JP3110405B2 - High frequency circuit package - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a structure for securing spatial isolation inside a microwave IC.

[0002]

2. Description of the Related Art Conventionally, high-frequency circuits not only in mobile telephones but also in radio communication equipment and the like radiate and interfere with electromagnetic waves, thus causing noise and the like and causing malfunctions of electronic equipment and the like. For this reason, various measures have been taken. For example, a so-called shield that covers a high frequency circuit with a metal plate is often used. Also, if necessary,
It has also been proposed to provide a radio wave absorber on a part of the shield.

For example, Japanese Unexamined Patent Publication No. 63-228801 (hereinafter referred to as "prior art 1") discloses a microstrip line formed on a dielectric substrate, ground patterns on both sides of the microstrip line, In a microstrip circuit having a large number of through holes connected to the ground conductor on the back side of the substrate and a microwave integrated circuit composed of a housing for housing the same, grooves are provided in the housing immediately below the ground pattern, and these grooves are formed in these grooves. A configuration including a radio wave absorber is disclosed.

Japanese Patent Application Laid-Open No. 5-259708 (hereinafter referred to as "prior art 2") provides an attenuating cap on a waveguide line having an open metal cover, and also provides a waveguide line in an internal space. A waveguide type attenuator configured by providing a radio wave absorber is disclosed. According to the prior art 2, a TE10 mode waveguide line in a metal case, a waveguide type attenuator, and an MIC package are connected at a high frequency.

[0005] Regarding the above prior arts 1 and 2, MIC
It is not shown to provide a radio wave absorber in the package itself.

Further, when a shield is provided in an MIC package, the space of the shield itself becomes large, so it is difficult to provide the shield in each electronic component. What has been proposed.

For example, Japanese Patent Application Laid-Open No. 6-188656 (hereinafter referred to as prior art 3) discloses that a dielectric resonator and a microwave IC are provided in a cavity, and an upper portion, a side portion, or the like in the cavity of the microwave IC is provided. A configuration in which a radio wave absorber is provided on the upper surface of a micro IC is disclosed.

In a microwave integrated circuit device disclosed in Japanese Patent Application Laid-Open No. Sho 62-265801 (hereinafter referred to as prior art 4), a multistage amplifier is formed on a microwave integrated circuit substrate, and further, a shield case for shielding. Is disclosed, and an electromagnetic wave absorber is provided in a concave portion periodically provided in a side wall portion of the shield case.

In the prior arts 3 and 4, a shield and a radio wave absorber are provided outside the microwave integrated circuit.

[0010]

However, in recent years,
The integration of high-frequency circuits is also increasing, and in particular, in microwave ICs and the like, spatial isolation is difficult to obtain due to physical size limitations.

Therefore, as one method of securing isolation, there is a method of installing a radio wave absorber inside a microwave IC. However, in the high frequency region, the frequency characteristics of the radio wave absorber become important, and the material is varied and the adhesive is used. Fixing by such means has problems in accuracy and reliability.

Accordingly, a technical problem of the present invention is to fix an electromagnetic wave absorber structurally on the microwave IC side without using an adhesive or the like, thereby causing abnormal oscillation caused by excitation of unnecessary waves inside the microwave IC. It is an object of the present invention to provide a high-frequency circuit package capable of preventing the occurrence of a high frequency circuit.

[0013]

According to the present invention, in a high frequency circuit package for fixing a plate-shaped radio wave absorber to an inner surface of a cap portion, an elastic spacer is provided on a convex portion provided on a header. And the spacer and the inner surface of the cap portion sandwich the radio wave absorber from both sides.
In addition, the side surface of the radio wave absorber through the spacer
A high-frequency circuit package having a structure fixed and supported on the inner surface of the cap portion is obtained.

Further, according to the present invention, in the high frequency circuit package, the spacer is made of rubber, and the high frequency circuit package is obtained.

Further, according to the present invention, in the high frequency circuit package, the cap portion includes a ceiling surface having a concave portion for accommodating the radio wave absorber, and a side portion hanging down from an edge of the ceiling surface. A high-frequency circuit package provided with an edge extending parallel to the ceiling surface outward from a lower end of the side portion.

According to the present invention, in a high-frequency circuit package for fixing a plate-shaped radio wave absorber to an inner surface of a cap, an elastic spacer is disposed on a convex portion provided on a header, and the spacer and the cap are provided. The radio wave absorber is sandwiched from both sides by the inner surface of the
The side of the body on the inner surface of the cap part via the spacer
A microwave IC package having a structure fixed and supported is obtained.

Further, according to the present invention, the microwave I
In the C package, a microwave IC package is obtained, wherein the spacer is made of rubber.

Further, according to the present invention, the microwave I
In the C package, the cap portion includes a ceiling surface having a concave portion for accommodating the radio wave absorber, a side portion hanging down from an edge of the ceiling surface, and a portion parallel to the ceiling surface outward from a lower end of the side portion. A microwave IC package characterized in that the microwave IC package is provided.

Furthermore, according to the present invention, the cap portion of the semiconductor package for mounting a plate-like radio wave absorber on the inner surface, with attached by sandwiching the wave absorber between the cap inner ceiling surface and the spacer, wherein The side of the radio wave absorber
A cap portion of the semiconductor package is obtained , wherein the surface is supported and fixed via the spacer .

[0020]

[0021]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a sectional view showing a high-frequency circuit package according to an embodiment of the present invention. FIG. 2 shows FIG.
FIG. 4 is a perspective view mainly showing a radio wave absorber portion of the high frequency circuit package of FIG.

Referring to FIG. 1, a high-frequency circuit package 10 includes a microwave integrated circuit (hereinafter simply referred to as a microwave IC (MI) including a millimeter-wave integrated circuit) as the high-frequency circuit 3.
C)), and a header portion 2 made of a conductive material, and a cap portion 1 made of a conductive material, for example, made of metal and covering the header portion.

The header portion 2 has a convex portion 6 erected around the high-frequency circuit 3 and an edge portion 8 which is one step lower than the fixing surface around the convex portion 6.

The cap portion 1 includes a ceiling surface 11, a side wall portion 13 hanging down from an end thereof, and an edge surface portion 14 extending outward from the lower end of the side wall portion 13 along the ceiling surface 11. And A radio wave absorber 4 is provided on the cap portion 1 via a rubber spacer 5, and the spacer 5 is supported by a convex portion 6 provided around the high frequency circuit 3 of the header portion 2. ing.

The radio wave absorber 4 is made of a generally used Mn-Z
A soft magnetic material powder such as an n-based ferrite powder or an Fe-Al-Si alloy powder is bound by using a synthetic resin or the like to form a plate.

Referring to FIG. 2, a rectangular concave portion 12 is formed inside the ceiling surface 11 of the cap portion 1. The spacer 5 includes a base portion 51, a frame-shaped protrusion 52 protruding from one surface of the base portion 51, and an inner side of the protrusion 52.
A rectangular hole 53 having a smaller size than the protrusion 52 is provided, and a seat 54 is formed around the hole 53 so that the radio wave absorber can be mounted around the hole 53. Part is formed.

In order to fix the radio wave absorber 4 to the cap portion 1, the radio wave absorber 4 is mounted on the accommodating portion 55 of the spacer 5, and then the projection 51 is mounted on the concave portion 12 of the cap portion 1.

When the cap on which the radio wave absorber 4 is mounted is mounted on the header 2, the spacer 5 is supported and fixed by the projection 6. In addition, the convex portion 6 may be a frame-shaped convex streak, or may be a column shape or a plate shape that supports a plurality of peripheral edges of the spacer 5. What is necessary is just to be able to support the peripheral part of the spacer 5 so that the fall-off of the spacer 5 may be prevented.

As described above, in the embodiment of the present invention, the concave portion 12 is provided in the cap portion 1, and the radio wave absorber 4 is provided with the concave portion 12 having a shape like an elastic spacer 5 so that the cap portion 1 is formed. Fixed to Further, by providing the convex portion 6 on the header portion 2 and widening the edge of the spacer 5, the spacer 5 is formed by the convex portion 6 and the cap portion 1.
Is fixed, and also has an action of preventing the radio wave absorber 4 from peeling off from the cap portion 1.

Further, by using the microwave IC structure to which the radio wave absorber according to the embodiment of the present invention is fixed,
The radio wave absorbers 4 of various materials can be fixed inside the microwave IC without using an adhesive or the like.

Further, according to the embodiment of the present invention, the machining accuracy of each part can be expected to have a certain margin by the elastic spacers 5, and the tolerance to expansion and contraction due to temperature can be enhanced. As a result, a radio wave absorber having a high effect at a desired frequency can be installed inside the microwave IC, spatial isolation can be obtained, and abnormal oscillation due to unnecessary wave excitation can be prevented.

[0033]

As described above, according to the present invention, in a microwave IC structure to which a radio wave absorber is fixed, the microwave absorber is fixed to the inner wall of the IC structure, so that the micro wave can be eliminated without using an adhesive or the like. -Frequency circuit package that can fix radio wave absorbers of various materials inside wave IC, especially microphone
A wave IC package can be provided.

Further, according to the present invention, working accuracy of each part is also expected that some margin by a spacer having a resilient, strong high-frequency circuit package in such expansion due to temperature, in particular, to provide a microwave IC package Can be.

Therefore, according to the present invention, a radio wave absorber having a high effect at a desired frequency can be installed inside the microwave IC by using the inner wall fixing structure of these radio wave absorbers. It is possible to provide a high-frequency circuit package, particularly a microwave IC package, having isolation and having an effect of preventing abnormal oscillation due to unnecessary wave excitation.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a high-frequency circuit package according to an embodiment of the present invention.

FIG. 2 is a perspective view mainly showing a radio wave absorber of the high frequency circuit package of FIG. 1;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Cap part 2 Header part 3 High frequency circuit 4 Radio wave absorber 5 Spacer 6 Convex part 8 Edge surface 10 High frequency circuit package 11 Ceiling surface 12 Depression 13 Side wall part 14 Edge surface part 51 Base part 52 Projection part 53 Hole part 54 Seat part 55 accommodation Department

Claims (7)

(57) [Claims] In a high frequency circuit package for fixing a plate-shaped radio wave absorber to an inner surface of a cap portion, an elastic spacer is disposed on a convex portion provided on a header, and the radio wave is formed by the spacer and the inner surface of the cap portion. Absorber on both sides
While holding the side of the radio wave absorber
A high-frequency circuit package having a structure supported and fixed to the inner surface of the cap portion via a pacer . 2. The high-frequency circuit package according to claim 1, wherein said spacer is made of rubber. 3. The high-frequency circuit package according to claim 2, wherein the cap portion has a ceiling surface provided with a recess for accommodating the radio wave absorber, a side portion hanging down from an edge of the ceiling surface, and the side portion. A high frequency circuit package comprising: an edge extending parallel to the ceiling surface from a lower end of the portion to the outside. 4. A high frequency circuit package for fixing a plate-shaped radio wave absorber to an inner surface of a cap portion, wherein an elastic spacer is disposed on a convex portion provided on a header, and the radio wave absorber is absorbed by the spacer and the inner surface of the cap portion. Body from both sides
Pinch the side of the radio wave absorber
A microwave IC package having a structure supported and fixed to the inner surface of the cap section via a cap . 5. The microwave IC package according to claim 4, wherein said spacer is made of rubber. 6. The microwave IC package according to claim 5, wherein the cap portion has a ceiling surface provided with a recess for accommodating the radio wave absorber, a side portion hanging down from an edge of the ceiling surface, and A microwave IC package having an edge extending parallel to the ceiling surface from a lower end of a side portion to an outer side. 7. The cap portion of the semiconductor package for mounting a plate-like radio wave absorber on the inner surface, attached by sandwiching the wave absorber between the cap inner ceiling surface and the spacer
With the side of the radio wave absorber through the spacer
A cap portion of the semiconductor package, wherein the cap portion is supported and fixed .