JP3130527U - Light emitting diode heat dissipation module - Google Patents

Abstract

A light emitting diode heat dissipation module capable of improving the heat dissipation efficiency of a light emitting diode is provided.
A circuit board, at least one light emitting diode, at least one heat transfer layer and a heat dissipation block are included, and an opening is formed in the circuit board, and the light emitting diode extends over the opening of the circuit board. At least one heat transfer layer is provided at the bottom of the light emitting diode, and a heat dissipation block is coupled to the heat transfer layer through an opening in the circuit board.
[Selection] Figure 1

Description

  The present invention relates to a light-emitting diode heat-dissipating module that can improve the heat-dissipation efficiency of a light-emitting diode, and is applied to a light-emitting diode with high brightness or ultra-high brightness or a similar structure.

While the application of existing LEDs has been expanded, it is now widely used in indicator lights and display devices for information communication and consumer electronic products. For example, it is applied to liquid crystal televisions, mobile phones, PDA and GPS display panels, lighting, and the like, but the input power of the LED chip is increased, and the light emission efficiency is reduced due to heat generation due to heat accumulation.
Further, the temperature rise of the LED element itself is accelerated, and the stress of the LED due to the temperature rise effect breaks down the structure of the LED. For this reason, manufacturers that manufacture light emitting diodes for mobile phones and lighting equipment suffer from heat dissipation problems. In particular, for light-emitting diodes applied to high-luminance or ultra-high-luminance lighting equipment, problems such as qualitative changes in materials due to high heat and a decrease in service life must be solved.

  FIG. 4 shows a conventional light-emitting diode heat dissipation module, in which a heat transfer layer 4 is mainly coupled below the light-emitting diode 1, and a circuit board 2 is further coupled below the heat transfer layer 4. An aluminum plate 3 is adhered to the circuit board 2, and a heat radiation block 5 for further accelerating the heat radiation speed is connected to the lower side of the aluminum plate 3.

  However, in the light emitting diode heat dissipation module, when heat is released from the light emitting diode 1, the heat is transferred to the circuit board 2 through the heat transfer layer 4, and then positioned downward through the circuit board 2 and the aluminum plate 3. However, since the circuit board 2 is made of a material that does not have a good heat transfer function, there is a problem that heat transfer is not performed smoothly and the heat release speed is greatly reduced.

  The present invention has been made to solve the above-described conventional problems, and a main object of the present invention is to provide a light emitting diode heat dissipation module capable of improving the heat dissipation efficiency of the light emitting diode.

  In order to achieve the above object, the present invention includes a circuit board, at least one light emitting diode, at least one heat transfer layer, and a heat dissipation block, and the circuit board has an opening formed therein. Provided over the opening of the circuit board, the at least one heat transfer layer is provided at the bottom of the light emitting diode, and a heat dissipation block is coupled to the heat transfer layer through the opening of the circuit board; Thereby, it is a light emitting diode heat dissipation module in which the heat dissipation efficiency of the light emitting diode is improved.

That is, the first device of the present application is a light emitting diode heat dissipation module including a circuit board, at least one light emitting diode, at least one heat transfer layer, and a heat dissipation block, wherein an opening is formed in the circuit board, The light emitting diode extends over the opening of the circuit board, and at least one heat transfer layer is provided at the bottom of the light emitting diode. The heat transfer layer is coupled to the heat dissipation block through the opening of the circuit board. Thus, a light emitting diode heat dissipation module is provided, in which the heat dissipation efficiency of the light emitting diode is improved.
The at least one heat transfer layer is a heat radiating piece.
Further, the at least one heat transfer layer is a heat radiation paste.

  Hereinafter, the features of the present invention will be described in detail with reference to the drawings and specific examples.

A light emitting diode heat dissipation module according to the present invention will be described with reference to FIGS.
The light emitting diode heat dissipation module according to the present invention includes a circuit board 10, at least one light emitting diode 20, at least one heat transfer layer 30 and a heat dissipation block 40.
Further, the circuit board 10 is provided with an opening 11, and a plurality of connecting circuits 12 are installed around the opening 11.
At least one light emitting diode 20 is installed so as to straddle the opening 11.
The light emitting diode 20 is provided with a coupling seat 22 and a plurality of stays 21.
The at least one heat transfer layer 30 is provided in accordance with the shape of the opening 11 of the circuit board 10.
Alternatively, it is provided in accordance with the shape of the coupling seat 22 of the light emitting diode 20.
In the present embodiment, in order to match the shape of the coupling seat 22 of the light emitting diode 20, it has a circular shape.
Further, below the heat transfer layer 30, a heat dissipation block 40 having a plurality of heat dissipation fins (other types of heat dissipation block 40 may be coupled).

When applied to the high-intensity light emitting diode 20, the stay 21 of the light emitting diode 20 is soldered to the connecting circuit 12 of the circuit board 10.
In this embodiment, three light emitting diodes 20 are provided, and the light emitting diodes 20 are provided so that they can be electrically connected to the connection circuit 12 on the circuit board 10.
Further, since the opening 11 is provided in the circuit board 10, the light emitting diode 20 is soldered to both sides of the opening 11 of the circuit board 10 by the plurality of stays 21.
The light emitting diode 20 is installed so as to straddle the opening 11 of the circuit board 10.
A concave cup body 23 is coupled in the coupling seat 22 of each light emitting diode 20.
A circular heat transfer layer 30 is coupled to the bottom surface of the concave cup 23.
Using the heat transfer layer 30 as a heat transfer medium, the heat in the light emitting diode 20 is transferred to the outside.
The heat transfer layer 30 may be a heat radiating piece or a heat radiating paste.
A heat dissipation block 40 having a plurality of fins is coupled below the heat transfer layer 30.
Heat is rapidly transmitted by the heat dissipation block 40 having a large heat dissipation area.
Further, since the contact area between the heat dissipation block 40 and air is large, the temperature of the light emitting diode 20 can be quickly reduced.
Further, since the heat dissipation block 40 is not directly attached to the lower side of the heat transfer layer 30 and is not isolated by the circuit board 10, the heat dissipation efficiency of the light emitting diode 20 is greatly improved.

  As described above, the present invention is a light emitting diode heat dissipation module that can achieve the expected purpose, and since a hole is formed in the circuit board, the heat dissipation efficiency is greatly improved as a heat dissipation module for a high brightness light emitting diode. It is practical.

  The above description is a description of the preferred embodiments of the present invention, and the present invention is not limited to these descriptions, and all equivalent changes and modifications appropriately made by those skilled in the art are claimed in the claims of the present invention. It is included in the range.

Three-dimensional external view of an embodiment of the present invention Parts exploded view of an embodiment of the present invention Cross-sectional conceptual diagram when the embodiment of the present invention is applied Cross-sectional conceptual diagram when applying a conventional light-emitting diode heat dissipation module

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Light emitting diode 10 ... Circuit board 11 ... Opening hole 12 ... Connection circuit 2 ... Circuit board 20 ... Light emitting diode 21 ... Stay 22 ... Coupling seat 23 ... Recessed cup 3 ... Aluminum plate 30 ... Heat transfer layer 4 ... Heat transfer layer 40 ... Heat release block 5 ... Heat release block

Claims (3)

A light emitting diode heat dissipation module comprising a circuit board, at least one light emitting diode, at least one heat transfer layer and a heat dissipation block,
An opening is formed in the circuit board;
The light emitting diode straddles above the opening of the circuit board, and at least one heat transfer layer is provided at the bottom of the light emitting diode,
The heat transfer layer is coupled to a heat dissipation block through an opening in the circuit board,
Thereby, the heat dissipation efficiency of the light emitting diode is improved,
Light emitting diode heat dissipation module.   The light emitting diode heat radiation module according to claim 1, wherein the at least one heat transfer layer is a heat radiation piece.   The light emitting diode heat radiation module according to claim 1, wherein the at least one heat transfer layer is a heat radiation paste.

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