JP3139167U - Package structure of multiple chip LED bulbs - Google Patents

Abstract

Provided is a package structure of a plurality of chip LED bulbs, in which a plurality of chip support bases are precisely encapsulated and a circuit board is inserted between a taper surface provided around the frame and a downward projecting portion of the frame. To do.
An LED support body 66, a resin bulb cover 68, a frame 5, a circuit board 6, a ring 7, a bottom seat body 78, and a base 8 are configured. The frame 5 includes an annular upper frame 51 and an annular lower frame 52 that is provided coaxially and integrally. A taper surface 511 that is inclined in the center direction from above to below is provided on the inner periphery of the upper frame 51, and a lower frame 52 is provided continuously on the lower surface of the taper surface 511. A protrusion 521 is provided around the top, and a groove 53 is formed between the bottom of the tapered surface tip 512 and the protrusion 521, and the circuit board 6 is fitted and positioned in the groove 53. Retained.
[Selection] Figure 1

Description

  The present invention relates to a package structure of a plurality of chip LED bulbs.

  The structure of a conventional light bulb consists of members such as glass shells, cores, conductors, and tungsten filaments. Many parts are complicated, and each part unit is collected and processed and managed one by one to form a single light bulb. Therefore, the manufacture is not easy and the cost is extremely high. Furthermore, since the inside emits light by the tungsten filament, the service life is limited and the power consumption of the tungsten filament light is a heavy burden. For this reason, in the electronic era, LED cold negative light was born, and for a long time, LEDs have surely replaced conventional light bulbs.

  However, at this stage, the LED products are all a single individual, that is, they are directly bonded and encapsulated on individual support bases, and in order to increase the lightness of the light source, a plurality are individually assembled on a circuit board and incorporated. Although necessary, this individual weld assembly can cause a difference in the current through which the lightness can be imbalanced. Moreover, not only is quality control difficult, but production efficiency is low due to the large number of manufacturing steps.

  Accordingly, the present invention has been made in view of this, and the purpose thereof is to precisely enclose a plurality of chip support bases as one body, and to form a taper surface that is provided in the frame and a protrusion formed below the taper surface. A package structure of a plurality of chip LED bulbs in which a circuit board is inserted between the parts is provided.

  The package structure of a plurality of chip LED bulbs according to claim 1 includes an LED support, a resin bulb cover, a frame, a circuit board, a ring, a bottom seat, and a base. A frame and an annular lower frame coaxially and integrally provided at the lower portion of the upper frame, and a tapered surface that is inclined in the central direction from the upper side to the lower side is provided on the inner periphery of the upper frame. The lower frame is continuously provided on the lower surface of the tapered surface, and a protruding portion is provided at the upper portion of the inner peripheral surface of the lower frame, and between the bottom portion of the tip end portion of the tapered surface and the protruding portion. A groove is formed, the circuit board is fitted into the groove and positioned, and the circuit board is held by the protrusion.

  The package structure of a plurality of chip LED bulbs according to claim 2 is a package structure of a plurality of chip LED bulbs according to claim 1, wherein a plurality of LED supports are erected upward on the upper surface of the circuit board, The plurality of LED supports are sealed on the circuit board by the resin light bulb cover.

  The package structure of a plurality of chip LED bulbs according to claim 3 is the package structure of a plurality of chip LED bulbs according to claim 1, wherein the diameter of the tip of the tapered surface is narrower than the inner diameter of the lower frame. It is what.

  According to the package structure of a plurality of chip LED bulbs according to claim 1, the projecting portion is provided below the tapered surface to form a groove portion, and the circuit board is fitted and fixed to the groove portion. At this time, the circuit board does not slide and the enclosing and fixing accuracy is not lost.

  According to the package structure of a plurality of chip LED bulbs according to claim 2, a plurality of LED supports that are erected on the upper surface of the circuit board can be enclosed by a bulb cover made of resin, A structure that is stable, precise, and doubles the overall connectivity.

  According to the package structure of the plurality of chip LED bulbs according to claim 3, the bulb cover made of resin for packaging the LED support is radially arranged by the structure in which the diameter of the tip portion of the tapered surface is narrower than the inner diameter of the lower frame. It is held inward and firmly connected and fixed.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing a package structure of a plurality of chip LED bulbs according to an embodiment of the present invention. FIG. 2 is an exploded perspective view showing a package structure of a plurality of chip LED bulbs according to an embodiment of the present invention. It is. FIG. 3 is a perspective view showing an assembly example of a package structure of a plurality of chip LED bulbs. FIG. 4 is a front view showing a package structure of a plurality of chip LED bulbs.

  The package structure of a plurality of chip LED bulbs of the present invention includes members such as an LED support 66, an epoxy resin bulb cover 68, a frame 5, a circuit board 6, a ring 7, a bottom seat 78 and a base 8. Is done. A plurality of LED supports 66 are erected upward on the upper surface of the circuit board 6.

  The frame 5 includes an annular upper frame 51 and an annular lower frame 52 that is integrally provided coaxially with the upper frame 51 below the upper frame 51 (see FIGS. 2 and 3). FIG. 5 is an enlarged cross-sectional view showing a main part (a part surrounded by a one-dot chain line in a circle) in FIG. As shown in FIG. 5, a tapered surface 511 that is inclined in the central direction from the upper side to the lower side is formed on the inner periphery of the upper frame 51 over the entire circumference. A lower frame 52 is continuously provided on the lower surface of the tapered surface 511, and a protruding portion 521 having a semispherical cross section is provided at an appropriate position above the inner peripheral surface of the lower frame 52. Between the bottom of the upper end portion 512 of the tapered surface and the protruding portion 521, a groove 53 is formed in which the circuit board 6 can be fitted and positioned.

  As shown in FIG. 3, the circuit board 6 is inserted from below the lower frame 52 so as to be in contact with the bottom surface of the tip end portion 512 of the tapered surface, and is pushed into and fitted into the projecting portion 521 provided below the circuit board 6. Then, the circuit board 6 is held in the groove 53 and positioned. A plurality of LED supports 66 erected on the upper surface of the circuit board 6 can be enclosed by a light bulb cover 68 made of an epoxy resin 67. By providing the projecting portion 521 below the tapered surface 511 to form the groove portion 53 and fitting and fixing the circuit board 6 to the groove portion 53, the circuit board 6 slides downward in the encapsulated package so that the coupling strength is increased. Loss can be prevented, and since the diameter of the tip end portion 512 of the tapered surface is narrower than the inner diameter of the lower frame 52, the resin light bulb cover 68 for packaging the LED support is held radially inward. And firmly fixed. Then, the ring 7 is arranged on the outer peripheral surface of the upper frame 51, the bottom seat body 78 is incorporated in the outer peripheral surface of the lower frame 52, and the lower end of the ring 7 is supported by the upper end of the bottom seat body 78. Further, the base 8 is coupled to the lower portion of the bottom seat body 78 so as to be integrally constructed firmly. In this way, the bonding after the completion of the encapsulating package with the resin is integrated precisely and firmly.

  In the present invention, since a plurality of LED supports 66 are integrally packaged with a resin, as shown in a perspective view comparing the configuration of the present invention in FIG. 6 and a conventional LED, the prior art shown on the right side in FIG. Unlike the work of packaging a single LED support like a product to make a light bulb and then combining the individual parts and soldering them to the circuit board, the present invention shown in the center and left side of FIG. Since a plurality of LED supports are erected on a circuit board and then packaged as a single unit with resin, the coupling is stable, precise, and the overall connectivity can be doubled.

1 is a perspective view showing a package structure of a plurality of chip LED bulbs according to an embodiment of the present invention. It is a perspective view which decomposes | disassembles and shows the package structure of a several chip LED bulb same as the above. It is a perspective view which shows the assembly example of the package structure of a several chip | tip LED bulb | bulb same as the above. It is a front view which shows the package structure of a several chip | tip LED bulb | bulb same as the above. It is sectional drawing which expands and shows the principal part (part enclosed with the dashed-dotted line circle) of FIG. It is the perspective view which compared the structure of this invention and the conventional LED.

Explanation of symbols

5 Frame 51 Upper Frame 511 Tapered Surface 512 Tapered Surface Tip 52 Lower Frame 521 Projection 53 Groove 6 Circuit Board 66 LED Support 67 Epoxy Resin 68 Light Bulb Cover 7 Ring 78 Bottom Seat 8 Base

Claims (3)

A package structure of a plurality of chip LED bulbs, comprising an LED support, a resin bulb cover, a frame, a circuit board, a ring, a bottom seat and a base,
The frame is composed of an annular upper frame and an annular lower frame integrally provided coaxially with a lower portion of the upper frame,
A taper surface inclined in the center direction from above to below is provided on the inner periphery of the upper frame, and the lower frame is provided continuously on the lower surface of the taper surface, and an upper portion of the inner periphery of the lower frame. A projecting portion is provided in a circumferential direction, a groove is formed between the bottom of the tip end of the tapered surface and the projecting portion, the circuit board is fitted into the groove and positioned, and the circuit is formed by the projecting portion. The substrate is held,
A package structure of a plurality of chip LED bulbs.   A plurality of LED supports are erected upward on an upper surface of the circuit board, and the plurality of LED supports are sealed on the circuit board by the resin light bulb cover. 2. A package structure of a plurality of chip LED bulbs according to 1.   The package structure of a plurality of chip LED bulbs according to claim 1, wherein a diameter of a tip portion of the tapered surface is narrower than an inner diameter of the lower frame.

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