JP2007127481A - Method of making probe card - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of making a probe card provided with a sufficient height and a sufficient needle pressure capable of freely setting the layout of the probe or the number of probes. <P>SOLUTION: The method includes a step of forming a probe unit by arranging a plurality of adjoining probes on a first substrate at prescribed intervals, and a step of arranging a prescribed number of probe units on a second substrates, so as to arrange the prescribed number of probes on the second substrate. Thereby, the probes and the first substrate are arranged vertically, and the probe and the wiring provided on the second substrate are directly connected. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a method of manufacturing a probe card used for testing a semiconductor wafer, and more particularly to a method of manufacturing a probe card using a probe unit.

  As one method of manufacturing a conventional cantilever type probe card, there is a method in which probes are directly formed on a second substrate of a probe card using MEMS technology.

  As a result, a high-density probe card is obtained, which corresponds to the recent high-density arrangement of electrodes such as narrowing of electrode pads and area array due to high integration and high speed of semiconductor wafers.

  However, in the conventional probe card manufacturing method, the probe formed by the MEMS technology has a problem that it is difficult to sufficiently grow in the vertical direction, the height direction cannot be taken, and it is difficult to secure a sufficient needle pressure. there were.

  In addition, there is a problem that the beam length of the probe becomes long, and there is not enough flexibility in probe layout and multi-piece collection.

  The present invention has a sufficient size in the height direction in order to solve the problem that the method of directly forming probes using MEMS technology has in such a conventional probe card manufacturing method, An object of the present invention is to provide a probe card manufacturing method that includes a probe that secures sufficient needle pressure and can freely set the probe layout and multi-piece arrangement.

  The method for producing a probe card according to the present invention includes a step of creating a probe unit in which a plurality of adjacent probes are arranged on a first substrate at a predetermined interval, and a predetermined number of the probe units are arranged on a second substrate. A probe card manufacturing method in which a predetermined number of probes are arranged on the second substrate in a vertical direction, wherein the probe and the first substrate are in a vertical direction, and the probe and the second substrate are arranged on the second substrate. It is characterized in that it is directly joined to the wiring provided in the.

  Preferably, a groove is provided on the surface of the second substrate by anisotropic etching, and the probe unit is inserted into the groove to bond the probe and the wiring of the second substrate.

  The method for producing a probe card according to the present invention includes a step of creating a probe unit in which a plurality of adjacent probes are arranged on a first substrate at a predetermined interval, and a predetermined number of the probe units are arranged on a second substrate. A probe card manufacturing method in which a predetermined number of probes are arranged on the second substrate in a vertical direction, wherein the probe and the first substrate are in a vertical direction, and the probe and the second substrate are arranged on the second substrate. A probe that has a sufficient size in the height direction and secures sufficient stylus pressure by directly joining to the wiring provided on the probe, and can be set freely for probe layout and multi-piece Cards can be made.

  Also, a groove is provided by anisotropic etching on the surface of the second substrate, and the probe unit is inserted into the groove to bond the probe and the second substrate, thereby bonding the probe and the second substrate. Can be expected to further improve the needle pressure of the probe.

  The present invention will be described in detail below with reference to the drawings. FIG. 1 is a perspective view of a probe unit 1 used in the probe card manufacturing method of the present invention, and FIG. 2 is a diagram showing a procedure for producing the probe unit 1.

  The method for manufacturing a probe card according to the present invention includes a step of creating a probe unit 1 in which a plurality of probes 2 adjacent to each other at a predetermined interval are arranged on a first substrate 3; A method of arranging a predetermined number of probes 2 on the second substrate 8 by arranging on the substrate 8, wherein the probes 2 and the first substrate 3 are arranged in a vertical direction as shown in FIG. The probe 2 and the wiring 9 provided on the second substrate 8 are directly joined.

The probe 2 used in the present invention includes a support part 4, an arm part 5 extending from the support part 4 and having a spring property, and a contact part that is disposed on the distal end side of the arm part 5 and contacts an electrode of an object to be inspected. 6 is composed.

First, a process of creating a probe unit 1 in which a plurality of probes 2 are arranged on a first substrate will be described. The probes 2 used in the present invention are directly formed collectively on the first substrate 3 by the MEMS technique, and the plurality of probes 2 are aligned in a horizontal row on the first substrate 3.

In order to improve the contact of the contact portion 6 of the probe 2 with the electrode of the object to be inspected, the tip portion of the contact portion 6 can be sharply processed after the probe 2 is formed as shown in FIG. It is.

After the plurality of probes 2 are collectively formed on the first substrate 3 by the MEMS technique, the plurality of probes 2 are covered with a protective material 7. Since the first substrate 3 is an insulating substrate and the protective material 7 is removed later, a resin that can be dissolved and removed is used.

  After the probe 2 is covered with the protective material 7 and the probe 2 is protected, the first substrate 3 is cut to remove unnecessary portions. As shown in FIG. 2 (b), it is cut along the same line as the tip of the support portion 4 of the probe 2, leaving the first substrate 3 to be slightly larger than the support portion 4 and removing the other portions. . At this time, as shown in the perspective view of FIG. 1, the first substrate 3 is left so as to hold the probes 2 in a state of being aligned in a horizontal row.

After removing unnecessary portions of the first substrate 3, the protective material 7 is dissolved and removed. As a result, the probe 2 protected by the protective material 7 is exposed as shown in FIG. Then, as shown in FIG. 1, a probe unit 1 in which a plurality of probes 2 are arranged in a horizontal row on a first substrate 3 is formed.

  By attaching the probe unit 1 in the vertical direction to the second substrate 8 of the probe card, it is possible to attach a plurality of probes 2 in a state where the height direction of the probe 1 is sufficiently secured. FIG. 4 is a diagram showing a method for attaching the probe 1 using the probe unit 2.

  The step of arranging the probe unit 1 on the second substrate 8 will be described in detail. Since the mounting angle of the probe 2 changes depending on the angle θ (see FIG. 2D) of the front end cut surface of the first substrate 3 of the probe unit 1, the angle θ is an acute angle and the angle θ is an obtuse angle. Separately described. FIG. 4A shows a case where the angle θ is an acute angle, and FIG. 4B shows a case where the angle θ is an obtuse angle. First, the case where the angle θ is an acute angle will be described.

As shown in FIG. 4A, the probe unit 1 is bonded to the wiring 9 provided on the surface of the second substrate 8 in the vertical direction using solder or the like. At this time, the probe 2 and the wiring 9 are joined so as to be in direct contact, and the front end surface of the first substrate 3 has an angle θ, which is caused by solder or the like used for joining in the gap between the probe unit 1 and the wiring 9. Fill.

  By the above-described probe card manufacturing method, the probe 2 can be attached in the vertical direction, and the probe 2 is attached to the second substrate 8 with a sufficient length in the height direction. Since the needle pressure is sufficiently secured and the vertically long probe 2 can be disposed on the second substrate 8, it is possible to dispose probes with a narrower pitch.

  Next, the case where the angle θ is obtuse will be described. FIG. 4B shows the case where the angle θ is an obtuse angle, but in the same manner as in the case of an acute angle, the probe unit 1 is placed vertically on the wiring 9 provided on the surface of the second substrate 8 and solder or the like is used. Join. At this time, the probe 2 and the wiring 9 are joined so as to be in direct contact. When the bonding strength is insufficient, reinforcement may be performed using an adhesive or the like.

  In the above-described embodiment, the probe unit 1 is bonded as it is without processing the surface of the second substrate 8. However, in order to further increase the bonding strength, anisotropic etching is performed on the surface of the second substrate 8. The method of applying will be described.

  FIG. 4C shows the case where anisotropic etching is performed on the surface of the second substrate 8. A groove 11 is provided on the surface of the second substrate 8 provided with the wiring 9 by anisotropic etching. The groove 11 shown in FIG. 4C has a V-shaped cross section, and the probe unit 1 is inserted into the groove 11 and joined with solder or the like.

  Thus, since it joins after putting the probe unit 11 in the groove | channel 11, joint strength can be made high and the needle pressure of the probe 2 also improves.

  As described above, according to the probe card manufacturing method of the present invention, a probe having a sufficient size in the height direction and a sufficient needle pressure is provided, and the layout and multi-cavity of the probe can be freely set. A probe card can be realized.

The perspective view of the probe unit used for the probe card manufacturing method of this invention. The side view which shows the formation method of a probe unit. The perspective view which shows another form of the contact part of a probe. The side view which shows three types of methods of attaching a probe unit to a 2nd board | substrate.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Probe unit 2 Probe 3 1st board | substrate 4 Support part 5 Arm part 6 Contact part 7 Protective material 8 2nd board | substrate 9 Wiring 10 Solder 11 Groove

Claims (2)

  A step of creating a probe unit in which a plurality of probes adjacent to each other at a predetermined interval are arranged on the first substrate, and a step of arranging a predetermined number of the probe units on the second substrate. A method for manufacturing a probe card in which a predetermined number of probes are arranged in a vertical direction, wherein the probe and the first substrate are in a vertical direction, and the probe and a wiring provided on the second substrate are directly joined. A method of manufacturing a probe card characterized by the above. A method for producing a probe card, comprising: providing a groove by anisotropic etching on the surface of the second substrate; and inserting the probe unit into the groove to bond the probe and the wiring of the second substrate.

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