JP4238328B2 - Light emitting diode lamp and manufacturing method thereof - Google Patents

Light emitting diode lamp and manufacturing method thereof Download PDF

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JP4238328B2
JP4238328B2 JP2003389322A JP2003389322A JP4238328B2 JP 4238328 B2 JP4238328 B2 JP 4238328B2 JP 2003389322 A JP2003389322 A JP 2003389322A JP 2003389322 A JP2003389322 A JP 2003389322A JP 4238328 B2 JP4238328 B2 JP 4238328B2
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light emitting
current limiting
emitting diode
lead
support
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JP2005150603A (en
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進一 佐藤
剛久 竹内
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Fuji Electric FA Components and Systems Co Ltd
Chichibu Fuji Co Ltd
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Fuji Electric FA Components and Systems Co Ltd
Chichibu Fuji Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item

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  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)

Description

この発明は、配電盤や制御盤等の表示灯に使用される光源に発光ダイオードを使用した電球タイプの発光ダイオードランプに関する。   The present invention relates to a light bulb type light emitting diode lamp using a light emitting diode as a light source used for an indicator lamp such as a switchboard or a control panel.

特許文献１に示された従来の発光ダイオードランプの例を図７ないし図１０に示す。この従来の発光ダイオードランプは、図７に示すように、リードフレーム用帯材110上に、支持部112およびリード部114,116とこれらを相互に連結支持するタイバー部119とを有するリードフレーム111を形成し、支持部112上に発光ダイオードチップ121（図９、１０参照）を装着し、金細線122（図９、１０参照）によりチップと支持部およびリード部との間の必要な電気的配線を施して発光部を形成し、この発光部を絶縁樹脂により一体的にモールド形成された反射筒を兼ねた保持体123により保持して発光部ユニット120を構成する。この発光部ユニット120は、装着された発光ダイオードチップおよび金線細線による配線の保護のために、表面を透明の封止剤124により封止し、リード部、支持部をタイバー部から切断することにより、リードフレームから切り離される（図７参照）。
この発光部ユニット120は、一方のリード線116に、図８に示すように、電流制限要抵抗器180を接続し、他方のリード線114とともに整形した上で（図８参照）、絶縁材製のホルダー150に嵌合し、このホルダー150の外側から接続電極となる筒状の口金160を嵌着する。そして抵抗器180の発光部接続端と反対側のリード線181を口金の底部電極164にハンダ付けし、リード線114を口金の底部電極164から絶縁された外周電極160にハンダ付けまたはカシメにより接続して、発光ダイオードランプ100が構成される。
特開平６ー１８１３４０号公報 Examples of conventional light emitting diode lamps disclosed in Patent Document 1 are shown in FIGS. In this conventional light emitting diode lamp, as shown in FIG. 7, a lead frame 111 having a support portion 112, lead portions 114, 116 and a tie bar portion 119 for connecting and supporting them is formed on a lead frame strip 110. Then, the light emitting diode chip 121 (see FIGS. 9 and 10) is mounted on the support portion 112, and necessary electrical wiring between the chip and the support portion and the lead portion is made by the gold thin wire 122 (see FIGS. 9 and 10). The light-emitting part is formed, and this light-emitting part is held by a holding body 123 that also serves as a reflection tube integrally molded with an insulating resin to constitute the light-emitting part unit 120. The light-emitting unit 120 has a surface sealed with a transparent sealant 124 to protect the wiring with the mounted light-emitting diode chip and gold wire, and the lead part and the support part are cut from the tie bar part. Is separated from the lead frame (see FIG. 7).
As shown in FIG. 8, the light emitting unit 120 is connected to a current limiting resistor 180 as shown in FIG. 8 and shaped together with the other lead 114 (see FIG. 8). A cylindrical base 160 that is a connection electrode is fitted from the outside of the holder 150. Then, the lead wire 181 opposite to the light emitting portion connection end of the resistor 180 is soldered to the bottom electrode 164 of the base, and the lead wire 114 is connected to the outer peripheral electrode 160 insulated from the bottom electrode 164 of the base by soldering or caulking. Thus, the light emitting diode lamp 100 is configured.
JP-A-6-181340

このような従来の発光ダイオードランプにおいては、リードフレーム上には発光ダイオードチップで構成された発光部のみが絶縁性の成形材料により一体成形されるため、電流制限用抵抗器や外部接続のための電極を構成する口金を個別の部品として用意し、相互に組み立てる必要がある。   In such a conventional light emitting diode lamp, only the light emitting portion composed of the light emitting diode chip is integrally formed on the lead frame with an insulating molding material. It is necessary to prepare the bases constituting the electrodes as individual parts and assemble them together.

このように、部品点数が多くなると、組立工数が多大となりコストの上昇を招く不都合がある。   As described above, when the number of parts increases, the number of assembling steps increases and there is a problem in that the cost increases.

この発明は、このような不都合を除き、組立工数を大幅に減じることのできる発光ダイオードランプおよびその製造方法を提供することを課題とするものである。   SUMMARY OF THE INVENTION An object of the present invention is to provide a light emitting diode lamp and a method for manufacturing the same that can significantly reduce the number of assembling steps, excluding such inconveniences.

このような課題を解決するため、第１の発明は、リードフレームによって形成された、発光ダイオードチップを支持するための第１の支持部と、この支持部に連続する電流制限用素子を支持するための第２の支持部と、これら２つの支持部からそれぞれ引き出される第１および第２のリード部と、この第１および第２のリード部の端部にそれぞれ結合して形成された第１および第２の接続用電極とを有し、前記第１の支持部に発光ダイオードチップを装着して発光部を形成し、この発光部を絶縁樹脂により一体的にモールドして発光部保持体を形成し、前記第２の支持部に電流制限用素子を固着して電流制限部を形成し、前記第１のリード部を含む部分と、前記電流制限部および第２のリード部を含む部分とをそれぞれ絶縁樹脂により一体的にモールドして分割構成された筒または柱状の保持体を形成し、前記リードフレームを前記分割構成された保持体が互いに向かい合ように折り曲げ、分割された保持体を相互に接合して構成したことを特徴とするものである。   In order to solve such a problem, the first invention supports a first support portion for supporting a light emitting diode chip formed by a lead frame, and a current limiting element continuous to the support portion. A first support portion, first and second lead portions drawn from the two support portions, respectively, and first and second ends connected to the end portions of the first and second lead portions, respectively. And a second connection electrode, a light emitting diode chip is mounted on the first support portion to form a light emitting portion, and the light emitting portion is integrally molded with an insulating resin to form a light emitting portion holding body. Forming a current limiting portion by fixing a current limiting element to the second support portion, a portion including the first lead portion, and a portion including the current limiting portion and the second lead portion. Each integrated with insulating resin Forming a cylindrical or columnar holding body divided by molding, bending the lead frame so that the divided holding bodies face each other, and joining the divided holding bodies to each other It is characterized by.

第２の発明は、リードフレームによって形成された、発光ダイオードチップを支持するための第１の支持部と、この支持部に連続する電流制限用素子を支持するための第２の支持部と、この２つの支持部からそれぞれ引き出される第１および第２のリード部と、この第１および第２のリード部の端部にそれぞれ結合された第１および第２の接続用電極とを有し、前記第１の支持部に発光ダイオードチップを装着して発光部を形成し、この発光部を絶縁樹脂により一体的にモールドして発光部保持体を形成し、前記第２の支持部に電流制限用素子を装着して電流制限部を形成し、この電流制限部を絶縁樹脂により一体的にモールドして電流制限部保持体を形成し、前記リードフレームを前記電流制限部保持体が前記発光部保持体と接合されるよう折り曲げ、この全体を筒状のケースに挿入して構成することを特徴とするものである。   According to a second aspect of the present invention, there is provided a first support part for supporting a light emitting diode chip, a second support part for supporting a current limiting element continuous with the support part, formed by a lead frame, The first and second lead portions respectively drawn from the two support portions, and the first and second connection electrodes respectively coupled to the end portions of the first and second lead portions, A light emitting diode chip is mounted on the first support portion to form a light emitting portion, and the light emitting portion is integrally molded with an insulating resin to form a light emitting portion holding body, and a current limit is applied to the second support portion. The current limiting portion is formed by mounting the element, and the current limiting portion is integrally molded with an insulating resin to form a current limiting portion holding body, and the current limiting portion holding body is the light emitting portion. It will be joined to the holder Bending, it is characterized in that configuration by inserting the whole cylindrical case.

前記第１または第２の発明において、前記第１または第２の接続用電極の何れか一方の電極を球面状に形成することができる。また、電流制限素子としては、抵抗素子または、ＡーＤコンバータやＤーＤコンバータ等の電圧変換用ＩＣチップなどを搭載することができる。   In the first or second invention, one of the first and second connection electrodes can be formed in a spherical shape. Further, as the current limiting element, a resistance element or a voltage conversion IC chip such as an AD converter or a DD converter can be mounted.

第３の発明は、リードフレーム用帯材上に、発光ダイオードチップを支持するための第１の支持部と、この支持部に連続して電流制限用素子を支持するための第２の支持部と、この２つの支持部からそれぞれ引き出される第１および第２のリード線と、この第１および第２のリード部の端部にそれぞれ結合された第１および第２の接続用電極とを有するリードフレームを形成する工程と、前記第１の支持部に発光ダイオードチップを固着して発光部を形成する工程と、前記第２の支持部に電流制限用素子を固着して電流制限部を形成する工程と、前記発光部と前記第１のリード線を含む部分と前記電流制限部および第２のリード線を含む部分とにそれぞれ絶縁樹脂を一体的にモールドして保持体を形成する工程と、前記保持体の形成されたリードフレームをリードフレーム用帯材から切り離して前記各保持体を一体的に接合する工程とにより製造することを特徴とするものである。   According to a third aspect of the present invention, there is provided a first support portion for supporting the light emitting diode chip on the lead frame strip, and a second support portion for supporting the current limiting element continuously with the support portion. And first and second lead wires drawn from the two support portions, respectively, and first and second connection electrodes respectively coupled to end portions of the first and second lead portions. A step of forming a lead frame, a step of fixing a light emitting diode chip to the first support portion to form a light emitting portion, and a current limiting element fixed to the second support portion to form a current limiting portion And a step of forming a holding body by integrally molding an insulating resin in each of the light emitting portion, the portion including the first lead wire, and the portion including the current limiting portion and the second lead wire, and , The holding member formed with the holder The disconnect the lead frame from the lead frame for strip each carrier is characterized in that produced by the steps of integrally bonded.

この発明によれば、リードフレーム上に発光ダイオードを実装した発光部、電流制限素子を実装した電流制限部、および外部接続用の電極が形成され、各部に絶縁樹脂を一体モールドすることにより分割された保持体部も一体に形成されているので、１ユニットごとにリードフレームから分離すると１つの部品となり、この分離されたユニットのリード部分を折り曲げ加工するだけで、１つの発光ダイオードランプに組み立てることができるので、部品点数が削減され、組立てが容易となり組立て工数を低減できる効果が得られる。   According to the present invention, the light emitting part on which the light emitting diode is mounted on the lead frame, the current limiting part on which the current limiting element is mounted, and the electrode for external connection are formed, and each part is divided by integrally molding the insulating resin. Since the holding body is also integrally formed, it becomes a single part when separated from the lead frame for each unit, and it is assembled into one light emitting diode lamp simply by bending the lead part of the separated unit. Therefore, the number of parts is reduced, the assembly is facilitated, and the number of assembly steps can be reduced.

以下にこの発明を、図に示す実施例に基づいて説明する。   The present invention will be described below based on the embodiments shown in the drawings.

図１および図２はこの発明の実施例１に基づく発光ダイオードランプの全体を示す、斜視図および縦断面図である。   1 and 2 are a perspective view and a longitudinal sectional view showing an entire light emitting diode lamp according to Embodiment 1 of the present invention.

各図において、１は発光ダイオードランプであり、発光部２、電流制限部５および電極部６を一体的に結合して構成される。   In each figure, reference numeral 1 denotes a light emitting diode lamp, which is configured by integrally coupling a light emitting section 2, a current limiting section 5 and an electrode section 6.

発光部２は、リードフレームにより形成された発光ダイオード支持部１２、この支持部に装着され、金線２２により必要な電気的配線の施された発光ダイオードチップ２１およびこれらを外周から一体的に包み込むように絶縁樹脂によりモールドして形成された反射筒を兼ねる発光部保持体２３を有する。この保持体２３の中の発光ダイオードチップ２１および金線２２等を保護するために保持体２３の上部空間は透明の封止材を充填して封止されている。   The light emitting part 2 is a light emitting diode support part 12 formed by a lead frame, a light emitting diode chip 21 attached to the support part and provided with necessary electrical wiring by a gold wire 22, and these are integrally wrapped from the outer periphery. Thus, it has the light emission part holding body 23 which also serves as the reflection cylinder formed by molding with insulating resin. In order to protect the light emitting diode chip 21 and the gold wire 22 in the holder 23, the upper space of the holder 23 is sealed with a transparent sealing material.

電流制限部５は、リードフレームにより構成された電流制限素子支持部１３とこの支持部に装着された電流制限用の抵抗素子５３を一体的に絶縁樹脂によりモールドして、半分に分割された筒体状に形成された電流制限部保持体の半部５１と、リードフレームにより構成されたリード部１６とこれに連結された接続用電極１７を絶縁樹脂により一体的にモールドして半分に分割された筒体状に形成された電流制限部保持体の半部５２とにより構成される。この場合、電極１７の一部は保持体半部５２の外周に露出されている。２つの電流制限部保持体半部５１、５２は、互いに向かい合わせに接合し、接着剤等により接着される。   The current limiting portion 5 is a cylinder divided into halves by integrally molding a current limiting element support portion 13 formed of a lead frame and a current limiting resistance element 53 attached to the support portion with an insulating resin. The half part 51 of the current limiting part holding body formed in a body shape, the lead part 16 constituted by a lead frame, and the connection electrode 17 connected thereto are integrally molded with an insulating resin and divided into halves. And a half portion 52 of the current limiting portion holding body formed in a cylindrical shape. In this case, a part of the electrode 17 is exposed on the outer periphery of the holder half 52. The two current limiter holding member halves 51 and 52 are joined to face each other and are bonded by an adhesive or the like.

そして、電極部６は、リードフレームにより電流制限素子支持部１３に連続して形成されたリード部１４とこのリード部１４に連結して形成されたもう一方の接続用電極１５とを、電極１５の一部を底部に露出させて絶縁樹脂により一体的にモールドして形成した電極部保持体６１を有する。   The electrode portion 6 includes a lead portion 14 continuously formed on the current limiting element support portion 13 by a lead frame and another connection electrode 15 formed by being connected to the lead portion 14. A part holding portion 61 is exposed at the bottom and is integrally molded with an insulating resin.

前記発光部２、電流制限部５および電極部６はそれぞれの絶縁樹脂で構成された保持体を互いに接合し、接着剤等により接着し、一体化される。   The light emitting unit 2, the current limiting unit 5, and the electrode unit 6 are integrated by bonding a holding body made of each insulating resin and bonding them with an adhesive or the like.

このように構成された発光ダイオードランプ１は、電極１５と１７に所定の直流電圧を印加すると電流制限抵抗素子５３を通して発光部の発光ダイオードチップに電流が流れ発光ダイオードチップが発光する。   In the light-emitting diode lamp 1 configured as described above, when a predetermined DC voltage is applied to the electrodes 15 and 17, a current flows through the current-limiting resistor element 53 to the light-emitting diode chip of the light-emitting portion, and the light-emitting diode chip emits light.

次に、図１および図２に示す発光ダイオードランプの製造方法について説明する。   Next, a method for manufacturing the light-emitting diode lamp shown in FIGS. 1 and 2 will be described.

図３−１から図３−７に、この発明の実施例１の発光ダイオードランプの製造工程を示す。   FIGS. 3-1 to 3-7 show manufacturing steps of the light-emitting diode lamp according to Embodiment 1 of the present invention.

図３−１はリードフレームを形成する工程を示す。この工程においては、プレス加工などにより、導電性金属薄板からなるリードフレーム用帯材１０上に、発光ダイオードを装着するための発光ダイオード支持部１２、電流制限素子を装着するための電流制限素子支持部１３、発光ダイオード支持部１２に連続するリード部１６、電流制限素子支持部１３に連続するリード部１４、およびリード部１４、１６のそれぞれの先端に結合された外部接続用電極１５、１７と各部を連結するタイバー部１９を有するリードフレーム１１を多数形成する。   FIG. 3A shows a process of forming a lead frame. In this process, a light-emitting diode support 12 for mounting a light-emitting diode and a current-limiting element support for mounting a current-limiting element on a lead frame strip 10 made of a conductive metal thin plate by pressing or the like. A lead part 16 continuous to the light emitting diode support part 12, a lead part 14 continuous to the current limiting element support part 13, and external connection electrodes 15 and 17 coupled to the tips of the lead parts 14 and 16, respectively. A large number of lead frames 11 having tie bar portions 19 connecting the respective portions are formed.

ここで、電極１５は、絞り加工等により球面状に湾曲させて椀状に成形される。そして、馬蹄形に形成された電極１７は、曲げ加工により図３ー２に示すように帯材部分から切り離されてリード部１６の先端でこのリード部に対して直角に折曲される。   Here, the electrode 15 is curved into a spherical shape by drawing or the like, and is formed into a bowl shape. The electrode 17 formed in a horseshoe shape is cut off from the strip portion by bending and is bent at a right angle with respect to the lead portion at the tip of the lead portion 16 as shown in FIG.

次に、図３−３に示す素子の装着工程へ移る。この工程においては、自動マウント機等を使用して、リードフレーム１１の発光ダイオード支持部１２および電流制限素子支持部１３にそれぞれ発光ダイオードチップ２１を４個および抵抗素子５３を２個搭載し、ハンダ等により支持部に固着する。発光部２においては、（Ａ）に拡大して示すように、各発光ダイオードチップ２１と支持部１２との間を金線２２により接続して必要な電気的接続を行なう。発光部２における発光ダイオードチップ２１の搭載数は、発光量、使用電圧などによって決められる。また電流制限部５に設けられる抵抗素子５３の個数も、素子の熱容量が許せば１個であってもよい。   Next, the device mounting process shown in FIG. In this process, an automatic mounting machine or the like is used to mount four light emitting diode chips 21 and two resistance elements 53 on the light emitting diode support 12 and the current limiting element support 13 of the lead frame 11, respectively. It adheres to a support part by etc. In the light emitting unit 2, as shown in an enlarged view in (A), each light emitting diode chip 21 and the support unit 12 are connected by a gold wire 22 to perform necessary electrical connection. The number of light emitting diode chips 21 mounted in the light emitting unit 2 is determined by the amount of light emitted, the voltage used, and the like. Further, the number of resistance elements 53 provided in the current limiting unit 5 may be one if the heat capacity of the elements permits.

このように、リードフレーム１１に発光ダイオードチップや抵抗素子等の素子の装着が終わると、図３ー４および図３ー５に示すモールド工程へ移行する。モールド工程においては、リードフレーム１１を帯材１０につけたまま、発光ダイオード支持部１２、電流制限素子支持部１３、電極１５ならびに電極１７およびリード部１６をそれぞれ絶縁樹脂により一体的にモールドして各部にそれぞれ保持体を形成する。   As described above, when the elements such as the light emitting diode chip and the resistance element are attached to the lead frame 11, the process proceeds to the molding process shown in FIGS. 3-4 and 3-5. In the molding process, the light emitting diode support part 12, the current limiting element support part 13, the electrode 15, the electrode 17 and the lead part 16 are integrally molded with an insulating resin while the lead frame 11 is attached to the belt member 10, and each part is molded. A holding body is formed respectively.

発光ダイオード支持部１２に形成される発光部保持体２３はこの支持部１２を外周から取り囲んだ有底円筒状をなし発光部の反射筒を兼ねる。そしてその発光ダイオードチップ２１の配置されている上部空間は、発光ダイオードチップ２１および金線２２を保護するために、透明の封止材を充填して封止する。   The light-emitting part holding body 23 formed on the light-emitting diode support part 12 has a bottomed cylindrical shape surrounding the support part 12 from the outer periphery, and also serves as a reflection tube of the light-emitting part. The upper space where the light emitting diode chip 21 is disposed is filled with a transparent sealing material and sealed in order to protect the light emitting diode chip 21 and the gold wire 22.

電流制限素子支持部１３に一体的にモールドにより形成される保持体半部５１とリード部１６に一体的にモールドして形成される保持体半部５２は、図３ー５を参照するとより明らかであるように、それぞれ円筒の２分割された半部を構成し、互いに向かい合わせに接合することにより、１つの円筒状の電流制限部保持体５０を構成する。保持体半部５１は、図３ー５に示すように、電流制限抵抗素子５３の表面側のみを被覆するので、抵抗素子５３の裏面側は露出される。保持体半部５２は、直角に折り曲げられた馬蹄形の電極１７の両端部を露出させてリード部１６とともに包み込む。保持体半部５１には、保持体半部５２と接合したときにこの電極１７の保持体５２から露出した部分の一部が嵌合される溝５１ａが設けられている（図３−４参照）。   The holding body half 51 formed integrally with the current limiting element support part 13 by molding and the holding body half 52 formed integrally with the lead part 16 are more apparent with reference to FIGS. As described above, one cylindrical current limiting portion holding body 50 is formed by forming half-divided halves of each cylinder and joining them in a face-to-face relationship. As shown in FIG. 3-5, the holding body half 51 covers only the front surface side of the current limiting resistor element 53, so that the back surface side of the resistor element 53 is exposed. The holding body half 52 wraps together with the lead portion 16 by exposing both ends of the horseshoe-shaped electrode 17 bent at a right angle. The holder half 51 is provided with a groove 51a into which a part of the electrode 17 exposed from the holder 52 is fitted when joined to the holder half 52 (see FIG. 3-4). ).

椀状の電極１５部分にも、その球面の頂部分を残して一体的に絶縁樹脂がモールドされ、円盤状の電極部保持体６１が形成される。   The insulating resin is also molded integrally with the bowl-shaped electrode 15 portion, leaving the top portion of the spherical surface, and the disk-shaped electrode portion holder 61 is formed.

前記の発光部保持体２３および電極部保持体６１は、電流制限部の保持体半部５１、５２を接合して形成される円筒の両端に嵌り合う大きさにとなっている。   The light emitting unit holder 23 and the electrode unit holder 61 are sized to fit both ends of a cylinder formed by joining the holding body halves 51 and 52 of the current limiting unit.

このようなモールド工程の次は、リードフレーム１１のタイバー部１９を切断し、これを帯材１０から切り離す切離し工程となる。図３−６は、この切離し工程を示すもので、帯材１０から切り離されたリードフレーム１１には、すでに説明したように、発光ダイオードチップ２１、電流制限抵抗素子５３が装着され、フレームと一体的な絶縁樹脂モールドによる各部の保持体２３、５１、５２、６１が形成されている。   Next to such a molding process is a cutting process in which the tie bar portion 19 of the lead frame 11 is cut and separated from the strip 10. FIG. 3-6 shows this separation process. As described above, the light-emitting diode chip 21 and the current limiting resistor element 53 are attached to the lead frame 11 cut from the strip 10 and integrated with the frame. The holding bodies 23, 51, 52, 61 of the respective parts are formed by a typical insulating resin mold.

最後の組立て工程を図３−７に示す。   The final assembly process is shown in FIGS. 3-7.

帯材１０から切り離されたリードフレーム１１の電極部保持体６１を電極１５とともに電流制限部保持体５１に対して直角に折り曲げ、保持体半部５１の端部に嵌め合わせる（図３−７（Ａ）、（Ｂ）参照）。   The electrode part holding body 61 of the lead frame 11 cut off from the band material 10 is bent at a right angle with respect to the current limiting part holding body 51 together with the electrode 15 and fitted to the end of the holding body half part 51 (FIGS. 3-7 ( A) and (B)).

次に、電流制限部保持体半部５１を発光部保持体２３に対して直角に折り曲げ、この保持体半部５１を発光部保持体２３の端部に嵌め合わせる（図３−７（Ｂ）、（Ｃ）参照）。   Next, the current limiter holding body half 51 is bent at a right angle with respect to the light emitting part holding body 23, and this holding body half 51 is fitted to the end of the light emitting part holding body 23 (FIG. 3-7 (B)). (See (C)).

さらに、もう一方の電流制限部保持体半部５２を、発光部保持体２３に対して直角に折り曲げてこの保持体の両端を発光部保持体２３および電極部保持体６１に嵌め合わせるとともに保持体半部５１に接合する。各保持体の接合部分は接着剤により接着することにより保持体相互の接合強度を高めることができる。保持体半部５２の外側に露出した電極１７の一部は保持体半部５１に設けられた溝５１ａに嵌入され、この電極１７は両方の保持体半部５１および５２によって支持され、安定する。   Further, the other current limiting portion holding body half 52 is bent at a right angle with respect to the light emitting portion holding body 23 and both ends of the holding body are fitted to the light emitting portion holding body 23 and the electrode portion holding body 61 and the holding body. Join to half 51. Bonding strength between the holding bodies can be increased by bonding the bonding portions of the holding bodies with an adhesive. A part of the electrode 17 exposed to the outside of the holding body half 52 is fitted into a groove 51a provided in the holding body half 51, and this electrode 17 is supported and stabilized by both holding body halves 51 and 52. .

このようにして発光ダイオードランプ１が完成する（図３−７（Ｄ）参照）。   In this way, the light emitting diode lamp 1 is completed (see FIG. 3-7 (D)).

この組立て工程は、リードフレームの折り曲げ加工が主体であるので自動化することが容易となる。   This assembly process is easy to automate because the lead frame is mainly bent.

この実施例によれば、装着部品の発光ダイオードチップや電流制限用抵抗素子だけでなく保持体部分まで、リードフレーム上に形成することができるので、組立て部品数が１点となり、かつリードフレームの折り曲げ加工のみで組立てを行なうことができるので、組立てが極めて簡単となり、その工数を大幅に低減することができる。
（実施例２）
次に、従来例として図9および図７に示した口金付発光ダイオードランプに対応するこの発明の第２の実施例について説明する。 According to this embodiment, not only the light emitting diode chip and the current limiting resistor element of the mounted component but also the holding body portion can be formed on the lead frame, so that the number of assembled parts becomes one point and the lead frame Since the assembly can be performed only by bending, the assembly becomes extremely simple, and the number of man-hours can be greatly reduced.
(Example 2)
Next, a second embodiment of the present invention corresponding to the light emitting diode lamp with cap shown in FIGS. 9 and 7 will be described as a conventional example.

図４−１ないし４−３にこの実施例による発光ダイオードランプの製造工程を示すので、これらの図にしたがって説明する。各図において、実施例１における構成要素と同一の要素は同一の符号で示す。   FIGS. 4-1 to 4-3 show the manufacturing process of the light-emitting diode lamp according to this embodiment, which will be described with reference to these drawings. In each figure, the same elements as those in the first embodiment are denoted by the same reference numerals.

図４−１は、リードフレームの形成工程を示す。この工程においては、実施例１の場合と同様に、プレス加工等により、発光ダイオード支持部１２、これに連続する電流制限素子支持部１３、リード部１４を介して接続された椀状の電極１５および発光ダイオード支持部１３から電流制限素子支持部１３と反対側に延びた電極１７を備えたリード部１６を有するリードフレーム１１がリードフレーム用帯材１０上に多数形成される。   FIG. 4A shows a lead frame forming process. In this step, as in the case of the first embodiment, by pressing or the like, the light emitting diode support portion 12, the current limiting element support portion 13 continuous thereto, and the bowl-shaped electrode 15 connected via the lead portion 14 are used. A number of lead frames 11 having lead portions 16 having electrodes 17 extending from the light emitting diode support portions 13 to the opposite side of the current limiting element support portions 13 are formed on the lead frame strip 10.

ここでは図示が省略されているが、実施例１の場合と同様のリードフレーム上の発光ダイオード支持部１２および電流制限素子支持部１３にそれぞれ発光ダイオードチップおよび電流制限用抵抗素子などの電流制限素子を装着する工程を経て、図４−２に示すモールド工程へ移行する。   Although not shown here, the light-emitting diode support 12 and the current-limiting element support 13 on the lead frame are the same as those in the first embodiment. After the step of mounting, the process proceeds to the molding step shown in FIG.

このモールド工程においては、発光部を形成する発光ダイオードチップの装着された発光ダイオード支持部１２、電流制限部を構成する電流制限抵抗素子の装着された電流制限素子支持部１３および電極部を形成する椀状電極１５部分で絶縁樹脂によりリードフレームと一体的にモールドして発光部保持体２３、電流制限部保持体５１および電極部保持体６１を形成する。この実施例では、リード部１６部分に樹脂の保持体を形成しないところが前記の実施例１の場合と異なっている。   In this molding step, a light emitting diode support 12 having a light emitting diode chip forming a light emitting portion, a current limiting element support 13 having a current limiting resistance element constituting a current limiting portion, and an electrode portion are formed. The light emitting part holding body 23, the current limiting part holding body 51, and the electrode part holding body 61 are formed by molding integrally with the lead frame with insulating resin at the bowl-shaped electrode 15 portion. This embodiment is different from the first embodiment in that a resin holding body is not formed in the lead portion 16 portion.

このモールド工程の次のリードフレームを個々に切り離す工程で帯材１０から切り離されたリードフレームが図４−２に示す１１ａである。   The lead frame separated from the strip 10 in the step of individually separating the lead frames subsequent to the molding step is 11a shown in FIG.

切り離されたリードフレーム１１ａは、図４−３に示す組立て工程へ移され、この工程で発光ダイオードランプに仕上げられる。   The separated lead frame 11a is transferred to an assembly process shown in FIG. 4-3, and is finished into a light emitting diode lamp in this process.

図４−３（Ａ）は、帯材１０から切り離されたリードフレーム１１ａを発光部保持体２３を中心にして電流制限部保持体５１、電極部保持体６１およびリード部１６をそれぞれ直角に折り曲げ加工したもので、全体がほぼ円柱状に構成される。   FIG. 4-3 (A) shows that the lead frame 11a cut off from the band member 10 is bent at right angles with respect to the light-emitting portion holding body 23 and the current limiting portion holding body 51, the electrode portion holding body 61, and the lead portion 16 respectively. It is processed, and the whole is formed in a substantially cylindrical shape.

この円柱状に構成されたリードフレーム１１ａを、図４−３（Ｂ）に示す予め用意した絶縁樹脂により形成し円筒状の本体ケース５０に挿入する。そしてこのとき、リード部１６に形成された電極１７が本体ケース５０の電極引き出し窓５０ａからケースの外側に引き出されるようにする。   The columnar lead frame 11a is formed of an insulating resin prepared in advance as shown in FIG. 4-3 (B) and inserted into a cylindrical main body case 50. At this time, the electrode 17 formed on the lead portion 16 is drawn from the electrode lead-out window 50a of the main body case 50 to the outside of the case.

次に、リードフレーム１１ａの挿入された本体ケース５０に、図４−３（Ｃ）に示す導電性金属で構成された電極となる口金１８を嵌着し、口金１８の上端の複数の爪１８ａを内径側に変形させることによりその１つを電極１７と電気的に接続し、他をケース５０の係合穴５０ｂに係合させ、口金１８を本体ケース５０に固定する。この口金１８の下端は、図６に示すように本体ケースの下端のフランジ部５０ｃにより支持される。   Next, a base 18 serving as an electrode made of a conductive metal shown in FIG. 4C is fitted into the main body case 50 in which the lead frame 11a is inserted, and a plurality of claws 18a at the upper end of the base 18 are fitted. One is electrically connected to the electrode 17 by deforming it to the inner diameter side, the other is engaged with the engagement hole 50 b of the case 50, and the base 18 is fixed to the main body case 50. The lower end of the base 18 is supported by a flange portion 50c at the lower end of the main body case as shown in FIG.

このようにして組立ての完成した発光ダイオードランプを、図５および図６に示す。   The light-emitting diode lamp thus assembled is shown in FIGS.

この実施例２によれば、実施例１に比べて、本体ケース５０、口金１８が部品として増える分、組立て工数が増加し、不利となるが、前記した従来例に比較すると、リードフレーム上に電流制限抵抗素子が装着され、また外部接続用の電極の一方が一体的に形成されているので、この分組立ての必要な部品数が減少するので組立て工数を低減でき有利となる。   According to the second embodiment, as compared with the first embodiment, the main body case 50 and the base 18 are increased in number as parts, so that the number of assembling steps increases, which is disadvantageous. Since the current limiting resistance element is mounted and one of the electrodes for external connection is integrally formed, the number of parts required for the assembly is reduced, which is advantageous in that the number of assembly steps can be reduced.

前記各実施例において、電流制限素子として最も一般的な抵抗素子を用いた例を示したが、この発明においては、これの代わりにＡ−Ｄコンバ−タや、Ｄ−Ｄコンバータのような電圧変換用ＩＣチップを搭載することができ、特にＡ−Ｄコンバータを用いた場合は交流電源のもとで直接使用することが可能となる。   In each of the above embodiments, an example using the most common resistance element as a current limiting element has been shown. However, in the present invention, a voltage such as an AD converter or a DD converter is used instead. A conversion IC chip can be mounted. In particular, when an AD converter is used, it can be used directly under an AC power source.

この発明の実施例１による発光ダイオードランプの構成を示す斜視図である。It is a perspective view which shows the structure of the light emitting diode lamp by Example 1 of this invention. この発明の実施例１による発光ダイオードランプの構成を示す縦断面図である。It is a longitudinal cross-sectional view which shows the structure of the light emitting diode lamp by Example 1 of this invention. この発明の実施例１による発光ダイオードランプの製造方法のリードフレーム形成工程を示す図である。It is a figure which shows the lead frame formation process of the manufacturing method of the light emitting diode lamp by Example 1 of this invention. 同電極成形工程を示す図である。It is a figure which shows the same electrode formation process. 同各素子の装着工程を示す図である。It is a figure which shows the mounting process of each said element. 同モールド工程における帯材の表面を示す図である。It is a figure which shows the surface of the strip | belt material in the same mold process. 同モールド工程における帯材の裏面を示す図である。It is a figure which shows the back surface of the strip | belt material in the same mold process. 同リードフレームの分離工程を示す図である。It is a figure which shows the isolation | separation process of the lead frame. 同組立て工程を示す図である。It is a figure which shows the same assembly process. この発明の実施例２による発光ダイオードランプの製造方法のリードフレーム形成工程を示す図である。It is a figure which shows the lead frame formation process of the manufacturing method of the light emitting diode lamp by Example 2 of this invention. 同モールド工程および分離工程を示す図である。It is a figure which shows the same mold process and isolation | separation process. 同組立て工程を示す図である。It is a figure which shows the same assembly process. この発明の実施例２による発光ダイオードランプの構成を示す斜視図である。It is a perspective view which shows the structure of the light emitting diode lamp by Example 2 of this invention. この発明の実施例２による発光ダイオードランプの構成を示す縦断面図である。It is a longitudinal cross-sectional view which shows the structure of the light emitting diode lamp by Example 2 of this invention. 従来の発光ダイオードランプの製造方法におけるモールド工程および分離工程を示す図である。It is a figure which shows the molding process and isolation | separation process in the manufacturing method of the conventional light emitting diode lamp. 同組立て工程を示す図である。It is a figure which shows the same assembly process. 従来の発光ダイオードランプの構成を示す斜視図である。It is a perspective view which shows the structure of the conventional light emitting diode lamp. 従来の発光ダイオードランプの構成を示す縦断面図である。It is a longitudinal cross-sectional view which shows the structure of the conventional light emitting diode lamp.

符号の説明Explanation of symbols

１：発光ダイオードランプ
１０：リードフレーム用帯材
１１：リードフレーム
１５、１７：接続用電極
２：発光部
２１：発光ダイオードチップ
２３：発光部保持体
５０：電流制限部
５１、５２：電流制限部保持体
６：電極部
６１：電極部保持体。

1: Light-emitting diode lamp 10: Strip material for lead frame 11: Lead frame 15, 17: Electrode for connection 2: Light-emitting part 21: Light-emitting diode chip 23: Light-emitting part holder 50: Current limiting part 51, 52: Current limiting part Holding body 6: Electrode part 61: Electrode part holding body.

Claims (5)

リードフレームによって形成された、発光ダイオードチップを支持するための第１の支持部と、この支持部に連続する電流制限用素子を支持するための第２の支持部と、これら２つの支持部からそれぞれ引き出される第１および第２のリード部と、この第１および第２のリード部の端部にそれぞれ結合して形成された第１および第２の接続用電極とを有し、前記第１の支持部に発光ダイオードチップを装着して発光部を形成し、この発光部を絶縁樹脂により一体的にモールドして発光部保持体を形成し、前記第２の支持部に電流制限用素子を固着して電流制限部を形成し、前記第１のリード部を含む部分と、前記電流制限部および第２のリード部を含む部分とをそれぞれ絶縁樹脂により一体的にモールドして分割構成された筒または柱状の保持体を形成し、前記リードフレームを前記分割構成された保持体が互いに向かい合ように折り曲げ、分割された保持体を相互に接合して構成したことを特徴とする発光ダイオードランプ。   A first support portion formed by the lead frame for supporting the light emitting diode chip, a second support portion for supporting a current limiting element continuous to the support portion, and the two support portions. First and second lead portions respectively drawn out, and first and second connection electrodes formed to be coupled to the ends of the first and second lead portions, respectively. A light emitting diode chip is attached to the support portion to form a light emitting portion, the light emitting portion is molded integrally with an insulating resin to form a light emitting portion holding body, and a current limiting element is provided to the second support portion. A current limiting part is formed by being fixed, and a part including the first lead part and a part including the current limiting part and the second lead part are each integrally molded with an insulating resin and divided. Tube or columnar protection LED lamp in the body to form the bent lead frame to the divided structure retention member is mutually facing engagement so, characterized by being formed by joining the divided holder together. リードフレームによって形成された、発光ダイオードチップを支持するための第１の支持部と、この支持部に連続する電流制限用素子を支持するための第２の支持部と、この２つの支持部からそれぞれ引き出される第１および第２のリード部と、この第１および第２のリード部の端部にそれぞれ結合された第１および第２の接続用電極とを有し、前記第１の支持部に発光ダイオードチップを装着して発光部を形成し、この発光部を絶縁樹脂により一体的にモールドして発光部保持体を形成し、前記第２の支持部に電流制限用素子を装着して電流制限部を形成し、この電流制限部を絶縁樹脂により一体的にモールドして電流制限部保持体を形成し、前記リードフレームを前記電流制限部保持体が前記発光部保持体と接合されるよう折り曲げ、この全体を筒状のケースに挿入して構成したことを特徴とする発光ダイオードランプ。   A first support portion formed by the lead frame for supporting the light emitting diode chip, a second support portion for supporting a current limiting element continuous to the support portion, and the two support portions. The first support portion includes first and second lead portions that are respectively drawn out, and first and second connection electrodes that are respectively coupled to ends of the first and second lead portions. A light-emitting diode chip is attached to form a light-emitting portion, and the light-emitting portion is molded integrally with an insulating resin to form a light-emitting portion holding body, and a current limiting element is attached to the second support portion. A current limiting portion is formed, and the current limiting portion is integrally molded with an insulating resin to form a current limiting portion holding body. The lead frame is joined to the light emitting portion holding body. Bend like this LED lamp, characterized in that the whole was constructed by inserting the cylindrical case. 請求項１または２記載の発光ダイオードランプにおいて、前記第１または第２の接続用電極の何れか一方の電極を球面状に形成したことを特徴とする発光ダイオードランプ。   3. The light emitting diode lamp according to claim 1, wherein either one of the first and second connection electrodes is formed in a spherical shape. 請求項１または２記載の発光ダイオードランプにおいて、電流制限素子として、抵抗素子または、ＡーＤコンバータやＤーＤコンバータ等の電圧変換用ＩＣチップを搭載することを特徴とする発光ダイオードランプ。   3. The light emitting diode lamp according to claim 1, wherein a resistance element or an IC chip for voltage conversion such as an AD converter or a DD converter is mounted as a current limiting element. リードフレーム用帯材上に、発光ダイオードチップを支持するための第１の支持部と、この支持部に連続する電流制限用素子を支持するための第２の支持部と、この２つの支持部のそれぞれから引き出される第１および第２のリード部と、この第１および第２のリード部の端部にそれぞれ結合された第１および第２の接続用電極とを有するリードフレームを形成する工程と、前記第１の支持部に発光ダイオードチップを固着して発光部を形成する工程と、前記第２の支持部に電流制限用素子を固着して電流制限部を形成する工程と、前記発光部と前記第１のリード部を含む部分と前記電流制限部および第２のリード線を含む部分とにそれぞれ絶縁樹脂を一体的にモールドして保持体を形成する工程と、前記保持体の形成されたリードフレームをリードフレーム用帯材から切り離して前記各保持体を一体的に接合する工程とを含むことを特徴とする発光ダイオードランプの製造方法。

On the lead frame strip, a first support for supporting the light emitting diode chip, a second support for supporting a current limiting element connected to the support, and the two support Forming a lead frame having first and second lead portions drawn from each of the first and second lead electrodes and first and second connection electrodes respectively coupled to ends of the first and second lead portions. A step of fixing a light emitting diode chip to the first support portion to form a light emitting portion, a step of fixing a current limiting element to the second support portion to form a current limiting portion, and the light emission. Forming a holding body by integrally molding an insulating resin into a portion including a portion, a portion including the first lead portion, and a portion including the current limiting portion and the second lead wire, and formation of the holding body Lead frame LED lamp manufacturing method which comprises a step of integrally bonding the respective holding member separately from the lead frame for strip.

JP2003389322A 2003-11-19 2003-11-19 Light emitting diode lamp and manufacturing method thereof Expired - Fee Related JP4238328B2 (en)

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