JP3087785B2 - Vacuum suction device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vacuum suction device used for handling small parts by suction.

[0002] In recent years, one of the methods for handling small parts such as electronic parts is transfer by vacuum suction. Some of the small components to be adsorbed that are handled are broken by the influence of static electricity, and it is necessary to remove static electricity at the time of adsorption and separation. Further, when handling, it is necessary to incorporate a vacuum suction device at the tip of the hand, and therefore, it is desired to reduce the size of the vacuum suction device.

[0003]

2. Description of the Related Art FIG. 4 shows a configuration diagram of a conventional vacuum suction device. FIG. 4 is a partial sectional view. In the vacuum suction device 30 shown in FIG. 4, a rubber suction plate (rubber pad) 32 is slidably attached to the tip of a hollow shaft 31 having a flange 31a. In this case, the rubber pad 32
A spring 33 is interposed between the rubber pad 32 and the flange 31a, and the rubber pad 32 moves up and down. And the hollow shaft 31
The other end of the rubber pad 3 communicates with a vacuum source (not shown).
2 Pull air in.

On the other hand, a nozzle 34 is provided near the rubber pad 32.
Is located, for example, an IC of a resin package, which is an object to be adsorbed.
Ions (for example, ozone) for removing static electricity are sprayed on 35.

The vacuum suction device 30 presses the rubber pad 32 against the resin package of the IC 35 while drawing air from the rubber pad 32 through a hollow shaft 31 from a vacuum source. Generally, static electricity is generated when the rubber and the plastic come into contact with or separated from each other, so that the IC 35 may fail due to the influence of the static electricity.
Therefore, before adsorbing the IC 35, ions are sprayed onto the resin package from the nozzle 34 to remove static electricity.

[0006]

However, in the case of spraying ions, if the length of the ion spraying path is lengthened, the ion state collapses and the static elimination effect is deteriorated, so that the circulation cannot be lengthened. Further, there is a problem that a space for installing the nozzle 34 for spraying ions is required, the space cannot be installed in a narrow space, and it is difficult to reduce the size.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has as its object to provide a vacuum storage device that eliminates static electricity and reduces the size.

[0008]

Means for Solving the Problems The above-mentioned problem is caused by neutralizing gas.
A first hole that is supplied and injects the neutralizing gas ;
An injection unit for the second hole is formed communicating with the first hole, before
It was provided at the lower part of the injection part and was communicated with the second hole in the previous term.
An ejection / suction unit having a third hole;
A nozzle attached to the tip and a sliding
A hood that moves and closes or opens the injection port of the first hole
And a switching unit having a unit,
When the first hole is closed by the switching unit,
Suction from the nozzle through the second and third holes;
The neutralizing gas is injected to the object, and the first part is switched by the switching part.
When the hole is opened, the nozzle is inserted through the hood.
Injecting the neutralizing gas to the object to be adsorbed from around the chisel
By setting the nozzle to a negative pressure,
The problem is solved by the configuration in which the nozzle is made to adsorb .

[0009]

As described above, when the first hole is closed by the switching unit, the neutralizing gas is injected from the second hole to the object through the nozzle through the holder and the hollow shaft. This neutralizes the static electricity already charged on the object.

When the first hole is opened by the switching unit, the neutralizing gas is injected from the periphery of the nozzle to the adsorbed object through the switching unit. At this time, a negative pressure is applied from the second hole to the nozzle , and the object to be sucked is sucked by vacuum. That is, the object is vacuum-adsorbed while neutralizing the neutralized gas .

As described above, since the neutralizing gas is injected at the nozzle and the vicinity thereof, it is possible to effectively perform static electricity elimination and to reduce the size.

[0012]

FIG. 1 is a block diagram showing an embodiment of the present invention.
The vacuum suction device 10 of FIG.
The micro-ejector 1 which is provided at the tip of an apparatus for handling C11 as an object to be adsorbed,
2 has a first hole 13 formed on a lower side portion from above, and a second hole 14 communicating with the vicinity of the lower side portion. Although not shown, the upper end of the micro ejector 12 is connected to a supply source of ions (eg, ozone) as a neutralizing gas .

At the lower part of the micro ejector 12, a second
A holder 15 communicating with the hole 14 is provided. An intermediate plate 15a is formed in the holder 15, and a hole 15c having a tapered shape 15b is formed in the thickness direction.

The hole 15c is provided with a hollow shaft 16 formed with a taper 16a at one end of which is fitted, and has an automatic space between the side of the hollow shaft 16 and the inside of the tip of the holder 15. Aligning spherical sliding bearing 17
Intervenes. A nozzle 18 is attached to the tip of the hollow shaft 16, and a spring 19 is interposed between the nozzle 18 and the tip of the holder 15.

The hole of the holder 15 communicating with the second hole 14
15d, a hole 15c, and a hole 16 of the hollow shaft 16.
a, a third hole communicating with the second hole 14 is formed,
Holder 15 and hollow shaft 16 have a third hole
The injection / suction unit is configured. This third hole is nozzle 1
8 communicates with the hole 18a.

The sliding bearing 17 and the spring 19 constitute a movable mechanism. That is, the nozzle 18 attached to the tip of the hollow shaft 16 moves up and down in the axial direction of the hollow shaft 16 and rotates on a plane perpendicular to the axial direction. In this case, the taper 16a of the hollow shaft 16 fits into the hole 15c of the holder 15 and is positioned.

Here, the nozzle 18 is formed of aluminum or aluminum alloy or the like, and the surface thereof is subjected to a tuffram treatment. Tufram treatment is a process in which a hard anodic oxide film, which is a high-resistance film, is formed on the surface of aluminum and aluminum alloys, and the holes in the film are impregnated with Teflon. Excellent wear resistance and electrical resistance of 106 to 1
It is formed with about 010Ω.

That is, by making the surface of the nozzle 18 electrically high resistance, static electricity charged in the package of the IC 11 can be gently eliminated, and the IC
Since the material is metal even in the case of contact with 11, static electricity can be hardly generated. Further, since the surface of the nozzle 18 has high abrasion resistance, the nozzle 18 does not need to be replaced.

On the other hand, the valve 20, which is a switching portion, is positioned so as to cover the micro-ejector 12 and a part of the holder 15 between the stoppers 21a and 21b (21b is formed on the holder 15). The valve 20 includes a hood 20a
The upper part is formed with a thickness larger than at least the diameter of the injection hole of the first hole 13, and a ball plunger 23 is provided in part via a spring 22.

On the side of the micro ejector 12, grooves 24a and 24b into which the ball plunger 23 is fitted are continuously formed at a predetermined distance in the axial direction. That is, the valve 20
Slides on the micro-ejector 12 and moves up and down, and the ball plunger 23 is fitted into the groove 24a or 24b to be positioned. In this case, when the valve 20 is located above, the first hole 13 is open, and when it is located below, the first hole 13 is closed.

Next, FIG. 2 shows a diagram for explaining the operation of FIG. FIG. 1 shows a case where the valve 20 is located above, and FIG. 2 shows a case where it is located below.

First, in FIG. 2, the ball plunger 23 of the valve 20 fits into the groove 24b and is located below the stopper 21b. At this time, the valve 20 closes the injection port of the first hole 13 of the micro ejector 12.

When ions (ozone) are supplied from an ion supply source (not shown), the ions are supplied to the second hole 1.
4, the nozzle 18 via the holder 15 and the hollow shaft 16
It is sprayed on the package of IC11. At this time, the static electricity already charged on the package is neutralized.

Returning to FIG. 1, the valve 20 is moved upward to move the ball plunger 23 into the groove 24.
a, and the position is fixed by the stopper 21a.
The injection hole of the first hole 13 is open. Therefore, the first
When ions are supplied at a predetermined flow rate from the holes 13, the ions are injected from the injection holes of the first holes 13 along the hood portion 20 a of the valve 20 onto the package of the IC 11 from around the nozzle 18.

At this time, a negative pressure state is established from the second hole 14 to the nozzle 18. Then, the nozzle 18 is connected to the IC 11
IC 11 is vacuum-sucked. That is, the IC 11 is vacuum-adsorbed while ejecting ions to remove static electricity.

As described above, static electricity can be efficiently eliminated, and the generation of static electricity can be reduced by performing the tuff ram treatment on the nozzle 18. Also,
The size reduction can be achieved because the injection of ions for static elimination and the vacuum adsorption are integrated.

Next, FIG. 3 is a view for explaining a case where the object to be adsorbed in FIG. 1 is inclined. In FIG. 3, when the IC 11 that is the object to be adsorbed is inclined, the nozzle 1
8 is brought into contact with the package and pressed by a spring 19, the taper 16a of the hollow shaft 16 is separated from the hole 15c of the middle plate 15a of the holding body 15, and the surface of the nozzle 18 and the package of the IC 11 are moved by the spherical slide bearing 17. The surface is brought into close contact with the surface. That is, the inclination of the IC 11 is absorbed by the spring 19 and the slide bearing 17 to ensure the vacuum suction.

When the apparatus main body is lifted and conveyed after the IC 11 is sucked, the nozzle 18 is pushed back down by the spring 19, and the tapered portion 16a of the hollow shaft 16 is fitted into the hole 15c and automatically positioned. Is done. Therefore, accurate suction and separation can be performed without any displacement due to conveyance or the like.

[0029]

As described above, according to the present invention, static electricity can be efficiently removed by simultaneously spraying a neutralizing gas for removing static electricity onto an object to be adsorbed and performing vacuum suction. At the same time, the size can be reduced because they are integrated.

[Brief description of the drawings]

FIG. 1 is a configuration diagram of an embodiment of the present invention.

FIG. 2 is a diagram for explaining the operation of FIG. 1;

FIG. 3 is a diagram for explaining a case where an object to be adsorbed in FIG. 1 is inclined.

FIG. 4 is a configuration diagram of a conventional vacuum suction device.

[Explanation of symbols]

 Reference Signs List 10 vacuum suction device 11 IC 12 micro ejector 13 first hole 14 second hole 15 holder 15a middle plate 15b, 16a taper 15c,15d, 16a, 18a Hole 16 Hollow shaft 17 Sliding bearing 18nozzle  20 Valve 20a Hood

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-3-154793 (JP, A) JP-A-1-120899 (JP, A) JP-A-61-37635 (JP, A) JP-A-63-63 204738 (JP, A) JP-A-1-240287 (JP, A) JP-A-1-84994 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) B25J 15/06 B25B 11 / 00 B65G 47/91 H05F 3/04 H05K 13/00

Claims (3)

(57) [Claims] (1) neutralizationGas is supplied to the neutralizing gasSpout
The first hole to shootAnd a second hole communicated with the first hole
Was formedAn injection unit,It is provided at the lower part of the injection unit, and is communicated with the second hole.
An injection / suction unit having a third hole, A nozzle attached to the tip of the jet / suction unit; Sliding with respect to the injection section, closing the injection port of the first hole
A switching unit having a hood unit that closes or opens, A vacuum suction device having When the first hole is closed by the switching unit,
Suction from the nozzle through the second and third holes;
Inject the neutralizing gas into the object, When the first hole is opened by the switching unit,
The object to be adsorbed from the periphery of the nozzle through the hood portion
The nozzle is negatively charged by injecting the neutralizing gas into
Pressure so that the object is adsorbed to the nozzle.
Composed A vacuum suction device characterized by the above-mentioned. 2. The vacuum suction device according to claim 1, wherein a high resistance film is provided on a surface of the nozzle . (3)The injection / suction unit includes a holder and the holder.
The nozzle communicates with the second hole through a holding body,
Having a hollow shaft attached to the  The holder and the hollow shaft areSaidHollow shaft
Along with being formed in a shape that fits together in the axial direction,
nozzleToSaidAxial direction andSaidRotation on a plane perpendicular to the axial direction
A movable mechanism for causing the movable mechanism to be provided.
2. The vacuum suction device according to 2.