JP2002137157A - Polishing device for inner periphery of sleeve and wire for polishing sleeve used in the polishing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable provision of a sleeve 1 excellent in cylindricity of an inner periphery and to enable a decrease of a connection loss value optical characteristics essential to a photo connector. SOLUTION: By forming a polishing wire 11 in a shape that a fine wire 22 is wound around the outer periphery of a core wire 21, an inner periphery machining device provided with a main spindle 15 to hold and rotate a wire feed part 12, a wire winding part 16, a wire straight line guide part 14, and the sleeve 1 is used.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inner peripheral polishing device for a sleeve, which is used for optical communication or the like.

[0002]

2. Description of the Related Art A sleeve used for optical communication or the like is composed of a split sleeve used in an optical connector for connecting a pair of optical fibers and a precision sleeve used in a receptacle for connecting a semiconductor laser and an optical connector. Sleeves. Both sleeves have the same function in that they hold the ferrule at the inner periphery.

A general split sleeve is shown in FIG.
A slit 2 is formed in the longitudinal direction in a cylindrical shape, and the through hole 3 is slightly polished slightly smaller than the outer diameter of a ferrule (not shown) (see JP-A-2-231545), and is inserted by its spring property. The ferrule is gripped and aligned.

[0004] The split sleeve 1 is manufactured by polishing a work having a through hole 3 formed in the axis thereof into a cylindrical shape having a predetermined inner diameter, and then forming a slit 2 therein.

In the conventional method for polishing the inner circumference of the split sleeve 1, as shown in FIG. 6, a work W (split sleeve 1) is inserted into a rotating tapered polishing wire 61, and the work W is moved back and forth to penetrate. The split sleeve 1 was manufactured by grinding the inner periphery of the hole 3 into a cylindrical shape (Japanese Patent Laid-Open No. 5-203).
No. 838).

Further, as shown in FIG. 7, a taper-shaped polishing wire 71 is wound around a wire feed portion 72, and a wire linear guide portion 74 of the polishing wire 71 A main shaft 75 is provided, and a work W (a ferrule is held in the main shaft 75. A wire for winding the polishing wire 71 after polishing the inner periphery of the through hole of the work W is provided downstream of the main shaft 75. A winding unit 76 is provided.

The polishing wire 71 is wound around a wire winding section 76 while rotating the main shaft 75 in the circumferential direction. that time,
When diamond abrasive grains are supplied to the polishing wire 71 and the polishing wire 71 is sent at a constant speed, the polishing wire 71
The inner circumference of the through hole of the ferrule is polished into a cylindrical shape on the outer peripheral surface of the ferrule (see Japanese Patent Application Laid-Open No. 10-328985).

[0008]

The above-described conventional inner sleeve polishing apparatus for a split sleeve has a structure in which only one side of the polishing wire 61 is supported. It is difficult to move in parallel to the central axis, and the workpiece W is polished in a state where it is running sideways. For this reason, the problem that the cylindricity of the inner circumference is bad occurs,
There is a problem that a connection loss value, which is an important optical characteristic in an optical connector, is increased.

A method of diverting the inner peripheral polishing device of the ferrule shown in FIG. 7 to a split sleeve is also conceivable. However, since the inner diameter of the ferrule is as large as φ0.125 mm and the inner diameter of the split sleeve is as large as φ2.5 mm, A thick polishing wire corresponding to this must be used, and such a thick wire is difficult to bend and cannot be wound around the wire winding portion 72, and this method has not been used at all.

[0010]

In view of the above, the present invention provides
In an inner peripheral polishing device for an optical communication sleeve provided with a slit in a longitudinal direction of a cylindrical body, a polishing wire in which a small diameter wire is wound around an outer periphery of a core wire, a wire feeding portion in which the wire is wound, and a wire winding portion , A wire linear guide, and a main shaft disposed on the wire linear guide for holding and rotating the sleeve.

Further, in the wire for polishing a sleeve, a thin wire is wound around the outer periphery of the core wire.

Further, the present invention is characterized in that the core wire is tapered and a small diameter wire is wound around its outer periphery.

In addition, the present invention is characterized in that diamond abrasive grains are electrodeposited and solidified on the outer periphery of the small diameter wire.

That is, according to the present invention, the polishing wire is formed by winding a small-diameter wire around the outer periphery of the core wire.
It is possible to use a device having a wire feeder, a wire take-up unit, a wire linear guide unit, and a main shaft for rotating a split sleeve, which is an inner peripheral polishing device of a ferrule which has not been conventionally usable. A sleeve with good cylindricity was obtained, and a connection loss value, which is an important optical characteristic in an optical connector, could be reduced.

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a schematic diagram showing an apparatus for polishing the inner periphery of a split sleeve according to an embodiment of the present invention. A tapered polishing wire 11, which will be described in detail later, is wound around a wire feed portion 12. Two pulleys 13 are provided for laying the polishing wire 11 in a straight line, and a main shaft 15 is disposed in a wire linear guide portion 14 between the pulleys 13.
A work W (split sleeve) is held in 5. On the downstream side of the main shaft 15, a wire take-up section 16 for winding the polishing wire 11 after polishing the inner periphery of the through hole of the work W is provided.

The polishing wire 11 is wound around a wire winding section 16 while rotating the main shaft 15 in the circumferential direction. that time,
When diamond abrasive grains are supplied to the polishing wire 11 and the polishing wire 11 is fed at a constant speed, the polishing wire 11
The inner periphery of the through hole of the work W is polished into a cylindrical shape on the outer peripheral surface of the workpiece W.

Here, the main shaft 15 needs to have a structure for fixing the work W and rotating the work W. For example, a chuck method or a method using a rubber roller may be used. In addition, a structure in which a plurality of works W are fixed is more preferable because working efficiency is improved.

Further, the wire feeding section 12 and the wire winding section 16 need to have a mechanism that does not loosen the polishing wire 11 even if the winding diameter changes. For this purpose, a method of synchronizing the feeding speed and the winding speed of the polishing wire 11 or a method in which a tension pulley is provided and slackness of the polishing wire 11 is suppressed by a spring may be used.

The pulley 13 needs to be provided with a groove through which the polishing wire 11 passes. The pulley 13 has a V-shaped groove or a U-shaped groove, and has a groove width such that the polishing wire 11 does not move sideways.
It is desirable that the diameter is slightly larger than the outer diameter of No. 1.

The wire feeding section 12 and the wire winding section 1
6, the material of the pulley 13 can be metal, resin, ceramic, or the like, but it is preferable to use alumina ceramics in consideration of groove wear.

In the apparatus for polishing the inner periphery of the split sleeve according to the present invention shown in FIG. 1, the longitudinal direction of the work W is shown to be vertical, but the same effect can be obtained even when it is horizontal.

Next, the polishing wire 11 will be described with reference to FIG.

The polishing wire 11 is a central core wire 2
1 has a tapered shape in advance, and has a structure in which a small-diameter wire 22 is wound around the outer periphery. Although it is desirable that the core wire 21 and the small-diameter wire 22 are in close contact with each other, three places, that is, both ends of the small-diameter wire 22 and the taper start point of the core wire 21 are fixed by welding, soldering, plating, or the like. A method is also acceptable.

The reason why the polishing wire 11 is tapered is to make it easier to insert the polishing wire 11 when processing the inner periphery of the split sleeve.

The core wire 21 and the small diameter wire 22 are both made of metal. However, the core wire 21 is made of a high-strength steel wire because tension is applied, and the small diameter wire 22 has a function of eroding diamond abrasive grains. Therefore, it is desirable to use a non-ferrous metal wire such as a copper alloy or a tin alloy. From the viewpoint of durability and cost, it is particularly desirable to use a piano wire for the core wire 22 and a phosphor bronze wire for the small diameter wire.

Thus, the polishing wire 11 is connected to the core wire 2
By arranging a small diameter wire around the periphery of the wire 1, the wire can be easily bent even if the wire is thick, and can be satisfactorily wound around the wire feed portion 12 of the apparatus shown in FIG. 1.

The outer diameter of the core wire 21 is φ0.2 mm or more.
1.8 mm can be used. If it is less than 0.2 mm, it may not be able to withstand the tension of the polishing machine and may be cut during processing, and if it exceeds 1.8 mm, the core wire 21 does not bend along the groove of the pulley 13. . Preferably, φ0.2 mm to 1.5 mm is good. This is φ1.5m
m, the radius of curvature of the bend becomes large.
This is because the outer diameter of No. 3 must also be increased.

The outer diameter of the small-diameter wire 22 is φ0.1 to
1.2 mm can be used. If it is less than 0.1 mm, the sleeve 1 may be worn out during polishing. Because it is gone.

As an example, in the case of polishing the inner circumference of a split sleeve of φ2.5 mm, the outer diameter of the core wire 21 is 0.9 to 0.9 mm.
A 1.5 mm piano wire, and the thin wire 22 is 0.5 m
A phosphor bronze wire of m to 0.8 mm may be used.

Although a thin wire 22 having a circular cross section is used here, various cross sectional shapes such as a square, a rectangle, and a trapezoid may be used.

Next, another embodiment of the polishing wire of the present invention will be described with reference to FIG.

In FIG. 3A, reference numeral 11 denotes a central core wire 3
1 is a small diameter wire 2
2 is a configuration in which the diameter is gradually reduced. FIG. 3 (b)
Is a configuration in which a small-diameter wire 22 is wound and then worked on a taper. In each case, the core wire 21 is attached to the small diameter wire 22.
The effect of the present invention can be obtained as long as the shape is wound. Although the small-diameter wire 22 is shown by a round wire in FIG. 3, various cross-sectional shapes such as a square, a rectangle, and a trapezoid may be used.

Finally, a third embodiment of the polishing wire will be described with reference to FIG.

In the polishing wire 11, the diamond abrasive grains 43 are fixed to the outermost peripheral portion of the assembly of the core wire 41 and the small diameter wire 42 by metal plating or the like by electrodeposition or metal bonding. Configuration.

In the case of electrodeposition, about 4/5 of the diamond abrasive grains 43 are covered with Ni plating, and
It becomes 5. By fixing the diamond abrasive grains in this manner, scattering of the diamond paste during processing is prevented, and the polishing apparatus is not contaminated.

As described above, according to the present invention, by forming the polishing wire into a shape in which a small-diameter wire is wound around the core wire, a large polishing wire can be sufficiently bent.
By using a device equipped with a wire feeder, a wire take-up unit, a wire linear guide, and a main shaft for rotating a sleeve, which is an inner peripheral polishing device of a ferrule that has not been conventionally usable, an inner peripheral cylinder is formed. It is possible to obtain a split sleeve having a good degree, and to reduce a connection loss value, which is an important optical characteristic in an optical connector.

Although the present invention has been described with reference to the split sleeve as an example, the present invention can also be applied to a precision sleeve.

[0039]

EXAMPLE Here, an experiment was conducted by the following method.

The core wire 21 of the present invention shown in FIG.
1.3 mm piano wire, and the fine wire 22 is φ0.6
The inner peripheral polishing apparatus of the present invention shown in FIG. 1 using a polishing wire 11 made of a phosphor bronze wire of 0.1 mm and the inner peripheral processing apparatus shown in FIG. Outer diameter D of the split sleeve 1 is φ3.2m
m, length L = 11.4 mm, through hole d = φ2.45 mm
Of the workpieces W were prepared and processed by 20 pieces each. The processing conditions were such that the rotation speed of the main shaft 15 was 300 rpm, and the wire feed speed was 0.1 m / s.

The straightness in the longitudinal direction of the inner periphery of the sample after processing was measured. As a measuring method, a method of tracing with a stylus using a shape measuring instrument was used.

Table 1 shows the results.

[0043]

[Table 1]

From these results, it was found that the average value and the variation of the cylindricity were 0.79 μm when the inner peripheral polishing apparatus of the related art was used.
m, which is 0.114 μm, which is bad, the average value and variation are 0.19 μm,
This is a very stable value of 0.046 μm.

[0045]

As described above, according to the present invention, an inner peripheral polishing apparatus for a ferrule which cannot be used conventionally is obtained by using a structure in which a fine wire is wound around the outer periphery of a core wire. A device having a wire feeder, a wire take-up unit, a wire linear guide, and a main shaft for holding and rotating the sleeve can be used, and a sleeve having good inner peripheral cylindricity can be obtained. as a result,
A connection loss value, which is an important optical characteristic in an optical connector, can be reduced.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram showing an inner peripheral polishing apparatus for a sleeve of the present invention.

FIG. 2 is a cross-sectional view showing a sleeve polishing wire of the present invention.

FIGS. 3A and 3B are cross-sectional views showing a sleeve polishing wire according to another embodiment of the present invention.

FIG. 4 is a cross-sectional view showing a sleeve polishing wire of the present invention.

FIG. 5 is a perspective view showing a general split sleeve.

FIG. 6 is a schematic configuration diagram showing a conventional method for polishing the inner periphery of a split sleeve.

FIG. 7 is a schematic configuration diagram showing a conventional inner peripheral polishing device for a ferrule.

[Explanation of symbols]

 10 Split Sleeve 2 Slit 3 Through Hole 11 Polishing Wire 12 Wire Feeding Part 13 Pulley 14 Wire Linear Guide 15 Spindle 16 Wire Winding Part 17 Rear End Chamfer 21 Core Wire 22 Small Wire 31 Core Wire 32 Small Wire 41 Core Wire 42 Fine Wire 43 Diamond Abrasive 44 Ni Plating 61 Polishing Wire 71 Polishing Wire 72 Wire Feeding Part 74 Wire Linear Guide 75 Main Shaft 76 Wire Winding Part W Work

Claims (4)

[Claims] An inner peripheral polishing apparatus for an optical communication sleeve provided with a slit in a longitudinal direction of a cylindrical body, a polishing wire in which a small-diameter wire is wound around an outer periphery of a core wire, and a wire feeder in which the wire is wound. An inner diameter grinding device for a sleeve, comprising: a wire winding portion; a wire linear guide portion; and a main shaft arranged on the wire linear guide portion for holding and rotating the sleeve. 2. A sleeve polishing wire, wherein a small-diameter wire is wound around the outer periphery of a core wire. 3. A tapered shape of the core wire and a small diameter wire wound around its outer periphery.
The wire for polishing a sleeve according to claim 1. 4. A wire for polishing a sleeve according to claim 2, wherein diamond abrasive grains are electrodeposited and solidified on the outer periphery of said small diameter wire.