JP3111704B2 - Polishing wire - Google Patents
Polishing wireInfo
- Publication number
- JP3111704B2 JP3111704B2 JP29897892A JP29897892A JP3111704B2 JP 3111704 B2 JP3111704 B2 JP 3111704B2 JP 29897892 A JP29897892 A JP 29897892A JP 29897892 A JP29897892 A JP 29897892A JP 3111704 B2 JP3111704 B2 JP 3111704B2
- Authority
- JP
- Japan
- Prior art keywords
- wire
- polishing
- hole
- cylindrical body
- magnetic powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
- B23D61/18—Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
- B23D61/185—Saw wires; Saw cables; Twisted saw strips
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Light Guides In General And Applications Therefor (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、光ファイバーフェルー
ルのような筒状体の貫通孔を研磨する研磨用ワイヤに関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing wire for polishing a through-hole of a cylindrical body such as an optical fiber ferrule.
【０００２】[0002]
【従来の技術】従来、この種の光ファイバーフェルール
は、射出成形で得られたセラミック素材孔にドリル加
工、遊離砥粒及び超音波加工にて貫通孔を施していた
（特開平４−７０６０８号公報参照）。2. Description of the Related Art Conventionally, in this type of optical fiber ferrule, a through hole is formed in a ceramic material hole obtained by injection molding by drilling, free abrasive grains and ultrasonic processing (Japanese Patent Laid-Open No. 4-70608). reference).
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、上記従
来のようにドリルを用いてセラミック素材を加工する場
合には、ドリルの摩耗が激しく、コストが嵩む上に、精
度が悪く、しかも加工に時間がかかるという問題があっ
た。また、ダイヤモンドを電着固化させたワイヤを用い
て孔加工を行う方法も提案されているが、ダイヤモンド
砥粒の硬度が高すぎるため、この加工だけでは貫通孔の
研磨面が滑らかに研磨されないという問題がある。そこ
で、本発明者等が鋭意検討した結果、ワイヤ本体の外周
に磁性粉を被覆してなる研磨用ワイヤをワイヤ放電加工
機に用いることにより、光ファイバーフェルールのよう
な筒状体の貫通孔を円滑に研磨する方法を案出した。However, when a ceramic material is machined by using a drill as in the above-mentioned conventional technique, the drill is severely worn, the cost is increased, the accuracy is poor, and the machining is time-consuming. There was such a problem. Also, a method of performing hole processing using a wire obtained by electrodepositing diamond has been proposed, but since the hardness of diamond abrasive grains is too high, the polishing surface of the through-hole is not polished smoothly by this processing alone. There's a problem. Therefore, as a result of intensive studies by the present inventors, the use of a polishing wire having the outer periphery of a wire body coated with a magnetic powder in a wire electric discharge machine makes it possible to smoothly penetrate a cylindrical body such as an optical fiber ferrule. A method of polishing was devised.
【０００４】本発明は、上記事情に鑑みてなされたもの
で、その目的とするところは、光ファイバーフェルール
のような筒状体の貫通孔を円滑にかつ精度良く研磨する
ことができて、確実に孔加工を行うことができる研磨用
ワイヤを提供することにある。The present invention has been made in view of the above circumstances, and an object of the present invention is to be able to smoothly and accurately polish a through-hole of a cylindrical body such as an optical fiber ferrule, thereby ensuring reliable polishing. An object of the present invention is to provide a polishing wire capable of performing hole processing.
【０００５】[0005]
【課題を解決するための手段】上記目的を達成するため
に、本発明は、筒状体の貫通孔に挿通して軸線方向に移
動させることにより、上記筒状体の貫通孔を研磨する研
磨用ワイヤにおいて、ワイヤ本体の外周に、γ-Ｆｅ 2 Ｏ
3 ，二酸化クロム，コバルト被着酸化鉄，メタル磁性
粉，バリウムフェライトのうちから選択された粒径５〜
１００μｍの磁性粉を被覆したものである。In order to achieve the above object, the present invention provides a polishing method for polishing a through-hole of a cylindrical body by inserting the through-hole into the cylindrical body and moving the same in an axial direction. Γ-Fe 2 O
3 , chromium dioxide, cobalt-coated iron oxide, metal magnetism
Particle size selected from powder and barium ferrite
It is coated with 100 μm magnetic powder.
【０００６】[0006]
【作用】本発明の研磨用ワイヤにあっては、ワイヤ本体
の外周に被覆した磁性粉を、筒状体の貫通孔に接触させ
て摺動させることにより、上記磁性粉によって、筒状体
の貫通孔を研磨する。In the polishing wire of the present invention, the magnetic powder coated on the outer periphery of the wire body is brought into contact with the through-hole of the cylindrical body and slid, so that the magnetic powder forms the cylindrical body. Polish through holes.
【０００７】[0007]
【実施例】以下、図１と図２に基づいて本発明の一実施
例を説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS.
【０００８】図１は本発明の研磨用ワイヤの一例を示す
図であり、この研磨用ワイヤＷは、ワイヤ本体Ｗａの外
周に、塗布もしくは蒸着（メッキ，真空蒸着，あるいは
スパッタリングなど）により、磁性粉Ｗｂをコーティン
グしたものである。上記ワイヤ本体Ｗａとしては、直径
が０．０５〜０．２ｍｍの真ちゅう，タングステン等の
金属や、樹脂製のものが用いられる。また、上記磁性粉
Ｗｂとしては、粒径５〜１００μｍのγ-Ｆｅ2Ｏ3，二
酸化クロム（ＣｒＯ2），コバルト被着酸化鉄，メタル
磁性粉，バリウムフェライト等磁気テープに用いられて
いるものが適宜選択される。FIG. 1 is a view showing an example of a polishing wire according to the present invention. The polishing wire W is applied to the outer periphery of a wire body Wa by coating or vapor deposition (plating, vacuum vapor deposition, sputtering or the like). Powder Wb is coated. As the wire body Wa, a metal such as brass or tungsten having a diameter of 0.05 to 0.2 mm or a resin is used. Examples of the magnetic powder Wb include γ-Fe 2 O 3 , chromium dioxide (CrO 2 ), cobalt-coated iron oxide, metal magnetic powder, and barium ferrite having a particle size of 5 to 100 μm. Is appropriately selected.
【０００９】上記研磨用ワイヤＷを用いて、筒状体の貫
通孔を研磨する装置としては、図２に示すようなワイヤ
放電加工機が挙げられる。すなわち、このワイヤ放電加
工機は、ヘッド部２と、下部ワイヤガイド４と、ワーク
固定台６とにより概略構成されている。そして、貫通孔
８を有するワーク１０をワーク固定台６に載置し、ヘッ
ド部２から下部ワイヤガイド４へ研磨用ワイヤＷを自動
的に送給して、ヘッド部２の先端と下部ワイヤガイド４
との間に研磨用ワイヤＷを張設することにより、研磨用
ワイヤＷをワーク（筒状体）１０の貫通孔８に挿通し
て、研磨用ワイヤＷでワーク１０の貫通孔８の研磨加工
を行うものである。すなわち、上記研磨用ワイヤＷはワ
イヤ供給ボビン１２に巻回されており、このワイヤ供給
ボビン１２から供給された研磨用ワイヤＷは、ダンパー
プーリ１４、プーリ１６と該プーリ１６と連動するブレ
ーキローラ１８、ワイヤ押え２０、支持プーリ２２、ワ
イヤ送り出しローラ２４、先端検出用リミットスイッチ
２６を通ってヘッド部２先端の給電ダイス２８及びダイ
スガイド３０に導かれる。次いで、上記ヘッド部２の先
端からワーク固定台６上のワーク１０の貫通孔８を通っ
た研磨用ワイヤＷは、下部ワイヤガイド４の先端のダイ
スガイド３４及び給電ダイス３６へ導かれ、支持プーリ
３８、ワイヤ回収ローラ４０を通って、ワイヤ感知板４
４が内部に設けられたワイヤ回収箱４２に回収される。
この結果、研磨用ワイヤＷがワーク１０の貫通孔８に沿
って移動することにより、該貫通孔８が研磨用ワイヤＷ
の磁性粉Ｗｂによって円滑に研磨される。As an apparatus for polishing a through-hole in a cylindrical body using the polishing wire W, a wire electric discharge machine as shown in FIG. 2 is exemplified. That is, this wire electric discharge machine is schematically constituted by the head portion 2, the lower wire guide 4, and the work fixing base 6. Then, the work 10 having the through-hole 8 is placed on the work fixing table 6, and the polishing wire W is automatically fed from the head 2 to the lower wire guide 4, so that the tip of the head 2 and the lower wire guide 4
The polishing wire W is inserted into the through-hole 8 of the workpiece (cylindrical body) 10 and the polishing wire W is used to polish the through-hole 8 of the workpiece 10. Is what you do. That is, the polishing wire W is wound around the wire supply bobbin 12, and the polishing wire W supplied from the wire supply bobbin 12 is supplied to the damper pulley 14, the pulley 16 and the brake roller 18 linked to the pulley 16. , A wire puller 20, a support pulley 22, a wire feed roller 24, and a limit switch 26 for detecting a leading end, and are guided to a power supply die 28 and a die guide 30 at the leading end of the head unit 2. Next, the polishing wire W passing through the through hole 8 of the work 10 on the work fixing table 6 from the tip of the head portion 2 is guided to the die guide 34 and the power supply die 36 at the tip of the lower wire guide 4, and is supported by the support pulley. 38, through the wire collecting roller 40, and the wire sensing plate 4
4 is collected in a wire collection box 42 provided inside.
As a result, the polishing wire W moves along the through hole 8 of the work 10, so that the through hole 8 becomes
Is smoothly polished by the magnetic powder Wb.
【００１０】また、ワーク１０が導電性のセラミックの
場合には、上記研磨用ワイヤＷによる研磨加工に先立っ
て、上記ワイヤ放電加工機に放電加工用ワイヤを装着し
て通常の放電加工により、上記ワーク１０の貫通孔８に
孔加工を施してもよい。ここで、上記ワイヤ放電加工機
において、上記放電加工用ワイヤあるいは上記研磨用ワ
イヤＷをヘッド部２から下部ワイヤガイド４に送給し
て、ワーク１０の貫通孔８に挿通する場合には、上記ワ
イヤ放電加工機に内蔵されたワイヤ自動挿通機能を利用
する。すなわち、予めワイヤをワイヤ供給ボビン１２か
ら繰り出し、ワイヤの先端がワイヤ送り出しローラ２４
よりも下側にある状態にセットし、ワイヤ送り出しロー
ラ２４を駆動して、ワイヤを下側に送り出し、ワイヤ回
収ローラ４０の位置まで導く。そして、上記ワイヤ送り
出しローラ２４を駆動し続けると、ワイヤ回収ローラ４
０を経たワイヤが、やや下方に傾斜しながら、ワイヤ回
収箱４２の背面側に設けられたワイヤ感知板４４に当接
する。この場合、上記ワイヤとワイヤ感知板４４との間
に電圧が印加されており、両者間に電流が流れるから、
この電流を検出することにより、ワイヤ送り出しローラ
２４の駆動を停止して、ワイヤの自動挿通操作が完了す
る。なお、該ワイヤの自動挿通操作時には、ワイヤの送
りを補助するために、通常、ワイヤとともに脱イオン処
理された水が流される。When the workpiece 10 is made of a conductive ceramic, prior to polishing with the polishing wire W, an electric discharge wire is attached to the wire electric discharge machine and the electric discharge machining is carried out. Hole processing may be performed on the through hole 8 of the work 10. Here, in the wire electric discharge machine, when the electric discharge machining wire or the polishing wire W is fed from the head portion 2 to the lower wire guide 4 and inserted into the through hole 8 of the work 10, Utilizes the automatic wire insertion function built into the wire electric discharge machine. That is, the wire is fed in advance from the wire supply bobbin 12 and the tip of the wire is
The wire is set to a position lower than the lower side, and the wire feed roller 24 is driven to feed the wire to the lower side and guide the wire to the position of the wire collecting roller 40. If the wire feed roller 24 continues to be driven, the wire collection roller 4
The wire passing through 0 abuts on a wire sensing plate 44 provided on the back side of the wire collection box 42 while slightly tilting downward. In this case, a voltage is applied between the wire and the wire sensing plate 44, and a current flows between the two.
By detecting this current, the driving of the wire feed roller 24 is stopped, and the automatic insertion operation of the wire is completed. In addition, at the time of the automatic insertion operation of the wire, in order to assist the feeding of the wire, usually, deionized water is flowed together with the wire.
【００１１】[0011]
【発明の効果】以上説明したように、本発明は、筒状体
の貫通孔に挿通して軸線方向に移動させることにより、
上記筒状体の貫通孔を研磨する研磨用ワイヤにおいて、
ワイヤ本体の外周に、γ-Ｆｅ 2 Ｏ 3 ，二酸化クロム，コ
バルト被着酸化鉄，メタル磁性粉，バリウムフェライト
のうちから選択された粒径５〜１００μｍの磁性粉を被
覆したものであるから、この磁性粉を、筒状体の貫通孔
に接触させて摺動させることにより、上記磁性粉によっ
て、光ファイバーフェルールのような筒状体の貫通孔を
円滑にかつ精度良く研磨することができて、確実に孔加
工を行うことができる。さらに、異形状の孔研磨加工に
も応用可能である。As described above, according to the present invention, by inserting a through-hole in a cylindrical body and moving it in the axial direction,
In a polishing wire for polishing the through-hole of the cylindrical body,
Γ-Fe 2 O 3 , chromium dioxide,
Baltic-coated iron oxide, metal magnetic powder, barium ferrite
The magnetic powder is coated with a magnetic powder having a particle size of 5 to 100 μm selected from the above. Such a through hole of a cylindrical body can be polished smoothly and accurately, and the hole processing can be performed reliably. Further, the present invention can be applied to polishing of holes having different shapes.
【図１】本発明の一実施例を示す断面図である。FIG. 1 is a sectional view showing one embodiment of the present invention.
【図２】ワイヤ放電加工機の一例を示す概略構成図であ
る。FIG. 2 is a schematic configuration diagram illustrating an example of a wire electric discharge machine.
Ｗ 研磨用ワイヤ Ｗａ ワイヤ本体 Ｗｂ 磁性粉 ８ 貫通孔 １０ ワーク（筒状体） W Polishing wire Wa Wire body Wb Magnetic powder 8 Through hole 10 Work (cylindrical body)
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) B23H 7/02 - 7/10 B24B 5/00 - 7/30 B24D 3/00 - 18/00 G02B 6/25 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. 7 , DB name) B23H 7 /02-7/10 B24B 5/00-7/30 B24D 3/00-18/00 G02B 6 / twenty five
Claims (1)
動させることにより、上記筒状体の貫通孔を研磨する研
磨用ワイヤにおいて、ワイヤ本体の外周に、γ-Ｆｅ 2 Ｏ
3 ，二酸化クロム，コバルト被着酸化鉄，メタル磁性
粉，バリウムフェライトのうちから選択された粒径５〜
１００μｍの磁性粉を被覆したことを特徴とする研磨用
ワイヤ。By 1. A moving axially inserted into the through hole of the tubular body, the abrasive wire for polishing a through-hole of the cylindrical body, the outer periphery of the wire body, gamma-Fe 2 O
3 , chromium dioxide, cobalt-coated iron oxide, metal magnetism
Particle size selected from powder and barium ferrite
A polishing wire coated with 100 μm magnetic powder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29897892A JP3111704B2 (en) | 1992-11-09 | 1992-11-09 | Polishing wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29897892A JP3111704B2 (en) | 1992-11-09 | 1992-11-09 | Polishing wire |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06143039A JPH06143039A (en) | 1994-05-24 |
| JP3111704B2 true JP3111704B2 (en) | 2000-11-27 |
Family
ID=17866656
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29897892A Expired - Fee Related JP3111704B2 (en) | 1992-11-09 | 1992-11-09 | Polishing wire |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3111704B2 (en) |
-
1992
- 1992-11-09 JP JP29897892A patent/JP3111704B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH06143039A (en) | 1994-05-24 |
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