JP3139865U - サイドビューledパッケージ構造 - Google Patents
サイドビューledパッケージ構造 Download PDFInfo
- Publication number
- JP3139865U JP3139865U JP2007009607U JP2007009607U JP3139865U JP 3139865 U JP3139865 U JP 3139865U JP 2007009607 U JP2007009607 U JP 2007009607U JP 2007009607 U JP2007009607 U JP 2007009607U JP 3139865 U JP3139865 U JP 3139865U
- Authority
- JP
- Japan
- Prior art keywords
- view led
- led chip
- package structure
- conducting member
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
【解決手段】サイドビューLEDパッケージ構造は、パッケージハウジング、サイドビューLEDチップおよび熱伝導部材を含む。サイドビューLEDチップは、パッケージハウジングにより囲まれ、サイドビューLEDチップの出射方向は、基板の厚み方向に対して垂直である。サイドビューLEDチップに接続された熱伝導部材は、パッケージハウジング中に配置され、その一部がパッケージハウジングの放熱開口から延伸され、サイドビューLEDチップの放熱を行う。
【選択図】図1A
Description
104 パッケージハウジング
104a 第1の表面
104b 第2の表面
106 熱伝導部材
108 電極リード
110 導線
112 出射開口
114 放熱開口
120 基板
132 厚み方向
134 出射方向
202 サイドビューLEDチップ
204 パッケージハウジング
206 熱伝導部材
208 高反射層
220 基板
Claims (15)
- 出射開口および放熱開口を有するパッケージハウジングと、前記パッケージハウジング中に配置され、出射方向が基板の厚み方向に対して垂直で、前記出射開口へ向かうサイドビューLEDチップと、前記サイドビューLEDチップに接続され、前記放熱開口を介して前記パッケージハウジングから一部が露出され、前記サイドビューLEDチップが発生する熱を放熱させる熱伝導部材と、を備えることを特徴とするサイドビューLEDパッケージ構造。
- 前記熱伝導部材はL字状の熱伝導部材であることを特徴とする請求項1に記載のサイドビューLEDパッケージ構造。
- 前記熱伝導部材は金属材料からなることを特徴とする請求項1に記載のサイドビューLEDパッケージ構造。
- 前記熱伝導部材は前記放熱開口を占有することを特徴とする請求項1に記載のサイドビューLEDパッケージ構造。
- 前記熱伝導部材は高反射層で覆われることを特徴とする請求項1に記載のサイドビューLEDパッケージ構造。
- 前記高反射層は、金または銀からなることを特徴とする請求項5に記載のサイドビューLEDパッケージ構造。
- 前記パッケージハウジングは、高反射材料からなることを特徴とする請求項1に記載のサイドビューLEDパッケージ構造。
- 出射開口および放熱開口を有するパッケージハウジングと、前記パッケージハウジング中に配置され、出射方向が基板の厚み方向に対して垂直で、前記出射開口へ向かうサイドビューLEDチップと、前記サイドビューLEDチップの正極および負極とそれぞれ電気的に接続され、前記サイドビューLEDチップ中へ外部電源を提供し、前記パッケージハウジング上に固着された2つの電極リードと、前記サイドビューLEDチップに接続され、前記放熱開口を介して前記パッケージハウジングから一部が露出され、前記サイドビューLEDチップが発生する熱を放熱させる熱伝導部材と、を備えることを特徴とするサイドビューLEDパッケージ構造。
- 前記電極リードは、導線の各々を介して前記サイドビューLEDチップと電気的に接続されていることを特徴とする請求項8に記載のサイドビューLEDパッケージ構造。
- 前記熱伝導部材はL字状の熱伝導部材であることを特徴とする請求項8に記載のサイドビューLEDパッケージ構造。
- 前記熱伝導部材は金属材料からなることを特徴とする請求項8に記載のサイドビューLEDパッケージ構造。
- 前記熱伝導部材は前記放熱開口を占有することを特徴とする請求項8に記載のサイドビューLEDパッケージ構造。
- 前記熱伝導部材は高反射層で覆われていることを特徴とする請求項8に記載のサイドビューLEDパッケージ構造。
- 前記高反射層は、金または銀からなることを特徴とする請求項13に記載のサイドビューLEDパッケージ構造。
- 前記パッケージハウジングは、高反射材料からなることを特徴とする請求項8に記載のサイドビューLEDパッケージ構造。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW095216726U TWM309757U (en) | 2006-09-19 | 2006-09-19 | Side view LED package structure |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007242871 Continuation | 2007-09-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP3139865U true JP3139865U (ja) | 2008-03-06 |
Family
ID=38644285
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007009607U Expired - Fee Related JP3139865U (ja) | 2006-09-19 | 2007-12-14 | サイドビューledパッケージ構造 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8368110B2 (ja) |
JP (1) | JP3139865U (ja) |
TW (1) | TWM309757U (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009260222A (ja) * | 2008-03-28 | 2009-11-05 | Rohm Co Ltd | 半導体発光モジュールおよびその製造方法 |
JP2013030714A (ja) * | 2011-07-29 | 2013-02-07 | Nichia Chem Ind Ltd | 発光装置 |
KR101532878B1 (ko) | 2014-05-29 | 2015-06-30 | 성균관대학교산학협력단 | 발광다이오드 패키지 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101290091B (zh) | 2007-04-20 | 2010-12-01 | 鸿富锦精密工业(深圳)有限公司 | 发光二极管照明装置 |
KR100857693B1 (ko) * | 2007-05-10 | 2008-09-08 | 삼성에스디아이 주식회사 | 액정 표시장치 |
TWM329244U (en) * | 2007-10-01 | 2008-03-21 | Everlight Electronics Co Ltd | Light emitting diode device |
KR100969142B1 (ko) * | 2008-01-25 | 2010-07-08 | 알티전자 주식회사 | 측면 발광 다이오드 패키지 |
US8120055B2 (en) * | 2009-04-20 | 2012-02-21 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Light source |
US10591124B2 (en) | 2012-08-30 | 2020-03-17 | Sabic Global Technologies B.V. | Heat dissipating system for a light, headlamp assembly comprising the same, and method of dissipating heat |
CN103887398B (zh) * | 2012-12-22 | 2017-06-20 | 展晶科技(深圳)有限公司 | 发光二极管封装结构 |
CN109148667B (zh) * | 2017-06-27 | 2020-09-25 | 亿光电子工业股份有限公司 | 一种封装支架结构及包含该封装支架机构的发光装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1103759A3 (en) * | 1999-11-11 | 2005-02-23 | Toyoda Gosei Co., Ltd. | Full-color light source unit |
US6480389B1 (en) * | 2002-01-04 | 2002-11-12 | Opto Tech Corporation | Heat dissipation structure for solid-state light emitting device package |
JP4211359B2 (ja) * | 2002-03-06 | 2009-01-21 | 日亜化学工業株式会社 | 半導体装置の製造方法 |
US6799870B2 (en) * | 2002-09-19 | 2004-10-05 | Para Light Electronics Co. Ltd. | Sideway-projecting light emitting diode structure |
JP3910144B2 (ja) * | 2003-01-06 | 2007-04-25 | シャープ株式会社 | 半導体発光装置およびその製造方法 |
US7168842B2 (en) * | 2004-12-01 | 2007-01-30 | Au Optronics Corporation | Light emitting diode backlight package |
TWM312020U (en) * | 2006-12-04 | 2007-05-11 | Lighthouse Technology Co Ltd | Light emitting diode package structure |
US7566159B2 (en) * | 2007-05-31 | 2009-07-28 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Side-emitting LED package with improved heat dissipation |
-
2006
- 2006-09-19 TW TW095216726U patent/TWM309757U/zh not_active IP Right Cessation
-
2007
- 2007-09-19 US US11/902,141 patent/US8368110B2/en not_active Expired - Fee Related
- 2007-12-14 JP JP2007009607U patent/JP3139865U/ja not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009260222A (ja) * | 2008-03-28 | 2009-11-05 | Rohm Co Ltd | 半導体発光モジュールおよびその製造方法 |
JP2013030714A (ja) * | 2011-07-29 | 2013-02-07 | Nichia Chem Ind Ltd | 発光装置 |
KR101532878B1 (ko) | 2014-05-29 | 2015-06-30 | 성균관대학교산학협력단 | 발광다이오드 패키지 |
Also Published As
Publication number | Publication date |
---|---|
TWM309757U (en) | 2007-04-11 |
US8368110B2 (en) | 2013-02-05 |
US20080067535A1 (en) | 2008-03-20 |
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