JP3113517B2 - Substrate processing equipment - Google Patents

Substrate processing equipment

Info

Publication number
JP3113517B2
JP3113517B2 JP23332094A JP23332094A JP3113517B2 JP 3113517 B2 JP3113517 B2 JP 3113517B2 JP 23332094 A JP23332094 A JP 23332094A JP 23332094 A JP23332094 A JP 23332094A JP 3113517 B2 JP3113517 B2 JP 3113517B2
Authority
JP
Japan
Prior art keywords
substrate
substrate processing
unit
cleaning
drying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP23332094A
Other languages
Japanese (ja)
Other versions
JPH0897177A (en
Inventor
祐介 村岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Screen Holdings Co Ltd
Dainippon Screen Manufacturing Co Ltd
Original Assignee
Screen Holdings Co Ltd
Dainippon Screen Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Screen Holdings Co Ltd, Dainippon Screen Manufacturing Co Ltd filed Critical Screen Holdings Co Ltd
Priority to JP23332094A priority Critical patent/JP3113517B2/en
Publication of JPH0897177A publication Critical patent/JPH0897177A/en
Application granted granted Critical
Publication of JP3113517B2 publication Critical patent/JP3113517B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、基板処理装置、特に、
複数の基板処理を行う基板処理装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing apparatus,
The present invention relates to a substrate processing apparatus that performs a plurality of substrate processing.

【0002】[0002]

【従来の技術】例えば、半導体基板や液晶表示装置用ガ
ラス基板等の処理対象の基板の表面を洗浄する場合、浸
漬型の基板処理装置が用いられる。この種の基板処理装
置として、キャリアレスで基板を処理するものが知られ
ている。この基板処理装置は、キャリアの搬入搬出部
と、キャリア内から基板を出し入れする基板移載部と、
搬入搬出部と基板移載部との間でキャリアを搬送するキ
ャリア移載ロボットと、並べて配置された複数の基板処
理部と、基板移載部と基板処理部との間で基板を搬送す
る基板搬送ロボットとを備えている。基板搬送ロボット
は基板を挟持する開閉する保持アームを有している。ま
た、基板を搬送する際に、処理液で汚染された保持アー
ムによって基板を保持することで基板を汚染しないよう
に、基板搬送ロボットの保持アームを洗浄するアーム洗
浄装置が基板処理部に並べて配置されている。アーム洗
浄装置は、水洗槽と、水洗槽内で洗浄液を吐出する洗浄
液吐出部と、水洗槽内で乾燥ガスを吐出するガス吐出部
とを備えている。
2. Description of the Related Art For cleaning the surface of a substrate to be processed, for example, a semiconductor substrate or a glass substrate for a liquid crystal display device, an immersion type substrate processing apparatus is used. As this type of substrate processing apparatus, an apparatus for processing a substrate without a carrier is known. The substrate processing apparatus includes a carrier loading / unloading unit, a substrate transfer unit configured to take a substrate in and out of the carrier,
A carrier transfer robot that transfers a carrier between the loading / unloading unit and the substrate transfer unit, a plurality of substrate processing units arranged side by side, and a substrate that transfers the substrate between the substrate transfer unit and the substrate processing unit And a transfer robot. The substrate transfer robot has a holding arm that opens and closes and holds the substrate. In addition, an arm cleaning device that cleans the holding arm of the substrate transfer robot is arranged in the substrate processing unit so that the substrate is not contaminated by holding the substrate by the holding arm that is contaminated with the processing liquid when transferring the substrate. Have been. The arm washing device includes a washing tank, a washing liquid ejection unit that ejects a washing liquid in the washing tank, and a gas ejection unit that ejects a dry gas in the washing tank.

【0003】このようなアーム洗浄装置は、処理液で濡
れた基板を搬送する基板搬送ロボットの台数分設けられ
ている。例えば1台で基板を搬送する際には1基、3台
で基板を搬送しかつそのうちの2台で濡れた基板を搬送
する場合には2基それぞれ設けられている。
[0003] Such arm cleaning devices are provided by the number of substrate transport robots that transport substrates wet with a processing liquid. For example, when one substrate is transported, one substrate is provided, three substrates are transported, and when two of the substrates are wet, two substrates are provided.

【0004】[0004]

【発明が解決しようとする課題】前記従来の装置では、
基板処理部に並べてアーム洗浄装置が設けられているた
め、装置の設置面積が大きくなる。特に基板処理部の数
が少ないと、アーム洗浄装置の装置全体に占める割合が
大きくなり、効率が悪いものになる。本発明の目的は、
小さい設置面積で保持アームによる汚染を防止できる基
板処理装置を提供することにある。
In the above-mentioned conventional apparatus,
Since the arm cleaning device is provided beside the substrate processing unit, the installation area of the device is increased. In particular, when the number of the substrate processing units is small, the ratio of the arm cleaning device to the entire device increases, and the efficiency becomes poor. The purpose of the present invention is
An object of the present invention is to provide a substrate processing apparatus capable of preventing contamination by a holding arm with a small installation area.

【0005】本発明の別の目的は、保持アームによる汚
染を確実に防止できる基板処理装置を提供することにあ
る。
Another object of the present invention is to provide a substrate processing apparatus capable of reliably preventing contamination by a holding arm.

【0006】[0006]

【課題を解決するための手段】請求項1に係る基板処理
装置は複数の基板処理を行う基板処理装置であって、
基板を処理する処理槽を有する1または複数の基板処理
手段と、基板を保持する保持アームを有し、基板を基板
処理手段に搬送する基板搬送手段と、基板処理手段に設
けられ、保持アームを乾燥させる乾燥手段と、基板処理
手段に設けられ、保持アームを洗浄する洗浄手段と、を
備え、基板処理手段が、処理槽の周囲に配置された外側
槽を有し、乾燥手段及び洗浄手段が、外側槽の内側に配
置されている。
According to a first aspect of the present invention, there is provided a substrate processing apparatus for processing a plurality of substrates,
One or more substrate processing having a processing bath for processing a substrate
Means, and a holding arm for holding the substrate.
Substrate transfer means for transferring to the processing means; and
Drying means for drying the holding arm and substrate processing
Cleaning means provided on the means, for cleaning the holding arm;
The substrate processing means is disposed outside the processing tank.
A drying unit and a washing unit disposed inside the outer tank.
Is placed.

【0007】[0007]

【0008】請求項に係る基板処理装置は、請求項
に記載の装置において、乾燥手段が保持アームに向けて
乾燥ガスを吐出する乾燥ガスを吐出する乾燥ガス吐出部
を有し、洗浄手段が保持アームに向けて洗浄液を吐出す
る洗浄液吐出部を有している。請求項に係る基板処理
装置は、請求項に記載の装置において、洗浄手段の洗
浄液吐出部及び乾燥手段の乾燥ガス吐出部をさせる昇降
駆動部をさらに備えている。
[0008] The substrate processing apparatus according to claim 2, claim 1
Wherein the drying means has a dry gas discharge section for discharging a dry gas for discharging the dry gas toward the holding arm, and the cleaning means has a cleaning liquid discharge section for discharging the cleaning liquid toward the holding arm. ing. According to a third aspect of the present invention, there is provided the substrate processing apparatus according to the second aspect , further comprising an elevating drive unit configured to make a cleaning liquid discharge unit of the cleaning unit and a dry gas discharge unit of the drying unit.

【0009】請求項に係る基板処理装置は、請求項1
のいずれかに記載の装置において、基板処理手段の
うち少なくとも1つは水洗処理を行う水洗槽を有し、乾
燥手段が、水洗槽を有する基板処理手段に設けられてい
る。請求項に係る基板処理装置は、請求項に記載の
装置において、洗浄手段が、水洗槽を有する基板処理手
段に設けられている。
According to a fourth aspect of the present invention, there is provided a substrate processing apparatus.
4. In the apparatus according to any one of the above-described items 3 , at least one of the substrate processing units has a rinsing tank for performing a rinsing process, and the drying unit is provided in the substrate processing unit having the rinsing tank. According to a fifth aspect of the present invention, in the apparatus of the fourth aspect , the cleaning unit is provided in the substrate processing unit having a washing tank.

【0010】請求項に係る基板処理装置は、請求項1
のいずれかに記載の装置いおいて、基板処理手段
が、処理槽で複数の処理液により基板処理を連続して行
う。
[0010] The substrate processing apparatus according to claim 6 is the first aspect of the present invention.
In the apparatus according to any one of the above items (1) to ( 3 ), the substrate processing means continuously performs the substrate processing with the plurality of processing liquids in the processing tank.

【0011】[0011]

【作用】請求項1に係る基板処理装置では、基板搬送手
段が保持アームで基板を基板処理手段に搬送する。搬送
された基板は処理槽に浸漬されて基板処理される。処理
が終了した基板は保持アームで保持されて搬送される。
基板搬送手段が基板を搬送しないとき、処理槽の周囲に
配置された外側槽の内側に配置された洗浄手段が保持ア
ームを洗浄した後に、外側槽の内側に配置された乾燥手
段が保持アームを乾燥させる。
In the substrate processing apparatus according to the first aspect, the substrate transfer means transfers the substrate to the substrate processing means by the holding arm. The transported substrate is immersed in a processing bath to be processed. The substrate after the processing is transported while being held by the holding arm.
When the substrate transport means does not transport the substrate ,
The cleaning means arranged inside the arranged outer tub is
After cleaning the arm, dry hands placed inside the outer tank
The step dries the holding arm.

【0012】[0012]

【0013】請求項に係る基板処理装置では、洗浄液
吐出部が保持アームに向けて洗浄液を吐出し、その後に
乾燥ガス吐出部が保持アームに向けて乾燥ガスを吐出す
る。請求項に係る基板処理装置では、昇降駆動部が洗
浄液吐出部及び乾燥ガス吐出部を昇降させる。請求項
に係る基板処理装置では、水洗処理を行う水洗槽を有す
る基板処理手段に乾燥手段が設けられており、水洗槽内
に保持アームを浸漬させた後に乾燥させるだけで保持ア
ームを洗浄乾燥できる。
In the substrate processing apparatus according to the second aspect, the cleaning liquid discharge section discharges the cleaning liquid toward the holding arm, and thereafter, the dry gas discharge section discharges the drying gas toward the holding arm. In the substrate processing apparatus according to the third aspect , the lifting drive unit raises and lowers the cleaning liquid discharge unit and the dry gas discharge unit. Claim 4
In the substrate processing apparatus according to the above, the drying means is provided in the substrate processing means having the washing tank for performing the washing treatment, and the holding arm can be washed and dried only by dipping the holding arm in the washing tank and then drying.

【0014】請求項に係る基板処理装置では、水洗槽
上で洗浄手段によって保持アームを水洗した後に乾燥手
段によって保持アームを乾燥させる。請求項に係る基
板処理装置では、基板処理手段において、1つの処理槽
で複数の処理液による基板処理を連続して行う。
In the substrate processing apparatus according to the fifth aspect , the holding arm is washed with the washing means on the washing tank, and then the holding arm is dried by the drying means. In the substrate processing apparatus according to claim 6 , in the substrate processing means, the substrate processing is continuously performed with a plurality of processing liquids in one processing tank.

【0015】[0015]

【実施例】図1及び図2において、本発明の一実施例に
よる基板処理装置である浸漬型基板洗浄装置1は、基板
Wを収容するキャリアCの搬入搬出部2と、キャリアC
からの基板Wの取り出し又はキャリアCへの基板Wの収
納を行う基板移載部3と、搬入搬出部2と基板移載部3
との間でキャリアCを移載するキャリア移載ロボット4
と、複数の基板Wを一括して洗浄する浸漬型基板洗浄処
理部5と、基板Wの液切り及び乾燥のための基板乾燥部
6と、基板移載部3でキャリアCから取り出した複数の
基板Wを一括して保持して基板洗浄処理部5及び基板乾
燥部6に搬送する基板搬送ロボット7とから構成されて
いる。
1 and 2, an immersion type substrate cleaning apparatus 1 as a substrate processing apparatus according to an embodiment of the present invention includes a loading / unloading section 2 for a carrier C containing a substrate W and a carrier C.
Transfer unit 3 for taking out the substrate W from the substrate or storing the substrate W in the carrier C, the loading / unloading unit 2 and the substrate transfer unit 3
Transfer robot 4 for transferring carrier C between
A immersion-type substrate cleaning section 5 for cleaning a plurality of substrates W at once, a substrate drying section 6 for draining and drying the substrates W, and a plurality of substrates taken out of the carrier C by the substrate transfer section 3. The apparatus is composed of a substrate transfer robot 7 that collectively holds the substrates W and transfers the substrates W to the substrate cleaning unit 5 and the substrate drying unit 6.

【0016】基板移載部3は、キャリアCを載置して9
0°回転する2つのテーブル8と、テーブル8に載置さ
れたキャリアCから基板Wを抜き出すための基板保持部
3aとを有している。基板保持部3aは、テーブル8の
中央で昇降可能である。キャリア移載ロボット4は、昇
降及び回転自在でありかつ矢印A方向に移動可能に構成
されている。キャリア移載ロボット4は、搬入搬出部2
に搬入されてきたキャリアCを基板移載部3のテーブル
8上に移載し、また、洗浄済み基板Wを収容したキャリ
アCをテーブル8から搬入搬出部2へ移載する。
The substrate transfer section 3 mounts the carrier C and
It has two tables 8 that rotate by 0 °, and a substrate holder 3a for extracting a substrate W from the carrier C placed on the table 8. The substrate holder 3a can be moved up and down at the center of the table 8. The carrier transfer robot 4 is configured to be able to move up and down, rotate, and move in the arrow A direction. The carrier transfer robot 4 includes the loading / unloading unit 2
The carrier C loaded into the substrate transfer section 3 is transferred onto the table 8 of the substrate transfer section 3, and the carrier C containing the cleaned substrate W is transferred from the table 8 to the transfer section 2.

【0017】基板搬送ロボット7は、矢印B方向に移動
可能な移動部10と、基板移載部3から受け取った複数
の基板Wを挟持する保持アーム9とを有している。この
ロボット7は、保持アーム9で挟持した複数の基板Wを
移動部10により基板洗浄処理部5及び基板乾燥部6へ
順次搬送する。基板洗浄処理部5は、オーバーフロー型
の洗浄処理部5aと、水洗処理部5bとの2つの別系統
の処理部から構成されている。各処理部5a,5bは、
洗浄槽12a,12bと、洗浄槽12a,12bに昇降
自在に設けられた基板保持具11とを備えている。各処
理部5a,5bは、基板搬送ロボット7から受け取った
複数の基板Wを基板保持具11で保持して洗浄槽12
a,12b内に浸漬する。
The substrate transfer robot 7 has a moving part 10 movable in the direction of arrow B, and a holding arm 9 for holding a plurality of substrates W received from the substrate transfer part 3. The robot 7 sequentially transports the plurality of substrates W sandwiched by the holding arms 9 to the substrate cleaning processing unit 5 and the substrate drying unit 6 by the moving unit 10. The substrate cleaning processing unit 5 includes two separate processing units, an overflow type cleaning processing unit 5a and a water cleaning processing unit 5b. Each processing unit 5a, 5b
The cleaning apparatus includes cleaning tanks 12a and 12b and a substrate holder 11 provided in the cleaning tanks 12a and 12b so as to be able to move up and down. Each of the processing units 5a and 5b holds a plurality of substrates W received from the substrate transfer robot 7 by the substrate holder 11 and
a, 12b.

【0018】水洗処理部5bの洗浄槽12bの周囲に
は、図3及び図4に示すように、外側槽25が配置され
ている。外側槽25の内側には、保持アーム9を洗浄乾
燥するためのアーム洗浄乾燥装置30が設けられてい
る。アーム洗浄乾燥装置30は、外側槽25の内壁に上
下に配置されたガイド部材31と、ガイド部材31に上
下に案内される洗浄乾燥機本体32と、洗浄乾燥機本体
32を昇降駆動する昇降駆動機構33とを有している。
As shown in FIGS. 3 and 4, an outer tank 25 is disposed around the washing tank 12b of the washing section 5b. An arm cleaning and drying device 30 for cleaning and drying the holding arm 9 is provided inside the outer tank 25. The arm washing / drying device 30 includes a guide member 31 vertically arranged on the inner wall of the outer tub 25, a washing / drying machine main body 32 vertically guided by the guide member 31, and an elevating drive for driving the washing / drying machine main body 32 up and down. And a mechanism 33.

【0019】ガイド部材31は、図5に示すように、断
面がコ字状の部材であり、上下に長い部材である。洗浄
乾燥機本体32は、ガイド部材31に案内されるスライ
ド板35と、スライド板35の上部中央に配置された樹
脂製のエアシリンダ36と、エアシリンダ36の先端に
ワイヤ37を介して連結された揺動フレーム38とを有
している。ワイヤ37は、プーリ39に巻き掛けられて
いる。
As shown in FIG. 5, the guide member 31 is a member having a U-shaped cross section and a vertically long member. The washing / drying machine main body 32 is connected to a slide plate 35 guided by the guide member 31, a resin air cylinder 36 disposed at the upper center of the slide plate 35, and a tip of the air cylinder 36 via a wire 37. Swing frame 38. The wire 37 is wound around a pulley 39.

【0020】揺動フレーム38は、ワイヤ37の先端に
連結されたガス吐出部40と、ガス吐出部40の下方に
平行に配置された洗浄液吐出部41と、ガス吐出部40
及び洗浄液吐出部41の両端にそれぞれ連結された上リ
ンク42及び下リンク43とを有している。上リンク4
2及び下リンク43は平行に配置されており、基端がス
ライド板35に回転自在に支持されている。またガス吐
出部40と洗浄液吐出部41の両端はつなぎリンク44
により連結されている。ガス吐出部40及び洗浄液吐出
部41はそれぞれパイプの両端を封止した構造であり、
保持アーム9に向けてガス及び洗浄液を斜め下方に吐出
するガス吐出口45及び液吐出口46を有している。こ
れらの吐出口45,46は軸方向に並べて多数配置され
ている。ガス吐出部40及び洗浄液吐出部41の一端に
は、それぞれ図示しないガス供給源及び洗浄液供給源か
らの乾燥ガス及び洗浄液がそれぞれ供給され得る。
The oscillating frame 38 includes a gas discharge portion 40 connected to the tip of the wire 37, a cleaning liquid discharge portion 41 disposed in parallel below the gas discharge portion 40, and a gas discharge portion 40.
And an upper link 42 and a lower link 43 connected to both ends of the cleaning liquid discharge section 41, respectively. Upper link 4
The second link 43 and the lower link 43 are arranged in parallel, and the base end is rotatably supported by the slide plate 35. Further, both ends of the gas discharge unit 40 and the cleaning liquid discharge unit 41 are connected by a link 44.
Are connected by The gas discharge unit 40 and the cleaning liquid discharge unit 41 have a structure in which both ends of the pipe are sealed,
It has a gas discharge port 45 and a liquid discharge port 46 for discharging gas and cleaning liquid obliquely downward toward the holding arm 9. A large number of these discharge ports 45 and 46 are arranged in the axial direction. A dry gas and a cleaning liquid from a gas supply source and a cleaning liquid supply source (not shown) can be supplied to one ends of the gas discharge unit 40 and the cleaning liquid discharge unit 41, respectively.

【0021】昇降機構33は、上下に間隔を隔てて配置
された駆動プーリ47及び従動プーリ48と、駆動プー
リ47及び従動プーリ48に架け渡された無端ベルト5
0と、駆動プーリを駆動する両軸モータ51とから主に
構成されている。両軸モータ51の両端には駆動軸52
が連結されており、駆動軸52の両端に駆動プーリ47
が固定されている。
The elevating mechanism 33 includes a driving pulley 47 and a driven pulley 48 that are vertically spaced from each other, and an endless belt 5 that is bridged between the driving pulley 47 and the driven pulley 48.
0 and a two-axis motor 51 for driving the driving pulley. A drive shaft 52 is provided at both ends of the double shaft motor 51.
Are connected to each other, and drive pulleys 47 are provided at both ends of the drive shaft 52.
Has been fixed.

【0022】次に、上述の実施例の動作について説明す
る。基板Wが収納されたキャリアCが搬入搬出部2に載
置されると、キャリア移載ロボット4がそれを受け取
り、基板移載部3に載置する。キャリアCが基板移載部
3のテーブル8に移載されると、基板移載部3におい
て、基板保持部3aがキャリアCから基板Wを取り出
し、基板搬送ロボット7に渡す。基板Wを渡された基板
搬送ロボット7は、洗浄処理部5aの洗浄槽12aに基
板Wを搬送する。洗浄処理が終了すると、基板搬送ロボ
ット7により水洗処理部5bの洗浄槽12bに基板Wを
搬送する。水洗処理が終了すると、浸漬された基板Wは
基板搬送ロボット7により基板乾燥部6に送られる。
Next, the operation of the above embodiment will be described. When the carrier C containing the substrate W is placed on the loading / unloading section 2, the carrier transfer robot 4 receives it and places it on the substrate transfer section 3. When the carrier C is transferred to the table 8 of the substrate transfer unit 3, the substrate holding unit 3 a takes out the substrate W from the carrier C and transfers it to the substrate transfer robot 7 in the substrate transfer unit 3. The substrate transfer robot 7 to which the substrate W has been transferred transfers the substrate W to the cleaning tank 12a of the cleaning processing unit 5a. When the cleaning process is completed, the substrate W is transferred by the substrate transfer robot 7 to the cleaning tank 12b of the rinsing unit 5b. When the rinsing process is completed, the immersed substrate W is sent to the substrate drying unit 6 by the substrate transfer robot 7.

【0023】基板乾燥部6に送られると、基板Wが液切
り乾燥処理される。この液切り乾燥処理中において、基
板搬送ロボット7は水洗処理部5b上に配置される。基
板搬送ロボット7が水洗処理部5b上に配置されると、
図4に示すように、洗浄乾燥機本体32が昇降機構33
により上昇する。続いて、揺動フレーム38をエアシリ
ンダ36の進出によりそれぞれ内側に揺動させてガス吐
出部40及び洗浄液吐出部41を保持アーム9に接近さ
せる。そして保持アーム9に向けてまず洗浄液吐出部4
1から洗浄液を所定時間吐出する。洗浄液の吐出が終了
すると、スライド板35を僅かに下降させてガス吐出部
40を保持アーム9に接近させ、ガス吐出部40から乾
燥ガスを所定時間吐出する。この乾燥ガスとしてはたと
えばN2ガスが用いられる。乾燥ガスの吐出が終了する
と、昇降機構33により洗浄乾燥機本体32を図3に示
す位置に下降させる。また、ガス吐出部40及び洗浄液
吐出部41を、エアシリンダ36の退入によりスライド
板35に沿った位置に収納する。これにより、洗浄液に
よって濡れて汚染された保持アーム9が洗浄乾燥され
る。
When the substrate W is sent to the substrate drying section 6, the substrate W is drained and dried. During the draining and drying process, the substrate transfer robot 7 is disposed on the water washing section 5b. When the substrate transfer robot 7 is placed on the washing section 5b,
As shown in FIG. 4, the washing / drying machine main body 32 is
To rise. Subsequently, the swing frame 38 is swung inward by the advance of the air cylinder 36, so that the gas discharge unit 40 and the cleaning liquid discharge unit 41 approach the holding arm 9. Then, toward the holding arm 9, first, the cleaning liquid discharge unit 4
The cleaning liquid is discharged from 1 for a predetermined time. When the discharge of the cleaning liquid is completed, the slide plate 35 is slightly lowered to bring the gas discharge unit 40 close to the holding arm 9, and the dry gas is discharged from the gas discharge unit 40 for a predetermined time. As the drying gas, for example, N 2 gas is used. When the discharge of the drying gas is completed, the washing / drying machine main body 32 is lowered to the position shown in FIG. Further, the gas discharge unit 40 and the cleaning liquid discharge unit 41 are stored at positions along the slide plate 35 by retreating the air cylinder 36. Thus, the holding arm 9 wet and contaminated by the cleaning liquid is washed and dried.

【0024】基板乾燥部6による基板乾燥処理が終了す
ると、洗浄乾燥された保持アーム9により基板Wを保持
して基板移載部3に搬送する。基板移載部3では、基板
保持部が基板を受け取りキャリアC内に基板Wを収容す
る。処理済みの基板Wが収容されたキャリアCは、キャ
リア搬送ロボット4により搬入搬出部2に移載されキャ
リア運搬台車(図示せず)による搬出を待つ。 〔他の実施例〕 (a) 保持アームとの位置関係によっては必ずしもガ
ス吐出部40及び液吐出部41の揺動機構は必要ではな
く、スライド板35にガス吐出部40及び洗浄液吐出部
41を直接固定してもよい。 (b) 基板搬送ロボットが昇降機構を有する場合に
は、水洗槽12bに保持アーム9を浸漬させて洗浄し、
ガス吐出部40による乾燥処理だけを行っても良い。 (c) ガス吐出部40及び洗浄液吐出部41は複数の
吐出部45,46の代わりに1つ毎の吐出口を有し、別
の揺動機構によって保持アームの長手方向水平に吐出口
をスキャンするものでもよい。
When the substrate drying process by the substrate drying unit 6 is completed, the substrate W is held by the holding arm 9 that has been washed and dried, and transferred to the substrate transfer unit 3. In the substrate transfer unit 3, the substrate holding unit receives the substrate and stores the substrate W in the carrier C. The carrier C containing the processed substrate W is transferred to the carry-in / carry-out section 2 by the carrier transport robot 4 and waits for carry-out by a carrier carrier (not shown). [Other Embodiments] (a) The swing mechanism of the gas discharge unit 40 and the liquid discharge unit 41 is not necessarily required depending on the positional relationship with the holding arm, and the gas discharge unit 40 and the cleaning liquid discharge unit 41 are mounted on the slide plate 35. It may be fixed directly. (B) When the substrate transfer robot has an elevating mechanism, the holding arm 9 is immersed in the washing tank 12b for washing.
Only the drying process by the gas discharge unit 40 may be performed. (C) Each of the gas discharge unit 40 and the cleaning liquid discharge unit 41 has one discharge port instead of the plurality of discharge units 45 and 46, and scans the discharge ports horizontally in the longitudinal direction of the holding arm by another swing mechanism. You may do it.

【0025】[0025]

【発明の効果】請求項1に係る基板処理装置では、乾燥
手段が基板処理手段に設けられているので、別に乾燥手
段を設ける必要がなくなり、設置面積を小さくできる。
また、洗浄後に乾燥できるので、保持アームによる汚染
を確実に防止できる。さらに、乾燥手段及び洗浄手段が
処理槽内に配置されていないので、乾燥手段及び洗浄手
段が処理液に汚染されにくく、保持アームによる汚染を
より確実に防止できる。
According to the first aspect of the present invention, since the drying means is provided in the substrate processing means, there is no need to provide a separate drying means, and the installation area can be reduced.
In addition, since drying can be performed after cleaning, contamination by the holding arm can be reliably prevented. Furthermore, drying means and washing means
Since it is not located in the processing tank, drying means and cleaning
The step is less likely to be contaminated by the processing solution, which reduces contamination by the holding arm.
It can be prevented more reliably.

【0026】請求項に係る基板処理装置では、洗浄液
で洗浄した後に乾燥ガスで乾燥させているので、保持ア
ームを効率良く洗浄乾燥できる。
In the substrate processing apparatus according to the second aspect , the holding arm can be efficiently cleaned and dried because the substrate is cleaned with the cleaning liquid and then dried with the dry gas.

【0027】請求項に係る基板処理装置では、保持ア
ームの洗浄に際して、洗浄乾燥手段を処理槽上方に配置
できるので、保持アームを昇降する必要がなくなり、基
板搬送手段の構成が簡素になる。請求項に係る基板処
理装置では、水洗槽内に保持アームを浸漬させた後に乾
燥だけを行うだけで保持アームを洗浄乾燥できる。
In the substrate processing apparatus according to the third aspect , when cleaning the holding arm, the cleaning and drying means can be arranged above the processing tank, so that it is not necessary to raise and lower the holding arm, and the structure of the substrate transfer means is simplified. In the substrate processing apparatus according to the fourth aspect , the holding arm can be washed and dried only by performing drying only after immersing the holding arm in the washing tank.

【0028】請求項に係る基板処理装置では、保持ア
ームの洗浄乾燥処理が水洗槽上で行われるので、処理液
の排出が容易である。請求項に係る基板処理装置で
は、処理槽の数を減らすことができるので、より設置面
積を小さくできる。
In the substrate processing apparatus according to the fifth aspect , since the cleaning and drying processing of the holding arm is performed in the washing tank, the processing liquid can be easily discharged. In the substrate processing apparatus according to the sixth aspect , since the number of processing tanks can be reduced, the installation area can be further reduced.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の一実施例による基板処理装置の斜視
図。
FIG. 1 is a perspective view of a substrate processing apparatus according to an embodiment of the present invention.

【図2】その縦断面図。FIG. 2 is a longitudinal sectional view thereof.

【図3】アーム洗浄乾燥装置の断面模式図。FIG. 3 is a schematic sectional view of an arm cleaning / drying apparatus.

【図4】アーム洗浄乾燥装置の断面模式図。FIG. 4 is a schematic sectional view of an arm cleaning / drying apparatus.

【図5】アーム洗浄乾燥装置の斜視部分図。FIG. 5 is a perspective partial view of an arm cleaning / drying apparatus.

【符号の説明】[Explanation of symbols]

1 基板処理装置 5 基板洗浄処理部 5b 水洗処理部 12b 洗浄槽 30 アーム洗浄乾燥装置 32 洗浄乾燥機本体 33 昇降機構 40 ガス吐出部 41 洗浄液吐出部 DESCRIPTION OF SYMBOLS 1 Substrate processing apparatus 5 Substrate cleaning processing part 5b Water cleaning processing part 12b Cleaning tank 30 Arm cleaning / drying device 32 Cleaning / drying machine main body 33 Elevating mechanism 40 Gas discharge part 41 Cleaning liquid discharge part

Claims (6)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】複数の基板処理を行う基板処理装置であっ
て、 前記基板を処理する処理槽を有する1または複数の基板
処理手段と、 前記基板を保持する保持アームを有し、前記基板を前記
基板処理手段に搬送する基板搬送手段と、 前記基板処理手段に設けられ、前記保持アームを乾燥さ
せる乾燥手段と、前記基板処理手段に設けられ、前記保持アームを洗浄す
る洗浄手段と、を備え、 前記基板処理手段は、前記処理槽の周囲に配置された外
側槽を有し、前記乾燥手段及び洗浄手段は、前記外側槽
の内側に配置されている、 基板処理装置。
1. A substrate processing apparatus for processing a plurality of substrates, comprising: one or a plurality of substrate processing means having a processing bath for processing the substrate; and a holding arm for holding the substrate. A substrate transporting unit for transporting the substrate to the substrate processing unit; a drying unit provided in the substrate processing unit for drying the holding arm; and a drying unit provided to the substrate processing unit for cleaning the holding arm.
Cleaning means, wherein the substrate processing means is provided outside the processing tank.
A drying tank and a washing means,
Substrate processing equipment located inside
【請求項2】前記乾燥手段は、前記保持アームに向けて
乾燥ガスを吐出する乾燥ガスを吐出する乾燥ガス吐出部
を有しており、前記洗浄手段は、前記保持アームに向け
て洗浄液を吐出する洗浄液吐出部を有している、請求項
1に記載の基板処理装置。
2. The drying means according to claim 1 , wherein
Dry gas discharge unit that discharges dry gas that discharges dry gas
Wherein the cleaning means is directed toward the holding arm.
2. The substrate processing apparatus according to claim 1 , further comprising a cleaning liquid discharge unit configured to discharge the cleaning liquid .
【請求項3】前記洗浄手段の前記洗浄液吐出部及び前記
乾燥手段の前記乾燥ガス吐出部を昇降させる昇降駆動部
をさらに備えている、請求項2に記載の基板処理装置。
3. The cleaning liquid discharge section of the cleaning means and the cleaning liquid discharge section.
A lifting drive unit for raising and lowering the drying gas discharge unit of the drying unit
The substrate processing apparatus according to claim 2, further comprising:
【請求項4】前記複数の基板処理手段のうち、少なくと
も1つは水洗処理を行う水洗槽を有し、前記乾燥手段
は、水洗槽を有する基板処理手段に設けられている、請
求項1から3のいずれかに記載の基板処理装置。
4. A method according to claim 1, wherein at least one of said plurality of substrate processing means is provided.
Another one has a washing tank for performing a washing treatment, and the drying means
Is provided in the substrate processing means having a washing tank.
4. The substrate processing apparatus according to claim 1, wherein:
【請求項5】前記洗浄手段は、前記水洗槽を有する基板
処理手段に、設けられている、請求項4に記載の基板処
理装置。
5. A cleaning device according to claim 1 , wherein said cleaning means comprises a substrate having said washing tank.
The substrate processing apparatus according to claim 4 , wherein the substrate processing apparatus is provided in a processing unit.
【請求項6】前記基板処理手段は、前記処理槽で複数の
処理液による基板処理を連続して行う、請求項1から3
のいずれかに記載の基板処理装置。
6. The substrate processing means includes:
4. The method according to claim 1, wherein the substrate processing using the processing liquid is performed continuously.
A substrate processing apparatus according to any one of the above.
JP23332094A 1994-09-28 1994-09-28 Substrate processing equipment Expired - Fee Related JP3113517B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23332094A JP3113517B2 (en) 1994-09-28 1994-09-28 Substrate processing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23332094A JP3113517B2 (en) 1994-09-28 1994-09-28 Substrate processing equipment

Publications (2)

Publication Number Publication Date
JPH0897177A JPH0897177A (en) 1996-04-12
JP3113517B2 true JP3113517B2 (en) 2000-12-04

Family

ID=16953297

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23332094A Expired - Fee Related JP3113517B2 (en) 1994-09-28 1994-09-28 Substrate processing equipment

Country Status (1)

Country Link
JP (1) JP3113517B2 (en)

Also Published As

Publication number Publication date
JPH0897177A (en) 1996-04-12

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