JP3116336B2 - Device for detecting the end point of wet etching - Google Patents

Device for detecting the end point of wet etching

Info

Publication number
JP3116336B2
JP3116336B2 JP05042545A JP4254593A JP3116336B2 JP 3116336 B2 JP3116336 B2 JP 3116336B2 JP 05042545 A JP05042545 A JP 05042545A JP 4254593 A JP4254593 A JP 4254593A JP 3116336 B2 JP3116336 B2 JP 3116336B2
Authority
JP
Japan
Prior art keywords
etching
end point
etching solution
etched
sample
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP05042545A
Other languages
Japanese (ja)
Other versions
JPH06260479A (en
Inventor
勝男 溝渕
靖 東野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yokogawa Electric Corp
Original Assignee
Yokogawa Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yokogawa Electric Corp filed Critical Yokogawa Electric Corp
Priority to JP05042545A priority Critical patent/JP3116336B2/en
Publication of JPH06260479A publication Critical patent/JPH06260479A/en
Application granted granted Critical
Publication of JP3116336B2 publication Critical patent/JP3116336B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Weting (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は,半導体基板等の所定の
箇所を部分的にエッチングするための装置に関し,エッ
チングの終点を検出するウエットエッチング終点検出用
装置に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for partially etching a predetermined portion of a semiconductor substrate or the like, and more particularly, to an apparatus for detecting an end point of wet etching for detecting an end point of etching.

【0002】[0002]

【従来の技術】従来のウエットエッチングにおける終点
検出はエッチング速度と膜厚を勘案し,計算により一定
の時間試料をエッチング液に浸漬する方法がとられてい
る。
2. Description of the Related Art Conventionally, end point detection in wet etching is performed by immersing a sample in an etching solution for a predetermined time by calculation in consideration of an etching rate and a film thickness.

【0003】[0003]

【発明が解決しようとする課題】しかしながら,上記の
方法においては,膜厚がわからない場合や,エッチング
液が劣化した場合等ではおおよその見当をつけて早めに
引き上げ,顕微鏡で確認しながら複数回出し入れを行う
こともあり,時間がかかるとともに適切なエッチング条
件で終了することが難しいという問題があった。本発明
は上記従来技術の問題点を解決するために成されたもの
で,エッチング液中に含まれるイオン濃度を監視してお
き,その濃度が飽和状態となった試料を引き上げること
によりエッチング時間の短縮化をはかったウエットエッ
チング終点検出用装置を提供することを目的とする。
However, in the above method, when the film thickness is not known or when the etching solution is deteriorated, an approximate registration is made and the film is pulled up early, and is taken in and out a plurality of times while confirming with a microscope. However, there is a problem that it takes time and it is difficult to complete the etching under appropriate etching conditions. The present invention has been made to solve the above-mentioned problems of the prior art. The ion concentration contained in an etching solution is monitored, and a sample whose concentration is saturated is pulled up to reduce the etching time. It is an object of the present invention to provide an apparatus for detecting an end point of a wet etching which is shortened.

【0004】[0004]

【課題を解決するための手段】上記課題を解決するため
に本発明は、エッチング液が入れられた容器と、前記エ
ッチング液に浸漬されたエッチングすべき試料と、前記
エッチング液の一部を導入して加熱分解して液中に含ま
れる被エッチング部材をイオン化する加熱手段と、該イ
オンを取入れて該イオンの量をカウントするイオン検出
手段と、該検出手段からの出力の変化率に基づいてエッ
チングの終点を判断する終点検出手段と、該終点検出手
段からの出力信号に基づいて前記試料を前記エッチング
液から引き上げる駆動手段とを備えたことを特徴とする
ものである。
SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention provides a container containing an etching solution, a sample to be etched immersed in the etching solution, and a part of the etching solution. And decompose by heating , contained in the liquid
Heating means for ionizing the member to be etched, ion detection means for taking in the ions and counting the amount of the ions, and end point detection means for determining an end point of the etching based on a change rate of an output from the detection means; And a driving means for pulling up the sample from the etching liquid based on an output signal from the end point detecting means.

【0005】[0005]

【作用】試料がエッチング液に浸漬されると被エッチン
グ部分がエッチングされてエッチング液中に拡散する。
加熱手段はそのエッチング液を導入してイオン化してイ
オン検出手段に送出する。終点検出手段はエッチング液
中のイオン濃度を監視しておき飽和状態になったところ
をエッチングの終点と判断して終点検出信号を出力す
る。駆動手段は終点検出手段からの出力に基づいて試料
をエッチング液から引き上げる。
When a sample is immersed in an etching solution, a portion to be etched is etched and diffuses into the etching solution.
The heating means introduces the etching solution, ionizes it, and sends it out to the ion detection means. The end point detection means monitors the ion concentration in the etching solution, determines that the saturated state is reached as the end point of the etching, and outputs an end point detection signal. The driving means pulls up the sample from the etching solution based on the output from the end point detecting means.

【0006】[0006]

【実施例】以下図面を用いて本発明を説明する。図1は
本発明のウエットエッチング終点検出用装置の一実施例
を示す要部構成図である。図において1はエッチング液
2が入れられた容器であり,そのエッチング溶液2中に
はバスケット3に所定の間隔をおいて試料4が配置され
ている。6は駆動手段で支持棒7を介してバスケット3
に接続されており,矢印A方向に支持棒を駆動してバス
ケット3をエッチング液中に浸漬し若しくは引き上げ
る。
BRIEF DESCRIPTION OF THE DRAWINGS FIG. FIG. 1 is a main part configuration diagram showing an embodiment of a wet etching end point detecting apparatus according to the present invention. In FIG. 1, reference numeral 1 denotes a container containing an etching solution 2, in which a sample 4 is arranged at a predetermined interval in a basket 3. Numeral 6 denotes a driving means for supporting the basket 3 via the support rod 7.
The basket 3 is immersed in the etchant or pulled up by driving the support rod in the direction of arrow A.

【0007】8はエッチング液中に一端が挿入された配
管,9は配管8を介してエッチング液を加熱手段10に
送出するポンプである。12は例えば誘導結合プラズマ
質量分析装置12a及び検出器12bの様なイオン検出
手段であり,14は例えばCPUからなる終点検出手段
で,イオン検出手段からの信号に基づいてイオン数をカ
ウントし,その変化率を演算する。そしてこのCPUは
カウント数の変化率が予め定めた値になった時駆動手段
6に信号を発する。
Reference numeral 8 denotes a pipe having one end inserted into the etching liquid, and 9 denotes a pump for sending the etching liquid to the heating means 10 through the pipe 8. Numeral 12 denotes ion detecting means such as an inductively coupled plasma mass spectrometer 12a and a detector 12b. Numeral 14 denotes end point detecting means comprising, for example, a CPU which counts the number of ions based on a signal from the ion detecting means. Calculate the rate of change. The CPU sends a signal to the driving means 6 when the rate of change of the count reaches a predetermined value.

【0008】上記の構成において,はじめにエッチング
すべき基板をバスケットに並べ,支持棒7の先端に固定
してエッチング液2中に浸漬する。エッチング液にはエ
ッチングされた試料(基板)からの被エッチング部材が
拡散する。この被エッチング部材が拡散したエッチング
液は配管8を介してポンプ9で吸引され加熱手段10へ
送出される。加熱手段10は送られてきたエッチング液
を加熱して液中に含まれる被エッチング部材をイオン化
する。イオン化された被エッチング部材は質量分析手段
によって分析されその数がイオン検出器13によりカウ
ントさる。
In the above configuration, first, the substrates to be etched are arranged in a basket, fixed to the tip of the support rod 7 and immersed in the etching solution 2. The member to be etched from the etched sample (substrate) diffuses into the etchant. The etching solution diffused by the member to be etched is sucked by the pump 9 through the pipe 8 and sent to the heating means 10. The heating means 10 heats the etching solution sent to ionize the member to be etched contained in the solution. The ionized member to be etched is analyzed by the mass spectrometer, and the number thereof is counted by the ion detector 13.

【0009】その値はCPUへ送られてその変化率が殆
どゼロになった時,駆動装置6に対して駆動信号を出力
し,駆動装置6は支持棒7を上方へ駆動して試料を引き
上げる。図2はエッチング時間とエッチングされた元素
(被測エッチング部材)の関係を示すものである。図に
示す様にカウントされる元素の量はある時間までは所定
の速度で増え続けるが,一定時間経過後はエッチング速
度が極端に低下する。従ってCPUではこの変化率を監
視しておく。なお,配管の先端は図示の例に限ることな
最もよくエッチングの状態をあらわす位置に配置するも
のとし,ポンプや配管は出来るだけ早くエッチング液を
送出来る様に構成するものとする。
The value is sent to the CPU, and when the rate of change becomes almost zero, a drive signal is output to the drive unit 6, which drives the support rod 7 upward to lift the sample. . FIG. 2 shows the relationship between the etching time and the etched element (member to be etched). As shown in the figure, the amount of the element counted continues to increase at a predetermined rate until a certain time, but after a certain time has elapsed, the etching rate decreases extremely. Therefore, the CPU monitors this rate of change. It is to be noted that the tip of the pipe is arranged at a position representing the state of etching best, which is not limited to the illustrated example, and the pump and the pipe are configured to be able to send the etching solution as soon as possible.

【0010】[0010]

【発明の効果】以上実施例とともに具体的に説明したよ
うに本発明によれば,エッチング液中に含まれるイオン
濃度を監視しておき,その濃度が飽和状態となったとき
試料を引き上げる様にしたので,常に適切なエッチング
時間でエッチングを終了させることができ,歩留まりの
向上をはかることができる。また,エッチング速度の変
化率を監視しているので,複数回使用したエッチング液
であっても使用することが出来,エッチングの自動化も
可能となる。
According to the present invention, as described above in detail with the embodiments, the concentration of ions contained in the etching solution is monitored, and the sample is pulled up when the concentration becomes saturated. As a result, the etching can be always completed in an appropriate etching time, and the yield can be improved. Further, since the rate of change of the etching rate is monitored, the etching liquid used a plurality of times can be used, and the etching can be automated.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明のウエットエッチング終点検出用装置の
一実施例を示す構成図である。
FIG. 1 is a configuration diagram showing an embodiment of an apparatus for detecting an end point of wet etching according to the present invention.

【図2】エッチング時間とエッチングされた元素(被エ
ッチング部材)の関係を示す図である。
FIG. 2 is a diagram showing a relationship between an etching time and an etched element (a member to be etched).

【符号の説明】[Explanation of symbols]

1 容器 2 エッチング液 3 バスケット 4 試料 6 駆動手段 7 支持棒 8 配管 9 ポンプ 10 加熱手段 12 イオン検出手段 14 コンピュータ DESCRIPTION OF SYMBOLS 1 Container 2 Etching liquid 3 Basket 4 Sample 6 Driving means 7 Support rod 8 Piping 9 Pump 10 Heating means 12 Ion detection means 14 Computer

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】エッチング液が入れられた容器と、前記エ
ッチング液に浸漬されたエッチングすべき試料と、前記
エッチング液の一部を導入して加熱分解して液中に含ま
れる被エッチング部材をイオン化する加熱手段と、該イ
オンを取入れて該イオンの量をカウントするイオン検出
手段と、該検出手段からの出力の変化率に基づいてエッ
チングの終点を判断する終点検出手段と、該終点検出手
段からの出力信号に基づいて前記試料を前記エッチング
液から引き上げる駆動手段とを備えたことを特徴とする
ウエットエッチング終点検出用装置。
1. A container containing an etching solution, a sample to be etched immersed in the etching solution, and a part of the etching solution being introduced and thermally decomposed to be contained in the solution.
Heating means for ionizing the member to be etched, ion detection means for taking in the ions and counting the amount of the ions, and end point detection means for determining an end point of the etching based on a change rate of an output from the detection means; And a drive unit for pulling up the sample from the etching solution based on an output signal from the end point detection unit.
JP05042545A 1993-03-03 1993-03-03 Device for detecting the end point of wet etching Expired - Fee Related JP3116336B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP05042545A JP3116336B2 (en) 1993-03-03 1993-03-03 Device for detecting the end point of wet etching

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP05042545A JP3116336B2 (en) 1993-03-03 1993-03-03 Device for detecting the end point of wet etching

Publications (2)

Publication Number Publication Date
JPH06260479A JPH06260479A (en) 1994-09-16
JP3116336B2 true JP3116336B2 (en) 2000-12-11

Family

ID=12639034

Family Applications (1)

Application Number Title Priority Date Filing Date
JP05042545A Expired - Fee Related JP3116336B2 (en) 1993-03-03 1993-03-03 Device for detecting the end point of wet etching

Country Status (1)

Country Link
JP (1) JP3116336B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6018723B1 (en) * 2016-07-29 2016-11-02 株式会社Naaエレテック Baggage restriction curtain for X-ray inspection

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4542869B2 (en) * 2004-10-19 2010-09-15 東京エレクトロン株式会社 Processing method and computer program for implementing the processing method
JP2010153887A (en) * 2010-02-05 2010-07-08 Tokyo Electron Ltd Processing apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6018723B1 (en) * 2016-07-29 2016-11-02 株式会社Naaエレテック Baggage restriction curtain for X-ray inspection

Also Published As

Publication number Publication date
JPH06260479A (en) 1994-09-16

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