JP3115115U - Parallel jumper connection structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent a short circuit from occurring.
SOLUTION: A large number of pins 13a to 13j protruding from both ends of a parallel jumper 8 are inserted into pin holes 15a to 15j of respective pin hole rows 15A and 15B, and both substrates 4 and 6 with the parallel jumper 8 are placed in a dip tank. By passing the solder solution area along the solder direction B, the solder solution is attached between the lands 16a to 16j and the pins 13a to 13j of the boards 4 and 6, and the solder direction. A substantially triangular extension land 16A is integrally extended along the rear end side of each land 16a along the line B toward the rear side in the solder direction B, and the pin hole rows 15A, 15B.
The distance a + b between the rearmost pin hole 15a and the adjacent pin hole 15b along the solder direction B of
Is set wider than the interval a between the other pin holes, and the rearmost pin 13a inserted through the rearmost pinhole 15a is inclined rearward along the solder direction B.
[Selection] Figure 1

Description

The present invention provides a parallel jumper connection in which a pair of printed boards (hereinafter abbreviated as boards) used in an electronic device such as a disk device (DVD player, DVD recorder, video device integrated DVD) are connected by a parallel jumper. Regarding the structure, a short circuit is not particularly generated.

An example of a disk device is shown in FIG. This is a video device-integrated DVD, and a video for playing a DVD player (or DVD recorder) 2 for playing a disk D and a tape cassette T in front of the housing 1. The device 3 is arranged, the AV substrate 4 and the power supply substrate 5 are arranged behind the housing 1, and the connection substrate 6 is connected to the connector 7.
Is connected to the power supply substrate 5, and the connection substrate 6 and the AV substrate 4 are connected by a parallel jumper 8.

As shown in FIG. 7, the connection substrate 6 is integrally formed on the AV substrate 4 so as to be separable via a joint portion 10 between the cuts 9, and the AV substrate 4 is separated by dividing the joint portion 10.
Separated from.

As shown in FIGS. 7A and 8, the parallel jumper 8 has a large number of conductive wires arranged in parallel in the insulating resin film 12, and is connected to each conductive wire from both ends of the parallel jumper 8. A large number (in this example, 10) of pins 13a to 13j protrude at an equal interval a, and the retaining portions 14 are formed by bending the central portions of the pins 13a to 13j into a substantially square shape.

As shown in FIGS. 7 (a) and 8, each substrate 4 corresponding to each pin 13a-13j.
, 6 are provided with a plurality of (in this example, 10) pin holes 15a to 15j at equal intervals a to form a pair of linear pin hole rows 15A and 15B parallel to each other, and each substrate 4 , 6 are formed with circular lands 16a to 16j at the peripheral edges of the pin holes 15a to 15j.

Conventionally, the connection procedure of the parallel jumper 8 has been described in Patent Document 1 and the like, and an example thereof will be described. As shown in FIG. 7 (a), a parallel jumper bent in a substantially U shape is indicated. Then, the pins 13a to 13j are manually inserted into the pin holes 15a to 15j of the pin hole rows 15A and 15B [FIG. 7 (b)].

Subsequently, as shown in FIG. 9, the boards 4 and 6 with the parallel jumpers 8 are passed from the upper position (18a) in the dip tank 18 through the solder solution area (18b) along the soldering direction B, so that The lower surfaces of the substrates 4 and 6 are immersed in the solder solution 19 jetted toward the substrate, and the solder solution 19 adheres between the lands 16a to 16j and the pins 13a to 13j of the substrates 4 and 6 [FIG. 1
0 (a) reference].

Thereafter, when the two boards 4 and 6 with the parallel jumpers 8 pass through the solder solution area (18b) and reach the lower position (18c), the solder solution 19 is drained, and the lands 16a to 16j and the pin holes 15a. 10j, only a small amount of solder liquid 19 remains, and a reverse surface tension F due to the surface tension is applied to the remaining solder liquid 19 toward the pins 13a to 13j. As shown in FIG. 4, the solder liquid 19 is cut between the lands 16a to 16j, and the gap c
The solder liquid 19 separated by the gap c is solidified around the pins 13a to 13j, and the pins 13a to 13j are connected to the lands 16a to 16j independently of each other via the solidified solder 19a. Is done.

As described above, the boards 4 and 6 with the parallel jumpers 8 are connected to the solder solution area (18b) in the solder direction B.
The rear end side pin 13a and the rear end side land 16 in the solder direction B.
The amount of solder liquid 19 remaining between a and a decreases. Therefore, as shown in FIG. 8B, a substantially triangular extended land 16A is integrally extended toward the rear side along the solder direction B on the rearmost end land 16a, thereby extending the extended land 16A. An appropriate amount of solder solution 19 is left between the attached land 16a and the pin 13a.
JP-A-8-125323

In the above configuration, the solder liquid 19 remaining on the extension land 16A is easily transferred by being pulled around the rearmost pin 13a toward the adjacent pin 13b, and the transferred solder liquid 19 is easily transferred to the adjacent land 1.
6b, the bridge portion 19b (see FIG. 10B) is formed, the solidified solder 19a on the rearmost land 16a and the solidified solder 19a on the adjacent land 16b are connected, and there is a possibility that a short circuit may occur. As shown in phantom lines in FIG. 10 (b), when the rearmost pin 13a is bent when inserted into the pin hole 15a and inclined so as to approach the adjacent pin 13b side,
The bridge portion 19b is more likely to be generated, and the possibility of occurrence of a short circuit is increased.

An object of the present invention is to provide a parallel jumper connection structure in which a short circuit does not occur in view of the above-described conventional drawbacks.

In order to achieve the above object, the invention described in claim 1 is configured such that a pair of substrates each including an AV substrate and a connection substrate for a power supply substrate formed integrally with the AV substrate in a separable manner are connected by a parallel jumper. In the disk device, a central portion of a large number of pins protruding at equal intervals from both ends of the parallel jumper is bent into a substantially square shape to form a retaining portion, and each substrate corresponds to each pin. A pair of linear pin hole rows that are parallel to each other are formed by penetrating a large number of pin holes, and circular lands are formed at the periphery of each pin hole on the lower surface of each substrate. A large number of pins projecting from both ends are inserted into the pin holes of each of the pin hole rows, and each board with parallel jumpers is passed through the solder solution area in the dip tank along the solder direction, thereby In the parallel jumper connection structure in which the solder liquid is attached between the pin and each pin, a substantially triangular extension land is integrally extended toward the rear side in the solder direction in each land on the rearmost side along the solder direction. And the distance between the rearmost pin hole and the adjacent pin hole along the solder direction of each pin hole row is set wider than the distance between the other pin holes, Of the pins that extend to the rear side in the solder direction and are formed in an oval shape and project from both ends of the parallel jumper, the rear end pins are left in a straight state without being provided with the retaining portions, The tip of the rearmost pin protrudes longer than the tip of the other pin by a predetermined distance. Insert the tip of each rearmost pin into the rearmost pin hole and move the parallel jumper in the soldering direction. To solder each pin Each other pin is opposed to each pin hole, and both ends of the parallel jumper are pushed out to the both board sides to face each pin other than the last end side pin. It is characterized by being plugged into.

The invention according to claim 2 is an electronic apparatus in which a pair of substrates are connected by parallel jumpers, and each of the corresponding devices corresponds to a number of pins protruding at equal intervals from both ends of the parallel jumpers. A plurality of pin holes are formed in the substrate to form a pair of linear pin hole rows parallel to each other, and circular lands are formed on the periphery of each pin hole on the lower surface of each substrate. A large number of pins projecting from both ends are inserted into the pin holes of each of the pin hole rows, and both boards with parallel jumpers are passed through the solder solution area in the dip tank along the solder direction, whereby each land of both boards is In the parallel jumper connection structure in which the solder solution is attached between each pin and each pin, a substantially triangular extended land is directed to the rear end in the solder direction on each rearmost land along the solder direction. The distance between the pin hole on the rear end side and the adjacent pin hole is set wider than the distance between the other pin holes along the solder direction of each pin hole row, It is characterized in that the rearmost pin inserted through the rearmost pin hole is inclined rearward along the solder direction.

The device described in claim 3 is characterized in that, in the device described in claim 2, each rear end side pin hole extends in the rear direction along the solder direction and is formed in an oval shape.

The invention according to claim 4 is the invention according to claim 2 or 3, wherein, among the pins protruding from both ends of the parallel jumper, the tip of the rearmost pin is a predetermined distance from the tips of the other pins. It protrudes long, and the tip of each rear end side pin is inserted into the rear end side pin hole of each pin hole row, and each rear end side pin is moved along the solder direction by moving the parallel jumper in the solder direction. Inclining to the rear side, making each other pin face each pin hole, pushing both ends of the parallel jumper to both board sides, and inserting each pin other than each rearmost pin into each pin hole facing It is a feature.

The invention according to claim 1 corresponds to the third embodiment (see FIGS. 4 and 5), and according to this, each rear end protruded longer than the other pins by a predetermined interval. By simply inserting the tip of the side pin into each pin end pin hole and moving the parallel jumper in the solder direction, the pin on the pin end side can be bent and inclined as desired along the solder direction to the rear side. At the same time, it is possible to easily insert the pins other than the rearmost pins into the corresponding pin holes simply by pushing both ends of the parallel jumper to the both substrate sides, and the insertion work can be performed efficiently.

By inclining the rearmost pin to the rear side in the solder direction as described above, the interval between the inclined rearmost pin and the adjacent pin is widened, so that the solder liquid remaining on the extended land is on the rearmost side. Even when the pin is pulled and moved to the adjacent pin side, the transferred solder liquid does not reach the adjacent land, and it is possible to prevent a short circuit from occurring between the rearmost pin and the adjacent pin.

Further, by simply inserting the rear end side pin into the rear end side pin hole formed in an oval shape, the rear end side pin can be smoothly bent rearward along the solder direction and inclined as desired.

What is important here is that the tip end of the pin protrudes longer than the other pins simply by leaving it in a straight line without forming the retaining portion that has been conventionally applied to the rearmost pin. This means that the existing parallel jumper 8 can be used as it is, making it easy to use. Moreover, it is only necessary to slightly widen the distance between the rearmost pin hole and the adjacent pinhole of each existing substrate, and to make the rearmost pin hole an oval, and the change range is extremely small. It is practically not expensive.

In short, it is possible to provide an easy-to-use disk device in which a pair of substrates including an AV substrate and a connection substrate for a power supply substrate integrally formed so as to be separable from the AV substrate are safely connected so as not to be short-circuited by a parallel jumper. Is.

According to the second aspect of the present invention, when the rearmost pin is inserted into the rearmost pin hole, the rearmost pin is bent and inclined rearward along the solder direction. Since the space between the side pin and the adjacent pin is widened, even if the solder liquid remaining on the extension land is pulled around the rearmost pin and moved to the adjacent pin side, the transferred solder liquid reaches the adjacent land. Therefore, it is possible to prevent a short circuit from occurring between the rearmost pin and the adjacent pin, and the safety is high.

In order to incline the rear end side pin as described above, it is only necessary to slightly widen the distance between the rear end side pin hole and the adjacent pin hole of each existing board, and the change range is extremely small. It is practical for practical use.

According to the third aspect of the invention, it is desirable that the rearmost pin is smoothly bent rearward along the solder direction by simply inserting the rearmost pin into the rearmost pin hole formed in an oval shape. Can be tilted on the street.

According to the fourth aspect of the present invention, the tip of each rear end side pin projected longer than the other pins by a predetermined interval is inserted into each rear end side pin hole, and the parallel jumper is moved in the soldering direction. Each end pin can be bent and tilted back as desired along the solder direction, and each pin other than each end pin can be tilted just by pushing both ends of the parallel jumper to both board sides. Can be easily inserted into the respective pin holes facing each other, and the insertion operation can be performed efficiently.

FIG. 1 shows a parallel jumper connection structure according to a first embodiment of the present invention.
A plurality of (in this embodiment, 10) pins 13a to 13j protrude at equal intervals a from both ends of the parallel jumper 8, and the rearmost pin hole 1 along the solder direction B of each of the pin hole rows 15A and 15B.
An interval a + b between 5a and the adjacent pin hole 15b is set wider than an interval a between the other pin holes 15b to 15j. Since the configuration other than the above is substantially the same as the configuration shown in FIGS. 6 to 10, the same reference numerals are given to the same portions and the description thereof is omitted.

An example of specific dimensions will be described. The distance a between the pins 13a to 13j is 2 mm, the widening width b between the rearmost pin hole 15a and the adjacent pin hole 15b is 0.2 mm, and the rearmost pin The distance a + b between the hole 15a and the adjacent pin hole 15b is set to 2.2 mm, and each pin 13a
The outer diameter r of .about.13j is set to 0.5 mm, and the inner diameter d of each pin hole 15a to 15j is set to 0.8 mm.

The procedure for connecting the parallel jumper 8 will be described. As shown in FIG. 2A, the parallel jumper bent in a substantially U shape is held by a finger, and the pins 13a to 13j are manually inserted into the pin hole rows 15 as shown in FIG.
By inserting it into the pin holes 15a to 15j of A and 15B, the rear end side pin 13a is brought into contact with the upper end edge 15C of the rear end side pin hole 15a and bent obliquely rearward by a predetermined angle α (for example, 10 °). Let

Subsequently, as shown in FIG. 9, the boards 4 and 6 with the parallel jumpers 8 are passed from the upper position (18a) in the dip tank 18 through the solder solution area (18b) along the soldering direction B, so that The lower surfaces of the substrates 4 and 6 are immersed in the solder solution 19 jetting toward the substrate, and the solder solution 19 adheres between the lands 16a to 16j and the pins 13a to 13j of the substrates 4 and 6 [FIG. (
b)].

Thereafter, when the two boards 4 and 6 with the parallel jumpers 8 pass through the solder solution area (18b) and reach the lower position (18c), the solder solution 19 is drained, and the lands 16a to 16j and the pin holes 15a are removed. 2j, only a small amount of the solder liquid 19 remains, and a reverse surface tension F due to the surface tension is applied to the remaining solder liquid 19 toward the pins 13a to 13j, so that FIG. As shown in FIG. 3, the solder liquid 19 is cut between the lands 16a to 16j to form a gap c, and the solder liquid 19 cut by the gap c is solidified around the pins 13a to 13j, and the solidified solder. Each pin 13a to 13j is independent from each other via the land 19a.
6a to 16j.

According to the above configuration, when the rearmost end side pin 13a is inserted into the rearmost end side pin hole 15a, the rearmost end side pin 13a is bent and inclined rearward along the solder direction B, and the inclined rearmost end side Since the distance H (see FIG. 2B) between the pin 13a and the adjacent pin 13b is widened,
Even if the solder liquid 19 remaining on the extension land 16A is pulled and moved to the adjacent pin 13b around the rear end side pin 13a, the transferred solder liquid 19 does not reach the adjacent land 16b, and the rear end. A short circuit can be prevented from occurring between the side pin 13a and the adjacent pin 13b, and safety is high.

In order to incline the rear end side pin 13a as described above, it is only necessary to slightly widen the distance a + b between the rear end side pin hole 15a and the adjacent pin hole 15b of each of the existing boards 4 and 6, and the change Since the range is extremely small, the cost is hardly increased and it is practical.
High safety.

FIG. 3 shows a parallel jumper connection structure according to a second embodiment of the present invention.
Each rear end side pin hole 15a extends rearward along the solder direction B and has a predetermined width L (for example, 1.6 mm).
). The configuration other than the above is the first embodiment (see FIGS. 1 and 2).
Therefore, the same parts are denoted by the same reference numerals and the description thereof is omitted.

According to the above configuration, the rear end side pin 13a can be smoothly bent rearwardly along the solder direction B just by inserting the rear end side pin 13a into the rear end side pin hole 15a formed in an oval shape as desired. Can be tilted.

FIG. 4 shows a parallel jumper connection structure according to a third embodiment of the present invention.
By leaving each rear end side pin 13a in a straight line state without applying the retaining portion 14, the front end of each rear end side pin 13a has a predetermined distance e (for example, 1 m) from the front ends of the other pins 13b to 13j.
m) protrudes longer. Since the configuration other than the above is substantially the same as that of the first and second embodiments (see FIGS. 1 to 3), the same parts are denoted by the same reference numerals and the description thereof is omitted.

The connection procedure of the parallel jumper 8 will be explained. As shown in FIG. 5A, the parallel jumper bent in a substantially U shape is gripped by a finger, and the tip of each pin 13a at the end is manually inserted. By inserting the parallel jumper 8 in the soldering direction B as shown in FIG. 5 (b), the rear end side pins 13a are brought into contact with the upper end edge 15C of the rear end side pin hole 15a. The other pins 13b to 13j are opposed to the respective pin holes 15b to 15j, and both ends of the parallel jumper 8 are connected to both substrates 4, as shown in FIG. The pins 13b to 13j other than the rearmost end side pin 13a are inserted into the opposing pin holes 15b to 15j.

According to the above configuration, substantially the same effects as those of the first and second embodiments (see FIGS. 1 to 3) can be obtained. In particular, the protrusions are longer than the other pins 13b to 13j by a predetermined distance e. Further, by inserting the tip of each rear end side pin 13a into the rear end side pin hole 15a and moving the parallel jumper 8 in the soldering direction B, each rear end side pin 13a is desired to be rearward along the soldering direction B. In addition to being able to bend and incline the street, the pins 13b to 13j other than the rearmost pins 13a can be opposed to the pin holes 15b to 15j facing each other by simply pushing both ends of the parallel jumper 8 toward both the boards 4 and 6. And can be inserted efficiently.

What is important here is that the tip end of the pin 13a is made straighter than the other pins 13b to 13j simply by leaving the pinning portion 14 which is conventionally applied to the rearmost pin 13a without being formed in the straight shape. This means that the existing parallel jumper 8 can be used as it is, making it easy to use.

In short, a pair of substrates 4 and 6 including the AV substrate 4 and the connection substrate 6 for the power supply substrate 5 integrally formed so as to be separable to the AV substrate 4 are safely connected so as not to be short-circuited by the parallel jumper 8. A disk device can be provided.

In the above embodiment, the disk device (DVD player, DVD recorder, video device integrated DVD) has been described as an example, but the present invention is also applicable to other parallel jumper connection structures of various electronic devices.

(A) is a perspective view of the principal part which shows the parallel jumper connection structure which is 1st Embodiment of this invention, (b) is a bottom view of the board | substrate. (A)-(c) is a longitudinal cross-sectional view which shows the connection procedure. (A) is the bottom view of the board | substrate in the parallel jumper connection structure which is the 2nd Embodiment of this invention, (b) is the longitudinal cross-sectional view. (A) is a perspective view of the principal part which shows the parallel jumper connection structure which is the 3rd Embodiment of this invention, (b) is a bottom view of the board | substrate. (A)-(c) is a longitudinal cross-sectional view which shows the connection procedure. (A) is a schematic horizontal sectional view of the disk device, and (b) is an AA arrow view. (A) And (b) is a perspective view which shows the conventional connection procedure. (A) is a perspective view of the principal part of a prior art example, (b) is a bottom view of the substrate. It is a schematic longitudinal cross-sectional view of a dip tank. (A) And (b) is a longitudinal cross-sectional view which shows the connection procedure.

Explanation of symbols

4 AV substrate (substrate)
5 Power supply board 6 Connection board (board)
13a to 13j Pin 14 Detachable portion 15A, 15B Pin hole row 15a to 15j Pin hole 16a to 16j Land 16A Extension land 18 Dip tank 18b Solder solution area 19 Solder solution 19a Solidified solder B Solder direction H Between the pin on the end side and the adjacent pin Interval

Claims (4)

A disk device in which a pair of substrates each consisting of an AV substrate and a connection substrate for a power supply substrate integrally formed so as to be separable to the AV substrate are connected by parallel jumpers, and is equidistant from both ends of the parallel jumper. A pair of pins that are parallel to each other are formed by bending the central part of a large number of protruding pins into a substantially square shape to form a retaining part and penetrating a large number of pin holes in each substrate corresponding to each pin. Are formed, circular lands are formed around the periphery of each pin hole on the lower surface of each substrate, and a plurality of pins protruding from both ends of the parallel jumper are connected to the pin holes of each pin hole array. The solder solution was attached between each land and each pin by passing the board with the parallel jumper through the solder solution area in the dip tank along the solder direction. In the row jumper connection structure, substantially triangular extension lands are integrally extended toward the rear side in the solder direction on each land on the rearmost side along the solder direction, and the rearmost end along the solder direction of each pin hole row The distance between the side pin hole and the adjacent pin hole is set wider than the distance between the other pin holes, and each rear end side pin hole extends to the rear side in the solder direction and is formed into an oval shape. Of the pins protruding from both ends of the parallel jumper, by leaving the pin at the rearmost end side without leaving the retaining portion, the front end of each rearmost pin is more predetermined than the tips of the other pins. It protrudes long by the interval, and inserts the tip of each pin on the end pin into the pin hole on the pin end side and moves the parallel jumper in the solder direction to move the pin on the pin end side along the solder direction. Tilt to and each other It is opposed to down into each pin hole,
A parallel jumper connection structure characterized in that both ends of the parallel jumper are pushed out to both board sides and each pin other than each rearmost pin is inserted into each opposing pin hole. An electronic device in which a pair of substrates are connected to each other with parallel jumpers, and a plurality of pin holes are penetrated through each of the substrates in correspondence with a number of pins protruding at equal intervals from both ends of the parallel jumpers. A pair of linear pin hole rows that are parallel to each other are formed,
Circular lands are formed on the periphery of each pin hole on the lower surface of each board. A large number of pins protruding from both ends of the parallel jumper are inserted into the pin holes of each pin hole row, and both boards with the parallel jumper are dipped. In the parallel jumper connection structure in which the solder solution is adhered between each land and each pin of the both boards by passing the solder solution area in the bath along the solder direction, the rearmost end along the solder direction A substantially triangular extension land is integrally formed on each side land toward the rear side in the soldering direction, and a distance between the rearmost pin hole and its adjacent pin hole along the soldering direction of each pin hole row Is set wider than the interval between the other pin holes, and the rear end pin inserted through the rear end pin hole is inclined rearward along the solder direction. Connection structure 3. The parallel jumper connection structure according to claim 2, wherein each pin end side pin hole extends in a rear direction along the solder direction and is formed in an oval shape. Of the pins protruding from both ends of the parallel jumper, the tip of the rearmost pin protrudes longer than the tips of the other pins by a predetermined interval, and the tip of each rearmost pin is inserted into each pin hole row. By inserting it into the rear end side pin hole and moving the parallel jumper in the solder direction, each rear end side pin is inclined rearward along the solder direction, and other pins are made to face each pin hole, 4. The parallel jumper connection structure according to claim 2, wherein both ends of the parallel jumper are pushed out toward both substrates, and each pin other than each rearmost pin is inserted into each opposing pin hole.

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