 is held on the board pedestal 31 on the front end surface 21a of each of the heads, the head 85 is retracted from the state of FIG. After being dropped on the surface of the wiring board 3, the pressing means 10 is operated in the first stage to bring it into the state shown in the drawing, whereby the flip chip 1 is brought close to the wiring board 3. At this time, the stroke of the first stage operation of the pressing means 10 is set so that the gap between the tip of the bump electrode 2 and the wiring conductor 5 is sufficiently small, for example, about 0.5 mm.

In this example, since the insulating substrate 4 of the wiring board 3 is transparent, the wiring board 3 and the flip chip 1 can be seen through the board pedestal 31, and the optical means 40, which is simply shown in the figure, is used to detect their positions. . A stereomicroscope is suitable for the optical means 40. By combining this with a video camera, a magnified image in which the images of the wiring board 3 and the flip chip 1 are overlapped can be displayed on the monitor TV.

Therefore, in this embodiment, the position of the pressure rod 21 is adjusted by the position adjusting means 50 while looking at the enlarged image, and the image of each bump electrode 2 is superimposed on the image of the tip of the corresponding wiring conductor 5, for example. The flip chip 1 and the wiring board 3 can be precisely aligned with each other so that the mutual displacement is about several μm. The position adjusting means 50 is, for example, a combination of an x stage, ay stage and a θ stage.
Directional position controls are used.

FIG. 1 (c) shows a state in which the pressing means 10 is operated in the second stage. This second-stage operation requires only a very small stroke of about 0.5 mm, and by gradually increasing the pressing force after the tip of the bump electrode 2 hits the wiring conductor 5, the bump electrode 2 having a large height is deformed by about 20% at the maximum. Then, after all the bump electrodes 2 are brought into contact with the corresponding wiring conductors 5, the pressing force is kept constant. The pressing force control of the pressurizing means 10 can be easily performed by, for example, inserting a pressure regulating valve or a throttle in the supply passage of the working fluid to the cylinder mechanism for the second stage operation as usual.

At this time, the pressing rod 21 receives the pressing force from the pressing means 10 through the steel ball 22 only in the pressing direction, and the stroke of the second stage operation is very small. Therefore, the state of FIG. The bump electrode 2 can be brought into contact with the wiring conductor 5 while being precisely aligned. Further, in the pressed state after this contact, even if the wiring board 3 is slightly tilted, the pressing rod 21 presses the flip chip 1 against the wiring board 3 in a posture corresponding thereto, so that the tilt between the two is minimized. It is possible to almost completely eliminate the occurrence of push failure.

In this state, the bump electrodes 2 are evenly pressed against the corresponding wiring conductors 5, and in this example, from the projection head at the tip of the optical fiber of the light projection means 70, which is simply shown in the lower part of the drawing, the transparent substrate receiving member Ultraviolet rays are applied to the resin 6 for a short time through the base 31 and the insulating substrate 4, and the ultraviolet rays are cured to complete the mounting. After that, by using the loading head configured in the same manner as the loading head 85 of FIG. 1A, the wiring board 3 on which the flip chip 1 is mounted can be taken out from the board pedestal 31 by means such as vacuum suction. Good.

When the substrate pedestal 31 is made of quartz glass and the insulating substrate 4 of the wiring substrate 3 is Pyrex, a transmittance of about 80% or more with respect to ultraviolet rays having a wavelength of 365 nm can be obtained, and a transmittance of 250 with respect to the resin 6.
Ultraviolet rays can be irradiated with an intensity of ~ 300 mW / cm ² .
At this time, the mirror surface 32b of the support plate 32 below the substrate pedestal 31 plays a role of effectively utilizing scattered ultraviolet rays.

FIG. 2 exemplifies the overall configuration of the device of the present invention, of which only the main parts are shown in FIG. 1, and FIG. 2 (a) is a front view thereof and FIG. 2 (b) is a partial top view thereof. A side view is shown in FIG.

At the center of the upper part of FIG. 2 (a), the main part described in FIG. 1 is shown. The pressurizing means 10 is composed of a first-stage cylinder mechanism 11 and a second-stage cylinder mechanism 12 which are connected in series, and the strokes thereof are, for example, 50 mm for the former and 0.5 mm for the latter. This pressurizing means 10 is mounted on a movable base 51 of the position adjusting means 50 together with a position operation device 52 as shown in FIG. 7C, and the above-mentioned steel balls and the like are attached to the pressure rod 21 guided by the position operation device 52. A pressure force is applied through.

As shown in FIG. 7C, the support plate 32 of the substrate holding mechanism 30 is firmly attached to the underframe or the like via a plurality of legs, and the optical means 40 is arranged below it. Optical means 40 Stereomicroscope 41 is a column 44 whose position is controlled by a position controller 43 on a movable table 42.
The position control device 43 allows the field of view to be finely adjusted. The stereomicroscope 41 is preferably equipped with a coaxial illumination having a magnification of about several tens, and a video camera is combined with this to display the field of view as an image on the monitor television 45 of FIG. As the monitor television 45, it is suitable to use one having a horizontal resolution of 400 to 500 similarly to a video camera. An x stage and a y stage are combined for the position operation device 43.

The dispenser 61 of the resin supply system 60 on the upper side of the monitor TV 45 in FIG. 7A is capable of supplying the ultraviolet curable resin described above in minute amounts with an accuracy of about 0.1 mg.
It is connected to the capillary-shaped resin supply nozzle 63 carried by the position operation device 52 via the. The cylinder 64 operates the nozzle 63 to the resin supply position via the movable table 51.

Ultraviolet source of the light projection system 70 shown in the lower right part of FIG.
The ultraviolet light generated at 71 is sent to the projection head 73 carried by the stereomicroscope 41 via the optical fiber 72. A cylinder 74 is also provided for the light projection system 70, and the projection head 73 can be operated to the projection position via the movable table 42.

A robot 80 is provided for operating the above-described loading head 85 for loading the flip chip and the wiring board at the mounting position. As shown in FIG. 2B, this robot 80 uses a x-direction operating device 81 and a y-direction operating device 82 to program-control the position of the operation head 83 that supports the charging head 85 via the arm 84 described above. It is something to operate. In the operation head 83, the arm 84 is operated little by little in the vertical direction so as to bring the charging head 85 close to the lower end surface 21a of the pressure rod 21 or the substrate pedestal 31, as previously described in FIG. A simple mechanism is incorporated.

A vacuum system 90 including a vacuum pump 91 and a drive motor 92 is attached to the device of the present invention for attracting flip chips and wiring boards.

In addition, in the device of the present invention, a program control device 100 for sequence-controlling the operation of each part thereof, and an operation control device 10 for controlling or operating each part in the device according to the command thereof.
1 is incorporated.

An example of a flip-chip mounting procedure performed under the control of the program control device 100 will be described in order.

(1) First, with the charging head 85 placed at a predetermined position outside the mounting position, the flip chip is placed on the upper side by equipment or hands (not shown), and then the charging head 85 is moved by the robot 80 as shown in FIG. ) Is moved onto a substrate tray 7 placed on an appropriate table as shown in FIG. 2), and the wiring substrates arranged therein are vacuum-sucked to the lower side of the loading head 85.

(2) The loading head 85 is moved to the position shown in FIG. 1 (a) by the robot 80, and the flip chip 1 is added according to the procedure described above while operating the operation head 83 little by little in the vertical direction. The wiring board 3 is transferred to and held by the lower end surface 21a of the pressure rod 21 on the board pedestal 31.

(3) After the charging head 85 is returned to the initial position by the robot 80, the cylinder 64 is urged to move the nozzle 63 onto the wiring board 3 and then the dispenser 61 sets it in advance. A few milligrams of resin 6 is added to the wiring board 3
Drop it on top.

(4) The pressurizing means 10 is operated in the first stage to bring it to the state of FIG. 1 (b), and the position operation device 52 is operated while watching the image on the monitor TV 45 captured by the stereomicroscope 41 as described above. The flip chip 1 and the wiring board 2 are aligned by using them until the displacement becomes 10 μm or less.

(5) The pressurizing means 10 is operated in the second stage to bring it to the state of FIG. 1 (c), the bump electrode 2 is brought into uniform contact with the wiring conductor 5, and then the cylinder 74 is urged to project the light projection head 73. Is placed at the projection position, the resin 6 is normally irradiated with ultraviolet rays from the ultraviolet source 71 for about several tens of seconds to cure it.

(6) Since the mounting is completed as described above, the wiring board 3 on which the flip chip 1 is mounted is taken out from the mounting position by an appropriate means (not shown), and the same operation is repeated thereafter.

Although it is necessary to obtain the position alignment in (4) in the above procedure in this embodiment, the video signal captured by the stereomicroscope 41 is given to the computer that performs the pattern recognition operation, and the position operation device 52 is controlled by the computer. Then the whole procedure can be fully automated.

The flip chip mounted by the mounting apparatus according to the present invention described above has no appreciable inclination with the wiring board, and even if the chip before mounting has a slight warp, the flip chip is mounted between the bump electrode and the wiring conductor. There is little variation in contact resistance,
The maximum variation is 20 even when the number of bump electrodes is 100 or more.
% Or less. Further, even during the use period of the mounted product, it is possible to maintain the uniformity of the contact over a long period of time.

In order to ensure such uniform contact or connection,
It is necessary to maintain the flatness of the lower end surface of the pressure rod and the surface of the substrate pedestal, especially the flatness of the former with submicron accuracy, and in the past, this flatness tended to deteriorate during operation of the device. The mounting apparatus according to the present invention can maintain the flatness of the pressing surface for a long period of time.

INDUSTRIAL APPLICABILITY The flip-chip mounting apparatus according to the present invention can be applied to the mounting of a flip-chip having 100 or more bump electrodes each having a size of 10 to 50 μm square and an array pitch of 20 to 100 μm, and the alignment accuracy with a wiring board is 10 μm. The following can be guaranteed with an inclination of 3 μm or less for a 10 mm square chip.

The present invention is not limited to the embodiments described above, and can be implemented in various modes. In the embodiment, the bump electrode is gold, but the bump electrode made of copper or solder can also be applied. Further, the insulating substrate of the wiring board does not necessarily have to be transparent, and the present invention can be implemented within the scope of the invention by appropriately changing the procedure of mounting work and the like. First of the device of the present invention
The configuration of the main part of the figure and the overall specific configuration of FIG. 2 are merely examples, and various practical configurations and forms should be given to them in accordance with the type of bump electrode and the automation requirement of mounting work. You can The same applies to the specific procedures and conditions of the mounting work, and various modifications can be added or selected as necessary or necessary.

〔The invention's effect〕

As described above, according to the present invention, the flip-chip mounting apparatus performs the first-stage operation and the second-stage operation with a smaller movement amount, and the movable means is movable in a direction other than the pressing direction. Chip pressing mechanism that includes a pressure rod that is operated in the above manner and a holding means for holding a flip chip on the tip end surface thereof, a substrate holding mechanism that includes a transparent substrate pedestal and a wiring substrate holding means, and a flip through the substrate pedestal. Optical means for detecting the positions of the chip and the wiring board, and position adjusting means for adjusting the relative positions of the chip pressing mechanism and the substrate holding mechanism are provided.
The flip chip is held on the tip surface of the pressure rod, the wiring substrate is held on the substrate pedestal respectively, and the pressure means is operated in the first stage to bring the two into proximity, and the position is adjusted while the position of the both is detected by the optical means. The bump electrode is fixedly connected to the wiring conductor in a state where the pressing means is operated in the second stage, thereby solving the problems of the prior art and achieving the following effects. Can be played.

(A) First, the pressurizing unit is caused to perform the first stage operation, and the relative position of the flip chip and the wiring substrate is determined by the optical unit through the transparent substrate pedestal in the state of mounting the flip chip close to the wiring substrate. It is possible to detect them, and based on this, the both can be accurately aligned by the position adjusting means.

(B) After this positioning, when the pressing means is operated in the second stage to bring the bump electrode of the flip chip into contact with the wiring conductor of the wiring board, the pressing rod holding the flip chip is not in the pressing direction by the pressing means. Is operated to move freely,
The pressure rod is not affected by this even if the pressure means moves a little in the direction of displacement, and since the stroke of the second stage operation is very small, it is possible to deal with the bump electrode precisely aligned. The wiring conductor can be accurately contacted.

Due to the effects of (a) and (b), in the present invention, the displacement between the flip chip and the wiring board can be suppressed to 10 μm or less at the maximum, and further to 5 μm or less by using the technology of image processing and pattern recognition. .

(C) When the bump electrode is brought into contact with the wiring conductor and then the mounting pressure is applied, even if there are factors such as warpage of the flip chip and inclination of the wiring substrate surface that cause uneven connection, the pressure rod is not in the pressing direction. Since the flip chip is pressed against the wiring board in such a manner that it can move freely and in a posture according to such factors, it is possible to uniformly and fixedly connect a large number of bump electrodes to the wiring conductor while effectively preventing the occurrence of inconvenience such as so-called one-sided pressing. . As a result, the inclination of the mounting attitude of the flip chip with respect to the wiring board is suppressed to within a few μm even when the chip size is 10 mm square, and when flip chips with 100 or more gold bump electrodes are mounted using resin adhesive force. However, the variation of the contact resistance between the bump electrode and the wiring conductor can be suppressed within 20%, and the uniformity of this contact can be maintained for a long time during the use of the mounted product.

The features of the present invention are particularly useful for mounting flip-chips at multiple connection points in which small bump electrodes having a size of several tens of μm are arranged at a narrow pitch, and miniaturization and operation of the chip of this kind of integrated circuit device. It can contribute to the improvement of reliability.

[Brief description of drawings]

The drawings are all related to the present invention. FIG. 1 is a sectional view showing an example of the configuration of a main part of a flip-chip mounting device according to the present invention for each main operating state, and FIG. 2 is a front view illustrating the overall configuration of the device of the present invention. FIG. 3, a partial top view, and a side view, and FIG. 3 are side views showing a procedure for mounting a flip chip on a wiring board. In these figures, 1: flip chip, 2: bump electrode, 2a: solder bump electrode, 2b: gold bump electrode, 3: wiring substrate, 4: insulating substrate, 5: wiring conductor, 6: resin, 7: substrate tray , 10: pressurizing means, 11: first
Step cylinder mechanism, 12: Second step cylinder mechanism, 20: Tip pressurizing mechanism, 21: Pressurizing rod, 21a: Tip surface of pressurizing rod, 22:
Steel ball, 23: Suction hole as a means to hold flip chip, 3
0: substrate holding mechanism, 31: substrate pedestal, 32: support plate, 32a: recess,
32b: mirror surface, 33: suction hole as a holding means for the wiring board, 40:
Optical means, 41: stereomicroscope, 42: movable table, 43: position control device, 44: support, 45: monitor TV, 50: position adjustment means, 51:
Movable table, 52: Position adjuster, 60: Resin supply system, 61: Dispenser, 62: Hose, 63: Resin supply nozzle, 64: Nozzle position operating cylinder, 70: Light projection system, 71: Ultraviolet source, 72: Optical fiber, 73: Projection head, 74: Head position operating cylinder, 80: Robot, 81: x direction operating device, 82: y direction operating device, 8
3: Operation head, 84: Arm, 85: Loading head, 86: Flip chip seat, 87: Air ejection hole, 88: Adsorption hole, 90: Vacuum system, 91: Vacuum pump, 92: Drive motor, 100 : Program control device 101: Operation control device.

Claims (1)

(57) [Claims] 1. A pressurizing means for performing a first step operation and a second step operation having a smaller movement amount than that, a pressurizing rod which is movably operated in a direction other than the pressurizing direction and a tip end surface thereof. A chip pressing mechanism having a means for holding a flip chip, a substrate holding mechanism having a transparent substrate pedestal and means for holding a wiring substrate thereon, and a position of the flip chip and the wiring substrate are detected through the substrate pedestal. An optical means and a position adjusting means capable of adjusting the position of the chip pressing mechanism and the other of the board holding mechanism are provided, and the flip chip is held on the tip end surface of the pressing rod and the wiring board is held on the board pedestal. In addition, the pressure adjusting means is operated in the first stage to bring them close to each other, while the optical adjusting means detects the positions of the both, they are aligned by the position adjusting means, and the pressurizing means is operated in the second stage to perform flip-chip operation. Flip chip mounting apparatus that the bump electrode fixed connected to the wiring board of the wiring conductor of the.