JP3096465B2 - 錫及び/又は鉛/錫合金の電着用酸性水溶液 - Google Patents

錫及び/又は鉛/錫合金の電着用酸性水溶液

Info

Publication number
JP3096465B2
JP3096465B2 JP02014730A JP1473090A JP3096465B2 JP 3096465 B2 JP3096465 B2 JP 3096465B2 JP 02014730 A JP02014730 A JP 02014730A JP 1473090 A JP1473090 A JP 1473090A JP 3096465 B2 JP3096465 B2 JP 3096465B2
Authority
JP
Japan
Prior art keywords
tin
lead
aqueous solution
acidic aqueous
electrodeposition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP02014730A
Other languages
English (en)
Japanese (ja)
Other versions
JPH02232389A (ja
Inventor
ヴィリー・メッツガー
マンフレッド・シュミッツ
カール―ユルゲン・シュミット
Original Assignee
ブラスベルク・オーベルフレヒェンテクニーク・ジー・エム・ビー・エイチ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ブラスベルク・オーベルフレヒェンテクニーク・ジー・エム・ビー・エイチ filed Critical ブラスベルク・オーベルフレヒェンテクニーク・ジー・エム・ビー・エイチ
Publication of JPH02232389A publication Critical patent/JPH02232389A/ja
Application granted granted Critical
Publication of JP3096465B2 publication Critical patent/JP3096465B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/30Electroplating: Baths therefor from solutions of tin
    • C25D3/32Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • C25D3/60Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrolytic Production Of Metals (AREA)
JP02014730A 1989-01-25 1990-01-24 錫及び/又は鉛/錫合金の電着用酸性水溶液 Expired - Lifetime JP3096465B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3902042.8 1989-01-25
DE3902042A DE3902042A1 (de) 1989-01-25 1989-01-25 Waessrige, saure loesungen fuer die elektrolytische abscheidung von zinn und/oder blei/zinnlegierungen

Publications (2)

Publication Number Publication Date
JPH02232389A JPH02232389A (ja) 1990-09-14
JP3096465B2 true JP3096465B2 (ja) 2000-10-10

Family

ID=6372697

Family Applications (1)

Application Number Title Priority Date Filing Date
JP02014730A Expired - Lifetime JP3096465B2 (ja) 1989-01-25 1990-01-24 錫及び/又は鉛/錫合金の電着用酸性水溶液

Country Status (5)

Country Link
US (1) US5021130A (enExample)
EP (1) EP0379948B1 (enExample)
JP (1) JP3096465B2 (enExample)
DD (1) DD291785A5 (enExample)
DE (2) DE3902042A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9666547B2 (en) 2002-10-08 2017-05-30 Honeywell International Inc. Method of refining solder materials

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5651873A (en) * 1994-06-30 1997-07-29 Mitsubishi Materials Corporation Electroplating solution for forming Pb-Sn alloy bump electrodes on semiconductor wafer surface
CN1100893C (zh) * 1994-12-09 2003-02-05 格里卡金属工厂格里卡两合公司 滑动元件用层状材料及其制备方法和所用试剂
DE19728777C2 (de) * 1997-07-05 2001-03-15 Federal Mogul Wiesbaden Gmbh Schichtverbundwerkstoff für Gleitlager sowie Verfahren zur Herstellung von Lagerschalen
US6267863B1 (en) 1999-02-05 2001-07-31 Lucent Technologies Inc. Electroplating solution for electroplating lead and lead/tin alloys
EP1260614B1 (en) * 2001-05-24 2008-04-23 Shipley Co. L.L.C. Tin plating
US6730209B2 (en) * 2002-02-22 2004-05-04 Lucent Technologies Inc. Solder electroplating bath including brighteners having reduced volatility
GB0216331D0 (en) 2002-07-13 2002-08-21 Dana Corp Bearings
JP4749746B2 (ja) * 2005-03-24 2011-08-17 Dowaメタルテック株式会社 錫めっき材およびその製造方法
CN110428939B (zh) * 2019-08-09 2020-06-30 常州大学 一种高导电石墨烯铜/铝复合导线的制备方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2525942A (en) * 1945-06-29 1950-10-17 Standard Oil Co Electrodepositing bath and process
DE1260262B (de) * 1963-05-06 1968-02-01 Friedr Blasberg G M B H Galvanisches Bad und Verfahren zur elektrolytischen Abscheidung hochglaenzender Zinnueberzuege
US4132610A (en) * 1976-05-18 1979-01-02 Hyogo Prefectural Government Method of bright electroplating of tin-lead alloy
US4582576A (en) * 1985-03-26 1986-04-15 Mcgean-Rohco, Inc. Plating bath and method for electroplating tin and/or lead

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9666547B2 (en) 2002-10-08 2017-05-30 Honeywell International Inc. Method of refining solder materials

Also Published As

Publication number Publication date
DE3902042A1 (de) 1990-07-26
EP0379948A2 (de) 1990-08-01
US5021130A (en) 1991-06-04
JPH02232389A (ja) 1990-09-14
EP0379948B1 (de) 1994-03-09
DE3902042C2 (enExample) 1991-05-02
EP0379948A3 (de) 1991-07-31
DD291785A5 (de) 1991-07-11
DE59004841D1 (de) 1994-04-14

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