JP3130067B2 - Basket for semiconductor wafer - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor wafer basket in which a large number of semiconductor wafers are arranged and stored in parallel at predetermined pitches, and are subjected to processes such as cleaning, etching and drying. The present invention relates to a semiconductor wafer basket suitable for a wafer.

[0002]

2. Description of the Related Art As a basket for a semiconductor wafer of this kind, for example, Japanese Utility Model Application Publication No. 2-25 proposed previously by the present applicant.
No. 233 is disclosed. As shown in FIGS. 5 to 7, the entire basket A is integrally formed of a fluororesin material, and has a support plate 13 extending along the lateral direction between both ends of both side walls 1 and 3 parallel in the longitudinal direction. At the same time, bases 5 and 6 for supporting the wafer W are respectively provided to project inwardly below the side walls 1 and 3 so as to face each other, and are formed in a box shape with upper and lower openings. . The above both side walls 1, 3
A large number of ribs 2 and 4 extending in the vertical direction into which the wafer W is inserted are provided in parallel at a predetermined pitch in the longitudinal direction of the side walls 1 and 3 on the inner surface of the rib 2. Vertical slits 7 and 8 for communicating the inside and outside of both side walls 1 and 3 between them
Are drilled. In addition, the inclined upper surfaces 5 of the base portions 5 and 6
Ribs 9 and 10 protruding from the ribs 2 and 4 are also provided on the a and 6a.
Also, vertically elongated slits 11 and 12 for communicating the inside and the outside of both side walls 1 and 3 are formed between them, and the slits 7 and 11 and the slits 8 and 12 are respectively arranged vertically in the insertion direction of the wafer W. They are arranged in an aligned state.

When the wafer W is inserted into the basket A, when the wafer W is inserted between the ribs 2 and 4, the wafer W which has fallen and has reached between The lower edge of the sloping upper surface 5 of the bases 5, 6
a, 6a. A large number of wafers W accommodated in the basket A in this manner are spaced apart from each other by the ribs 2 and 4 and the ribs 9 and 10 so as to be aligned, and the slits 7 and 8 and the slit 1
The flow of the processing liquid and the drainage of the processing liquid are improved by 1 and 12, so that a uniform and favorable processing can be performed.

[0004]

However, a remarkable technological innovation in recent years has enabled large-diameter semiconductor wafers of this kind to be manufactured, and semiconductor chips of as large a diameter as possible have to be cut out from chips. For this reason, the diameter is gradually increased for reasons such as higher production efficiency and economical efficiency. Recently, a diameter of 8 inches has been standardized.
As the diameter of the semiconductor wafer increases, the weight of the semiconductor wafer increases, and the thickness of the semiconductor wafer also increases to prevent cracking and deformation. Therefore, it is a matter of course that the shape of the basket must be increased to conform to this. In addition to this, since the basket is required to be more uniform and capable of better treatment than ever, it is not sufficient to simply increase the shape of the above-described conventional basket.

For example, when a large-diameter wafer is stored in the above-described conventional basket A, the inclined upper surfaces 5a and 6a of the pedestals 5 and 6 supporting the lower edge of the wafer W have been increased due to an increase in the weight of the wafer. It receives the impact and load at the time of a large drop. However, the inclined upper surfaces 5a and 6a have a small pressure receiving area because the middle portions are cut off by the slits 11 and 12, and therefore receive a large load per unit area. A large drop impact is received by the edge of the wafer W. For this reason, while the loading and unloading of the wafer W is frequently repeated, the inclined upper surfaces 5a and 6a that carry the wafer W are depressed,
The edges of the wafers 1 and 12 may be damaged, and the wafer W may be stabbed, making it impossible to take the wafer W in and out. The performance of the wafer W is remarkably reduced due to adhesion or contamination of the processing liquid, and the wafer W is made unusable.

In the basket A having the conventional structure, the slits 7 and 11 or the slits 8 and 12
Are arranged vertically in alignment with each other in the insertion direction of the wafer W, so that the thick wafer W can be placed between the adjacent ribs 2 and 2 and between the ribs 9 and 9 and between the ribs 4 and 4. When each is inserted between the ribs 10 and 10, a part of all the slits 7, 8, 11, and 12 in the wafer W is more closed from the inside than before, and the flow of the processing liquid becomes poor. Will be lost. However, if the pitch between the ribs is increased to increase the spacing to prevent this, the number of wafers W to be stored is reduced and the processing capacity is reduced, and the play space in which the wafer W swings between the ribs is increased. As a result, the adjacent wafers W may be damaged by contact with each other, so that the pitch cannot be unnecessarily increased.

Further, each of the slits 7, 8, 11,
In particular, the inclined slits 11 and 12 formed in the pedestals 5 and 6 are extremely important places that communicate with each other in the vertical direction to perform the last liquid drainage.
2 is closed by the wafer W as described above, or when the edges of the slits 11 and 12 are damaged due to the impact of the dropped wafer W or the like and the smooth surface becomes fluffy, the processing liquid stagnates in this portion. As a result, uniform processing cannot be performed. SUMMARY OF THE INVENTION It is an object of the present invention to solve these problems and to provide a basket for a semiconductor wafer which can be adapted to a wafer having a large diameter and an increased weight and thickness.

[0008]

SUMMARY OF THE INVENTION The gist of the present invention is that both side walls parallel to each other in the longitudinal direction, left and right support plates connecting both ends of the both side walls, and a continuous state below the both side walls. Are formed in a box-shaped basket having an upper and lower opening provided with a sloping pedestal portion, each of which protrudes inwardly to the inside of the both side walls and carries the lower edge portion of the wafer. On the inner surfaces of the side walls, a number of ribs extending in the vertical direction forming a wafer insertion passage are provided in parallel at a predetermined pitch in the longitudinal direction of the side walls, and between these ribs. A vertically elongated upper slit for communicating the inside and the outside of the basket is formed, and both side walls including the respective ribs extend substantially vertically on the upper side and are inclined inwardly on the lower side. At the connection with the An inclined support surface for supporting the lower edge of the wafer inserted on the extension of the cassette is formed. On both sides of the inclined support surface, an inclined lower slit for communicating the inside and the outside of the basket, A semiconductor wafer basket in which a spacing member that engages with and is spaced from an edge is arranged in parallel at a predetermined pitch so as to be aligned with an extension of the rib. Another aspect of the present invention is a semiconductor wafer basket in which the width of the upper slit is wider than the insertion width formed between the adjacent spacing members.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the embodiments shown in FIGS. This basket 30
Side walls 31 and 32 parallel to each other in the longitudinal direction, left and right support plates 33 and 34 connecting both ends of the side walls 31 and 32, respectively, and extend continuously below the side walls 31 and 32. At the same time, the inclined receiving bases 35 and 36 for holding the lower edges of the wafers W projecting to the inside of the both side walls 31 and 32 facing each other are provided below the receiving bases 35 and 36. It is formed in a box shape with upper and lower openings by the provided leg portions 37 and 38, and the whole is integrally formed of a fluorine resin material.

On the inner surfaces of the side walls 31, 32, a number of longitudinally extending ribs 39, 40 are formed in the longitudinal direction of the side walls 31, 32 to form an insertion passage for the wafer W between adjacent sides. These ribs 3 are provided in parallel at every pitch.
Elongated upper slits 41 and 42 for communicating the inside and the outside of the basket 30 are formed between the slots 9 and 40. Also,
The side walls 31, 32 and the ribs 39, 40 extend substantially vertically on the upper side and inclined inward on the lower side, and the ribs 39, 40 project from each other. The ribs 39 and 40 are connected at their intermediate portions by reinforcing ribs 43 and 44 between adjacent ones, and the ribs 39 and 40 are terminated at the connecting portions with the receiving portions 35 and 36. I have.

Next, the receiving portions 35 and 36 are short and inclined lower slits 45 and 46 for communicating between the inside and the outside of the basket 30, and a spacing member for locking and separating the wafer W. Are provided. The lower slits 45, 46 and the positioning projections 47, 48 are arranged in parallel at a predetermined pitch so as to be aligned with an extension of each of the ribs 39, 40, and the positioning projections 47, 48 are truncated cones. The interval formed between the base portions of the positioning projections adjacent to each other in shape is slightly smaller than the interval between the adjacent ribs 39 and 40. The inclined supporting surfaces 35a, 36a formed from between the adjacent lower slits 45, 46 and between the adjacent positioning projections 47, 48 are formed into arc-shaped surfaces that match the outer peripheral surface of the wafer W. ing.

When the wafer W is inserted into the upper slits 41 and 42 formed between the adjacent ribs 39 and 40 when the wafer W is stored in the basket 30, the dropped wafer W has a lower edge. It is carried by the inclined carrying surfaces 35a, 36a of the receiving portions 35, 36. Since the inclined carrying surfaces 35a and 36a have no opening and a wide pressure receiving area, damage and deformation due to a drop impact of the wafer W are small. A large number of wafers W accommodated in the basket 30 are spaced from each other adjacent to the ribs 39, 40 and the positioning projections 47, 48, which are respectively engaged with both surfaces, in an aligned state. The insertion width formed between adjacent ribs 39 and 40 and positioning projections 47 and 48 is
Instead of being constant as in the case of a series of ribs of conventional construction, they can be set to different desired widths. Therefore, for example, as in the above-described embodiment, the wafers W can be easily inserted into the ribs 39 and 40 at the side thereof, and the upper sides can be swingably inserted to reduce the closing of the upper slits 41 and 42 by the inserted wafer W. The width can be widened, and the insertion width can be narrowed at the positioning protrusions 47 and 48 so as to prevent the adjacent wafers W swinging from coming into contact with each other, thereby maintaining the spacing. In addition, instead of the positioning protrusions 47 and 48 described above,
A short rib separated from the ribs 39 and 40 may be used as the spacing member. Further, the lower slits 45 and 46 described above are disposed so as not to be aligned with the upper slits 41 and 42, and the inclined supporting surface 35 for supporting the wafer W.
Since the openings are formed on both sides of the wafer W, the processing liquid can be effectively flown to both sides of the wafer W without being completely blocked by the wafer W.

[0013]

As is apparent from the above embodiment, the semiconductor wafer basket according to the present invention has the following effects. In this basket, the lower edge of the wafer to be stored is supported by the inclined supporting surface having a large pressure receiving area without an opening formed in the receiving base, so that damage or deformation due to the impact of falling of the wafer is prevented. Few. Further, the wafer housed in the basket is provided with ribs which are respectively engaged on both upper surfaces and positioning protrusions or short ribs which are separately formed from the ribs and which are respectively engaged with both lower surfaces, so that the spacing members are adjacent to each other. Since the gaps are maintained and aligned in the aligned state, the insertion width for inserting the wafer is not regulated as in the case of the series of ribs of the conventional structure, and the insertion of the wafer and the processing liquid for the wafer are not restricted. Can be individually set to a desired insertion width suitable for the fluid flow. Therefore, for example, the insertion width between the ribs is set to be wide and the insertion width between the spacing members is set to be narrow, and the upper side of the wafer is swung so that the wafer can be easily inserted and the upper slit formed between the ribs is less obstructed. In addition to this, swinging of the lower side of the wafer can be restricted between the spacing members so that adjacent wafers do not come into contact with each other. Further, the lower slit formed in the pedestal portion is disposed so as not to be aligned with the upper slit formed between the ribs, and the lower slit of the pedestal portion is opened on both sides of the inclined carrying surface for carrying the wafer. Therefore, the processing liquid can be effectively flown to both surfaces of the wafer without being completely blocked by the wafer.

[Brief description of the drawings]

FIG. 1 is a fragmentary perspective view showing a part of a semiconductor wafer basket according to an embodiment of the present invention, which is cut away.

FIG. 2 is a plan view showing the entire basket.

FIG. 3 is a front view showing the entire basket.

FIG. 4 is a longitudinal sectional view taken along the line BC of FIG. 2;

FIG. 5 is an overall perspective view of a conventional semiconductor wafer basket.

FIG. 6 is a front view of the basket.

FIG. 7 is a longitudinal sectional view taken along the line BB of FIG. 6;

[Explanation of symbols]

30 Basket 31, 32 Side wall 33, 34 Support plate 35, 36 Receiving part 35a, 36a Inclined supporting surface 37, 38 Leg 39, 40 Rib 41, 42 Upper slit 43, 44 Reinforcement rib 45, 46 Lower slit 47, 48 Positioning protrusion W Wafer

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H01L 21/68 H01L 21/304 H01L 21/306

Claims (2)

(57) [Claims] 1. Side walls parallel to each other along a longitudinal direction, left and right support plates connecting both ends of the side walls, and both of the side walls extend continuously below the side walls, and Each of the inner surfaces, each of which protrudes inwardly to face the lower surface of the wafer and which carries the lower edge of the wafer, is formed as a box-shaped basket having an inclined receiving base and having an open top and bottom. A large number of ribs extending in the vertical direction forming the insertion passage are provided in parallel at predetermined intervals in the longitudinal direction of the both side walls, and a vertically long upper slit communicating between the inside and outside of the basket is provided between these ribs. The upper and lower sides of the side walls including the respective ribs are extended substantially vertically and the lower side is inclined inward.Each of the ribs is terminated at a connection portion with the cradle portion, The pedestal section has a wafer inserted along the extension of the upper slit. An inclined supporting surface for supporting the lower edge of the c is formed, and an inclined lower slit for communicating between the inside and the outside of the basket is provided on both sides of the inclined supporting surface, and the inclined lower slit is engaged with the lower edge of the wafer to be spaced therefrom. A basket for semiconductor wafers, wherein the spacing members to be arranged are arranged in parallel at predetermined intervals so as to be aligned with the extension of the rib. 2. The semiconductor wafer basket according to claim 1, wherein a width of said upper slit is formed to be wider than an insertion width formed between adjacent ones of said spacing members.