JPH10245071A - Embossed carrier-tape - Google Patents

Embossed carrier-tape

Info

Publication number
JPH10245071A
JPH10245071A JP6750097A JP6750097A JPH10245071A JP H10245071 A JPH10245071 A JP H10245071A JP 6750097 A JP6750097 A JP 6750097A JP 6750097 A JP6750097 A JP 6750097A JP H10245071 A JPH10245071 A JP H10245071A
Authority
JP
Japan
Prior art keywords
wall surface
lead
embossed carrier
carrier tape
storage recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6750097A
Other languages
Japanese (ja)
Other versions
JP3135223B2 (en
Inventor
Hiroshi Kato
浩 加藤
Tomoyasu Kato
知康 加藤
Yasuyuki Takao
康幸 高尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Polymer Co Ltd
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Polymer Co Ltd
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Polymer Co Ltd, Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Polymer Co Ltd
Priority to JP09067500A priority Critical patent/JP3135223B2/en
Publication of JPH10245071A publication Critical patent/JPH10245071A/en
Application granted granted Critical
Publication of JP3135223B2 publication Critical patent/JP3135223B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

PROBLEM TO BE SOLVED: To provide an embossed carrier-tape in which pictures of electronic parts stored in its storage recesses are taken with a camera and bends or the like in leads can be checked automatically and correctly by image-processing an image-pickup signal from the camera. SOLUTION: In an embossed carrier-tape, a large number of storage recesses 12, which are open on the surface side, are formed, semiconductor packages 20 are stored in the storage recesses 12, and bends or the like in leads 22 are checked by taking pictures of the semiconductor packages 20 in the storage recesses 12 by a camera C. Both the side wall 12b of each storage recess 12 are inclined at an angle θ of 90.1-100.0 deg., and the side walls 12b each continues to a bottom wall 12a via a curved wall 12c having a circular-arc-shaped cross- section which curves with a radius R of 0.1mm-1.0mm. In the case the semiconductor package 20 moves in the storage recess 20, the front end of the lead 22 is allowed to contact the radial part of the curved wall 12c which is on the side of a bottom wall 12a, thereby preventing the direct contact of the front end of the lead 22 with the side wall 12b.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】この発明は、電子部品の輸送
・保管や装着装置への供給等に用いられるエンボスキャ
リアテープ、特に、電子部品を収納凹部に収納した後に
収納凹部内の電子部品をカメラで撮影し、このカメラの
撮像信号を処理して電子部品のリード曲がり等の検査に
供されるエンボスキャリアテープに関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an embossed carrier tape used for transport / storage of electronic components and supply to a mounting device, and more particularly, to a camera for storing electronic components in a storage recess after storing the electronic components in the storage recess. The present invention relates to an embossed carrier tape which is photographed by a camera, processes an imaging signal of the camera, and is used for inspection of lead bending of an electronic component or the like.

【0002】[0002]

【従来の技術】エンボスキャリアテープは、長手方向に
間隔を隔て多数の収納凹部をプレス成形等で形成してな
り、これら収納凹部内に電子部品を収納する。このよう
なエンボスキャリアテープは、SOP(Small Outline
Package)やQFP(Quad FlatPackage)等の半導体パ
ッケージの収納に適し、これら半導体パッケージの収納
多用されている。そして、このような半導体パッケージ
をエンボスキャリアテープへ収納する際には、半導体パ
ッケージの電気特性等の機能検査および部品の欠損、部
品表面のマーキング等の外観検査を行い、半導体パッケ
ージを収納した後にキャリアテープに収納凹部の開口を
塞ぐトップテープを貼合して出荷する。
2. Description of the Related Art An embossed carrier tape has a large number of recesses formed by press molding or the like at intervals in a longitudinal direction, and electronic components are housed in these recesses. Such an embossed carrier tape is called SOP (Small Outline).
Package) and QFP (Quad Flat Package) are suitable for storing semiconductor packages, and these semiconductor packages are frequently used for storage. When such a semiconductor package is stored in an embossed carrier tape, a functional inspection such as an electrical characteristic of the semiconductor package and an appearance inspection such as a defect of a part and a marking on a part surface are performed. The tape is attached with a top tape that covers the opening of the storage recess, and shipped.

【0003】また、キャリアテープの収納凹部に収納さ
れた半導体パッケージは、トップテープの貼合の前、お
よび、トップテープの貼合後の出荷前等において、その
挿入方向、異品種混入、製造ロット、マーキングの有
無、部品の欠落、リードの曲がり等の検査が行われる。
一般に、この検査は作業者の目視検査により行っている
が、判定ミスが発生しやすく、また、判断基準の一定化
が困難であり、さらに、リードが狭ピッチで設けられた
小型半導体パッケージの検査が実質的に不可能であっ
た。
[0003] Further, the semiconductor package housed in the housing recess of the carrier tape is inserted before the top tape is pasted, before the shipment after the top tape is pasted, etc., in the insertion direction, mixed with different kinds of products, and manufactured in lots. Inspections such as presence / absence of marking, missing parts, and bent leads are performed.
In general, this inspection is performed by visual inspection of an operator. However, it is easy to make a determination error, it is difficult to stabilize the determination standard, and further, inspection of a small semiconductor package in which leads are provided at a narrow pitch. Was virtually impossible.

【0004】そこで、近年では、上述した外観検査等を
カメラを用いた検査装置で自動化する試みがなされ、一
部で実用化されている。この検査装置としては、LED
やオプティカルファイバを利用した光源でキャリアテー
プ上面方向から収納凹部内の半導体パッケージを照明
し、この照明された半導体パッケージをCCD等のカメ
ラで撮影し、このCCDカメラの撮像信号を基に2値化
またはグレースケールパターンマッチング等の画像処理
を行ってリード曲がり等を検査するもの等が用いられて
いる。
In recent years, attempts have been made to automate the above-described appearance inspection and the like by an inspection apparatus using a camera, and some of them have been put to practical use. As this inspection device, LED
The semiconductor package in the storage recess is illuminated from the top side of the carrier tape with a light source using optical fiber or optical fiber, the illuminated semiconductor package is photographed by a camera such as a CCD, and binarized based on the image signal of the CCD camera. Alternatively, an image processing device such as a device that performs image processing such as gray scale pattern matching and inspects lead bending or the like is used.

【0005】[0005]

【発明が解決しようとする課題】しかしながら、上述し
た従来のエンボスキャリアテープにあっては、収納凹部
は半導体パッケージの収納・取出が容易に行えるように
半導体パッケージの寸法よりも若干大きく成形され、収
納凹部の側壁面には成形時の型抜き用の傾斜勾配が付与
され、また、半導体パッケージはリードの先端側に平坦
部を有し、この平坦部が検査に際して検査装置の照明光
を強く反射し、さらに、検査装置の照明も収納凹部を均
一な照度で照明することが難しく、半導体パッケージの
本体上面に比較して収納凹部周辺の照度が低くなる傾向
がある。このため、検査装置による検査に際して、半導
体パッケージが収納凹部内に偏った状態で収納されリー
ド先端が側壁面に当接していると、収納凹部の側壁面に
リードの虚像が生じて実際のリード(実像)と連続し、
カメラの撮像信号の画像処理によってはリードを正確に
認識できず、検査が不能になるという問題があった。
However, in the above-mentioned conventional embossed carrier tape, the recess is formed slightly larger than the size of the semiconductor package so that the semiconductor package can be easily stored and removed. A slope is provided on the side wall surface of the concave portion for die release during molding, and the semiconductor package has a flat portion on the tip end side of the lead, and this flat portion strongly reflects the illumination light of the inspection device during inspection. Further, it is difficult for the inspection device to illuminate the storage recess with uniform illuminance, and the illuminance around the storage recess tends to be lower than that of the upper surface of the main body of the semiconductor package. For this reason, at the time of inspection by the inspection device, if the semiconductor package is housed in the housing recess in a deviated state and the lead tip is in contact with the side wall surface, a virtual image of the lead is generated on the side wall surface of the housing recess and the actual lead ( Real image)
There has been a problem that leads cannot be accurately recognized depending on image processing of an image signal of a camera, and inspection cannot be performed.

【0006】そこで、本出願人にあっては、カメラによ
るリードの検査を正確に行えるエンボスキャリアテープ
を先に提案した(整理番号PK702171、平成9年
2月17日提出)。このエンボスキャリアテープは、収
納凹部の側壁面下部に底壁面と鈍角で交差する傾斜面を
形成し、この傾斜面でリードの側壁面側への偏倚を規制
してカメラにより撮影したリードの虚像と実像とを離間
させるものである。
Accordingly, the present applicant has previously proposed an embossed carrier tape capable of accurately inspecting a lead with a camera (reference number PK702171, filed on Feb. 17, 1997). This embossed carrier tape has an inclined surface that intersects the bottom wall surface at an obtuse angle at the lower part of the side wall surface of the storage recess and restricts the deviation of the lead to the side wall surface side with this inclined surface and the virtual image of the lead taken by the camera. It separates the real image from the real image.

【0007】ところで、エンボスキャリアテープの収納
凹部内の半導体パッケージの検査に際しては、キャリア
テープを水平に保持してカメラにより撮影する方法と、
キャリアテープを傾斜させてカメラにより撮影する方法
とが適宜選択され、後者の方法は収納凹部内の半導体パ
ッケージを傾斜方向下方に移動させて定位置に位置させ
ることができる点で前者の方法よりも優れる。そして、
上述した先願にかかるエンボスキャリアテープは、前者
の方法に用いた場合、虚像を実像から離間させることが
でき、検査を正確に行える。
By the way, when inspecting the semiconductor package in the storage recess of the embossed carrier tape, a method of holding the carrier tape horizontally and photographing with a camera,
A method in which the carrier tape is tilted and photographing is performed by a camera is appropriately selected, and the latter method is different from the former method in that the semiconductor package in the storage recess can be moved downward in the tilt direction and positioned at a fixed position. Excellent. And
When the embossed carrier tape according to the prior application described above is used in the former method, the virtual image can be separated from the real image, and the inspection can be performed accurately.

【0008】ところが、先願にかかるエンボスキャリア
テープにあっては、後者の方法に用いた場合、半導体パ
ッケージがリード先端を傾斜面上を摺動させてリード先
端が側壁面に当接するまで移動しやすく、検査の信頼性
に劣るということが判明した。すなわち、前述したよう
に、リード先端が収納凹部の側壁面と当接すると、リー
ドの実像と虚像が連続して検査が不能になり、傾斜面が
有効に機能しないということが判明した。この発明は、
前述した問題、また、上述した先願の不具合に鑑みてな
されたもので、傾斜させた状態で収納凹部内の電子部品
を撮影する検査に用いてもリードを正確に認識できるエ
ンボスキャリアテープを提供し、カメラを用いた自動検
査に高い信頼性を得ることを目的とする。
However, in the case of the embossed carrier tape according to the prior application, when the latter method is used, the semiconductor package slides the lead tip on the inclined surface and moves until the lead tip comes into contact with the side wall face. It was found that the test was easy and the reliability of the test was poor. That is, as described above, when the tip of the lead comes into contact with the side wall surface of the storage recess, it has been found that the real image and the virtual image of the lead continuously cannot be inspected, and the inclined surface does not function effectively. The present invention
The present invention has been made in view of the above-described problem and the above-mentioned problem of the prior application, and provides an embossed carrier tape that can accurately recognize a lead even when used for inspection in which an electronic component in a storage recess is photographed in an inclined state. It is another object of the present invention to obtain high reliability in an automatic inspection using a camera.

【0009】[0009]

【課題を解決するための手段】上記目的を達成するた
め、請求項1に記載の発明は、略直方体形状の多数の収
納凹部を長手方向に間隔を隔て形成し、これら収納凹部
にリード付きの電子部品を収納するエンボスキャリアテ
ープにおいて、前記収納凹部の側壁面をテープ上面に対
して上面側が拡開する角度θで傾斜させるとともに、前
記収納凹部の底壁面と側壁面とを半径Rの断面部分円弧
状の湾曲壁面で連続させ、前記角度θを90.1〜10
0.0°に、前記半径Rを0.1〜1.0mmとした。
In order to achieve the above object, according to the first aspect of the present invention, a plurality of substantially rectangular parallelepiped storage recesses are formed at intervals in the longitudinal direction, and these storage recesses are provided with leads. In an embossed carrier tape for housing electronic components, a side wall surface of the housing recess is inclined at an angle θ at which an upper surface side expands with respect to an upper surface of the tape, and a bottom wall surface and a side wall surface of the housing recess have a radius R. The angle θ is 90.1 to 10
At 0.0 °, the radius R was set to 0.1 to 1.0 mm.

【0010】また、請求項2に記載の発明は、略直方体
形状の多数の収納凹部を長手方向に間隔を隔て形成し、
これら収納凹部にリード付きの電子部品を収納するエン
ボスキャリアテープにおいて、前記収納凹部の底壁面に
前記電子部品の本体が載置可能な台座部を高さhに膨出
成形し、前記収納凹部の側壁面をテープ上面に対して上
面側が拡開する角度θで傾斜させるとともに、前記収納
凹部の底壁面と側壁面とを半径Rの断面部分円弧状の湾
曲壁面で連続させ、前記角度θを90.1〜100.0
°に、前記半径Rを(0.1+h)〜(1.0+h)m
mとした。
According to a second aspect of the present invention, a large number of substantially rectangular parallelepiped storage recesses are formed at intervals in the longitudinal direction.
In an embossed carrier tape for storing electronic components with leads in these storage recesses, a pedestal portion on which the main body of the electronic component can be mounted is formed on the bottom wall surface of the storage recess by bulging to a height h. The side wall surface is inclined at an angle θ at which the upper surface side expands with respect to the upper surface of the tape, and the bottom wall surface and the side wall surface of the storage recess are connected to each other by a curved wall surface having a cross section of a radius R and the angle θ is set to 90 ° .1 to 100.0
°, the radius R is (0.1 + h) to (1.0 + h) m
m.

【0011】そして、上記請求項1および請求項2に記
載のエンボスキャリアテープは、前記収納凹部の側壁面
に、該収納凹部内に収容された電子部品の本体と当接可
能に位置決め用の凸部を形成する態様(請求項3)に構
成することができる。
The embossed carrier tape according to the first and second aspects of the present invention is characterized in that the embossed carrier tape is provided on the side wall surface of the housing recess so as to be in contact with the main body of the electronic component housed in the housing recess. It can be configured to form a part (claim 3).

【0012】電子部品は、パッケージ本体(本体)の対
向する2辺あるいは全ての辺の側面からそれぞれ複数の
リードが延出するものであって、前述したSOPやQF
P等の半導体パッケージに代表される。SOP等の半導
体パッケージを例示すれば、一般に、リードの下方高さ
(スタンドオフ)が本体底面から下方に最大0.25m
mであって、スタンドオフは上限として本体底面と同一
高さ、下限として本体底面より0.25mm下がった値
の範囲で変動する。ただし、スタンドオフは、半導体パ
ッケージの種類によって数値が変動している場合もあ
り、この場合も最大値から本体底面の範囲で変動する。
The electronic component has a plurality of leads extending from two or all sides of the package body (main body) facing each other.
It is represented by a semiconductor package such as P. In the case of a semiconductor package such as an SOP, the height of the lead (stand-off) is generally 0.25 m at the maximum from the bottom of the main body.
m, the standoff varies within the range of the same height as the upper surface of the main body as an upper limit and the value of 0.25 mm lower than the lower surface of the main body as a lower limit. However, the stand-off value may vary depending on the type of the semiconductor package, and also in this case, the value varies within a range from the maximum value to the bottom surface of the main body.

【0013】エンボスキャリアテープは、収納凹部と平
行して多数の送り孔が所定のピッチで幅方向の一側ある
いは両側に形成される。このエンボスキャリアテープ
は、熱可塑性樹脂のポリエチレン、ポリ塩化ビニル、ア
モルファスポリエステル、ポリカーボネート等の樹脂シ
ートを用いてプレス成形、真空成形、圧空成形、真空圧
空成形等で、あるいは、上記材料を用い射出成形等で成
形される。
In the embossed carrier tape, a number of feed holes are formed at one or both sides in the width direction at a predetermined pitch in parallel with the storage recess. This embossed carrier tape is formed by press molding, vacuum molding, air pressure molding, vacuum air pressure molding, or the like using a resin sheet of a thermoplastic resin such as polyethylene, polyvinyl chloride, amorphous polyester, or polycarbonate, or by injection molding using the above materials. Etc.

【0014】収納凹部は、電子部品と対応した立体形
状、例えば、立方体あるいは直方体形状であって、側壁
面と底壁面が湾曲壁面で連続する。側壁面はテープ上面
(表面)に対して傾斜角度θで傾斜し、また、底壁面は
収容する電子部品のリード線端の包絡線で規定される形
状と同一の寸法あるいは該形状よりも大きな寸法を有
し、この底壁面には中央部に所定高さhの台座部が収納
する電子部品に応じて適宜膨出形成される(請求項
2)。
The storage recess has a three-dimensional shape corresponding to the electronic component, for example, a cubic or rectangular parallelepiped shape, and a side wall surface and a bottom wall surface are continuous with a curved wall surface. The side wall surface is inclined at an inclination angle θ with respect to the tape upper surface (surface), and the bottom wall surface is the same size as or larger than the shape defined by the envelope of the lead wire end of the electronic component to be housed. In the bottom wall surface, a pedestal portion having a predetermined height h is formed at a central portion so as to appropriately bulge in accordance with an electronic component housed therein.

【0015】湾曲壁面は側壁面と底壁面との間の湾曲範
囲の角度φ、および半径Rにより定められ、これら半径
Rおよび角度φ(底壁面の寸法)は半径Rの寸法が収容
する電子部品のスタンドオフに応じて定められる。この
湾曲壁面は、電子部品が移動した場合等に電子部品のリ
ード先端と当接、望ましくは、底壁面側の半部がリード
先端と当接し、リード先端と側壁面との直接接触を防止
する。
The curved wall surface is defined by an angle φ and a radius R of a curved range between the side wall surface and the bottom wall surface, and the radius R and the angle φ (dimension of the bottom wall surface) are electronic components accommodated by the radius R. Is determined according to the stand-off of This curved wall surface abuts on the lead end of the electronic component when the electronic component moves or the like, desirably, the half on the bottom wall side abuts on the lead end, preventing direct contact between the lead end and the side wall surface. .

【0016】[0016]

【作用】この発明にかかるエンボスキャリアテープは、
収納凹部内に収容した電子部品をカメラで撮影する際に
電子部品が移動すると、リード先端が湾曲壁面に当接す
るが、湾曲壁面の傾斜角度(リード先端の接触点におけ
る接線角度)が側壁面に向かうにしたがい大きくリード
先端が側壁面に向かって摺動する際の抵抗力も増大する
ため、また、リード先端が湾曲壁面に当接した時の反動
(スプリングバック)で電子部品が押し戻されるため、
そのリード先端と側壁面との直接接触が防止される。そ
して、リード先端が湾曲壁面に当接しても、リード先端
と側壁面との間には湾曲壁面により平面視で相当の間隔
が形成されるため、撮影時に側壁面に生じる虚像と実際
のリード(実像)は相当の間隔で隔てられ、撮像信号の
画像処理でリードを正確に認識できる。
The embossed carrier tape according to the present invention comprises:
When the electronic component moves when the electronic component stored in the storage recess is photographed by the camera, the tip of the lead comes into contact with the curved wall surface, but the angle of inclination of the curved wall surface (the tangent angle at the contact point of the lead tip) is on the side wall surface. As the resistance increases when the lead tip slides toward the side wall surface, the electronic component is pushed back by the reaction (spring back) when the lead tip contacts the curved wall surface.
Direct contact between the tip of the lead and the side wall surface is prevented. Even when the tip of the lead abuts against the curved wall surface, a considerable distance is formed between the tip of the lead and the side wall surface by the curved wall surface in a plan view. (Real images) are separated at a considerable interval, and leads can be accurately recognized by image processing of an image pickup signal.

【0017】より詳細に述べれば、前述したように、水
平状態で撮影する場合に電子部品が何らかの原因で移動
したとしたとしてもリード先端が湾曲壁部と当接すると
湾曲壁部のスプリングバックで電子部品が底壁面中央側
に押し戻され、また、傾斜状態で撮影する場合に傾斜さ
せることで電子部品が移動したとしてもリード先端が湾
曲壁面を摺動する際の抵抗が側壁面に向かうにしたがい
大きくなるため、電子部品のリード先端が直接に側壁面
に当接することがない。すなわち、前述した先願にかか
るエンボスキャリアテープの傾斜面は平面であるため大
きな力のスプリングバックを期待できず、また、傾斜さ
せた場合に傾斜下方の傾斜面の傾きが一定でかつ小さく
なるためリード先端が側壁面まで摺動しやすいが、本願
のエンボスキャリアテープはスプリングバックにより電
子部品を押し戻すことができ、また、リード先端の摺動
抵抗も側壁に向かうにともない大きくなるため、リード
先端が側壁面に直接接触することを防止できる。
More specifically, as described above, even if the electronic component moves for some reason when shooting in a horizontal state, if the lead tip comes into contact with the curved wall, the curved wall will spring back. Even when the electronic component is pushed back to the center of the bottom wall surface and tilted when shooting in the inclined state, even if the electronic component is moved, the resistance when the lead end slides on the curved wall surface becomes closer to the side wall surface. Since it becomes large, the lead end of the electronic component does not directly contact the side wall surface. That is, since the inclined surface of the embossed carrier tape according to the prior application described above is a flat surface, spring back of a large force cannot be expected, and when the inclined surface is inclined, the inclination of the inclined surface below the inclined surface is constant and small. Although the tip of the lead easily slides to the side wall surface, the embossed carrier tape of the present application can push back the electronic component by springback, and the sliding resistance of the lead end increases as it goes to the side wall. Direct contact with the side wall surface can be prevented.

【0018】[0018]

【実施の形態】以下、この発明の実施の形態を図面を参
照して説明する。図1から図4はこの発明の一の実施の
形態にかかるエンボスキャリアテープを示し、図1が平
面図、図2aが図1のA−A矢視断面図、図2bがaの
一部を拡大したaと異なる状態の模式図、図3が図1の
B−B矢視断面図、図4が同エンボスキャリアテープに
収容された電子部品をカメラにより撮影する状態を示す
図である。
Embodiments of the present invention will be described below with reference to the drawings. 1 to 4 show an embossed carrier tape according to one embodiment of the present invention. FIG. 1 is a plan view, FIG. 2a is a cross-sectional view taken along the line AA of FIG. 1, and FIG. FIG. 3 is a schematic diagram illustrating a state different from the enlarged a, FIG. 3 is a cross-sectional view taken along line BB of FIG. 1, and FIG. 4 is a view illustrating a state in which electronic components housed in the embossed carrier tape are photographed by a camera.

【0019】図1、2、3において、10はエンボスキ
ャリアテープ、20は電子部品を示す。エンボスキャリ
アテープ10には、幅方向中央に多数の収納凹部12が
テープ長手方向に一定間隔(ピッチ)で形成され、幅方
向一側に多数の送り孔13が収納凹部12より小さいピ
ッチで形成される。図示と詳細な説明は省略するが、こ
のエンボスキャリアテープ10は、収納凹部12内に電
子部品20を収容した状態で収納凹部12が開口する表
面にトップテープが貼合され、収納凹部12の開口が閉
止される。なお、14は収納凹部12の底壁面中央に形
成された検知孔である。
1, 2, and 3, reference numeral 10 denotes an embossed carrier tape, and reference numeral 20 denotes an electronic component. In the embossed carrier tape 10, a large number of storage recesses 12 are formed at a constant interval (pitch) in the longitudinal direction of the tape at the center in the width direction, and a large number of feed holes 13 are formed at a pitch smaller than the storage recess 12 on one side in the width direction. You. Although illustration and detailed description are omitted, this embossed carrier tape 10 is attached with a top tape on the surface where the storage recess 12 opens in a state where the electronic component 20 is stored in the storage recess 12, and the opening of the storage recess 12 is opened. Is closed. Reference numeral 14 denotes a detection hole formed at the center of the bottom wall surface of the storage recess 12.

【0020】電子部品20は、図2に示すように、SO
P等の半導体パッケージであって、本体21の対向する
2側面部にそれぞれ複数のリード22を有する。本体2
1は樹脂モールド等により構成され、また、リード22
は先端部分が鉤型状に屈曲して規定のスタンドオフsで
本体21の下面側へ延出する。この電子部品20は、リ
ード22をテープ長手方向に一致させて収納凹部12内
に収容され、収納凹部12内で移動した場合に後述する
湾曲壁面に当接可能となる。なお、電子部品20はリー
ド22をテープ幅方向に一致させて収納凹部12内に収
容することも可能である。
The electronic component 20 is, as shown in FIG.
A semiconductor package such as P, which has a plurality of leads 22 on two opposing side surfaces of the main body 21. Body 2
Reference numeral 1 denotes a resin mold or the like.
The tip portion is bent in a hook shape and extends toward the lower surface of the main body 21 at a prescribed standoff s. The electronic component 20 is accommodated in the accommodating recess 12 with the lead 22 aligned with the longitudinal direction of the tape, and when the electronic component 20 moves within the accommodating recess 12, the electronic component 20 can abut on a curved wall surface described later. Note that the electronic component 20 can be accommodated in the accommodating recess 12 with the leads 22 aligned with the tape width direction.

【0021】収納凹部12は、長方形状または正方形状
の底壁面12aの4辺部にそれぞれ側壁面12bが起立
する直方体形状を有し、底壁面12aのテープ長手方向
の2辺部と側壁面12bとの間に湾曲壁面12cが形成
される。底壁面12aは、その平面視形状(湾曲壁面1
2cとの境界線、すなわち、変曲線で規定される形状)
が半導体パッケージ20の本体21およびリード22の
包絡線で規定される形状と略同一の寸法あるいは該形状
よりも大きな寸法を有する。側壁面12bは、テープ上
面に対して開口側が拡幅する傾斜角度θ、具体的には、
90.1°〜100.0°、望ましくは、90.1°〜
93.0°で傾斜する。
The storage recess 12 has a rectangular parallelepiped shape in which side walls 12b stand upright on four sides of a rectangular or square bottom wall 12a, and two sides of the bottom wall 12a in the tape longitudinal direction and the side walls 12b. And a curved wall surface 12c is formed between them. The bottom wall surface 12a has a plan view shape (curved wall surface 1).
Boundary line with 2c, that is, the shape defined by the inflection curve)
Have dimensions substantially the same as or larger than the shape defined by the envelopes of the body 21 and the leads 22 of the semiconductor package 20. The side wall surface 12b has an inclination angle θ at which the opening side widens with respect to the tape upper surface, specifically,
90.1 ° to 100.0 °, desirably 90.1 ° to
Incline at 93.0 °.

【0022】湾曲壁面12cは、角度φの範囲で半径R
で湾曲する断面部分円弧状をなす。この湾曲壁面12c
の角度φおよび半径Rは半導体パッケージ20のスタン
ドオフs等に応じて定められるが、角度φは通常約90
°程度であり、また、半径Rは通常、0.1mm〜1.
0mm、好ましくは、0.15mm〜0.40mm程度
の値が採用される。
The curved wall surface 12c has a radius R within the range of the angle φ.
The cross section is curved in the shape of an arc. This curved wall surface 12c
Is determined according to the stand-off s of the semiconductor package 20, etc., and the angle φ is usually about 90 °.
° and the radius R is usually 0.1 mm to 1.
0 mm, preferably a value of about 0.15 mm to 0.40 mm is adopted.

【0023】この実施の形態にかかるエンボスキャリア
テープ10にあっては、機能検査等が完了した半導体パ
ッケージ20が収納凹部12内に収納され、この後、ト
ップテープが貼合されて収納凹部12開口が閉止され
る。そして、このエンボスキャリアテープ10はトップ
テープが貼合される前、また、トップテープが貼合され
た後に、収納凹部12内の半導体パッケージ20をカメ
ラCにより撮影し、このカメラCの撮像信号を画像処理
してそのリード22曲がり等を検査する。
In the embossed carrier tape 10 according to this embodiment, the semiconductor package 20 which has been subjected to a function test or the like is stored in the storage recess 12, and then a top tape is stuck to open the storage recess 12. Is closed. The embossed carrier tape 10 captures an image of the semiconductor package 20 in the storage recess 12 with the camera C before the top tape is bonded and after the top tape is bonded. The lead 22 is inspected for bending and the like by image processing.

【0024】すなわち、図4に示すように、エンボスキ
ャリアテープ10を走行方向前方下向きに所定角度αで
傾斜させて走行させ、半導体パッケージ20を上方から
LED等の光源で照明してカメラCにより撮影し、この
カメラCの撮像信号を画像処理する。そして、これらカ
メラCおよびLEDは一体的に組み付けられたものを用
い、また、カメラCをテープ上面の垂直線に対して若干
の角度βだけ走行方向後方に指向させて設置する。
That is, as shown in FIG. 4, the embossed carrier tape 10 is caused to travel forward and downward at a predetermined angle α, and the semiconductor package 20 is illuminated from above with a light source such as an LED and photographed by the camera C. Then, the image signal of the camera C is processed. The camera C and the LED used are integrally assembled, and the camera C is installed so as to be directed backward in the running direction by a slight angle β with respect to a vertical line on the upper surface of the tape.

【0025】ここで、エンボスキャリアテープ10は走
行方向前方を下向きに傾斜するため、収納凹部12内の
半導体パッケージ20はテープ走行方向前方に移動す
る。しかしながら、半導体パッケージ20は走行方向前
方側のリード22先端が湾曲壁面12cと当接、具体的
には、湾曲壁面12cの底壁面12a側の半部に当接し
てリード22先端のさらなる側壁面12b側への移動が
禁止される(図2b参照)。すなわち、湾曲壁面12c
は側壁面12b側に向かうにともない傾斜角度が大きく
リード22先端の摺動に対する抵抗力が増大するため、
リード22が湾曲壁面12cを乗り越えて側壁面12b
と直接に当接することが防止される。したがって、リー
ド22先端と側壁面12bとの間には平面視で相当の距
離δが形成され、実像と虚像が距離δにより分離され、
リード22を画像処理により正確に認識できる。
Here, since the embossed carrier tape 10 is inclined downward at the front in the running direction, the semiconductor package 20 in the storage recess 12 moves forward in the tape running direction. However, in the semiconductor package 20, the leading end of the lead 22 on the front side in the running direction abuts on the curved wall surface 12c, specifically, the half of the curved wall surface 12c on the bottom wall surface 12a side, and the further side wall surface 12b Movement to the side is prohibited (see FIG. 2b). That is, the curved wall surface 12c
Since the angle of inclination increases as the direction toward the side wall surface 12b increases, the resistance to sliding of the tip of the lead 22 increases,
The lead 22 climbs over the curved wall surface 12c and the side wall surface 12b
Is prevented from directly contacting Therefore, a considerable distance δ is formed between the tip of the lead 22 and the side wall surface 12b in plan view, and the real image and the virtual image are separated by the distance δ,
The leads 22 can be accurately recognized by image processing.

【0026】図5および図6はこの発明の第2の実施の
形態にかかるエンボスキャリアテープを示し、図5が平
面図、図6aが図5のC−C矢視断面図、図6bが図5
のD−D矢視断面図である。なお、この実施の形態およ
び後述する実施の形態においては、前述した実施の形態
と同一の部分には同一の番号を付して一部の説明を省略
する。
5 and 6 show an embossed carrier tape according to a second embodiment of the present invention. FIG. 5 is a plan view, FIG. 6a is a sectional view taken along the line CC of FIG. 5, and FIG. 5
FIG. 4 is a sectional view taken along the line DD in FIG. In this embodiment and the embodiment described later, the same portions as those in the above-described embodiment are denoted by the same reference numerals, and a part of the description will be omitted.

【0027】この実施の形態は、本体21の4辺部全て
にリード22を有するQFP等の半導体パッケージ20
を収容するエンボスキャリアテープ10であって、この
エンボスキャリアテープ10は収納凹部12の4辺の側
壁部12bの下縁が底壁面12aと連続する。そして、
前述した実施の形態と同様に、収納凹部12は、底壁面
12aが半導体パッケージ20のリード22先端の包絡
線で規定される形状以上の寸法を有し、各側壁面12b
が90.1°〜100.0°の角度θで傾斜し、湾曲壁
面12cが0.1mm〜1.0mmの半径Rで湾曲す
る。
In this embodiment, a semiconductor package 20 such as a QFP having leads 22 on all four sides of a main body 21 is used.
The lower edge of the side wall 12b of the four sides of the storage recess 12 is continuous with the bottom wall 12a. And
As in the above-described embodiment, the storage recess 12 has a bottom wall surface 12a having a size greater than or equal to the shape defined by the envelope of the tip of the lead 22 of the semiconductor package 20, and each side wall surface 12b
Is inclined at an angle θ of 90.1 ° to 100.0 °, and the curved wall surface 12c is curved with a radius R of 0.1 mm to 1.0 mm.

【0028】この実施の形態にあっても、収納凹部12
内に半導体パッケージ20を収容した状態でカメラCに
より撮影し、このカメラCの撮像信号を画像処理してリ
ード22の曲がり等を判定する。例えば、エンボスキャ
リアテープ10を水平状態で走行させ、このテープの上
方からカメラCにより半導体パッケージ20を撮影す
る。
Even in this embodiment, the storage recess 12
The semiconductor package 20 is accommodated in the camera C, and an image is taken by the camera C. The image signal of the camera C is processed to determine the bending of the lead 22 or the like. For example, the embossed carrier tape 10 is run in a horizontal state, and the camera C photographs the semiconductor package 20 from above the tape.

【0029】ここで、収納凹部12内の半導体パッケー
ジ20がカメラCの撮影位置に到達するまでに何らかの
原因で移動してリード22先端が湾曲壁面12cに当接
したとしても、半導体パッケージ20はリード22先端
が湾曲壁面12cと当接した際の湾曲壁面12cのスプ
リングバックにより戻されるため、リード22先端と側
壁面12bとの間に相当の距離が確保され、また例え、
リード22先端と湾曲壁面12cが当接した状態にあっ
ても平面視で相当の距離δが形成される。したがって、
側壁面12bの虚像とリード22の実像とが隔てられ、
カメラCの画像処理でリード22を正確に認識できる。
Here, even if the semiconductor package 20 in the storage recess 12 moves for some reason before reaching the photographing position of the camera C, and the tip of the lead 22 abuts against the curved wall surface 12c, the semiconductor package 20 remains in the lead. Since the distal end of the lead 22 is returned by the spring back of the curved wall surface 12c when the distal end of the lead 22 contacts the curved wall surface 12c, a considerable distance is secured between the distal end of the lead 22 and the side wall surface 12b.
Even when the tip of the lead 22 and the curved wall surface 12c are in contact with each other, a considerable distance δ is formed in a plan view. Therefore,
A virtual image of the side wall surface 12b is separated from a real image of the lead 22,
The lead 22 can be accurately recognized by the image processing of the camera C.

【0030】図7および図8はこの発明の第3の実施の
形態にかかるエンボスキャリアテープを示し、図7が平
面図、図8が図7のE−E矢視断面図である。この実施
の形態にかかるエンボスキャリアテープは、収納凹部1
2の底壁面12a中央部に台座19を所定高さhに膨出
形成し、本体21を台座19上に載せて半導体パッケー
ジ20を収納凹部12内に収容する。
7 and 8 show an embossed carrier tape according to a third embodiment of the present invention. FIG. 7 is a plan view, and FIG. 8 is a sectional view taken along the line EE of FIG. The embossed carrier tape according to this embodiment includes a storage recess 1.
A pedestal 19 is bulged at a predetermined height h at the center of the bottom wall 12 a of the second 2, and the main body 21 is placed on the pedestal 19 and the semiconductor package 20 is accommodated in the accommodation recess 12.

【0031】そして、収納凹部12は、湾曲壁面12c
が半導体パッケージ20のスタンドオフおよび台座19
の高さh等に応じて(0.1+h)mm〜(1.0+
h)mm、望ましくは、(0.15+h)mm〜(0.
40+h)mmの半径Rで形成され、また、側壁面12
bが90.1°〜100.0°、望ましくは、90.1
°〜93°の傾斜角度に傾斜して形成される。
The storage recess 12 has a curved wall surface 12c.
Is the stand-off of the semiconductor package 20 and the pedestal 19
(0.1 + h) mm to (1.0+
h) mm, preferably (0.15 + h) mm to (0.
40 + h) mm, and the side wall surface 12
b is 90.1 ° to 100.0 °, preferably 90.1 °
It is formed to be inclined at an inclination angle of ° to 93 °.

【0032】図9および図10はこの発明の第4の他の
実施の形態にかかるエンボスキャリアテープを示し、図
9aが平面図、図9bが図9aの一部拡大図、図10が
図9aのF−F矢視断面図である。この実施の形態にか
かるエンボスキャリアテープ10は、収納凹部12のテ
ープ幅方向両側の側壁面12bに位置決め用の凸部15
を内側に膨出形成する。この凸部15は、図9bに示す
ように、その膨出高さfが収納凹部12の角(平面視)
の平面視寸法gよりも大きく、かつ、1mmを超えない
ように形成される。
9 and 10 show an embossed carrier tape according to a fourth embodiment of the present invention, wherein FIG. 9a is a plan view, FIG. 9b is a partially enlarged view of FIG. 9a, and FIG. FIG. 4 is a sectional view taken along the line FF in FIG. The embossed carrier tape 10 according to this embodiment has positioning protrusions 15 on the side wall surfaces 12 b on both sides in the tape width direction of the storage recess 12.
Bulges inward. As shown in FIG. 9B, the convex portion 15 has a bulging height f corresponding to a corner (in plan view) of the storage concave portion 12.
Is formed so as to be larger than the dimension g in plan view and not to exceed 1 mm.

【0033】この実施の形態にあっては、収納凹部12
内に収容された半導体パッケージ20は本体21が凸部
15により位置規制される。このため、検査の時に半導
体パッケージ20が移動したとしても、半導体パッケー
ジ20の端のリード22(説明の便宜上、iの添え字を
付す)が収納凹部12の角の湾曲部に近接することが無
く、端のリード22iのカメラCによる検査も正確に行
える。
In this embodiment, the storage recess 12
The position of the main body 21 of the semiconductor package 20 housed therein is regulated by the convex portion 15. Therefore, even if the semiconductor package 20 moves during the inspection, the leads 22 at the end of the semiconductor package 20 (subscript i is added for convenience of explanation) do not approach the curved portion of the corner of the storage recess 12. Also, the inspection of the end lead 22i by the camera C can be performed accurately.

【0034】すなわち、エンボスキャリアテープ10は
収納凹部12の角に成形金型の加工精度や成形性等の制
約から湾曲部が不可避的に形成される。このため、収納
凹部12内に収容した半導体パッケージ20の端のリー
ド22iが湾曲部に向かって延出すると、端のリード2
2iの虚像がリード22iと近接した位置に生じ、カメ
ラCの撮像信号を画像処理しても実像と虚像を区別する
ことが困難である。しかしながら、この実施の形態にあ
っては、半導体パッケージ20は本体21が凸部15に
より位置規制されて中央側に湾曲部から外れて位置す
る。このため、端のリード22iに付いても、実像と虚
像が離れ、画像処理により正確に認識できるようにな
る。
That is, in the embossed carrier tape 10, a curved portion is inevitably formed at the corner of the accommodating concave portion 12 due to restrictions on the processing accuracy and moldability of the molding die. For this reason, when the lead 22i at the end of the semiconductor package 20 housed in the housing recess 12 extends toward the curved portion, the lead 2i at the end is
The virtual image 2i occurs at a position close to the lead 22i, and it is difficult to distinguish the real image from the virtual image even if the image signal of the camera C is processed. However, in this embodiment, the position of the main body 21 of the semiconductor package 20 is regulated by the convex portion 15 and the semiconductor package 20 is located off the curved portion toward the center. For this reason, even with the lead 22i at the end, the real image and the virtual image are separated from each other, and can be accurately recognized by image processing.

【0035】なお、上述した第4の実施の形態における
凸部15は、上述した形状に限定されるものではなく、
凸部の形状は適宜選択でき、例えば、図11a,bに示
すように形成することも可能である。
The shape of the projection 15 in the fourth embodiment is not limited to the above-described shape.
The shape of the projection can be appropriately selected, and for example, can be formed as shown in FIGS. 11A and 11B.

【0036】[0036]

【発明の効果】以上説明したように、この発明にかかる
エンボスキャリアテープによれば、電子部品を収容する
収納凹部を、側壁面がテープ上面に対して90.1°〜
100.0°の角度θで傾斜し、側壁面と底壁面とを
0.1mm〜1.0mmの半径Rで湾曲する湾曲壁部で
連続させるため、収納凹部内の電子部品をカメラにより
撮影してリードの曲がり等を検査する際に、側壁面に生
じる虚像の影響を排除でき、その検査を正確に行える。
As described above, according to the embossed carrier tape according to the present invention, the housing recess for housing the electronic component is formed so that the side wall surface is 90.1 ° to the tape upper surface.
The electronic component in the storage recess is photographed by a camera in order to incline at an angle θ of 100.0 ° and to make the side wall surface and the bottom wall surface continuous with a curved wall portion having a radius R of 0.1 mm to 1.0 mm. When inspecting for lead bending or the like, the effect of a virtual image generated on the side wall surface can be eliminated, and the inspection can be performed accurately.

【図面の簡単な説明】[Brief description of the drawings]

【図1】この発明の第1の実施の形態にかかるエンボス
キャリアテープの平面図である。
FIG. 1 is a plan view of an embossed carrier tape according to a first embodiment of the present invention.

【図2】aが図1のA−A矢視断面図、bがaの一部を
拡大したaと異なる状態の模式図である。
2A is a cross-sectional view taken along the line AA in FIG. 1, and FIG. 2B is a schematic diagram illustrating a state in which a part of “a” is different from “a”.

【図3】図1のB−B矢視断面図である。FIG. 3 is a sectional view taken along the line BB of FIG. 1;

【図4】同エンボスキャリアテープに収容された電子部
品をカメラにより撮影して検査する際の状態を模式的に
示す図である。
FIG. 4 is a view schematically showing a state in which electronic components housed in the embossed carrier tape are photographed by a camera and inspected.

【図5】この発明の第2の実施の形態にかかるエンボス
キャリアテープの平面図である。
FIG. 5 is a plan view of an embossed carrier tape according to a second embodiment of the present invention.

【図6】aが図5のC−C矢視断面図、bがD−D矢視
断面図である。
6A is a sectional view taken along the line CC in FIG. 5, and FIG. 6B is a sectional view taken along the line DD in FIG.

【図7】この発明の第3の実施の形態にかかるエンボス
キャリアテープの平面図である。
FIG. 7 is a plan view of an embossed carrier tape according to a third embodiment of the present invention.

【図8】図7のE−E矢視断面図である。FIG. 8 is a sectional view taken along the line EE in FIG. 7;

【図9】この発明の第4の実施の形態にかかるエンボス
キャリアテープを示し、aが平面図、bがaの一部拡大
図である。
FIG. 9 shows an embossed carrier tape according to a fourth embodiment of the present invention, wherein a is a plan view and b is a partially enlarged view of a.

【図10】図9のF−F矢視断面図である。FIG. 10 is a sectional view taken along the line FF in FIG. 9;

【図11】aが第4の実施の形態にかかるエンボスキャ
リアテープの他の態様を、bがまた他の態様を示す断面
図である。
11A is a cross-sectional view illustrating another aspect of the embossed carrier tape according to the fourth embodiment, and FIG.

【符号の説明】[Explanation of symbols]

10 エンボスキャリアテープ 12 収納凹部 12a 底壁面 12b 側壁面 12c 湾曲壁面 15 位置決め用の凸部 20 半導体パッケージ(電子部品) 21 本体 22 リード R 半径 θ 傾斜角度 DESCRIPTION OF SYMBOLS 10 Emboss carrier tape 12 Storage recessed part 12a Bottom wall surface 12b Side wall surface 12c Curved wall surface 15 Projection part for positioning 20 Semiconductor package (electronic component) 21 Main body 22 Lead R radius θ Tilt angle

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 略直方体形状の多数の収納凹部を長手方
向に間隔を隔て形成し、これら収納凹部にリード付きの
電子部品を収納するエンボスキャリアテープにおいて、 前記収納凹部の側壁面をテープ上面に対して上面側が拡
開する角度θで傾斜させるとともに、前記収納凹部の底
壁面と側壁面とを半径Rの断面部分円弧状の湾曲壁面で
連続させ、 前記角度θを90.1〜100.0°に、前記半径Rを
0.1〜1.0mmとしたことを特徴とするエンボスキ
ャリアテープ。
1. An embossed carrier tape in which a plurality of substantially rectangular parallelepiped storage recesses are formed at intervals in a longitudinal direction and an electronic component with a lead is stored in each of the storage recesses. In contrast, the upper surface side is inclined at an angle θ that expands, and the bottom wall surface and the side wall surface of the storage recess are continuous with a curved wall surface having a partially arc-shaped cross section with a radius R, and the angle θ is 90.1 to 100.0. The embossed carrier tape, wherein the radius R is 0.1 to 1.0 mm.
【請求項2】 略直方体形状の多数の収納凹部を長手方
向に間隔を隔て形成し、これら収納凹部にリード付きの
電子部品を収納するエンボスキャリアテープにおいて、 前記収納凹部の底壁面に前記電子部品の本体が載置可能
な台座部を高さhに膨出成形し、前記収納凹部の側壁面
をテープ上面に対して上面側が拡開する角度θで傾斜さ
せるとともに、前記収納凹部の底壁面と側壁面とを半径
Rの断面部分円弧状の湾曲壁面で連続させ、 前記角度θを90.1〜100.0°に、前記半径Rを
(0.1+h)〜(1.0+h)mmとしたことを特徴
とするエンボスキャリアテープ。
2. An embossed carrier tape in which a plurality of substantially rectangular parallelepiped storage recesses are formed at intervals in a longitudinal direction and an electronic component with a lead is stored in these storage recesses, wherein the electronic component is provided on a bottom wall surface of the storage recess. The pedestal portion on which the main body can be mounted is bulged to a height h, and the side wall surface of the storage recess is inclined at an angle θ at which the upper surface side expands with respect to the tape upper surface, and the bottom wall surface of the storage recess is formed. The side wall surface is made continuous with a curved wall surface having a circular cross section with a radius R, the angle θ is set to 90.1 to 100.0 °, and the radius R is set to (0.1 + h) to (1.0 + h) mm. An embossed carrier tape, characterized in that:
【請求項3】 前記収納凹部の側壁面に、該収納凹部内
に収容された電子部品の本体と当接可能に位置決め用の
凸部を形成した請求項1または請求項2に記載のエンボ
スキャリアテープ。
3. The emboss carrier according to claim 1, wherein a projection for positioning is formed on a side wall surface of the storage recess so as to be able to contact the main body of the electronic component housed in the storage recess. tape.
JP09067500A 1997-03-06 1997-03-06 Embossed carrier tape Expired - Lifetime JP3135223B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP09067500A JP3135223B2 (en) 1997-03-06 1997-03-06 Embossed carrier tape

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP09067500A JP3135223B2 (en) 1997-03-06 1997-03-06 Embossed carrier tape

Publications (2)

Publication Number Publication Date
JPH10245071A true JPH10245071A (en) 1998-09-14
JP3135223B2 JP3135223B2 (en) 2001-02-13

Family

ID=13346779

Family Applications (1)

Application Number Title Priority Date Filing Date
JP09067500A Expired - Lifetime JP3135223B2 (en) 1997-03-06 1997-03-06 Embossed carrier tape

Country Status (1)

Country Link
JP (1) JP3135223B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002019831A (en) * 2000-07-11 2002-01-23 Oki Electric Ind Co Ltd Embossed carrier tape
JP2006160369A (en) * 2004-11-15 2006-06-22 Shin Etsu Polymer Co Ltd Embossed carrier tape and method for manufacturing the same
JP2006273426A (en) * 2005-03-02 2006-10-12 Shin Etsu Polymer Co Ltd Embossing carrier tape and its manufacturing method
JP2008273578A (en) * 2007-04-27 2008-11-13 Koa Corp Packaging tape and electronic component for surface mounting

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002019831A (en) * 2000-07-11 2002-01-23 Oki Electric Ind Co Ltd Embossed carrier tape
JP2006160369A (en) * 2004-11-15 2006-06-22 Shin Etsu Polymer Co Ltd Embossed carrier tape and method for manufacturing the same
JP2006273426A (en) * 2005-03-02 2006-10-12 Shin Etsu Polymer Co Ltd Embossing carrier tape and its manufacturing method
JP2008273578A (en) * 2007-04-27 2008-11-13 Koa Corp Packaging tape and electronic component for surface mounting

Also Published As

Publication number Publication date
JP3135223B2 (en) 2001-02-13

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