JP3107812B2 - Manufacturing method of indirectly heated cathode - Google Patents
Manufacturing method of indirectly heated cathodeInfo
- Publication number
- JP3107812B2 JP3107812B2 JP02329711A JP32971190A JP3107812B2 JP 3107812 B2 JP3107812 B2 JP 3107812B2 JP 02329711 A JP02329711 A JP 02329711A JP 32971190 A JP32971190 A JP 32971190A JP 3107812 B2 JP3107812 B2 JP 3107812B2
- Authority
- JP
- Japan
- Prior art keywords
- cathode
- base
- nickel
- copper
- porous
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は傍熱型陰極の製造方法に関し、特にマッシュ
型陰極等の電子放射性物質を陰極基体内部に充填する陰
極の多孔質陰極基体の製造方法に関する。Description: FIELD OF THE INVENTION The present invention relates to a method for manufacturing an indirectly heated cathode, and more particularly to a method for manufacturing a porous cathode substrate as a cathode in which an electron-emitting substance such as a mash type cathode is filled inside the cathode substrate. About the method.
従来、例えばマッシュ型陰極など陰極に多孔質を作っ
て、その孔に電子放射性物質を充填する陰極の多孔質陰
極基体は、第４図に示すように、治具11の内部に取付け
た部品12との間の空間13に、ニッケル粉末を充填して圧
縮し治具11と一体で焼結後治具を取り外し、ニッケル粉
末の間の間隙を利用した多孔質体を形成する方法が採ら
れていた。Conventionally, a porous cathode substrate, such as a mash-type cathode, in which a cathode is made porous and its holes are filled with an electron-emitting substance, is a component 12 mounted inside a jig 11 as shown in FIG. In this method, a space 13 is filled with nickel powder, compressed, compressed and sintered integrally with the jig 11, and then the jig is removed to form a porous body using a gap between the nickel powders. Was.
また空隙の量の多い、すなわち気孔率の大きな陰極基
体を形成するにはニッケル粉末の間隙だけでは不可能で
あるため、プラスチック等の粉末の表面にニッケルを無
電解メッキ等で被覆した後圧縮成形し、焼結後化学的又
は熱的処理でプラスチック等を除去したり、ニッケル粉
末とプラスチック等、基体金属より低融点物質の粉末等
を混合圧縮成形し、焼結後低融点物質を化学的又は熱的
処理により除去して多孔質体を形成する方法が採られて
いる。In addition, since it is impossible to form a cathode substrate having a large amount of voids, that is, a cathode substrate having a large porosity, only by the gap between nickel powders, the surface of a powder of plastic or the like is coated with nickel by electroless plating or the like and then compression-molded. After sintering, plastic or the like is removed by chemical or thermal treatment, or nickel powder and plastic etc. are mixed and compression molded with a powder of a material having a lower melting point than the base metal. A method of forming a porous body by removing it by a thermal treatment is employed.
上記の基体金属粉末を焼結させて、その空隙を利用す
る多孔質金属基体の製造方法においては、金属粉末の粒
径を選定しても、大きな気孔率のものを得ることができ
ない上に、粉末粒径のバラツキ又は金属粉末焼結時の温
度、時間等のバラツキにより、空隙の体積、即わち気孔
率の一定のものを得ることが難かしい。In the method for producing a porous metal substrate using the voids by sintering the above-described substrate metal powder, even if the particle size of the metal powder is selected, a material having a large porosity cannot be obtained. Due to variations in powder particle size or variations in temperature and time during sintering of metal powder, it is difficult to obtain a void having a constant volume, that is, a constant porosity.
また、基体金属より低融点の物質粉末の表面に基体金
属を被覆して形成する方法では、逆に気孔率が大き過ぎ
て、所望の気孔率のものを得ることが難かしい。また基
体金属の粉末とそれより低融点物質の粉末とを混合して
形成する方法では、均一に混合することが難かしく、均
一な気孔率の多孔質金属基体を得ることができないとい
う問題があった。On the other hand, in a method in which the surface of a substance powder having a lower melting point than the base metal is coated with the base metal, the porosity is too large, and it is difficult to obtain a desired porosity. In addition, in the method of mixing and forming the powder of the base metal and the powder of the substance having a lower melting point, it is difficult to mix uniformly, and there is a problem that a porous metal base having a uniform porosity cannot be obtained. Was.
本発明は、所望の気孔率で、空孔の均一な多孔質陰極
基体を備えた傍熱型陰極の製造方法を提供するもので、
具体的には、ニッケル及び銅を主体とする合金からなる
陰極基体を形成する工程と、該陰極基体と陰極スリーブ
との固着体を形成する工程と、該固着体を真空熱処理
し、前記陰極基体から銅を除去し、該陰極基体を多孔質
化する工程と、該多孔質化した陰極基体に電子放射性物
質を充填する工程と、前記陰極スリーブ内にヒータを挿
入する工程とからなることを特徴とするものである。ま
た、上記傍熱型陰極の製造方法において、前記陰極基体
は、ニッケルからなる所定形状に形成された基体表面
に、銅を含む金属材料を部分的に被着させた後、加熱処
理を行うことで形成された所定の混合割合の合金からな
ることを特徴とするものである。The present invention provides a method for producing an indirectly heated cathode having a desired porosity and a porous cathode substrate having uniform pores,
Specifically, a step of forming a cathode base made of an alloy mainly composed of nickel and copper, a step of forming a fixed body between the cathode base and the cathode sleeve, and performing a vacuum heat treatment on the fixed body to form the cathode base Removing the copper from the substrate, making the cathode substrate porous, filling the porous cathode substrate with an electron-emitting substance, and inserting a heater into the cathode sleeve. It is assumed that. Further, in the method for manufacturing an indirectly heated cathode, the cathode substrate may be subjected to a heat treatment after a metal material containing copper is partially adhered to the surface of the substrate formed in a predetermined shape made of nickel. Characterized by being made of an alloy having a predetermined mixing ratio formed by
以下、本発明の実施例について説明する。第１図に第
１の実施例を示す。第１図（ａ）に示すように、陰極ス
リーブ１にロウ付け等により固着されている陰極形状を
形成した陰極基体５の表面に、銅材６をメッキ又は堆積
等により１〜50μｍ付着させる。その後、銅の体積の割
合に応じた重量％で示す温度、即ち固溶体形成温度に５
〜15分間保持し、所望の割合の合金を形成する。この固
溶体形成温度は、第３図に示す銅−ニッケルの状態図の
実線で示す温度で、この温度に保持することにより、対
応する割合の合金を形成することができる。具体的に
は、1300℃に設定することにより、ニッケルが50重量％
の合金を形成することができる。それを真空中で熱処理
すると、第１図（ｂ）に示すように、所望の気孔率の多
孔質陰極基体３を形成することができる。この場合、合
金化させる陰極基体のニッケルの体積とその表面に付着
する銅の体積の割合が、所望の気孔率になるように銅を
被着する。Hereinafter, examples of the present invention will be described. FIG. 1 shows a first embodiment. As shown in FIG. 1 (a), a copper material 6 is adhered to the surface of a cathode base 5 having a cathode shape fixed to the cathode sleeve 1 by brazing or the like by plating or depositing by 1 to 50 μm. Thereafter, the temperature is expressed in terms of weight% according to the volume ratio of copper, that is, the solid solution formation temperature is 5%.
Hold for ~ 15 minutes to form the desired percentage of alloy. The solid solution forming temperature is the temperature shown by the solid line in the copper-nickel phase diagram shown in FIG. 3, and by maintaining this temperature, an alloy having a corresponding ratio can be formed. Specifically, by setting the temperature to 1300 ° C, nickel becomes 50% by weight.
Alloys can be formed. When this is heat-treated in a vacuum, a porous cathode substrate 3 having a desired porosity can be formed as shown in FIG. 1 (b). In this case, copper is applied so that the ratio of the volume of nickel of the cathode substrate to be alloyed to the volume of copper adhering to the surface thereof has a desired porosity.
更に他の実施例として、第２図（ａ）に示すように陰
極基体５の表面に部分的に銅材６を被着して合金化し、
真空中で熱処理することにより第２図（ｂ）に示すよう
に部分的に多孔質陰極基体３を形成することができる。
この場合、陰極基体５に例えばニッケルの同一材料で形
成したものに部分的に銅材６を被着すると肉厚方向に銅
が浸み込んで合金化すると共に、横方向にも浸み込むた
め気孔率を考慮する場合のニッケルの量を適切に把握す
る必要がある。その煩雑さを避けるために陰極を形成し
たい部分以外又はその境界を他の金属材料で形成するこ
ともできる。As still another embodiment, as shown in FIG. 2 (a), a copper material 6 is partially applied to the surface of the cathode base 5 and alloyed.
By performing the heat treatment in a vacuum, the porous cathode substrate 3 can be partially formed as shown in FIG. 2 (b).
In this case, when the copper material 6 is partially applied to the cathode base 5 formed of, for example, the same material of nickel, the copper penetrates in the thickness direction and alloys, and also penetrates in the lateral direction. When considering the porosity, it is necessary to appropriately grasp the amount of nickel. In order to avoid such complication, a portion other than the portion where the cathode is desired to be formed or a boundary thereof may be formed of another metal material.
上記の如く、陰極スリーブと、合金化し陰極形状とし
た陰極基体を固着したもの、又は陰極スリーブに陰極形
状を形成した陰極基体を固着した後陰極基体を合金化し
たもの、を多孔質化し、その多孔質化した陰極基体の孔
部にオキサイド等の電子放射性物質を充填して陰極スリ
ーブ内にヒータを配置すれば傍熱型陰極を得ることがで
きる。As described above, the cathode sleeve and the cathode base formed by alloying and fixing the cathode base, or the cathode sleeve formed by fixing the cathode base formed in the cathode shape and then alloying the cathode base are made porous, An indirectly heated cathode can be obtained by filling the pores of the porous cathode substrate with an electron-emitting substance such as oxide and arranging a heater in the cathode sleeve.
また、ニッケルを主体とする陰極基体にバリウムなど
の還元材を混入しておくと電子放射特性を非常に向上さ
せることができるのに、バリウムをニッケル中に固溶さ
せることは非常に難かしいことが特公平２−47055号公
報に開示されている。しかし本発明の技術によれば、バ
リウムは銅を任意の割合で合金を形成するため、バリウ
ム−銅合金と、ニッケルとを更に合金化させることによ
り、ニッケルの中にバリウムも混入させることができ、
真空熱処理により銅を蒸発除去させれば、バリウム混入
ニッケルの多孔質陰極基体を得ることができ、その細孔
に電子放射性物質を充填することにより、非常に電子放
射特性の良い陰極を得ることができる。In addition, if a reducing material such as barium is mixed in a cathode base mainly composed of nickel, electron emission characteristics can be greatly improved, but it is very difficult to form a solid solution of barium in nickel. Is disclosed in Japanese Patent Publication No. 2-47055. However, according to the technique of the present invention, barium forms an alloy of copper in an arbitrary ratio, so that barium can be mixed in nickel by further alloying barium-copper alloy and nickel. ,
By evaporating and removing copper by vacuum heat treatment, a porous cathode substrate of barium-containing nickel can be obtained. By filling the pores with an electron-emitting substance, a cathode having very good electron emission characteristics can be obtained. it can.
以上説明したように本発明によれば、所望の気孔率の
多孔質陰極基体を容易に形成することができる。そのた
め、電子放射性物質の量を自由に調整できるため、特性
の優れた信頼性の高い傍熱型陰極を得ることができると
いう利点がある更に、陰極の一部のみから電子放射を得
たいような特殊な構造の陰極も容易に得ることができる
という顕著な効果を奏する。As described above, according to the present invention, a porous cathode substrate having a desired porosity can be easily formed. Therefore, since the amount of the electron-emitting substance can be freely adjusted, there is an advantage that a highly reliable indirectly heated cathode having excellent characteristics can be obtained. This has a remarkable effect that a cathode having a simple structure can be easily obtained.
第１図（ａ）、（ｂ）は本発明の実施例による傍熱型陰
極の製造方法を示す工程図、第２図は（ａ）、（ｂ）は
本発明の他の実施例による傍熱型陰極の製造方法を示す
工程図、第３図は銅とニッケルの組成割合を示す状態
図、第４図は従来の多孔質陰極基体の製造方法を示す断
面図である。 １……陰極スリーブ、２……空洞、３……多孔質陰極基
体、４……ヒータ、５……陰極基体、６……銅材。1 (a) and 1 (b) are process diagrams showing a method of manufacturing an indirectly heated cathode according to an embodiment of the present invention, and FIGS. 2 (a) and 2 (b) are side views according to another embodiment of the present invention. FIG. 3 is a process diagram showing a method of manufacturing a hot cathode, FIG. 3 is a phase diagram showing a composition ratio of copper and nickel, and FIG. 4 is a sectional view showing a conventional method of manufacturing a porous cathode substrate. DESCRIPTION OF SYMBOLS 1 ... Cathode sleeve, 2 ... Cavity, 3 ... Porous cathode base, 4 ... Heater, 5 ... Cathode base, 6 ... Copper material.
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特公 昭61−36979（ＪＰ，Ｂ２) 特公 昭51−5621（ＪＰ，Ｂ２) 特公 昭51−33044（ＪＰ，Ｂ２) 特公 昭39−15502（ＪＰ，Ｂ１) 特公 昭48−3724（ＪＰ，Ｂ１) (58)調査した分野(Int.Cl.7，ＤＢ名) C22C 1/08 H01J 9/04 ────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-B-61-36979 (JP, B2) JP-B-51-5621 (JP, B2) JP-B-51-33044 (JP, B2) JP-B 39- 15502 (JP, B1) JP 48-3724 (JP, B1) (58) Fields investigated (Int. Cl. 7 , DB name) C22C 1/08 H01J 9/04
Claims (2)
陰極基体を形成する工程と、該陰極基体と陰極スリーブ
との固着体を形成する工程と、該固着体を真空熱処理
し、前記陰極基体から銅を除去し、前記陰極基体を多孔
質化する工程と、該多孔質化した陰極基体に電子放射性
物質を充填する工程と、前記陰極スリーブ内にヒータを
挿入する工程とからなることを特徴とする傍熱型陰極の
製造方法。A step of forming a cathode base made of an alloy mainly composed of nickel and copper; a step of forming a fixed body between the cathode base and the cathode sleeve; Removing the copper from the substrate, making the cathode base porous, filling the porous cathode base with an electron-emitting substance, and inserting a heater into the cathode sleeve. Method for producing an indirectly heated cathode.
いて、前記陰極基体は、ニッケルからなる所定形状に形
成された基体表面に、銅を含む金属材料を部分的に被着
させた後、加熱処理を行うことで形成された所定の混合
割合の合金からなることを特徴とする傍熱型陰極の製造
方法。2. The method of manufacturing an indirectly heated cathode according to claim 1, wherein said cathode base is formed by partially depositing a metal material containing copper on a surface of a base formed of nickel in a predetermined shape. Thereafter, a method of manufacturing an indirectly heated cathode comprising an alloy having a predetermined mixing ratio formed by performing a heat treatment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP02329711A JP3107812B2 (en) | 1990-11-30 | 1990-11-30 | Manufacturing method of indirectly heated cathode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP02329711A JP3107812B2 (en) | 1990-11-30 | 1990-11-30 | Manufacturing method of indirectly heated cathode |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04202635A JPH04202635A (en) | 1992-07-23 |
| JP3107812B2 true JP3107812B2 (en) | 2000-11-13 |
Family
ID=18224420
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP02329711A Expired - Fee Related JP3107812B2 (en) | 1990-11-30 | 1990-11-30 | Manufacturing method of indirectly heated cathode |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3107812B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040011853A (en) * | 2002-07-31 | 2004-02-11 | 최성조 | Process method for the making micropore on the metal surface |
| CN110931329B (en) * | 2019-12-11 | 2022-03-04 | 中国电子科技集团公司第十二研究所 | Preparation method of columnar nickel sponge oxide cathode |
-
1990
- 1990-11-30 JP JP02329711A patent/JP3107812B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04202635A (en) | 1992-07-23 |
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