JP3135223B2 - Embossed carrier tape - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an embossed carrier tape used for transport / storage of electronic components and supply to a mounting device, and more particularly, to a camera for storing electronic components in a storage recess after storing the electronic components in the storage recess. The present invention relates to an embossed carrier tape which is photographed by a camera, processes an imaging signal of the camera, and is used for inspection of lead bending of an electronic component or the like.

[0002]

2. Description of the Related Art An embossed carrier tape has a large number of recesses formed by press molding or the like at intervals in a longitudinal direction, and electronic components are housed in these recesses. Such an embossed carrier tape is called SOP (Small Outline).
Package) and QFP (Quad Flat Package) are suitable for storing semiconductor packages, and these semiconductor packages are frequently used for storage. When such a semiconductor package is stored in an embossed carrier tape, a functional inspection such as an electrical characteristic of the semiconductor package and an appearance inspection such as a defect of a part and a marking on a part surface are performed. The tape is attached with a top tape that covers the opening of the storage recess, and shipped.

[0003] Further, the semiconductor package housed in the housing recess of the carrier tape is inserted before the top tape is pasted, before the shipment after the top tape is pasted, etc., in the insertion direction, mixed with different kinds of products, and manufactured in lots. Inspections such as presence / absence of marking, missing parts, and bent leads are performed.
In general, this inspection is performed by visual inspection of an operator. However, it is easy to make a determination error, it is difficult to stabilize the determination standard, and further, inspection of a small semiconductor package in which leads are provided at a narrow pitch. Was virtually impossible.

In recent years, attempts have been made to automate the above-described appearance inspection and the like by an inspection apparatus using a camera, and some of them have been put to practical use. As this inspection device, LED
The semiconductor package in the storage recess is illuminated from the top side of the carrier tape with a light source using optical fiber or optical fiber, the illuminated semiconductor package is photographed by a camera such as a CCD, and binarized based on the image signal of the CCD camera. Alternatively, an image processing device such as a device that performs image processing such as gray scale pattern matching and inspects lead bending or the like is used.

[0005]

However, in the above-mentioned conventional embossed carrier tape, the recess is formed slightly larger than the size of the semiconductor package so that the semiconductor package can be easily stored and removed. A slope is provided on the side wall surface of the concave portion for die release during molding, and the semiconductor package has a flat portion on the tip end side of the lead, and this flat portion strongly reflects the illumination light of the inspection device during inspection. Further, it is difficult for the inspection device to illuminate the storage recess with uniform illuminance, and the illuminance around the storage recess tends to be lower than that of the upper surface of the main body of the semiconductor package. For this reason, at the time of inspection by the inspection device, if the semiconductor package is housed in the housing recess in a deviated state and the lead tip is in contact with the side wall surface, a virtual image of the lead is generated on the side wall surface of the housing recess and the actual lead ( Real image)
There has been a problem that leads cannot be accurately recognized depending on image processing of an image signal of a camera, and inspection cannot be performed.

Accordingly, the present applicant has previously proposed an embossed carrier tape capable of accurately inspecting a lead with a camera (reference number PK702171, filed on Feb. 17, 1997). This embossed carrier tape has an inclined surface that intersects the bottom wall surface at an obtuse angle at the lower part of the side wall surface of the storage recess and restricts the deviation of the lead to the side wall surface side with this inclined surface and the virtual image of the lead taken by the camera. It separates the real image from the real image.

By the way, when inspecting the semiconductor package in the storage recess of the embossed carrier tape, a method of holding the carrier tape horizontally and photographing with a camera,
A method in which the carrier tape is tilted and photographing is performed by a camera is appropriately selected, and the latter method is different from the former method in that the semiconductor package in the storage recess can be moved downward in the tilt direction and positioned at a fixed position. Excellent. And
When the embossed carrier tape according to the prior application described above is used in the former method, the virtual image can be separated from the real image, and the inspection can be performed accurately.

However, in the case of the embossed carrier tape according to the prior application, when the latter method is used, the semiconductor package slides the lead tip on the inclined surface and moves until the lead tip comes into contact with the side wall face. It was found that the test was easy and the reliability of the test was poor. That is, as described above, when the tip of the lead comes into contact with the side wall surface of the storage recess, it has been found that the real image and the virtual image of the lead continuously cannot be inspected, and the inclined surface does not function effectively. The present invention
The present invention has been made in view of the above-described problem and the above-mentioned problem of the prior application, and provides an embossed carrier tape that can accurately recognize a lead even when used for inspection in which an electronic component in a storage recess is photographed in an inclined state. It is another object of the present invention to obtain high reliability in an automatic inspection using a camera.

[0009]

In order to achieve the above object, according to the first aspect of the present invention, a plurality of substantially rectangular parallelepiped storage recesses are formed at intervals in the longitudinal direction, and these storage recesses are provided with leads. In an embossed carrier tape for housing electronic components, a side wall surface of the housing recess is inclined at an angle θ at which an upper surface side expands with respect to an upper surface of the tape, and a bottom wall surface and a side wall surface of the housing recess have a radius R. The angle θ is 90.1 to 10
At 0.0 °, the radius R was set to 0.1 to 1.0 mm.

According to a second aspect of the present invention, a large number of substantially rectangular parallelepiped storage recesses are formed at intervals in the longitudinal direction.
In an embossed carrier tape for storing electronic components with leads in these storage recesses, a pedestal portion on which the main body of the electronic component can be mounted is formed on the bottom wall surface of the storage recess by bulging to a height h. The side wall surface is inclined at an angle θ at which the upper surface side expands with respect to the upper surface of the tape, and the bottom wall surface and the side wall surface of the storage recess are connected to each other by a curved wall surface having a cross section of a radius R, and the angle θ is set to 90 °. .1 to 100.0
°, the radius R is (0.1 + h) to (1.0 + h) m
m.

The embossed carrier tape according to the first and second aspects of the present invention is characterized in that the embossed carrier tape is provided on the side wall surface of the housing recess so as to be in contact with the main body of the electronic component housed in the housing recess. It can be configured to form a part (claim 3).

The electronic component has a plurality of leads extending from two or all sides of the package body (main body) facing each other.
It is represented by a semiconductor package such as P. In the case of a semiconductor package such as an SOP, the height of the lead (stand-off) is generally 0.25 m at the maximum from the bottom of the main body.
m, the standoff varies within the range of the same height as the upper surface of the main body as an upper limit and the value of 0.25 mm lower than the lower surface of the main body as a lower limit. However, the stand-off value may vary depending on the type of the semiconductor package, and also in this case, the value varies within a range from the maximum value to the bottom surface of the main body.

In the embossed carrier tape, a number of feed holes are formed at one or both sides in the width direction at a predetermined pitch in parallel with the storage recess. This embossed carrier tape is formed by press molding, vacuum molding, air pressure molding, vacuum air pressure molding, or the like using a resin sheet of a thermoplastic resin such as polyethylene, polyvinyl chloride, amorphous polyester, or polycarbonate, or by injection molding using the above materials. Etc.

The storage recess has a three-dimensional shape corresponding to the electronic component, for example, a cubic or rectangular parallelepiped shape, and a side wall surface and a bottom wall surface are continuous with a curved wall surface. The side wall surface is inclined at an inclination angle θ with respect to the tape upper surface (surface), and the bottom wall surface is the same size as or larger than the shape defined by the envelope of the lead wire end of the electronic component to be housed. In the bottom wall surface, a pedestal portion having a predetermined height h is formed at a central portion so as to appropriately bulge in accordance with an electronic component housed therein.

The curved wall surface is defined by an angle φ and a radius R of a curved range between the side wall surface and the bottom wall surface, and the radius R and the angle φ (dimension of the bottom wall surface) are electronic components accommodated by the radius R. Is determined according to the stand-off of This curved wall surface abuts on the lead end of the electronic component when the electronic component moves or the like, desirably, the half on the bottom wall side abuts on the lead end, preventing direct contact between the lead end and the side wall surface. .

[0016]

The embossed carrier tape according to the present invention comprises:
When the electronic component moves when the electronic component stored in the storage recess is photographed by the camera, the tip of the lead comes into contact with the curved wall surface, but the angle of inclination of the curved wall surface (the tangent angle at the contact point of the lead tip) is on the side wall surface. As the resistance increases when the lead tip slides toward the side wall surface, the electronic component is pushed back by the reaction (spring back) when the lead tip contacts the curved wall surface.
Direct contact between the tip of the lead and the side wall surface is prevented. Even when the tip of the lead abuts against the curved wall surface, a considerable distance is formed between the tip of the lead and the side wall surface by the curved wall surface in a plan view. (Real images) are separated at a considerable interval, and leads can be accurately recognized by image processing of an image pickup signal.

More specifically, as described above, even if the electronic component moves for some reason when shooting in a horizontal state, if the lead tip comes into contact with the curved wall, the curved wall will spring back. Even when the electronic component is pushed back to the center of the bottom wall surface and tilted when shooting in the inclined state, even if the electronic component is moved, the resistance when the lead end slides on the curved wall surface becomes closer to the side wall surface. Since it becomes large, the lead end of the electronic component does not directly contact the side wall surface. That is, since the inclined surface of the embossed carrier tape according to the prior application described above is a flat surface, spring back of a large force cannot be expected, and when the inclined surface is inclined, the inclination of the inclined surface below the inclined surface is constant and small. Although the tip of the lead easily slides to the side wall surface, the embossed carrier tape of the present application can push back the electronic component by springback, and the sliding resistance of the lead end increases as it goes to the side wall. Direct contact with the side wall surface can be prevented.

[0018]

Embodiments of the present invention will be described below with reference to the drawings. 1 to 4 show an embossed carrier tape according to one embodiment of the present invention. FIG. 1 is a plan view, FIG. 2a is a cross-sectional view taken along the line AA of FIG. 1, and FIG. FIG. 3 is a schematic diagram illustrating a state different from the enlarged a, FIG. 3 is a cross-sectional view taken along line BB of FIG. 1, and FIG. 4 is a view illustrating a state in which electronic components housed in the embossed carrier tape are photographed by a camera.

1, 2, and 3, reference numeral 10 denotes an embossed carrier tape, and reference numeral 20 denotes an electronic component. In the embossed carrier tape 10, a large number of storage recesses 12 are formed at a constant interval (pitch) in the longitudinal direction of the tape at the center in the width direction, and a large number of feed holes 13 are formed at a pitch smaller than the storage recess 12 on one side in the width direction. You. Although illustration and detailed description are omitted, this embossed carrier tape 10 is attached with a top tape on the surface where the storage recess 12 opens in a state where the electronic component 20 is stored in the storage recess 12, and the opening of the storage recess 12 is opened. Is closed. Reference numeral 14 denotes a detection hole formed at the center of the bottom wall surface of the storage recess 12.

The electronic component 20 is, as shown in FIG.
A semiconductor package such as P, which has a plurality of leads 22 on two opposing side surfaces of the main body 21. Body 2
Reference numeral 1 denotes a resin mold or the like.
The tip portion is bent in a hook shape and extends toward the lower surface of the main body 21 at a prescribed standoff s. The electronic component 20 is accommodated in the accommodating recess 12 with the lead 22 aligned with the longitudinal direction of the tape, and when the electronic component 20 moves within the accommodating recess 12, the electronic component 20 can abut on a curved wall surface described later. Note that the electronic component 20 can be accommodated in the accommodating recess 12 with the leads 22 aligned with the tape width direction.

The storage recess 12 has a rectangular parallelepiped shape in which side walls 12b stand upright on four sides of a rectangular or square bottom wall 12a, and two sides of the bottom wall 12a in the tape longitudinal direction and the side walls 12b. And a curved wall surface 12c is formed between them. The bottom wall surface 12a has a plan view shape (curved wall surface 1).
Boundary line with 2c, that is, the shape defined by the inflection curve)
Have dimensions substantially the same as or larger than the shape defined by the envelopes of the body 21 and the leads 22 of the semiconductor package 20. The side wall surface 12b has an inclination angle θ at which the opening side widens with respect to the tape upper surface, specifically,
90.1 ° to 100.0 °, desirably 90.1 ° to
Incline at 93.0 °.

The curved wall surface 12c has a radius R within the range of the angle φ.
The cross section is curved in the shape of an arc. This curved wall surface 12c
Is determined according to the stand-off s of the semiconductor package 20, etc., and the angle φ is usually about 90 °.
° and the radius R is usually 0.1 mm to 1.
0 mm, preferably a value of about 0.15 mm to 0.40 mm is adopted.

In the embossed carrier tape 10 according to this embodiment, the semiconductor package 20 which has been subjected to a function test or the like is stored in the storage recess 12, and then a top tape is stuck to open the storage recess 12. Is closed. The embossed carrier tape 10 captures an image of the semiconductor package 20 in the storage recess 12 with the camera C before the top tape is bonded and after the top tape is bonded. The lead 22 is inspected for bending and the like by image processing.

That is, as shown in FIG. 4, the embossed carrier tape 10 is caused to travel forward and downward at a predetermined angle α, and the semiconductor package 20 is illuminated from above with a light source such as an LED and photographed by the camera C. Then, the image signal of the camera C is processed. The camera C and the LED used are integrally assembled, and the camera C is installed so as to be directed backward in the running direction by a slight angle β with respect to a vertical line on the upper surface of the tape.

Here, since the embossed carrier tape 10 is inclined downward at the front in the running direction, the semiconductor package 20 in the storage recess 12 moves forward in the tape running direction. However, in the semiconductor package 20, the leading end of the lead 22 on the front side in the running direction abuts on the curved wall surface 12c, specifically, the half of the curved wall surface 12c on the bottom wall surface 12a side, and the further side wall surface 12b Movement to the side is prohibited (see FIG. 2b). That is, the curved wall surface 12c
Since the angle of inclination increases as the direction toward the side wall surface 12b increases, the resistance to sliding of the tip of the lead 22 increases,
The lead 22 climbs over the curved wall surface 12c and the side wall surface 12b
Is prevented from directly contacting Therefore, a considerable distance δ is formed between the tip of the lead 22 and the side wall surface 12b in plan view, and the real image and the virtual image are separated by the distance δ,
The leads 22 can be accurately recognized by image processing.

5 and 6 show an embossed carrier tape according to a second embodiment of the present invention. FIG. 5 is a plan view, FIG. 6a is a sectional view taken along the line CC of FIG. 5, and FIG. 5
FIG. 4 is a sectional view taken along the line DD in FIG. In this embodiment and the embodiment described later, the same portions as those in the above-described embodiment are denoted by the same reference numerals, and a part of the description will be omitted.

In this embodiment, a semiconductor package 20 such as a QFP having leads 22 on all four sides of a main body 21 is used.
The lower edge of the side wall 12b of the four sides of the storage recess 12 is continuous with the bottom wall 12a. And
As in the above-described embodiment, the storage recess 12 has a bottom wall surface 12a having a size greater than or equal to the shape defined by the envelope of the tip of the lead 22 of the semiconductor package 20, and each side wall surface 12b
Is inclined at an angle θ of 90.1 ° to 100.0 °, and the curved wall surface 12c is curved with a radius R of 0.1 mm to 1.0 mm.

Even in this embodiment, the storage recess 12
The semiconductor package 20 is accommodated in the camera C, and an image is taken by the camera C. The image signal of the camera C is processed to determine the bending of the lead 22 or the like. For example, the embossed carrier tape 10 is run in a horizontal state, and the camera C photographs the semiconductor package 20 from above the tape.

Here, even if the semiconductor package 20 in the storage recess 12 moves for some reason before reaching the photographing position of the camera C, and the tip of the lead 22 abuts against the curved wall surface 12c, the semiconductor package 20 remains in the lead. Since the distal end of the lead 22 is returned by the spring back of the curved wall surface 12c when the distal end of the lead 22 contacts the curved wall surface 12c, a considerable distance is secured between the distal end of the lead 22 and the side wall surface 12b.
Even when the tip of the lead 22 and the curved wall surface 12c are in contact with each other, a considerable distance δ is formed in a plan view. Therefore,
A virtual image of the side wall surface 12b is separated from a real image of the lead 22,
The lead 22 can be accurately recognized by the image processing of the camera C.

7 and 8 show an embossed carrier tape according to a third embodiment of the present invention. FIG. 7 is a plan view, and FIG. 8 is a sectional view taken along the line EE of FIG. The embossed carrier tape according to this embodiment includes a storage recess 1.
A pedestal 19 is bulged at a predetermined height h at the center of the bottom wall 12 a of the second 2, and the main body 21 is placed on the pedestal 19 and the semiconductor package 20 is accommodated in the accommodation recess 12.

The storage recess 12 has a curved wall surface 12c.
Is the stand-off of the semiconductor package 20 and the pedestal 19
(0.1 + h) mm to (1.0+
h) mm, preferably (0.15 + h) mm to (0.
40 + h) mm, and the side wall surface 12
b is 90.1 ° to 100.0 °, preferably 90.1 °
It is formed to be inclined at an inclination angle of ° to 93 °.

9 and 10 show an embossed carrier tape according to a fourth embodiment of the present invention, wherein FIG. 9a is a plan view, FIG. 9b is a partially enlarged view of FIG. 9a, and FIG. FIG. 4 is a sectional view taken along the line FF in FIG. The embossed carrier tape 10 according to this embodiment has positioning protrusions 15 on the side wall surfaces 12 b on both sides in the tape width direction of the storage recess 12.
Bulges inward. As shown in FIG. 9B, the convex portion 15 has a bulging height f corresponding to a corner (in plan view) of the storage concave portion 12.
Is formed so as to be larger than the dimension g in plan view and not to exceed 1 mm.

In this embodiment, the storage recess 12
The position of the main body 21 of the semiconductor package 20 housed therein is regulated by the convex portion 15. Therefore, even if the semiconductor package 20 moves during the inspection, the leads 22 at the end of the semiconductor package 20 (subscript i is added for convenience of explanation) do not approach the curved portion of the corner of the storage recess 12. Also, the inspection of the end lead 22i by the camera C can be performed accurately.

That is, in the embossed carrier tape 10, a curved portion is inevitably formed at the corner of the accommodating concave portion 12 due to restrictions on the processing accuracy and moldability of the molding die. For this reason, when the lead 22i at the end of the semiconductor package 20 housed in the housing recess 12 extends toward the curved portion, the lead 2i at the end is
The virtual image 2i occurs at a position close to the lead 22i, and it is difficult to distinguish the real image from the virtual image even if the image signal of the camera C is processed. However, in this embodiment, the position of the main body 21 of the semiconductor package 20 is regulated by the convex portion 15 and the semiconductor package 20 is located off the curved portion toward the center. For this reason, even with the lead 22i at the end, the real image and the virtual image are separated from each other, and can be accurately recognized by image processing.

The shape of the projection 15 in the fourth embodiment is not limited to the above-described shape.
The shape of the projection can be appropriately selected, and for example, can be formed as shown in FIGS. 11A and 11B.

[0036]

As described above, according to the embossed carrier tape according to the present invention, the housing recess for housing the electronic component is formed so that the side wall surface is 90.1 ° to the tape upper surface.
The electronic component in the storage recess is photographed by a camera in order to incline at an angle θ of 100.0 ° and to make the side wall surface and the bottom wall surface continuous with a curved wall portion having a radius R of 0.1 mm to 1.0 mm. When inspecting for lead bending or the like, the effect of a virtual image generated on the side wall surface can be eliminated, and the inspection can be performed accurately.

[Brief description of the drawings]

FIG. 1 is a plan view of an embossed carrier tape according to a first embodiment of the present invention.

2A is a cross-sectional view taken along the line AA in FIG. 1, and FIG. 2B is a schematic diagram illustrating a state in which a part of “a” is different from “a”.

FIG. 3 is a sectional view taken along the line BB of FIG. 1;

FIG. 4 is a view schematically showing a state in which electronic components housed in the embossed carrier tape are photographed by a camera and inspected.

FIG. 5 is a plan view of an embossed carrier tape according to a second embodiment of the present invention.

6A is a sectional view taken along the line CC in FIG. 5, and FIG. 6B is a sectional view taken along the line DD in FIG.

FIG. 7 is a plan view of an embossed carrier tape according to a third embodiment of the present invention.

FIG. 8 is a sectional view taken along the line EE of FIG. 7;

FIG. 9 shows an embossed carrier tape according to a fourth embodiment of the present invention, wherein a is a plan view and b is a partially enlarged view of a.

FIG. 10 is a sectional view taken along the line FF in FIG. 9;

11A is a cross-sectional view illustrating another aspect of the embossed carrier tape according to the fourth embodiment, and FIG.

[Explanation of symbols]

 REFERENCE SIGNS LIST 10 emboss carrier tape 12 storage recess 12 a bottom wall 12 b side wall 12 c curved wall 15 positioning projection 20 semiconductor package (electronic component) 21 main body 22 lead R radius θ tilt angle

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-2-258573 (JP, A) JP-A-2-99771 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) B65D 73/02

Claims (3)

(57) [Claims] 1. An embossed carrier tape in which a plurality of substantially rectangular parallelepiped storage recesses are formed at intervals in a longitudinal direction and an electronic component with a lead is stored in each of the storage recesses. In contrast, the upper surface side is inclined at an angle θ that expands, and the bottom wall surface and the side wall surface of the storage recess are continuous with a curved wall surface having a partially arc-shaped cross section with a radius R, and the angle θ is 90.1 to 100.0. The embossed carrier tape, wherein the radius R is 0.1 to 1.0 mm. 2. An embossed carrier tape in which a plurality of substantially rectangular parallelepiped storage recesses are formed at intervals in a longitudinal direction and an electronic component with a lead is stored in these storage recesses, wherein the electronic component is provided on a bottom wall surface of the storage recess. The pedestal portion on which the main body can be mounted is bulged to a height h, and the side wall surface of the storage recess is inclined at an angle θ at which the upper surface side expands relative to the tape upper surface, and the bottom wall surface of the storage recess is The side wall surface is made continuous with a curved wall surface having a circular cross section with a radius R, the angle θ is set to 90.1 to 100.0 °, and the radius R is set to (0.1 + h) to (1.0 + h) mm. An embossed carrier tape, characterized in that: 3. The emboss carrier according to claim 1, wherein a projection for positioning is formed on a side wall surface of the storage recess so as to be able to contact the main body of the electronic component housed in the storage recess. tape.