JP3131709B2 - IC frame transport mechanism in hydraulic deburring device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a hydraulic deburring apparatus.
The present invention relates to an improvement of an IC frame transport mechanism in a target-type hydraulic deburring apparatus, and was developed mainly for a transport mechanism in the vicinity of a high-pressure water injection area.

[0002]

2. Description of the Related Art There are two types of hydraulic deburring devices: one is to remove burrs by applying high-pressure water to the entire surface, and the other is to remove burrs by hitting the IC frame.
In the case of the full-surface type, since it is not necessary to stop the IC frame in the high-pressure water injection area, a transport system such as a round belt, a roller, and a flat belt is usually used. However, in the case of the target hitting type, in order to inject and process in a limited area, in addition to a normal transport device, a separate IC frame receiving jig and a pick-and-place mechanism for transferring to the receiving jig. Equipment is required.

[0003]

SUMMARY OF THE INVENTION According to the present invention, an IC frame receiving jig that can be driven in the X and Y directions without using a separate transfer device such as a pick and place device is used as a part of the transport path. It is an object of the present invention to provide a transport mechanism that can transport an IC frame in a hydraulic deburring device without using a separate device or the like for transport.

[0004]

In order to achieve the above object, the present invention eliminates burrs by injecting high-pressure water into an IC frame.
In hydraulic deburring apparatus, the conveyance path of the IC frame, the frame feeding device for moving the conveying direction of the IC frame of the transport path including the jig unit receives a receiving jig portion which forms part of the conveying path distribution And transfer the receiving jig to the IC frame
From the upper and lower molds that are open and closed when deburring
Configure and drive the receiving jig in X and Y directions
An XY drive unit is provided to enable reception by the XY drive unit.
Move the jig to a position where it receives high-pressure water from the high-pressure water injection gun.
An IC frame transport mechanism characterized by being movable .

[0005]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 to 3 are general views of a hydraulic deburring apparatus using the IC frame transport mechanism according to the present invention. The hydraulic deburring apparatus is shown in a front view of FIG. 1 and an internal plan view of FIG. A loader unit 1, a processing unit 2, and an unloader unit 3. That is, the IC frame is sent from the loader unit 1 to the processing unit 2
After the deburring process is completed in the processing unit 2, it is sent to the unloader unit 3.

The processing unit 2 includes a table 4 for receiving an IC frame from the loader unit 1 as shown in the plan view of FIG.
And a frame feeder 5 (FIG. 1)
3 to 3 are omitted and shown in FIG. ) And I
The receiving jig portion 6 in which two C frames are stored, and the receiving jig portion 6 has mobility in the X direction (a direction intersecting the transport direction) and the Y direction (a front-back direction with respect to the transport direction). XY drive unit 7, upper rotating gun 8 for jetting high-pressure water for deburring from above, lower rotary gun 8 'for jetting high-pressure water for deburring from below, frame feeder 5 from receiving jig unit 6. A table 4 'for receiving the IC frame sent from the server is provided.

The frame feeder 5 has a transporting and positioning function, and as shown in FIG. 4, three sets of claws 9, 9 ', 10, 10', 11, 1 which hold the IC frame.
1 ′. The frame feeder 5 receives the IC frame on the table 4 by a pair of claws 9 and 9 ′ on the left side (upper in FIG. 4) and conveys the IC frame to the jig unit 6 side.
The center pair of claws 10, 10 'is used to feed the IC frame from the upper surface processing unit 26 on the near side in the transport direction of the jig unit 6 to the lower surface processing unit 26' on the forward side in the transport direction. The pair of claws 11 and 11 ′ (4 middle and lower) receive the IC frame and feed the frame from the jig section 6 to the unloader section side table 4 ′.

As shown in the side view showing the open / close state of FIGS. 5 and 6, the receiving jig portion 6 includes a lower die 14 which is a part of a work transfer path and an upper die for fixing the work during processing. 15 is hinged so as to be openable and closable with a side (left side in the figure) remote from the work transport path as a fulcrum. Incidentally, the receiving jig portion 6 in the embodiment is provided with two IC frames 30 at the same time.
As shown in FIG. 4, two work receiving jig structures (upper surface processing section 26, lower surface processing section 26 ′) are provided in series in the front and rear direction in the transport direction. I have.

In the lower die 14, as shown in FIG. 4, hollow portions 16 and 16 'are provided in the same shape at two positions in the front and rear directions in the transport direction according to the size of the IC frame which is a work. The cavities 16, 16 'are formed in the center of the lower mold 14 so that the vicinity of the outer periphery of the package 31 of the IC frame 30 can be treated with high-pressure water.

A slit forming plate 1 for passing the work, which is long in the work transfer direction, is formed in the edge of the cavity 16 of the lower mold 14.
7 is mounted. The slit forming plate 17 is provided with notches 18 at predetermined intervals. The slit forming plate 17 has left and right (up and down in FIG. 4) hollow portions 1 on the side remote from the transport path.
6 and 16 ', the slit forming plate 17' on the conveyance path side may be slightly shorter than the length of the work for retracting the feed claws of the frame feed device 5 (see FIG. 4). It must be installed separately. still,
In FIG. 7, portions indicated by dotted lines on the slit forming plates 17 and 17 ′ are the end sides of the slit 19.

In the figure, reference numeral 20 denotes a supporting protrusion of the package.
The support protrusion 20 is provided with the IC in a line in the center conveyance direction of the cavity 16.
It is provided in accordance with the number of packages and the interval of the frame. The support projection 20 is configured as a series of sets and is mounted on the lower mold 14 as shown on the left side of FIG. 8, which is a partially cutaway front view taken along the dashed-dotted line AA in FIG.

[0012] As shown in FIG.
In FIGS. 6 and 16 ′, the support protrusion 20 is attached to the cavity 16 of the upper surface processing unit 26 in the upper part of the figure, but the support protrusion 20 is attached to the cavity 16 ′ of the lower surface processing part 26 ′ in the lower part of the figure. 2
0 is not attached. In the processing unit 2 of the illustrated embodiment, since the upper rotating gun 8 exists on the near side in the transport direction,
Although the supporting projection 20 is required in the cavity 16 on the front side of the lower mold 14, the lower rotating gun 8 is present in the transport direction of the processing unit 2. Part 1
It is not necessary for 6 ′, but is necessary for cavity 16 ′ of upper mold 15.

The upper die 15 is a slit forming plate 1 of the lower die 14.
A press projection 21 for fixing the position of the upper die and the lower die and a frame positioning pin 22 are provided in a portion corresponding to the notch 18 of the base 7, and a receiving hole 23 is formed in the lower die 14 at a position corresponding to the pin 22. Has been drilled. The arrow pointing downward in FIG. 4 and the arrow pointing left in FIG. 7 indicate the transport direction, respectively, and the horizontal arrow in FIG. 4 indicates the direction in which the receiving jig 6 moves in the X direction. It shows.

Next, the operation of the embodiment will be described. The IC frame is transported from the loader unit 1 to the table 4 of the processing unit 2. At this time, the work receiving jig 6 adjacent to the table 4 is in an open state as shown in FIG. In this state, the IC frame 30 is moved from the table 4 to the receiving jig 6 by the claws 9 and 9 ′ of the frame feeding device 5.

Immediately after the start of the movement, the end in the transport direction of the IC frame 30 is inserted into the slit 19 of the lower mold 14 and is set at a set position (a position where the package 31 of the IC frame 30 exists above the support protrusion 20). Positioning is stopped. At this position, the slit forming plate 17 'on the frame feeder 15 side
Since the length of the C frame 30 is shorter than that of the C frame 30,
The claws 9, 9 'holding the ends of the slit forming plate 1
The upper mold 15 is closed without being hindered by 7 ′, the upper mold 15 is closed, and the IC frame 30 is positioned and fixed by the pressing protrusion 21 and the pin 22 of the upper mold 15.

Thereafter, the receiving jig section 6 is moved by the operation of the XY drive section 7 below the upper rotating gun 8 existing in the X direction from the transport path, and is moved in the XY direction as necessary, thereby injecting the high-pressure water. The deburring process is performed. At this time, the high-pressure water is received from above, but since the support protrusion 20 exists under the package of the IC frame as the work, there is no possibility that the frame is deformed by the high-pressure water.

When the deburring process by the upper rotary gun 8 is completed, the receiving jig unit 6 is returned to the original conveying path by the XY drive unit 7, and the upper die 15 is opened again. Thereafter, the frame feeder 5 is operated again, and the IC frame is moved to the next stop position of the lower surface processing unit 26 '. After the positioning is completed, the XY drive unit 7 again moves the IC frame toward the lower rotating gun 8 ', and receives high-pressure water from below. Since the supporting jig portion 6 is mounted on the upper die 15, the receiving jig portion 6 is not affected by the injection of high-pressure water from below.

After the processing is completed, the receiving jig unit 6 returns to the transport path, and when the upper die 15 is opened, the frame feeding device 5 is operated, and the deburring process of the upper surface and the lower surface is performed by the claws 11, 11 '. The IC frame is transported to the table 4 'on the unloader section 3 side. Thus, a series of movements in the processing section ends.

[0019]

As described above, according to the present invention, the IC frame receiving jig 6 which can be driven in the X direction and the Y direction is used as a part of the transport path, and a separate device for transport is required. It is possible to transport the IC frame in the hydraulic deburring apparatus without using the IC frame. Further, as an effect of the embodiment, the ICs of the cavities 16, 16 ′ of the upper mold 15 or the lower mold 14 are
By providing the support projection 20 on the package application portion of the frame, the deformation of the IC frame due to water pressure can be prevented.

[Brief description of the drawings]

FIG. 1 is an overall front view of a partially cutout of a hydraulic deburring apparatus to which the present invention is applied.

FIG. 2 is an overall side view of a cutout of the same part.

FIG. 3 is an internal plan view of the same.

FIG. 4 is an explanatory plan view showing a relationship between a frame feeding device and a receiving jig.

FIG. 5 is a side view showing a state where the receiving jig is closed.

FIG. 6 is a side view showing a state where the receiving jig is opened.

FIG. 7 is a plan view of a partially cut-out portion of the receiving jig in a closed state.

FIG. 8 is a front view of the partial cutout.

[Explanation of symbols]

 1. . . . . Loader section 2. . . . . Processing unit 3. . . . . Unloader section 4, 4 '. . Table 5. . . . . Frame feeder 6. . . . . Receiving jig part 7. . . . . 7. XY drive section . . . . Upper rotating gun 8 '. . . . Lower rotating gun 9, 9 ', 10, 10', 11, 11 '. . . Nail 14 . . . Lower mold 15. . . . Upper mold 16, 16 '. . . Cavities 17, 17 '. . . Slit forming plate 18. . . . Notch 19. . . . Slit 20. . . . Support projection 21. . . . Presser projection 22. . . . Pin 23. . . . Receiving hole 26. . . . Upper surface processing unit 26 '. . . Lower surface processing unit 30. . . . IC frame 31. . . . package

Claims (1)

(57) [Claims] 1. Burr by injecting high pressure water into an IC frame
In a hydraulic deburring apparatus for removing, a frame feeder for moving a IC frame on a transport path including a receiving jig portion and a receiving jig portion forming a part of the transport path in a transport path of the IC frame in a transport direction. And transfer the receiving jig to the IC frame
Upper and lower molds that are opened when sending and closed when deburring
And an XY drive unit that can drive the receiving jig unit in the X direction and the Y direction.
Position where the receiving jig receives high-pressure water from the high-pressure water injection gun
An IC frame transport mechanism characterized in that the IC frame transport mechanism is movable .