JP3102473B2 - Resin sealing device for semiconductor device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a resin sealing device for a semiconductor device.

[0002]

2. Description of the Related Art Japanese Unexamined Patent Publication Nos. Hei 7-231005, Hei 2-105550, and Hei 7 (Japanese Patent Laid-Open Publication No.
No. 14867 discloses a proposal.

[0003] First, an unfilling detection method described in JP-A-7-231005 will be described. FIGS. 5 and 6 show how unfilling is detected by the resin sealing device described in this publication.
Shown in As shown in FIGS. 5 and 6, the unfilling detection method described in this publication seals a semiconductor chip on a strip-shaped lead frame conveyed in the longitudinal direction with a resin, and forms a resin burr of the product 14 after the resin sealing. This is a method of detecting the unit 17 by the transmission sensor 12. When not filled, resin burrs do not occur, so that light from the transmission sensor is transmitted without being blocked. Therefore, when light is transmitted, it is detected as unfilled.

Next, a description will be given of an unfilling detection method described in Japanese Patent Application Laid-Open No. 2-105550. FIG. 7 shows an apparatus for implementing the unfilling detection method in this publication. The device shown in this figure is not only a resin sealing device 21 for a semiconductor device, but also a lead frame supply reel 18, a die bonding device 19 for mounting a semiconductor element on a lead frame in a process order, and an electrical connection between the lead frame and the semiconductor element. 1. A wire bonding device 20, a resin sealing device 21 for sealing a semiconductor element with a resin, a defect detection and removal device 22, and a lead frame take-up reel 25 are provided.

[0005] The unfilled product is detected by the defect detection and removal device 22 to remove the unfilled product. FIG. 8 shows an unfilling detection mechanism. In this drawing, a holder 27 having a contact 29 urged by a spring 28 and a capacitance sensor 26 moves up and down at a timing interlocked with the forward feed operation of the lead frame. When the holder 27 is lowered, the contact 29 comes into contact with the resin-sealed product 14, the gap between the unfilled portion and the filled portion of the product 14 is captured, and the displacement amount is detected by the capacitance sensor 26. . Thus, the presence or absence of unfilling in the product 14 after resin sealing is detected.

Finally, an unfilling detection method described in Japanese Patent Application Laid-Open No. 7-14867 will be described. FIG. 9 shows a state of non-filling detection by the resin sealing device described in this publication.
In this figure, a recognition device 30 is installed above a lead frame to be transferred, and detects the presence or absence of unfilled product 14 after resin sealing. After the detection of the unfilled product 14, the unfilled product 14 is separated from the lead frame by the removal mold including the cylinder 31, the upper mold 32, and the lower mold 33. The removed unfilled product 14 is collected in the storage box 35. At the time of collection, a sensor 34 determines whether the unfilled product 14 that has been separated has fallen properly.
Confirmed by. After that, only good products after resin sealing 1
4 is stored in the storage magazine 2. FIG. 10 shows the situation of the lead frame from which unfilled products have been removed.

[0007]

In the above-mentioned prior art, unfilled products are detected and removed. However, since continuous production is performed, the cause of the occurrence of unfilled products cannot be removed.

[0008] The cause of the occurrence of unfilling may be that the resin starts to be cured before a predetermined amount of resin is filled due to poor flow of the resin. This is a case where the injection is not performed according to the set injection condition due to the variation in the operation of the injection drive source, causing a flow failure. As a solution, there is a method in which an injection speed, an injection pressure, and the like as injection conditions are constantly monitored and controlled so as to correct the injection value to an appropriate value.

However, in recent years, there has been a great demand for improving the reliability of products after resin sealing, and there has been an increasing tendency to use resins having high adhesion to lead frames.

For this reason, a new problem that a mold release failure occurs after resin sealing has arisen. Due to the mold release failure, the phenomenon that the resin remains in the gate part which is the entrance to the resin sealing part of the mold frequently occurs, and the gate part is blocked by the residual resin. There is a case where the resin is not filled in the resin sealing portion or a case where the resin is difficult to be filled.

As described above, the residual resin in the gate portion causes an unfilled defect, but in the prior art, there is a risk of continuously producing an unfilled defective product.

A lead frame in which semiconductor devices are arranged in a plurality of rows with one lead frame (hereinafter, referred to as a lead frame).
It is called "matrix lead frame". In the case of the target product, if a mechanism for removing the unfilled product from the lead frame is attached as in the related art, the device becomes complicated. This is because the matrix lead frame must be conveyed in both the XY directions (horizontal feed / depth feed) in order to make it possible to remove the unfilled row in any of a plurality of rows.

[0014] The adverse effect of the complicated apparatus causes an increase in the time until the system is restored in the event of a failure (MTTR), thereby lowering the production capacity.

SUMMARY OF THE INVENTION In view of the above-mentioned problems of the prior art, it is an object of the present invention to prevent continuous occurrence of unfilled defectives and to prevent unfilled defective products from flowing to the next process in the case of a matrix frame. Another object of the present invention is to provide a resin sealing device for a semiconductor device.

[0015]

SUMMARY OF THE INVENTION In order to achieve the above object, the present invention provides a resin sealing means for sealing a semiconductor device on a lead frame with a resin, and a method for detecting a defective filling of a product after resin sealing. In a resin sealing device for a semiconductor device including a filling detection mechanism, the unfilled detection mechanism includes a detection rod that comes into contact with a product after resin sealing, and a transmission sensor that detects an upper end of the detection rod, The resin sealing device is a resin sealing device in which the lower end of the detection rod is brought into contact with the product after resin sealing to detect a state where there is no resin or a state where resin is insufficient by the transmission sensor, and when it is determined that the product is unfilled, Is interrupted, and an instruction is issued to confirm whether or not there is residual resin in the mold gate opening.

Further, the present invention is directed to a resin sealing device for a semiconductor device for a lead frame in which semiconductor devices are arranged in a plurality of rows. It has an unfilled detection mechanism consisting of a transmission sensor that detects the upper end, and the unfilled detection mechanism contacts the product after sealing the lower end of the detection rod with the resin to detect the absence or lack of resin. Detected by the transmission sensor,
If it is judged that the product is not filled, the lead frame with a good product is stored in a good product storage magazine, the lead frame with a defective product is stored in a bad product magazine, the operation of the resin sealing device is suspended, and the product remains at the gate of the mold. It is characterized in that a confirmation instruction is made as to whether or not resin is present.

The above-described resin sealing device performs an operation of interrupting the operation of the resin sealing device and instructing whether or not there is residual resin in the mold gate opening when the predetermined number of detections is reached. It may start.

Further, the resin-sealed semiconductor device is continuously fed, and the quality of the semiconductor device is determined by transmitting or blocking the light of the transmission sensor with the contact between the product and the detection rod after the resin sealing. It is specifically conceivable.

[0019]

[0020]

(Operation) In the invention as described above, when an unfilled product is detected, the alarm is stopped in the system, so that the operator finds the residual resin in the gate portion which causes the unfilling failure, Can be removed. Therefore, there is no continuous production of unfilled defective products.

Further, after the resin sealing, the lead frame having the unfilled defective product is separated from the lead frame having only the normal non-defective product and stored, so that the semiconductor device is arranged in a plurality of rows (matrix lead). In the case of (frame), it is possible to prevent unfilled defective products from flowing in the next step without complicating the apparatus.
That is, in the case of the matrix lead frame, the lead frame can be transported in the X and Y directions in the prior art so that unfilled products generated in any row can be removed. Since it is separated from the lead frame including only good products, the apparatus does not need to be complicated. As a result, the time (MTTR) until recovery from the failure is not extended.

[0023]

Next, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a plan view showing a resin sealing device for a semiconductor device according to an embodiment of the present invention.

As shown in FIG. 1, the resin sealing device of this embodiment comprises a lead frame arrangement section 4 in which lead frames cut out from a supply tray 3 are arranged, a resin supply section 5 for supplying resin, A resin loader 6 in which are arranged, a press unit 8 in which a resin sealing mold 7 for performing resin sealing is installed,
Separation unit 9 for removing unnecessary resin (for example, resin by a runner) of a product after resin sealing, unfilling detection mechanism 1 for detecting unfilling of the product from which the unnecessary resin has been removed, and non-defective product for storing a good product A storage magazine 2a, a defective product storage magazine 2b for storing unfilled defective products, and a resin sealing mold 7
And a dust collector 11 that collects resin waste and the like.

FIGS. 2 and 3 show the structure of the unfilled detection mechanism 1. FIG. As shown in these figures, the unfilled detection mechanism 1 includes a transmission sensor 12, a detection rod 13, a detection rod support 15, and a spring 16. That is, the detection rod 13
Are inserted into the through holes of the detection rod support 15 and are supported by springs 16 in the support 15. When the lower end of the detection rod 13 is pushed back against the spring force of the spring 16, the upper part of the detection rod 13 projects from the through-hole of the support 15. Further, a transmission sensor 17 composed of a pair of light receiving / emitting elements whose light is blocked by an upper portion of the detection rod 13 is provided above the detection rod support 15. The transmission sensor 17 may be attached to the support 17 or may be attached using a base on which the product 14 is placed.

In such an unfilled detection mechanism 1, the lower end of the detection rod 13 is brought into contact with the product 14 after resin sealing by lowering the detection rod support 15. At this time, FIG.
If the product 14 is good after the resin sealing, the detection rod 13 is pushed back and the upper end of the detection rod 13 is
Further, the light from the transmission sensor 12 is shielded.
In addition, as shown in FIG. 3, when the product 14 after resin sealing is not filled, the light from the transmission sensor 12 is transmitted because the upper end of the detection rod 13 does not protrude from the support portion 15. As described above, the unfilled state of the product after resin sealing is determined based on the detection result of the transmission sensor 12 when the detection rod 13 is brought into contact with the product 14.

Next, the operation of the resin sealing device after resin sealing will be described with reference to FIGS. FIG. 4 shows an operation flow after the resin sealing. When the resin encapsulation is completed, an unnecessary resin such as a runner of the product 14 after resin encapsulation is removed by the separation unit 9, and the unfilled detection mechanism 1 detects non-filled state of the product 14 after resin encapsulation. In the case of a non-defective product in the non-fill detection, the lead frame having the non-defective product is stored as it is in the non-defective storage magazine 2a. If there is an unfilled defective product, the lead frame having the defective product is stored in the defective product storage magazine 2b. In this way, non-defective products and unfilled defective products are separated without removing them from the lead frame. In the case of products using a matrix lead frame, defective products are flowed to the next step without complicating the resin sealing device. Nothing. In other words, it is not necessary to enable the transport of the lead frame in the XY directions so that unfilled products occurring in any row can be removed, so that the resin sealing device is not complicated. Therefore, the time required for recovery in the event of a failure can be reduced.

Further, when there is an unfilled product as described above, the resin sealing device issues an alarm (alarm) and stops the system. When such a device stop alarm is issued, a message indicating that there is residual resin in the gate opening of the mold may be displayed on a panel or the like attached to the resin sealing device.

Further, since the cause of the unfilling is not only the clogging of the gate, it is not necessary to limit the method of stopping the resin sealing device every time when the defective product is detected by the unfilling detection. In other words, a method may be adopted in which the number of defective products detected in unfilled state detection can be set, and the resin sealing device is stopped according to the set number of times. For example, there is a method of stopping the alarm of the resin sealing device when an unfilled defective product is detected twice consecutively. In this case, the production capacity does not need to be reduced as compared with the case where the resin sealing device is stopped every time when a defect is detected.

[0031]

As described above, the present invention is a resin sealing device for a semiconductor device in which an alarm is stopped when an unfilled product is detected, so that an operator can remove the cause of the unfilled defect. For this reason, it is possible to prevent continuous occurrence of unfilled defects and improve the yield.

Further, after the resin sealing, the lead frame having the unfilled defective product is separated from the lead frame having only the non-defective product, so that when the resin sealing device is applied to a matrix frame or the like, the device is complicated. It is possible to prevent a defective product from flowing to the next process without any problem. Therefore, the time required for the inspection and confirmation by the operator at the time of failure can be significantly reduced, and the production capacity does not need to be reduced.

[Brief description of the drawings]

FIG. 1 is a plan view showing a resin sealing device for a semiconductor device according to one embodiment of the present invention.

FIG. 2 is a cross-sectional view showing a state when a non-defective product is detected by an unfilled detection mechanism of the resin sealing device shown in FIG.

FIG. 3 is a cross-sectional view showing a state when unfilling is detected by an unfilling detection mechanism of the resin sealing device shown in FIG. 1;

FIG. 4 is a diagram showing an operation flow after resin sealing of the resin sealing device shown in FIG. 1;

FIG. 5 is a perspective view showing a state of non-filling detection by a conventional resin sealing device described in JP-A-7-231005.

FIG. 6 is a detailed view showing an unfilled state detected by a conventional resin sealing device described in JP-A-7-231005.

FIG. 7 is a front view showing an apparatus for implementing a conventional unfilling detection method described in JP-A-2-105550.

FIG. 8 is a detailed view showing a mechanism for detecting unfilling in the defect detection and removal device shown in FIG. 7;

FIG. 9 is a schematic configuration diagram showing a conventional resin sealing device described in JP-A-7-14867.

FIG. 10 is a perspective view of a lead frame from which unfilled products have been removed by the mold shown in FIG. 9;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Unfilled detection mechanism 2a Good goods storage magazine 2b Defective goods storage magazine 3 Supply tray 4 Lead frame arrangement part 5 Resin supply part 6 Resin loader 7 Resin sealing type 8 Press part 9 Separation part 10 Cleaner 11 Dust collector 13 Detection rod 14 Resin seal Product after stop 15 Detecting rod support 16 Spring 17 Transmission sensor

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H01L 21/56 H01L 21/66 B29C 45/76

Claims (4)

(57) [Claims] 1. A resin sealing device for a semiconductor device, comprising: a resin sealing means for resin sealing a semiconductor device on a lead frame; and an unfilling detection mechanism for detecting an unfilling failure of a product after resin sealing. The unfilled detection mechanism includes a detection rod that comes into contact with a product after resin sealing, and a transmission sensor that detects an upper end of the detection rod. The resin sealing device seals a lower end of the detection rod with a resin. After the stop, the state where there is no resin or insufficient state by contacting the product is detected by the transmission sensor, and when it is determined that the product is not filled,
A resin sealing device for a semiconductor device, wherein the operation of the resin sealing device is interrupted and a confirmation instruction is made as to whether or not there is residual resin in a mold gate opening. 2. A resin sealing device for a semiconductor device for a lead frame in which semiconductor devices are arranged in a plurality of rows, wherein a detection rod to be brought into contact with a product after resin sealing and an upper end of the detection rod are detected. And an unfilled detection mechanism comprising a transmission sensor, wherein the unfilled detection mechanism contacts the product after the lower end of the detection rod is sealed with a resin, and the transmission sensor detects a state where there is no resin or a state where resin is insufficient. If it is detected and judged to be an unfilled product, the lead frame with a good product is stored in the good product storage magazine, the lead frame with the defective product is stored in the bad product magazine, the operation of the resin sealing device is interrupted, and the mold gate is stopped. A resin sealing device for a semiconductor device, wherein an instruction is issued to confirm whether or not there is residual resin in a mouth. 3. The method according to claim 1, wherein when a predetermined number of detections has been reached, the operation of the resin sealing device is interrupted and an operation for instructing whether or not there is residual resin in the mold gate opening is started. A resin sealing device for a semiconductor device as described in the above. 4. A resin-sealed semiconductor device is continuously fed, and the pass / fail judgment is made by transmitting or blocking the light of the transmission sensor when the detection rod comes into contact with the product after resin sealing. A resin sealing device for a semiconductor device according to claim 1.