JP3136391B2 - Insulating paint layer for smooth substrate - Google Patents

Insulating paint layer for smooth substrate

Info

Publication number
JP3136391B2
JP3136391B2 JP06319047A JP31904794A JP3136391B2 JP 3136391 B2 JP3136391 B2 JP 3136391B2 JP 06319047 A JP06319047 A JP 06319047A JP 31904794 A JP31904794 A JP 31904794A JP 3136391 B2 JP3136391 B2 JP 3136391B2
Authority
JP
Japan
Prior art keywords
insulating paint
paint layer
substrate
smooth
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP06319047A
Other languages
Japanese (ja)
Other versions
JPH08153941A (en
Inventor
明子 山田
陽子 萩原
Original Assignee
帝国通信工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 帝国通信工業株式会社 filed Critical 帝国通信工業株式会社
Priority to JP06319047A priority Critical patent/JP3136391B2/en
Publication of JPH08153941A publication Critical patent/JPH08153941A/en
Application granted granted Critical
Publication of JP3136391B2 publication Critical patent/JP3136391B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036Multilayers with layers of different types
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、パターンの表面がその
周囲の絶縁塗料層の表面と同一面になる平滑基板に関
し、特にその絶縁塗料層の材質に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a smooth substrate in which the surface of a pattern is flush with the surface of a surrounding insulating paint layer, and more particularly to a material of the insulating paint layer.

【0002】[0002]

【従来技術及び発明が解決しようとする課題】従来、可
変抵抗器用基板やスイッチ基板等の中には、摺動子が摺
接するパターン表面と絶縁基板表面とを同一面としたい
わゆる平滑基板がある。この種の平滑基板はパターンと
絶縁基板の間に何ら段差がないので、この上を摺接する
摺動子による対摩耗性が良く長寿命化が図れ、また摺動
子の移動もきわめてスムーズになるという利点がある。
2. Description of the Related Art Conventionally, among variable resistor substrates, switch substrates, and the like, there is a so-called smooth substrate in which a pattern surface on which a slider slides is in contact with an insulating substrate surface. . This kind of smooth substrate has no step between the pattern and the insulating substrate, so that the slider that slides on it has good abrasion resistance and long life, and the slider can move extremely smoothly. There is an advantage.

【0003】そしてこの種の従来の平滑基板としては、
例えば金属薄板にエッチングを施してパターン面となる
部分以外の部分を凹部とし、該パターン面を金型面に押
し付けた状態で該凹部内に絶縁性の合成樹脂を流し込ん
で前記パターン面と合成樹脂表面とを同一面としたもの
等がある。
[0003] As a conventional smooth substrate of this kind,
For example, a portion other than a portion to be a pattern surface by performing etching on a thin metal plate is formed into a concave portion, and in a state where the pattern surface is pressed against a mold surface, an insulating synthetic resin is poured into the concave portion to form the pattern surface and the synthetic resin. Some have the same surface as the surface.

【0004】しかしながらこの種の従来の平滑基板にあ
っては、平滑面の平滑度をそれほど高くすることはでき
ず、また平滑基板の平滑面と同等の平滑な面を設けた金
型を用意する必要があるが該金型は高価であり、さらに
平滑面において金属板からなるパターンと樹脂のつなぎ
目の部分にはどうしても他の部分よりも大きい凹凸が生
じてしまう。
However, in this type of conventional smooth substrate, the smoothness of the smooth surface cannot be increased so much, and a mold having a smooth surface equivalent to the smooth surface of the smooth substrate is prepared. Although it is necessary, the mold is expensive, and the joint between the pattern made of a metal plate and the resin on the smooth surface necessarily has larger irregularities than the other portions.

【0005】そこで本願出願人は特願平5−17237
2号の特許出願において、転写基板上に該転写基板との
密着性の悪い導電ペーストからなるパターンを印刷し、
該転写基板の表面全体に該転写基板との密着性が悪く前
記パターンとの密着性の良い絶縁塗料層を塗布し、前記
転写基板とは別の基体上に前記絶縁塗料層を直接又は他
の層を介して間接に接着し、前記転写基板のみを剥がし
て前記パターンと絶縁塗料層を露出せしめて製造される
平滑基板を提案した。
Accordingly, the applicant of the present application has filed Japanese Patent Application No. Hei 5-17237.
In the patent application No. 2, a pattern made of a conductive paste having poor adhesion to the transfer substrate is printed on the transfer substrate,
The entire surface of the transfer substrate is coated with an insulating paint layer having poor adhesion to the transfer substrate and good adhesion to the pattern, and applying the insulating paint layer directly or on another substrate different from the transfer substrate. A flat substrate manufactured by bonding indirectly via a layer and peeling only the transfer substrate to expose the pattern and the insulating paint layer has been proposed.

【0006】ところでこの平滑基板においては、その平
滑面が導電ペーストからなるパターンと絶縁塗料層とに
よって構成されているので、金属板製の摺動子は、該パ
ターンと絶縁塗料層の上に弾接した状態で摺動を繰り返
すこととなる。
In this smooth substrate, the smooth surface is constituted by a pattern made of a conductive paste and an insulating paint layer. The sliding is repeated in the contact state.

【0007】しかしながら前記絶縁塗料層は印刷によっ
て塗布される樹脂であるため、印刷固化後もある程度の
柔軟性を具備しており、該絶縁塗料層の柔軟性が大きい
と、その上に摺動子が弾接した状態で且つ高熱(例えば
85℃)で長時間(例えば100時間)経過すると、該
絶縁塗料層の弾接部分に凹みが生じてしまうという問題
点があった。
However, since the insulating paint layer is a resin applied by printing, the insulating paint layer has a certain degree of flexibility even after the printing is solidified. When a high temperature (for example, 85 ° C.) elapses for a long time (for example, 100 hours) in a state of being elastically contacted, there is a problem that a dent occurs in the elastically contacted portion of the insulating paint layer.

【0008】一方絶縁塗料層の硬度を高めるためには、
シリカ等の硬質材料からなる微粉末を混合すれば良い
が、そうすると絶縁塗料層の他の基材に対する密着性や
印刷性が悪化してしまうという問題点があった。
On the other hand, in order to increase the hardness of the insulating paint layer,
Fine powder made of a hard material such as silica may be mixed, but this causes a problem that the adhesion and printability of the insulating paint layer to other base materials are deteriorated.

【0009】本発明は上述の点に鑑みてなされたもので
ありその目的は、硬度が向上すると同時に密着性や印刷
性も満足する平滑基板用絶縁塗料層を提供することにあ
る。
The present invention has been made in view of the above points, and an object of the present invention is to provide an insulating paint layer for a smooth substrate which has improved hardness and at the same time satisfies adhesiveness and printability.

【0010】[0010]

【課題を解決するための手段】上記問題点を解決するた
め本発明は、基体上に直接又は他の層を介して絶縁塗料
層を設け、該絶縁塗料層中に埋め込むように導電ペース
トからなる所望形状のパターンを設け、且つ該絶縁塗料
層の表面とパターンの表面を平滑な同一面とし、この平
滑な面を摺動子が弾接して摺動する面とした平滑基板に
おいて、その表面を前記摺動子が弾接して摺動する前記
絶縁塗料層は、アクリル系の紫外線硬化型の樹脂であっ
てそのガラス転移温度が90℃乃至160℃のものの中
に、重量パーセントが5〜15%のシリカの粉末と、重
量パーセントが5〜25%のテフロンの粉末を混合せし
めて構成することとした。
SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention provides an insulating paint layer on a substrate directly or via another layer, and comprises a conductive paste so as to be embedded in the insulating paint layer. A pattern of a desired shape is provided, and the surface of the insulating paint layer and the surface of the pattern are made smooth and flush with each other .
In a smooth substrate having a smooth surface on which a slider elastically contacts and slides, the insulating paint layer on which the slider elastically contacts and slides the surface is made of an acrylic ultraviolet curing resin. In addition, among those having a glass transition temperature of 90 ° C. to 160 ° C., a powder of silica having a weight percentage of 5 to 15% and a powder of Teflon having a weight percentage of 5 to 25% are mixed. .

【0011】[0011]

【作用】上記の如く絶縁塗料層を構成することにより、
該絶縁塗料層の硬度と密着性と印刷性のいずれをも同時
に改善することができた。
By constituting the insulating paint layer as described above,
All of the hardness, adhesion and printability of the insulating paint layer could be simultaneously improved.

【0012】[0012]

【実施例】以下、本発明の実施例を図面に基づいて詳細
に説明する。ここで図1は本願発明にかかる絶縁塗料層
を用いて構成した平滑基板の1例を示す概略側断面図で
ある。同図に示すようにこの平滑基板1は、本基板(基
体)40上に3層の熱可塑性絶縁塗料35,30,25
と本発明にかかる絶縁塗料層20を設け、該絶縁塗料層
20中に埋め込むように導電ペーストからなるパターン
15を設け、該絶縁塗料層20の表面とパターン15の
表面を平滑な同一面として構成されている。
Embodiments of the present invention will be described below in detail with reference to the drawings. Here, FIG. 1 is a schematic side sectional view showing an example of a smooth substrate formed using the insulating paint layer according to the present invention. As shown in the figure, the smooth substrate 1 is provided on a main substrate (substrate) 40 with three layers of thermoplastic insulating paints 35, 30, 25.
And an insulating paint layer 20 according to the present invention, a pattern 15 made of a conductive paste is provided so as to be embedded in the insulating paint layer 20, and the surface of the insulating paint layer 20 and the surface of the pattern 15 are formed as a smooth and same surface. Have been.

【0013】そして本願発明は前記絶縁塗料層20の材
質を改良したものであるが、これについて説明する前
に、まず前記平滑基板1の製造方法を説明しておく。
In the present invention, the material of the insulating paint layer 20 is improved. Before describing this, a method of manufacturing the smooth substrate 1 will be described first.

【0014】即ち、まず図5(a)に示すように、合成
樹脂フイルムからなる転写基板10を用意する。
First, as shown in FIG. 5A, a transfer substrate 10 made of a synthetic resin film is prepared.

【0015】この転写基板の材質としては安価なポリエ
チレンテレフタレート(PET)を用いた。但し他のポ
リエステル系フイルム又はテフロン系フイルム又はシリ
コン系フイルムで構成しても良い。これら合成樹脂フイ
ルムの表面は通常滑らかであり、その表面粗さは通常
0.1μm以下である。
As a material of the transfer substrate, inexpensive polyethylene terephthalate (PET) was used. However, another polyester film, Teflon film, or silicon film may be used. The surface of these synthetic resin films is usually smooth, and the surface roughness is usually 0.1 μm or less.

【0016】次に同図(a)に示すようにこの転写基板
10の上に導電ペーストからなるパターン15を所望形
状となるようにスクリーン印刷する。
Next, as shown in FIG. 1A, a pattern 15 made of a conductive paste is screen-printed on the transfer substrate 10 so as to have a desired shape.

【0017】この導電パターン15の材質としては、フ
ェノール系樹脂に銀粉を混入した銀ペーストを用いた。
この導電ペーストの材質は、これを前記転写基板10に
印刷したとき、該転写基板10にくっつきにくく且つは
じかれにくい性質を有するものである。
As the material of the conductive pattern 15, a silver paste obtained by mixing silver powder with a phenolic resin was used.
The material of the conductive paste has such a property that when it is printed on the transfer substrate 10, it does not easily stick to the transfer substrate 10 and is hardly repelled.

【0018】次に同図(b)に示すように、該転写基板
10の表面全体に本発明にかかる絶縁塗料層20を塗布
して固化せしめる。
Next, as shown in FIG. 1B, the entire surface of the transfer substrate 10 is coated with the insulating paint layer 20 according to the present invention and solidified.

【0019】この絶縁塗料層20は、アクリル系の紫外
線硬化型の樹脂であってそのガラス転移温度が100℃
のものに、重量パーセントが10%のシリカ(Si
2)の粉末と、重量パーセントが10%のテフロンの
粉末を混合した材料で構成されている。
The insulating paint layer 20 is an acrylic UV-curable resin having a glass transition temperature of 100 ° C.
To 10% silica (Si
O 2 ) powder and 10% by weight Teflon powder.

【0020】なおこの絶縁塗料層20の材質であるアク
リル系紫外線硬化型樹脂は、前記パターン15を構成す
る導電ペーストとは密着性がよく、且つ前記転写基板1
0を構成するPET等の樹脂フイルムとは密着製の悪い
性質を有するものである。
The acrylic UV curable resin, which is the material of the insulating paint layer 20, has good adhesion to the conductive paste forming the pattern 15, and the transfer substrate 1
The resin film, such as PET, which constitutes No. 0 has poor adhesion properties.

【0021】次に同図(c)に示すように、前記絶縁塗
料層20の上にポリエステル系の熱可塑性絶縁塗料25
を塗布して固化させ、さらに該熱可塑性絶縁塗料25の
上に塩化ビニール系のホットメルトタイプの熱可塑性絶
縁塗料30を塗布する。この熱可塑性絶縁塗料30は、
100℃程度の温度で軟化する性質を有する。
Next, as shown in FIG. 1C, a polyester-based thermoplastic insulating coating 25 is formed on the insulating coating layer 20.
Is applied and solidified, and a vinyl chloride-based hot melt type thermoplastic insulating paint 30 is further applied on the thermoplastic insulating paint 25. This thermoplastic insulating paint 30
It has the property of softening at a temperature of about 100 ° C.

【0022】なお熱可塑性絶縁塗料25は、絶縁塗料層
20と熱可塑性絶縁塗料30間を強固に接続するために
設けたが、省略しても良い。
Although the thermoplastic insulating paint 25 is provided for firmly connecting the insulating paint layer 20 and the thermoplastic insulating paint 30, it may be omitted.

【0023】次に同図(d)に示すように合成樹脂フイ
ルムからなる本基板40を用意し、その上に前記熱可塑
性絶縁塗料30と同質の塩化ビニール系のホットメルト
タイプの熱可塑性絶縁塗料35を塗布する。
Next, as shown in FIG. 2D, a main substrate 40 made of a synthetic resin film is prepared, and a vinyl chloride-based hot melt type thermoplastic insulating coating of the same quality as the thermoplastic insulating coating 30 is provided thereon. 35 is applied.

【0024】ここで本基板40としては、ポリエチレン
テレフタレート製のものを用いているが、熱可塑性絶縁
塗料35との密着製の良い材質であれば、他の材質のも
のを用いても良い。
Here, the substrate 40 is made of polyethylene terephthalate, but any other material may be used as long as it has good adhesion to the thermoplastic insulating paint 35.

【0025】そして転写基板10と本基板40とを、両
者の熱可塑性絶縁塗料30,35の面が密着するように
重ね合わせて圧接・加熱する。これによっホットメルト
タイプの熱可塑性絶縁塗料30,35同士が融着一体化
する(同図(e))。
Then, the transfer substrate 10 and the main substrate 40 are overlapped with each other so that the surfaces of the thermoplastic insulating paints 30 and 35 are in close contact with each other, and are pressed and heated. As a result, the hot-melt type thermoplastic insulating paints 30 and 35 are fused and integrated with each other ((e) in the figure).

【0026】そして転写基板10を剥がせば、図1に示
す平滑基板1が完成する。ここで転写基板10は、パタ
ーン15及び絶縁塗料層20に対してその密着性が悪
く、一方パターン15−絶縁塗料層20−熱可塑性絶縁
塗料25−熱可塑性絶縁塗料30−熱可塑性絶縁塗料3
5−本基板40間はいずれも密着性が良いので、転写基
板10を剥がしたときに他の層が剥がれることはなく、
転写基板10のみが剥がれる。
Then, when the transfer substrate 10 is peeled off, the smooth substrate 1 shown in FIG. 1 is completed. Here, the transfer substrate 10 has poor adhesion to the pattern 15 and the insulating paint layer 20, while the pattern 15—the insulating paint layer 20—the thermoplastic insulating paint 25—the thermoplastic insulating paint 30—the thermoplastic insulating paint 3
Since the adhesion between the 5-substrate 40 is good, other layers are not peeled off when the transfer substrate 10 is peeled off.
Only the transfer substrate 10 is peeled off.

【0027】転写基板10を構成する合成樹脂フイルム
はその表面が非常に滑らかなので、これに密着していた
パターン15及び絶縁塗料層20の表面も非常に滑らか
な平滑面となり、またパターン15は絶縁塗料層20中
に完全に埋まり、該パターンと絶縁塗料層20の表面の
つなぎ目の部分に隙間ができることもない。
Since the surface of the synthetic resin film forming the transfer substrate 10 is very smooth, the surfaces of the pattern 15 and the insulating paint layer 20 which are in close contact with the synthetic resin film are also very smooth and smooth. It is completely buried in the paint layer 20 and there is no gap between the pattern and the joint of the surface of the insulating paint layer 20.

【0028】ところで本願発明者は、絶縁塗料層20の
硬度と密着性と印刷性のいずれをも満足する材料を各種
実験を繰り返すことによって見出した。以下説明する。
The inventor of the present application has found a material that satisfies all of the hardness, adhesion and printability of the insulating paint layer 20 by repeating various experiments. This will be described below.

【0029】絶縁塗料層20に要求される性能は、加熱
した状態の絶縁塗料層20に摺動子が長時間弾接したと
しても凹まない程度の硬度と、転写基板10を剥がした
ときに剥がれない(下記する凝集破壊しない)程度の密
着性と、その粘度が印刷できる程度のものである印刷性
が必要とされる。また印刷して固化したときの塗料の収
縮によってフイルムが反らないことも平滑面を得るため
の重要な要件である。
The performance required of the insulating paint layer 20 is such that the slider is not dented even if the slider elastically contacts the heated insulating paint layer 20 for a long time. It is required to have an adhesiveness that does not cause cohesion failure (to be described below) and a printability that has a viscosity that can be printed. Another important requirement for obtaining a smooth surface is that the film does not warp due to shrinkage of the paint when it is printed and solidified.

【0030】そしてこれらの要件は、アクリル系の紫外
線硬化型の樹脂のガラス転移温度を所定値のものにする
とともに、シリカとテフロンの粉末を所定量ずつ混合す
ることによって解決されることが分かった。ここでガラ
ス転移温度とは、高分子物質を加熱した場合にガラス状
のかたい状態からゴム状の軟らかい状態に変わる温度を
言う。以下具体的に説明する。
It has been found that these requirements can be solved by setting the glass transition temperature of the acrylic UV-curable resin to a predetermined value and mixing silica and Teflon powders by predetermined amounts. . Here, the glass transition temperature refers to a temperature at which a polymer substance is changed from a hard glassy state to a soft rubbery state when heated. This will be specifically described below.

【0031】即ち先ず、図3に示すように、6cm四方の
ポリエチレンテレフタレート製の合成樹脂フイルム60
上に5cm四方の絶縁塗料層の試料65を印刷し、該試料
65の反りと陥没性を調べた。
First, as shown in FIG. 3, a 6 cm square synthetic resin film 60 made of polyethylene terephthalate is used.
A 5 cm square sample 65 of an insulating paint layer was printed thereon, and the sample 65 was examined for warpage and depression.

【0032】ここで試料65としては、アクリル系の紫
外線硬化型樹脂であってそのガラス転移温度が50℃と
100℃と150℃のものであって、それぞれに重量パ
ーセントが10%ずつのシリカとテフロンの粉末を混合
したものを用いた。また合成樹脂フイルム60として
は、その厚みが75μmのものと188μmのものと2
50μmのものを用いた。
The sample 65 is an acrylic UV-curable resin having a glass transition temperature of 50.degree. C., 100.degree. C., and 150.degree. C., each containing 10% by weight of silica. A mixture of Teflon powder was used. The synthetic resin film 60 has a thickness of 75 μm, a thickness of 188 μm, and a thickness of 2 μm.
The thing of 50 μm was used.

【0033】そして反りの試験は、試料65の乾燥後の
合成樹脂フイルム60の反りの大きさを図3(b)に示
す寸法fとして求め、 f≦0.5(mm)のとき ○ 0.5<f≦1.0(mm)のとき △ 1.0<f (mm)のとき × とした。
In the warp test, the size of the warp of the synthetic resin film 60 after drying the sample 65 is obtained as a dimension f shown in FIG. 3B. When 5 <f ≦ 1.0 (mm), Δ was determined when 1.0 <f (mm).

【0034】また陥没性の試験は、この試料65を前記
図5に示す方法で別の本基板上に転写した後、合成樹脂
フイルム60を剥がし、該転写した試料65の表面(合
成樹脂フイルム60に密着していた側の面)にブラシ圧
5gの摺動子を弾接させた状態で、85℃で100時間
放置し、該弾接部分が陥没するか否かを調べた。そして
陥没しない場合は○、陥没した場合は×とした。
In the test for depressability, after transferring this sample 65 onto another main substrate by the method shown in FIG. 5, the synthetic resin film 60 was peeled off, and the surface of the transferred sample 65 (synthetic resin film 60) was removed. The slider with a brush pressure of 5 g was elastically contacted with the surface (the surface on the side that was in close contact with the roller) and left at 85 ° C. for 100 hours, and it was examined whether or not the elastic contact portion collapsed. And, when not depressed, it was evaluated as O, and when depressed, it was evaluated as X.

【0035】図2はこれらの結果を示す図である。同図
に示すようにガラス転移温度が100℃と150℃のも
のは85℃で長時間放置しても摺動子が陥没しないこと
が分かった。また反りはガラス転移温度が高くなるほど
増加し、これに対して合成樹脂フイルム60の厚みを厚
くすればするほど減少させることができることが分かっ
た。
FIG. 2 is a diagram showing these results. As shown in the figure, it was found that the sliders with glass transition temperatures of 100 ° C. and 150 ° C. did not collapse even when left at 85 ° C. for a long time. It was also found that the warpage increases as the glass transition temperature increases, whereas it can be reduced as the thickness of the synthetic resin film 60 increases.

【0036】そして陥没性の点からガラス転移温度は9
0乃至160℃のものが好ましいので、図5に示す転写
基板10の厚みは188μm程度以上のものを使用する
ことが好ましい。
The glass transition temperature is 9 from the point of depression.
Since a substrate having a temperature of 0 to 160 ° C. is preferable, it is preferable to use a substrate having a thickness of about 188 μm or more as shown in FIG.

【0037】以上のようにガラス転移温度は90乃至1
60℃のものが好ましいことが分かったが、次にこれに
混合するシリカ及びテフロンの粒子の最適量を求める実
験を行った。
As described above, the glass transition temperature is 90 to 1
Although it was found that a temperature of 60 ° C. was preferable, an experiment was conducted to determine the optimum amount of silica and Teflon particles to be mixed therewith.

【0038】ここでシリカを混合するのは、絶縁塗料層
20の硬度を大きくするためであり(シリカは硬いか
ら)、一方テフロンを混合するのは、絶縁塗料層20表
面の摩擦抵抗を小さくすると同時に転写基板10からの
剥離性を向上させるためである(テフロンの表面は摩擦
抵抗小さいから)。
The reason for mixing silica here is to increase the hardness of the insulating coating layer 20 (since the silica is hard), while mixing Teflon is used to reduce the frictional resistance of the surface of the insulating coating layer 20. At the same time, it is for improving the releasability from the transfer substrate 10 (because the surface of Teflon has low frictional resistance).

【0039】この実験に用いた試料としては、アクリル
系の紫外線硬化型樹脂であってそのガラス転移温度が1
00℃のものに、重量パーセントがそれぞれ0%,10
%,20%,30%のシリカとテフロンの粉末を混合し
たものを用いた。
The sample used in this experiment was an acrylic UV-curable resin having a glass transition temperature of 1
0%, 10%
%, 20%, and 30% of silica and Teflon powder were used.

【0040】そしてこれら試料は、ポリエチレンテレフ
タレート製の合成樹脂フイルム上に、上記各絶縁塗料層
の試料を印刷し、それぞれについて鉛筆硬度と、印刷性
と、密着性を検査した。
These samples were printed on a synthetic resin film made of polyethylene terephthalate, and the samples of the respective insulating paint layers were printed, and the pencil hardness, printability, and adhesion of each of the samples were examined.

【0041】ここで鉛筆硬度試験は、合成樹脂フイルム
上に塗布した試料(転写前)の表面に、硬度Hと2Hと
5Hの鉛筆を所定回数こすり付け、該こすり付けた部分
の試料表面に凹部が生じるか否かを検査する試験であ
り、硬度H以下で凹部が生じたものを×、硬度2H以下
で凹部が生じたものを△、硬度5H以上でも凹部が生じ
なかったものを○とした。絶縁塗料層の上には摺動子が
摺接するので所定の硬度が必要である。
Here, a pencil hardness test was conducted by rubbing pencils of hardness H, 2H, and 5H a predetermined number of times on the surface of the sample (before transfer) applied on the synthetic resin film, and forming a recess on the surface of the rubbed portion. This is a test for inspecting whether or not pits are formed. When a depression is formed at a hardness of not more than H, x is given. . A predetermined hardness is required because the slider slides on the insulating paint layer.

【0042】また印刷性の試験は、合成樹脂フイルム上
に試料を印刷したときに、印刷し易い粘度か否かを検査
する試験であり、印刷し易いものを○、印刷しずらいも
のを×とした。
The printability test is a test for examining whether or not the viscosity is such that it is easy to print when a sample is printed on a synthetic resin film. And

【0043】また密着性の試験は、合成樹脂フイルムに
印刷した試料を前記図5に示す方法で別の本基板上に転
写した後、合成樹脂フイルムを剥がし、該転写した試料
の塗膜に1mmピッチ角の基盤目状の傷をつけた後、粘着
テープ(ニットー31B)を密着して貼り付け、該粘着
テープを垂直上方に勢い良く剥がしたとき、該塗膜が剥
がれるか否かを調べた。そして剥がれた場合は×、剥が
れない場合は○とした。密着性が悪いと図5に示す転写
基板10を剥がすときに絶縁塗料層20も剥がれてしま
う。
In the adhesion test, a sample printed on a synthetic resin film was transferred onto another main substrate by the method shown in FIG. 5 and then the synthetic resin film was peeled off. After making a base-shaped scratch at the pitch angle, an adhesive tape (Nitto 31B) was adhered in close contact, and when the adhesive tape was vigorously peeled vertically upward, it was examined whether or not the coating film was peeled. . And when it peeled, it was evaluated as x, and when it did not peel, it was evaluated as o. If the adhesion is poor, when the transfer substrate 10 shown in FIG. 5 is peeled off, the insulating paint layer 20 also comes off.

【0044】図4はその実験結果を示す図である。同図
に示すように鉛筆硬度はシリカの重量%とテフロンの重
量%を同時に増加すればするほど向上することが分かっ
た。これはシリカを加えることによって硬度が増し、テ
フロンを加えることによって表面が滑らかになるからで
あると考えられる。
FIG. 4 shows the results of the experiment. As shown in the figure, it was found that the pencil hardness increased as the weight percent of silica and the weight percent of Teflon increased simultaneously. This is probably because the addition of silica increases the hardness and the addition of Teflon smoothes the surface.

【0045】また印刷性はシリカの重量%を増加すれば
するほど悪化する。これはシリカによってその硬度が増
す分、粘度が大きくなるためと考えられる。
The printability deteriorates as the weight percentage of silica increases. This is considered to be due to the fact that the viscosity increases as the hardness increases with silica.

【0046】また密着性はシリカ及び/又はテフロンの
重量%を増加すればするほど悪化する。これは印刷した
塗料内部で凝集破壊を引き起こすからであると考えられ
る。ここで凝集破壊を図6を用いて説明する。図6は図
5(e)に示す状態のときの絶縁塗料層20と転写基板
10周辺の拡大概略断面図である。
Also, the adhesion becomes worse as the weight percentage of silica and / or Teflon is increased. This is considered to be because cohesive failure occurs inside the printed paint. Here, cohesive failure will be described with reference to FIG. FIG. 6 is an enlarged schematic sectional view around the insulating paint layer 20 and the transfer substrate 10 in the state shown in FIG.

【0047】同図に示すように絶縁塗料層20内のシリ
カ及び/又はテフロンの粒子の量が過密になると、絶縁
塗料層20を構成する樹脂が上下の転写基板10と熱可
塑性絶縁塗料25に追いやられ、該転写基盤10と熱可
塑性絶縁塗料25表面において樹脂リッチになり、一方
絶縁塗料層20の中央部においてはシリカ及び/又はテ
フロンの粒子がリッチになる。このため絶縁塗料層20
の中央部において粒子間を結び付けている樹脂の量が減
り、該部分の結合力が低下する。このため前記転写基板
10を剥がしたとき、絶縁塗料層20がその中央部にお
いて引き裂かれてしまう。このことを凝集破壊というの
である。
As shown in the figure, when the amount of silica and / or Teflon particles in the insulating paint layer 20 becomes too dense, the resin constituting the insulating paint layer 20 is transferred to the upper and lower transfer substrates 10 and the thermoplastic insulating paint 25. The resin is enriched on the transfer substrate 10 and the surface of the thermoplastic insulating coating 25 while the silica and / or Teflon particles are enriched in the center of the insulating coating layer 20. Therefore, the insulating paint layer 20
In the central part of the resin, the amount of resin binding the particles decreases, and the bonding strength of the part decreases. Therefore, when the transfer substrate 10 is peeled off, the insulating paint layer 20 is torn at its center. This is called cohesive failure.

【0048】そして図4の結果から、鉛筆硬度と密着性
と印刷性を同時に満足するものの範囲は、同図に太枠で
囲む部分のものである。即ち、シリカは10重量%であ
り、テフロンは10重量%又は20重量%であり、さら
に詳細には、シリカの重量パーセントが5〜15%であ
り、且つテフロンの重量パーセントが5〜25%のもの
であった。
From the results of FIG. 4, the range satisfying the pencil hardness, adhesion and printability at the same time is the portion surrounded by the thick frame in FIG. That is, the silica is 10% by weight, the Teflon is 10% or 20% by weight, more particularly, the silica has a weight percentage of 5-15% and the Teflon has a weight percentage of 5-25%. Was something.

【0049】なお図1に示す平滑基板1は本願発明にか
かる絶縁塗料層を用いる1例を示したものであり、他の
構造の平滑基板に本願発明にかかる絶縁塗料層を用いて
も良いことは言うまでもない。
The smooth substrate 1 shown in FIG. 1 is an example in which the insulating paint layer according to the present invention is used, and the smooth paint substrate having another structure may use the insulating paint layer according to the present invention. Needless to say.

【0050】即ち例えば図7(a)に示すように、転写
基板10上にパターン15と絶縁塗料層20を塗布した
もの(これは前記実施例の図5(a),(b)の工程と
同一である)を用意し、これを上下金型A,B内に挟み
込む。
That is, for example, as shown in FIG. 7A, a pattern 15 and an insulating paint layer 20 are applied on a transfer substrate 10 (this is the same as the process of FIGS. 5A and 5B in the above embodiment). Are the same), and these are sandwiched between upper and lower molds A and B.

【0051】そして同図(a)に示すように、下金型B
の凹部B1の空隙D内に加熱・溶融された樹脂(例えば
PBT樹脂,PET樹脂,ABS樹脂)を充填すれば、
絶縁塗料層20は充填された溶融樹脂の熱によってこの
溶融樹脂と溶着し、該溶融樹脂が冷却したとき両者は強
固に固着される。そして上下金型A,Bを取り外して転
写基板10を剥がせば、同図(b)に示すような平滑基
板1′が完成する。なお50は溶融樹脂が固化した基体
である。
Then, as shown in FIG.
By filling the heated and melted resin (for example, PBT resin, PET resin, ABS resin) in the gap D of the concave portion B1,
The insulating paint layer 20 is welded to the molten resin by the heat of the filled molten resin, and when the molten resin is cooled, both are firmly fixed. Then, by removing the upper and lower molds A and B and peeling off the transfer substrate 10, a smooth substrate 1 'as shown in FIG. Reference numeral 50 denotes a substrate on which the molten resin is solidified.

【0052】また平滑基板は同図(c)に示すように、
転写基板10上にパターン15と絶縁塗料層20と熱可
塑性絶縁塗料25とホットメルトタイプの熱可塑性絶縁
塗料30を塗布したもの(これは前記図5(a)乃至
(c)の工程と同一である)を用意し、これを上下金型
A,Bで挟み込み、空隙D内に加熱・溶融された樹脂を
充填・固化した後、上下金型A,Bを取り外して転写基
板10を剥がせすことによっても平滑基板が製造でき
る。この場合は樹脂(基体)に対する絶縁塗料層20等
の固着力はより強固になる。
Further, as shown in FIG.
A pattern substrate, an insulating coating layer 20, a thermoplastic insulating coating 25, and a hot-melt type thermoplastic insulating coating 30 applied on a transfer substrate 10 (this is the same as the process shown in FIGS. 5A to 5C). Is prepared, and is sandwiched between upper and lower molds A and B. After filling and solidifying the resin which has been heated and melted in the space D, the upper and lower molds A and B are removed and the transfer substrate 10 is peeled off. This can also produce a smooth substrate. In this case, the adhesive force of the insulating paint layer 20 and the like to the resin (substrate) becomes stronger.

【0053】[0053]

【発明の効果】以上詳細に説明したように、本発明によ
れば、アクリル系の紫外線硬化型の樹脂にシリカとテフ
ロンの粉末を混合すると同時に、該樹脂のガラス転移温
度と、シリカとテフロンの混合比を所定のものとしたの
で、平滑基板用絶縁塗料層の硬度と密着性と印刷性のい
ずれをも同時に改善できるという優れた効果を有する。
As described in detail above, according to the present invention, an acrylic UV-curable resin is mixed with silica and Teflon powder, and at the same time, the glass transition temperature of the resin and the silica and Teflon are compared. Since the mixing ratio is set to a predetermined value, there is an excellent effect that all of the hardness, adhesion and printability of the insulating paint layer for a smooth substrate can be simultaneously improved.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本願発明にかかる絶縁塗料層を用いて構成した
平滑基板の1例を示す概略側断面図である。
FIG. 1 is a schematic side sectional view showing an example of a smooth substrate formed using an insulating paint layer according to the present invention.

【図2】陥没性と反りの実験結果を示す図である。FIG. 2 is a view showing experimental results of depression and warpage.

【図3】陥没性と反りの実験方法を示す図である。FIG. 3 is a view showing an experimental method of depression and warpage.

【図4】鉛筆硬度と密着性と印刷性の実験結果を示す図
である。
FIG. 4 is a view showing experimental results of pencil hardness, adhesion and printability.

【図5】平滑基板1の製造方法を示す図である。FIG. 5 is a diagram illustrating a method of manufacturing the smooth substrate 1.

【図6】凝集破壊について説明するための図である。FIG. 6 is a diagram for explaining cohesive failure.

【図7】本願発明にかかる絶縁塗料層を用いて構成した
平滑基板の他の例を示す図である。
FIG. 7 is a diagram showing another example of a smooth substrate formed using the insulating paint layer according to the present invention.

【符号の説明】[Explanation of symbols]

1 平滑基板 15 パターン 20 絶縁塗料層 40 本基板(基体) 50 基体 DESCRIPTION OF SYMBOLS 1 Smooth board 15 Pattern 20 Insulating paint layer 40 Main board (base) 50 Base

───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7,DB名) H05K 1/03 630 B05D 5/12 C09D 5/25 H05K 1/02 H05K 3/22 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int. Cl. 7 , DB name) H05K 1/03 630 B05D 5/12 C09D 5/25 H05K 1/02 H05K 3/22

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 基体上に直接又は他の層を介して絶縁塗
料層を設け、該絶縁塗料層中に埋め込むように導電ペー
ストからなる所望形状のパターンを設け、且つ該絶縁塗
料層の表面とパターンの表面を平滑な同一面とし、この
平滑な面を摺動子が弾接して摺動する面とした平滑基板
において、その表面を前記摺動子が弾接して摺動する 前記絶縁塗料
層は、アクリル系の紫外線硬化型の樹脂であってそのガ
ラス転移温度が90℃乃至160℃のものの中に、重量
パーセントが5〜15%のシリカの粉末と、重量パーセ
ントが5〜25%のテフロンの粉末を混合せしめて構成
されていることを特徴とする平滑基板用絶縁塗料層。
An insulating paint layer is provided on a substrate directly or via another layer, a pattern of a desired shape made of a conductive paste is provided so as to be embedded in the insulating paint layer, and a surface of the insulating paint layer is provided. the surface of the pattern as a smooth coplanar, this
In a smooth substrate having a smooth surface on which a slider elastically contacts and slides, the insulating paint layer on which the slider elastically contacts and slides on the surface is made of an acrylic ultraviolet curable resin. And having a glass transition temperature of 90 ° C. to 160 ° C., a mixture of silica powder having a weight percentage of 5 to 15% and Teflon powder having a weight percentage of 5 to 25%. An insulating paint layer for a smooth substrate, characterized by the following.
JP06319047A 1994-11-29 1994-11-29 Insulating paint layer for smooth substrate Expired - Fee Related JP3136391B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP06319047A JP3136391B2 (en) 1994-11-29 1994-11-29 Insulating paint layer for smooth substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP06319047A JP3136391B2 (en) 1994-11-29 1994-11-29 Insulating paint layer for smooth substrate

Publications (2)

Publication Number Publication Date
JPH08153941A JPH08153941A (en) 1996-06-11
JP3136391B2 true JP3136391B2 (en) 2001-02-19

Family

ID=18105917

Family Applications (1)

Application Number Title Priority Date Filing Date
JP06319047A Expired - Fee Related JP3136391B2 (en) 1994-11-29 1994-11-29 Insulating paint layer for smooth substrate

Country Status (1)

Country Link
JP (1) JP3136391B2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000227316A (en) * 1999-02-04 2000-08-15 Keyence Corp Inspection device
JP4892803B2 (en) * 2001-08-31 2012-03-07 凸版印刷株式会社 Method for producing conductive pattern film
KR101112591B1 (en) * 2010-06-21 2012-02-15 아주스틸 주식회사 Metal pcb for electronic products and manufacturing method the same
KR101361171B1 (en) * 2012-11-02 2014-02-10 주식회사 엔엔피 Fabricating method for substrate
CN113782256B (en) * 2021-11-09 2022-02-18 南京邮电大学 Method for manufacturing low-surface-roughness transparent electrode

Also Published As

Publication number Publication date
JPH08153941A (en) 1996-06-11

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