JP3121775B2 - Titanium electrodeposition drum - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a titanium electrodeposition drum in a copper foil producing machine for producing copper foil.

[0002]

2. Description of the Related Art Conventionally, improvements have been made to electrodeposit and generate a copper foil having a uniform and smooth surface on the surface of an electrodeposition drum with the same thickness. Titanium electroplated drums, in which a titanium plate having excellent corrosion resistance to the same is applied to the surface of the inner drum, and a copper foil having a uniform smooth surface on the outer peripheral surface of the titanium plate with the same thickness, have been widely used.

[0003] Generally, a titanium plate is attached to the outer peripheral portion of an inner drum made of mild steel or stainless steel and is conductive through this outer peripheral portion. If so, it is not necessary to consider improving the conductivity of the titanium plate , and if the adhesion between the titanium plate and the inner drum is improved, a copper foil of the same thickness having a uniform smooth surface as intended can be obtained. Focusing on the possibility of generation, a titanium electrodeposition drum with a copper plate etc. lined inside the titanium plate was prototyped, and the left and right side walls of the inner drum and An electrodeposition drum having a copper plate or the like attached to an intermediate reinforcing plate was prototyped, and the test was repeated to complete the present invention.

[0004]

The gist of the present invention will be described with reference to the accompanying drawings.

[0005] Outer peripheral surface 1a of outer peripheral plate 1 of inner drum b
In a titanium electrodeposition drum a in which a titanium plate 2 is stretched
Outer peripheral surface 1a of outer peripheral plate 1 of inner drum b and titanium plate 2
The circumferential設銅system plate 3a, such copper or copper alloy sheet brought Kaison on the upper and lower surfaces respectively close contact between the inner circumferential surface 2a of the inner
A copper plate or an outer surface of the left and right side walls 4 of the drum b
A copper-based plate 3b such as a copper alloy plate is attached, and the copper-based plate
The present invention relates to a titanium electrodeposition drum wherein the plate 3b and the peripheral copper plate 3a are directly connected .

Further, the titanium electrodeposition drum according to claim 1
In addition, a side titanium plate 11 is provided on the outer surface of the side copper based plate 3.
The present invention relates to a titanium electrodeposition drum characterized in that:

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be briefly described with reference to the drawings, showing the operation and effects.

[0008] shows the coefficient of linear expansion of the copper alloy and iron, such as titanium down and Dowaka Shikuwa brass is as follows.

[0009] Titanium 8.41 × 10- ⁶ (20 ℃) Iron 11.76 × 10- ⁶ (20 ℃) copper 16.5 × 10- ⁶ (20 ℃) Brass 20~21 × 10- ⁶ (20 ℃ As described above, the copper-based plate extends 2-2.5 times more than titanium, so that the peripheral copper-based plate 3a is stuck to the inner peripheral surface of the titanium plate 2 due to the temperature rise during the foil making. , Titanium plate 2
And the peripheral copper-based plate 3a are improved in adhesion.

The electrical resistivity of the three is as follows.

Titanium 55 (20 ° C. μΩ · cm) Iron 9.71 (〃) Copper 1.67 (〃) Brass 3.6-3.7 (〃) As described above, copper-based plates are better than titanium Since the conductive copper plate 3a having good conductivity is tightly lined inside the titanium plate 2 by utilizing the good linear expansion coefficient, the conductivity of the titanium plate 2 is improved. Can be expected to compensate for the lack of sex.

By this synergistic effect, a copper foil of the same thickness having a uniform smooth surface over the entire range is produced, and copper foil of excellent quality is produced without any local electric resistance heat which causes trouble. The foil becomes the titanium electrodeposition drum a generated on the surface of the titanium plate 2.

[0013] In addition, the left and right side wall of the inner drum b 4 · 4
Energization of the side設銅system plate 3b which is attached to the outer surface of the directly linked to stretched the circumferential設銅system board 3a to the inside of the titanium plate 2 treasure circumferential設銅system plate 3a by the side設銅system board 3b the amount will be more further <br/> increases.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Specific embodiments of the present invention will be described with reference to the drawings.

In this embodiment, the outer peripheral plate 1 of the inner drum b is used.
Of the outer peripheral surface 1a of the outer peripheral plate 1 of the inner drum b in the titanium electrodeposition drum a in which the titanium plate 2 is stretched on the outer peripheral surface 1a of the inner drum b
Plate or copper alloy between the metal plate and the inner peripheral surface 2a of the titanium plate 2
The peripheral copper-based plate 3a such as a plate is interposed in the upper and lower surfaces in close contact with each other.
Tightening, on the outer surface of the left and right side wall plates 4 of the inner drum b
A copper-based plate 3b such as a copper plate or a copper alloy plate is attached,
The side copper plate 3b is directly connected to the peripheral copper plate 3a.
It was done.

Further , an intermediate reinforcement provided on the inner drum b
Plate 5 is provided with an intermediate copper-based plate 3c such as a copper plate or a copper alloy plate.
The intermediate copper-based plate 3c is connected to the peripheral copper-based plate 3a.
It is installed near or connected to the power state.

FIG. 1 is an explanatory view of a copper foil producing machine A,
Reference numeral 6 denotes a conductive path, 7 denotes an electrode, 8 denotes a power source, 9 denotes a rotation axis,
3d copper tube which is provided on the outer periphery of the rotary shaft 9, 10 is <br/> a conductive bearing portion.

FIG. 2 is a side view of the peripheral copper-based plate 3a.
FIG. 3 shows an embodiment in which side copper-based plates 3b are directly connected to peripheral copper-based plates 3a. Note that reference numeral 13
Is a weld.

FIG. 4 shows that an intermediate copper plate 3c is attached to the intermediate reinforcing plate 5, and the outer end of the intermediate copper plate 3c is attached to the peripheral copper plate 3a.
Shows an example in which the conductive state is continuously provided, and an enlarged view thereof.
As in FIG. 5 is, 'continuously provided, and the flange portion 3c' horizontal annular flange portion 3c to the outer edge of the intermediate copper plate 3c plug weld 12 and a circumferential設銅system plate 3a was stoppered welded And a structure connected via
are doing.

The copper-based plate has better thermal conductivity than the titanium plate 2.

Copper 0.94: Titanium 0.037 (20 ° C.)
・ Cal / cm ・ s ・ ℃) Therefore, as described above, the peripheral copper plate 3a and the side copper plate 3
(b) The provision of the intermediate copper-based plate 3c improves the heat conduction and also has the effect of preventing the formation of a local hot zone, so that the surface can be made smooth and a foil of equal thickness can be formed.

An example of the size of the electrodeposition drum is as follows.

Electroplated drum φ2300mm diameter Electroplated drum 1200mm width Drum outer peripheral plate made of SUS or SS 122mm thick Titanium plate 25mm thick Peripheral copper-based plate 3a such as copper plate or copper alloy plate 4a 4mm thick copper plate or copper alloy plate Side copper plate 3b 5mm thickness Intermediate copper plate 3c such as copper plate or copper alloy plate 7mm thickness SUS or SS side wall plate 4 22mm thickness SUS or SS intermediate reinforcement plate 5 22mm thickness Outer circumference of rotating shaft 9 Large diameter part of the provided copper cylinder 3d 60mm thick Side-mounted titanium plate 114 4mm thick

[0024]

Since the present invention is constructed as described above, a copper-based plate having a good linear expansion coefficient, such as copper or a copper alloy such as brass, is adhered to the inner peripheral surface of the titanium plate. The adhesion of the plate is improved, and the copper-based plate is much more conductive than the titanium plate, so it compensates for the lack of conductivity of the titanium plate, and the synergistic effect causes insulation corrosion due to the formation of a surface corrosion layer or surface oxide layer. Compensates that the prevention effect decreases,
Continuously produced copper foils of the same thickness with a uniform and smooth surface over the entire range, and excellent quality copper foil without the occurrence of electrical resistance heat that causes trouble is the surface of titanium plate Will be generated.

Further, since the side copper-based plate attached to the outer surfaces of the left and right side walls of the electrodeposition drum and the peripheral copper-based plate stretched inside the titanium plate are directly connected , the side copper-based plate is used. Very good current supply to the surrounding copper plate, and current supply to the titanium plate
Sex will increase.

[Brief description of the drawings]

FIG. 1 is an explanatory view of a copper foil manufacturing machine.

FIG. 2 is a longitudinal sectional view of a main part of an embodiment in which a side copper-based plate is provided near a peripheral copper-based plate.

FIG. 3 is a longitudinal sectional view of a main part of an embodiment in which a side copper-based plate is directly connected to a peripheral copper-based plate.

FIG. 4 is a longitudinal sectional view in which hatching lines other than a copper-based plate of a type provided with an intermediate reinforcing plate provided with an intermediate copper-based plate in the middle are omitted.

FIG. 5 is a cross-sectional view of the plug fusing part of FIG.

[Explanation of symbols]

REFERENCE SIGNS LIST 1 outer peripheral plate 1 a outer peripheral surface 2 titanium plate 2 a inner peripheral surface 3 a peripheral copper-based plate 3 b side-side copper-based plate 4 side wall plate 11 side-side titanium plate a titanium electrodeposition drum b inner drum

Continuation of the front page (56) References JP-A-4-103788 (JP, A) JP-A-3-188292 (JP, A) JP-A-3-247787 (JP, A) JP-A-4-116190 (JP) JP-A-3-191079 (JP, A) JP-A-10-219493 (JP, A) JP-A-10-8286 (JP, A) Patent 2967239 (JP, B2) JP-B 5-77753 (JP, A) JP, B2) JP-B7-37676 (JP, B2) JP-T3-504255 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) C25D 1/00 C25D 1/22

Claims (2)

(57) [Claims] 1. A titanium electroplated drum having a titanium plate stretched over an outer peripheral surface of an outer peripheral plate of an inner drum, wherein a copper plate or a copper alloy plate is provided between the outer peripheral surface of the outer peripheral plate of the inner drum and the inner peripheral surface of the titanium plate. The peripheral copper-based plates, etc. are interposed in close contact with the upper and lower surfaces, respectively, and the outer surfaces of the left and right side walls of the inner drum
A copper-based plate such as a copper plate or copper alloy plate is attached to
Wherein said side copper-based plate is directly connected to said peripheral copper-based plate . 2. The titanium electrodeposition drum according to claim 1.
In addition, a side titanium plate is provided on the outer surface of the side copper-based plate.
A titanium electrodeposition drum.